CN106604540B - 电路板 - Google Patents
电路板 Download PDFInfo
- Publication number
- CN106604540B CN106604540B CN201510681153.1A CN201510681153A CN106604540B CN 106604540 B CN106604540 B CN 106604540B CN 201510681153 A CN201510681153 A CN 201510681153A CN 106604540 B CN106604540 B CN 106604540B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pad
- extension area
- insulating layer
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510681153.1A CN106604540B (zh) | 2015-10-19 | 2015-10-19 | 电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510681153.1A CN106604540B (zh) | 2015-10-19 | 2015-10-19 | 电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106604540A CN106604540A (zh) | 2017-04-26 |
CN106604540B true CN106604540B (zh) | 2019-08-13 |
Family
ID=58555104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510681153.1A Active CN106604540B (zh) | 2015-10-19 | 2015-10-19 | 电路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106604540B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109121285B (zh) * | 2018-09-29 | 2020-05-26 | 维沃移动通信有限公司 | 一种电路板结构及电子设备 |
CN111352516B (zh) * | 2018-12-24 | 2022-08-19 | 江西卓讯微电子有限公司 | 触摸屏及电子设备 |
CN113474853B (zh) * | 2019-02-27 | 2023-04-04 | 住友电工印刷电路株式会社 | 印刷配线板及印刷配线板的制造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6734570B1 (en) * | 2003-01-24 | 2004-05-11 | Gennum Corporation | Solder bumped substrate for a fine pitch flip-chip integrated circuit package |
CN102045939A (zh) * | 2009-10-19 | 2011-05-04 | 巨擘科技股份有限公司 | 柔性多层基板的金属层结构及其制造方法 |
CN102625575A (zh) * | 2011-01-31 | 2012-08-01 | 索尼公司 | 电路板、半导体元件、半导体装置及其制造方法 |
CN103415885A (zh) * | 2011-03-08 | 2013-11-27 | 大日本印刷株式会社 | 配线电路基板、悬架用柔性基板及悬架用柔性基板的制造方法 |
CN103733740A (zh) * | 2012-08-09 | 2014-04-16 | 日本特殊陶业株式会社 | 布线基板 |
CN103985691A (zh) * | 2013-02-13 | 2014-08-13 | 三菱电机株式会社 | 半导体装置 |
CN205029966U (zh) * | 2015-10-19 | 2016-02-10 | 南昌欧菲光电技术有限公司 | 电路板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7271484B2 (en) * | 2003-09-25 | 2007-09-18 | Infineon Technologies Ag | Substrate for producing a soldering connection |
-
2015
- 2015-10-19 CN CN201510681153.1A patent/CN106604540B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6734570B1 (en) * | 2003-01-24 | 2004-05-11 | Gennum Corporation | Solder bumped substrate for a fine pitch flip-chip integrated circuit package |
CN102045939A (zh) * | 2009-10-19 | 2011-05-04 | 巨擘科技股份有限公司 | 柔性多层基板的金属层结构及其制造方法 |
CN102625575A (zh) * | 2011-01-31 | 2012-08-01 | 索尼公司 | 电路板、半导体元件、半导体装置及其制造方法 |
CN103415885A (zh) * | 2011-03-08 | 2013-11-27 | 大日本印刷株式会社 | 配线电路基板、悬架用柔性基板及悬架用柔性基板的制造方法 |
CN103733740A (zh) * | 2012-08-09 | 2014-04-16 | 日本特殊陶业株式会社 | 布线基板 |
CN103985691A (zh) * | 2013-02-13 | 2014-08-13 | 三菱电机株式会社 | 半导体装置 |
CN205029966U (zh) * | 2015-10-19 | 2016-02-10 | 南昌欧菲光电技术有限公司 | 电路板 |
Also Published As
Publication number | Publication date |
---|---|
CN106604540A (zh) | 2017-04-26 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211011 Address after: 330000 east of Longtan Road and north of Longtan canal, Nanchang Economic and Technological Development Zone, Nanchang City, Jiangxi Province Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Address before: 330013 oufeiguang Technology Park, Huangjiahu West Road, Changbei Economic Development Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |