WO2010018682A1 - 照明装置 - Google Patents
照明装置 Download PDFInfo
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- WO2010018682A1 WO2010018682A1 PCT/JP2009/003838 JP2009003838W WO2010018682A1 WO 2010018682 A1 WO2010018682 A1 WO 2010018682A1 JP 2009003838 W JP2009003838 W JP 2009003838W WO 2010018682 A1 WO2010018682 A1 WO 2010018682A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21K9/272—Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21K9/278—Arrangement or mounting of circuit elements integrated in the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/345—Current stabilisation; Maintaining constant current
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the present invention relates to a lighting device using a light emitting diode (hereinafter referred to as LED) as a light source.
- This lighting device may be used, for example, as a so-called downlight that is installed on the ceiling of a building and illuminates the lower surface toward the floor or the like.
- you may have the form of the LED lamp which can be used especially as a substitute of a fluorescent lamp.
- the halogen lamp emits light by energizing a filament as a resistor, and emits a large amount of heat as it emits light. For this reason, energy efficiency was inferior compared with, for example, a fluorescent lamp.
- the shape of the reflector is relatively large, for example, a parabolic cross section. Therefore, in order to attach the lighting device, it is necessary to secure a corresponding space on the ceiling.
- FIG. 48 is a cross-sectional view showing an example of a conventional LED lamp that can be used as an alternative to a fluorescent lamp (see, for example, Patent Document 1).
- the LED lamp X1 shown in the figure includes a long rectangular substrate 191, a plurality of LED modules 192 mounted on the substrate 191, a heat dissipation member 195 to which the substrate 191 is attached, and a case 193 that houses the substrate 191. And a terminal 194.
- a wiring pattern (not shown) connected to the plurality of LED modules 192 and the terminals 194 is formed on the substrate 191.
- This LED lamp X1 is configured such that a plurality of LED modules 192 can emit light by fitting the terminal 194 into the socket of the general fluorescent lamp lighting fixture.
- each LED module 192 appears as a point light source.
- the case 193 In order to make the appearance of the LED lamp X1 resemble that of a fluorescent lamp, it is necessary to considerably diffuse the light from the LED module 192 by the case 193. The greater the diffusion effect of the case 193, the lower the transmittance of the case 193. In such a case, there was a problem that the luminous efficiency of the LED lamp X1 was lowered.
- each LED module 192 if the current passed through each LED module 192 is increased in order to increase the brightness of the entire LED lamp X1, the heat generated from the LED module 192 is unduly increased. This also reduces the light emission efficiency of the LED lamp X1.
- JP 2008-016417 A Japanese Utility Model Publication No. 6-54103
- the objective of this invention is providing the illuminating device excellent in energy efficiency.
- One specific object of the present invention is to provide an illumination device that is excellent in energy efficiency and can save space.
- Another specific object of the present invention is to provide an illuminating device in the form of an LED lamp capable of emitting light having a uniform luminance and improving luminous efficiency.
- the illuminating device provided by the 1st side surface of this invention is provided with the board
- the plurality of LED chips are arranged on the substrate (preferably evenly arranged) so that the mounting number density with respect to the opening area is 3 pieces / cm 2 or more, thereby forming a planar light source. is doing.
- the opening area may be larger than the area of the substrate facing the illumination space. That is, the planar light source unit may face the illumination space with an opening area larger than the area of the substrate.
- the opening area may be an area of the substrate surface facing the illumination space.
- the area of the opening facing the illumination space in the planar light source unit may be equal to the area of the substrate surface.
- the area of the partial area is an opening area
- the area of the entire area is The opening area.
- the planar light source unit is formed by arranging a plurality of LED chips on the substrate at a high density. Therefore, compared with the case where several high-intensity LEDs are used, the drive current per chip can be suppressed, and thus the LED chip can be caused to emit light in a current region with good energy efficiency. Accordingly, it is possible to realize a lighting device having excellent luminous efficiency.
- a substantially planar light source can be formed by arranging the LED chips at a high density, it is possible to emit light with uniform brightness. Furthermore, since the drive current per chip is small, the amount of generated heat can be suppressed. Therefore, heat dissipation measures are easy, and the configuration of the lighting device can be simplified and downsized accordingly.
- the light emitted from the planar light source part travels around the normal direction of the surface of the substrate and does not travel in all directions.
- a reflector for directing light to a desired range can be made smaller than an illuminating device including a point light source typified by a halogen lamp. Therefore, the lighting device can be miniaturized, and when the lighting device is attached, the installation space on the ceiling can be reduced.
- the plurality of LED chips preferably have a drive current per chip of 40% or less (more preferably 20% or less) of the rated current of the chip. More specifically, the plurality of LED chips preferably have a driving current per chip within a range of 20 ⁇ 3% of the rated current of the chip. More specifically, the plurality of LED chips may have a drive current per chip of 8 mA or less (more preferably 4 mA or less).
- the LED chip has excellent light emission efficiency, so that an energy efficient planar light source can be provided, thereby realizing an illumination device with excellent light emission efficiency.
- the drive current per LED chip is large, the brightness of each LED chip increases, and there is a risk of uneven illuminance. More specifically, a shading pattern or the like may be formed on an object surface (for example, a wall surface) at a short distance from the lighting device.
- the drive current per chip is designed in the above range, the illuminance unevenness can be effectively suppressed. That is, improvement in luminous efficiency and suppression of illuminance unevenness can be achieved together.
- the plurality of LED chips belong to a plurality of groups connected in series to each other, and the plurality of LED chips belonging to each group are connected to each other in parallel. .
- the lighting device may further include a constant current power source that supplies current to the plurality of LED chips, and the plurality of groups may be connected in series to the constant current power source.
- the current supplied from the constant current power source is distributed to a plurality of LED chips connected in parallel in each group. Therefore, the drive current of each LED chip becomes a value according to the number (parallel number) of LED chips constituting each group.
- the number of LED chips in each group is selected so that the drive current per LED chip is 40% or less (preferably 20% or less) of the rated current of the chip. It is preferable that More specifically, the number (parallel number) of LED chips in each group is selected so that the drive current per LED chip is within a range of 20% ⁇ 3% of the rated current of the chip. It is preferable that The number of LED chips in each group (parallel number) may be selected so that the drive current per LED chip is 8 mA or less (more specifically, 4 mA or less).
- each includes a plurality of LED modules each having one or more LED chips and a pair of mounting terminals spaced apart from each other.
- the ratio of the occupied area of the plurality of LED modules to the opening area is 20% or more.
- the plurality of LED modules are arranged such that the pair of mounting terminals are separated from each other in the first direction, and each of the plurality of LED modules follows a second direction that is perpendicular to the first direction. Are arranged so as to form a plurality of rows arranged in parallel to each other. Such a configuration is advantageous for realizing uniform surface light emission.
- each of the substrates includes an anode straight portion and a cathode straight portion that extend in the second direction and are spaced apart and parallel to the first direction.
- a skew connecting portion that connects the other cathode straight portion, and the plurality of LED modules are mounted so as to straddle the anode straight portion and the cathode straight portion. Yes.
- the LED modules arranged in the second direction can be connected so as to belong to a plurality of groups connected in series. Arranging the plurality of LED modules in an orderly manner is important for obtaining uniform surface light emission. Connecting a plurality of LED modules so as to belong to a plurality of groups connected in series with each other is convenient for setting the magnitude of current flowing through each of the LED modules to a low current suitable for high-efficiency light emission. .
- the wiring pattern includes an anode folded portion that connects the anode straight portions adjacent in the first direction, and a cathode folded portion that connects the cathode straight portions adjacent in the first direction.
- the wiring pattern is adjacent to the second direction in the plurality of pad portions, and the anode straight portion and the cathode straight portion are arranged on the opposite side in the first direction.
- it further includes an orthogonal connecting portion that connects one of the anode straight portions and the other of the cathode straight portions.
- an anode electrode and a cathode electrode are further provided, which are disposed closer to one side in the second direction than the plurality of pad portions.
- the anode folded portion and the cathode folded portion can be arranged so as to face the anode electrode and the cathode electrode. This is preferable for shortening the length of the portion connecting the anode folded portion and the cathode folded portion with the anode electrode and the cathode electrode.
- the cathode straight part or the anode straight part has a width overlapping with the LED chip of each LED module in plan view. According to such a configuration, heat generated from the LED chip is suitable for dissipating through the cathode straight part or the anode straight part.
- the wiring pattern is disposed near the end of the substrate, and at least one of an anode widening portion and a cathode widening portion having an outer shape along the edge of the substrate is provided. Have. According to such a configuration, the heat generated from the LED chip is suitable for dissipating through at least one of the anode widened portion and the cathode widened portion.
- the wiring pattern is not electrically connected to the anode straight portion and the cathode straight portion, and an end portion of the substrate with respect to the anode straight portion and the cathode straight portion. It has a non-conductive heat dissipating part located closer to it. Such a configuration is suitable for enhancing the heat dissipation from the substrate.
- the substrate has a circular shape, is divergent toward the normal direction of the surface on which the plurality of LED chips of the substrate are mounted, and the planar light source unit is
- the reflector further includes a substrate-side opening diameter D1 on the substrate side of the reflector and an exit-side opening diameter D2 on the opposite side of the substrate, where 0.5 ⁇ D1 / D2 ⁇ 0.69;
- the distance H between the substrate side opening and the emission side opening and the emission side opening diameter D2 are set to 0.3 ⁇ H / D2 ⁇ 0.55. According to such a structure, it is preferable to irradiate clearly and uniformly by the illumination device.
- the number density of the plurality of LED chips mounted on the substrate-side opening area of the reflector is 3.0 / cm 2 or more. In a preferred embodiment of the present invention, the mounting number density of the plurality of LED chips with respect to the substrate-side opening area of the reflector is 25 / cm 2 or more. In a preferred embodiment of the present invention, the number density of the plurality of LED chips mounted on the substrate-side opening area of the reflector is 60 / cm 2 or more.
- substrate side opening area of the said reflector is 30% or more.
- substrate side opening area of the said reflector is 70% or more.
- the planar light source unit is viewed as a light emitting surface instead of a set of a plurality of point light sources.
- the configuration in which the mounting number density is 60 pieces / cm 2 or more or the occupied area ratio is 70% or more can be realized even if a gap of about 0.5 mm is secured between the LED modules.
- mounter for mounting the LED module on the substrate.
- the base plate is disposed on the opposite side of the reflector from the reflector, and includes a bottom portion that contacts the substrate and a cylindrical portion that is integrally connected to the bottom portion.
- a housing is further provided. According to such a configuration, heat dissipation from the LED module can be further promoted through the housing.
- the surface of the reflector is an uneven metal surface. Such a configuration is advantageous for making the light from the illumination device uniform.
- the lighting device provided by the second aspect of the present invention has a form of an LED lamp including a strip-shaped substrate and a plurality of LED chips arranged on the substrate.
- Each of the LED lamps includes a plurality of LED modules each having one or more LED chips and a pair of mounting terminals spaced apart from each other.
- the LED lamp has a shape and size equivalent to a 40-inch straight tube fluorescent lamp.
- the number of the plurality of LED modules is 600 or more.
- each of the LED modules has a plan view dimension of 1.0 mm ⁇ 0.6 mm or less. In a preferred embodiment of the present invention, each of the LED modules has a plan view dimension of 1.6 mm ⁇ 0.8 mm or less. In a preferred embodiment of the present invention, each LED module has a height of 0.2 mm or less.
- the number of the plurality of LED modules is 1000 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules is 4000 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules is 8000 or more.
- the number of the plurality of LED modules is 12000 or more.
- the illuminating device provided by the 3rd side surface of this invention has a form of an LED lamp provided with a strip
- This LED lamp includes a plurality of LED modules each having one or more of the LED chips and a pair of mounting terminals spaced apart from each other.
- the LED lamp has a shape and size equivalent to a 20-inch straight tube fluorescent lamp.
- the number of the plurality of LED modules is 290 or more.
- the number of the plurality of LED modules is 480 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules is 1900 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules is 3900 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules is 5800 or more.
- the lighting device provided by the fourth aspect of the present invention is disposed on a belt-shaped substrate and the substrate. And a plurality of LED chips.
- This LED lamp includes a plurality of LED modules each having one or more of the LED chips and a pair of mounting terminals spaced apart from each other. The LED lamp has a shape and size equivalent to a 15-inch straight tube fluorescent lamp.
- the number of the plurality of LED modules is 200 or more.
- the number of the plurality of LED modules is 330 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules is 1300 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules is 2700 or more.
- the number of the plurality of LED modules is 4000 or more.
- the illuminating device provided by the 5th side surface of this invention has a form as an LED lamp provided with a strip
- This LED lamp includes a plurality of LED modules each having one or more of the LED chips and a pair of mounting terminals spaced apart from each other.
- the LED lamp has a shape and size equivalent to a 10-type straight tube fluorescent lamp.
- the number of the plurality of LED modules is 150 or more.
- the number of the plurality of LED modules is 250 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules is 1000 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules is 2000 or more.
- the number of the plurality of LED modules is 3000 or more.
- each of the LED modules has a plan view dimension of 1.0 mm ⁇ 0.6 mm or less.
- each of the LED modules has a plan view dimension of 1.6 mm ⁇ 0.8 mm or less.
- each LED module has a height of 0.2 mm or less.
- the LED lamp provided by the 6th side surface of this invention has a form as an LED lamp provided with a strip
- This LED lamp includes a plurality of LED modules each having one or more of the LED chips and a pair of mounting terminals spaced apart from each other. The mounting number density of the plurality of LED modules with respect to the area of the substrate is 3.0 pieces / cm 2 or more.
- the mounting number density of the plurality of LED modules with respect to the area of the substrate is 5.0 pieces / cm 2 or more. In a preferred embodiment of the present invention, the mounting number density of the plurality of LED modules with respect to the area of the substrate is 20 pieces / cm 2 or more. In a preferred embodiment of the present invention, the mounting number density of the plurality of LED modules with respect to the area of the substrate is 40 / cm 2 or more.
- the mounting number density of the plurality of LED modules with respect to the area of the substrate is 60 pieces / cm 2 or more. In a preferred embodiment of the present invention, the number of the plurality of LED modules mounted in the width direction of the substrate is 3 or more. In a preferred embodiment of the present invention, the mounting number density of the plurality of LED modules in the longitudinal direction of the substrate is larger than the mounting number density of the plurality of LED modules in the width direction of the substrate.
- each of the LED modules has a plan view dimension of 1.0 mm ⁇ 0.6 mm or less. In a preferred embodiment of the present invention, each of the LED modules has a plan view dimension of 1.6 mm ⁇ 0.8 mm or less. In a preferred embodiment of the present invention, each LED module has a height of 0.2 mm or less.
- the lighting device provided by the seventh aspect of the present invention has a form as an LED lamp including a strip-shaped substrate and a plurality of LED chips arranged on the substrate.
- This LED lamp includes a plurality of LED modules each having one or more of the LED chips and a pair of mounting terminals spaced apart from each other.
- substrate is 20% or more, and the planar view dimension of each said LED module is 4.0 mm x 2.0 mm or less.
- the lighting device provided by the eighth aspect of the present invention has a form as an LED lamp including a strip-shaped substrate and a plurality of LED chips arranged on the substrate.
- This LED lamp includes a plurality of LED modules each having one or more of the LED chips and a pair of mounting terminals spaced apart from each other. And the occupation area ratio of the said several LED module with respect to the area of the said board
- substrate is 35% or more. In preferable embodiment of this invention, the occupation area ratio of the said several LED module with respect to the area of the said board
- each of the LED modules has a plan view dimension of 1.0 mm ⁇ 0.6 mm or less. In a preferred embodiment of the present invention, each of the LED modules has a plan view dimension of 1.6 mm ⁇ 0.8 mm or less. In a preferred embodiment of the present invention, each LED module has a height of 0.2 mm or less.
- the occupation ratio of the plurality of LED modules in the longitudinal direction of the substrate is larger than the occupation ratio of the plurality of LED modules in the width direction of the substrate.
- the plurality of LED modules include ones having different wavelengths of emitted light.
- the plurality of LED modules has a smaller proportion of the plurality of LED modules that emit white light and a plurality of LED modules that emit white light, and are discrete. And a plurality of LED modules emitting red light, which are arranged in a regular manner.
- the electric current which flows into each said LED chip is 20% or less of the rated current.
- An illuminating device provided by a ninth aspect of the present invention includes a strip-shaped substrate and a planar light source unit including a plurality of LED chips disposed on the substrate, and has a form as an LED lamp. is doing. In a preferred embodiment of the present invention, it further includes a case having a circular tubular section that accommodates the substrate.
- the plurality of LED chips belong to a plurality of groups connected in series to each other, and the plurality of LED chips belonging to each group are connected to each other in parallel.
- each includes a plurality of LED modules each having one or more LED chips and a pair of mounting terminals spaced apart from each other. The pair of mounting terminals are arranged so as to be separated from each other in the width direction of the substrate, and are arranged in a plurality of rows arranged in parallel to each other along the longitudinal direction of the substrate.
- the plurality of LED modules are arranged in a staggered manner.
- substrate is a flexible wiring board which has the flexibility in which the resin layer and the metal wiring layer were laminated
- the case is a straight tube, and the case is integrally provided with protruding pieces protruding inward so as to form a pair in a plane parallel to the central axis.
- the board is restricted from moving in the radial direction with respect to the case by the protruding piece.
- the luminous efficiency of the LED lamp can be increased.
- the value of the current flowing through each LED chip can be relatively reduced. This is advantageous in reducing the proportion of energy input to the LED chip that is consumed for heat generation, and is suitable for increasing the luminous efficiency of the LED lamp.
- FIG. 2 is a cross-sectional view taken along the line II-II in FIG. It is a top view which shows the board
- FIG. 4 is an enlarged plan view showing a part S1 in FIG. 3.
- FIG. 4 is an enlarged plan view showing a part S ⁇ b> 2 of FIG. 3.
- FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 6. It is a bottom view which shows the LED module used for the illuminating device shown in FIG.
- FIG. 6 It is a circuit diagram which shows the illuminating device shown by FIG. It is a circuit diagram for demonstrating the structure of a power supply unit. It is a graph which shows the relationship between the electric current and luminous efficiency of the LED module used for the illuminating device shown in FIG. It is a figure which shows the relationship between the number of LED modules, and illumination intensity. It is a figure for demonstrating the calculation method of illumination intensity nonuniformity. It is a figure which shows the relationship between the number of LED modules, and illumination intensity nonuniformity. It is a figure which shows the relationship between the electric current per LED module, illumination intensity, and illumination intensity nonuniformity. 6 is a graph showing a change in distribution of relative illuminance B according to distance H.
- FIG. 21 is a cross-sectional view taken along line XXI-XXI in FIG. 20. It is a bottom view which shows the other example of the LED module used for the illuminating device shown in FIG. It is a top view which shows the other example of the board
- FIG. 24 is a main part cross-sectional view along the line XXIV-XXIV in FIG. 23. It is a top view which shows the further another example of the board
- FIG. 29 is a main part sectional view taken along line XXIX-XXIX in FIG. 28.
- FIG. 30 is a cross-sectional view taken along line XXX-XXX in FIG. 29. It is a principal part enlarged plan view which shows the board
- FIG. 33 is a cross-sectional view taken along line XXXIII-XXXIII in FIG. 32. It is a bottom view which shows the LED module shown in FIG. It is a circuit diagram which shows the LED lamp shown by FIG. It is a principal part enlarged plan view which shows the board
- FIG. 44 is a cross-sectional view taken along line XXXXIV-XXXXIV in FIG. 43. It is a principal part perspective view which shows an example of the LED lamp based on 6th Embodiment of this invention.
- FIG. 46 is an essential part cross-sectional view along the line XXXVI-XXXXVI in FIG. 45.
- FIG. 47 is a cross-sectional view taken along line XXXXVII-XXXXVII in FIG. 46. It is sectional drawing which shows an example of the conventional LED lamp.
- the illumination device A1 of this embodiment includes a substrate 1, a plurality of LED modules 3, a reflector 4, a housing 5, a connector 6, and a holder 7.
- the illuminating device A1 is used as a so-called downlight by being installed in an opening space provided on the ceiling in a posture in which the top and bottom are reversed in the z direction of FIG.
- the substrate 1 is, for example, an aluminum plate whose surface is subjected to insulation treatment, and is for mounting a plurality of LED modules 3.
- substrate 1 is circular and the diameter is about 66 mm.
- the region where the plurality of LED modules 3 are mounted is a circular region having a diameter of about 50 to 60 mm.
- a wiring pattern 2 is formed on the substrate 1.
- the wiring pattern 2 is made of, for example, a metal film such as copper, and is for mounting a plurality of LED modules 3 and supplying power to them.
- the wiring pattern 2 includes an anode electrode 21A, a cathode electrode 21B, a plurality of pad portions 22, a plurality of anode turn-back portions 24A, a plurality of cathode turn-back portions 24B, a plurality of skew connection portions 25, a straight connection portion 26, and an anode connection portion 27A. And a cathode connecting portion 27B. Portions other than the portion for mounting the LED module 3 in the wiring pattern 2 are covered with an insulating layer (not shown) having a high reflectance such as a white resist.
- the anode electrode 21 ⁇ / b> A and the cathode electrode 21 ⁇ / b> B are for connecting an electric wire (not shown) extending from the connector 6, and are arranged near one end in the x direction of the substrate 1.
- the plurality of pad portions 22 are portions where a plurality of LED modules 3 are mounted.
- the pad portion 22 includes an anode straight portion 23A (black in the drawing) and a cathode straight portion 23B (grey in the drawing).
- Each of the anode straight portion 23A and the cathode straight portion 23B extends in the x direction, and is arranged in parallel with an interval in the y direction orthogonal to the x direction. Thereby, all the some pad parts 22 are extended along the x direction.
- many of the plurality of pad portions 22 are arranged in parallel in the y direction at intervals. Further, several pad portions 22 are arranged in series at intervals in the x direction.
- FIG. 4 is a detailed view of part S1 in FIG.
- the LED module 3 includes an LED chip 31, a resin package 32, a substrate 33, and a pair of mounting terminals.
- the LED module 3 has a width of 0.8 mm, a length of 1.6 mm, and a thickness of about 0.5 mm, and is configured as a small and very thin LED module.
- the substrate 33 has a substantially rectangular shape in plan view, and is an insulating substrate made of, for example, a glass epoxy resin.
- An LED chip 31 is mounted on the surface of the substrate 33.
- a pair of mounting terminals 34 is formed on the back surface of the substrate 33.
- the thickness of the substrate 33 is about 0.08 to 0.1 mm.
- the LED chip 31 is a light source of the LED module 3 and can emit visible light, for example.
- the resin package 32 is for protecting the LED chip 31.
- the resin package 32 is made of, for example, an epoxy resin having translucency with respect to the light from the LED chip 31, or a translucent resin including a fluorescent material that emits light of different wavelengths when excited by the light from the LED chip 31. It is molded using.
- the LED module 3 can emit white light by mixing blue light from the LED chip 31 and yellow light from the fluorescent material contained in the resin package 32. As said fluorescent substance, it may replace with what emits yellow light, and may mix and use what emits red light, and what emits green light.
- the LED module 3 is mounted on the pad portion 22 by soldering, for example, one of the pair of mounting terminals 34 to the anode straight portion 23A and the other to the cathode straight portion 23B. Thereby, the several LED module 3 mounted in the one pad part 22 is mutually connected in parallel.
- two groups of a plurality of LED modules 3 connected in parallel are arranged with the skew connecting portion 25 interposed therebetween.
- the two pad portions 22 disposed on both sides of the skew connecting portion 25 have the same arrangement of the anode straight portion 23A and the cathode straight portion 23B in the y direction.
- the skew connecting portion 25 connects the anode straight portion 23 ⁇ / b> A of one pad portion 22 and the cathode straight portion 23 ⁇ / b> B of the other pad portion 22. Thereby, the some LED module 3 which belongs to these two groups is mutually connected in series.
- two groups of a plurality of LED modules 3 connected in parallel are arranged with the direct coupling part 26 interposed therebetween.
- the arrangement of the anode straight portion 23A and the cathode straight portion 23B is opposite in the y direction.
- the direct connection portion 26 connects the anode straight portion 23 ⁇ / b> A of one pad portion 22 and the cathode straight portion 23 ⁇ / b> B of the other pad portion 22.
- anode turn-back portion 24A connects the anode straight portions 23A adjacent in the y direction.
- the cathode turn-back portion 24B connects the cathode straight portions 23B adjacent in the y direction.
- a plurality of pad portions 22, one direct connection portion 26 and seven oblique connection portions 25 are arranged in this order from the anode electrode 21A side.
- the plurality of LED modules 3, that is, the plurality of LED chips 31, are connected as shown in FIG.
- 603 LED modules 3 (LED chips 31) are used.
- These LED modules 3 are divided into nine groups 31A.
- the group 31A includes 67 LED modules 3 connected in parallel to each other.
- These nine groups 31 ⁇ / b> A are connected to each other in series by one orthogonal connecting portion 26 and seven oblique connecting portions 25.
- 603 LED modules 3 are arranged in a staggered pattern on the substrate 1.
- the power supply specifications for causing the plurality of LED modules 3 to emit light are that the voltage between the anode electrode 21A and the cathode electrode 21B is about 27V, the voltage Vf of each LED module 3 is about 3.0V, and the current If is about 4.0 mA.
- the plurality of LED modules 3 mounted at high density emit light, the eyes do not visually recognize the set of point light sources but perceive as surface emission. That is, the area where the plurality of LED modules 3 are mounted constitutes a planar light source unit 3A.
- the plurality of anode turn-back portions 24A are located on the left side, and the plurality of cathode turn-back portions 24B are located on the right side. Then, in a region about 1/3 from the upper end of the substrate 1 with the portion where the direct connection portion 26 is provided as a boundary, the plurality of anode folding portions 24A are located on the right side, and the plurality of cathode folding portions 24B are on the left side. It is located in the direction.
- the anode connecting portion 27A connects the anode electrode 21A and the anode folded portion 24A on the upper right side portion of the substrate 1.
- the cathode connecting portion 27B connects the cathode electrode 21B and the cathode folded portion 24B in the lower right portion of the substrate 1.
- the reflector 4 has openings 41 and 42 and has a cone shape whose cross-sectional dimension increases as the distance from the substrate 1 increases.
- the reflector 4 is made of aluminum.
- the reflector 4 surrounds the plurality of LED modules 3 and reflects the light emitted from them in the z direction.
- the diameter D1 of the opening 41 is 60 mm
- the diameter D2 of the opening 42 is 100 mm
- the distance H is 50 mm.
- preferable irradiation can be obtained even with a configuration in which the diameter D1 is 52 to 62 mm, the diameter D2 is 90 mm, and the distance H is about 40 mm.
- the inner surface of the reflector 4 is, for example, an uneven Al plated surface.
- the planar light source unit 3 ⁇ / b> A faces the illumination target space (illumination space) at the opening 41.
- the mounting number density of the plurality of LED modules 3 per unit area of the opening 41 is about 31 / cm 2 . This mounting density is about 39% in terms of the ratio of the occupied area of the plurality of LED modules 3 to the area of the opening 41.
- the housing 5 is made of aluminum, for example, and supports the substrate 1 and the reflector 4. When the LED module 3 emits light, heat from the LED module 3 is transmitted to the reflector 4 and the housing 5 through the substrate 1. Thereby, heat dissipation promotion of the LED module 3 is aimed at.
- the connector 6 is connected to a building-side connector (not shown) when the lighting device A1 is installed on the ceiling.
- the holder 7 is formed by bending a stainless steel (SUS301) plate, for example. The holder 7 holds the illumination device A1 by engaging with a part of the ceiling when the illumination device A1 is attached to the ceiling.
- a power supply board 60A forming a power supply unit.
- the power supply substrate 60 ⁇ / b> A is supported in a state of being separated from the support substrate 8 by resin posts 9, 9 erected from the support substrate 8 in the housing 5.
- the support substrate 8 is fixed to the housing 5 on the side opposite to the substrate 1.
- a connector 6 is attached to the support substrate 8 on the same side as the housing 5 outside the housing 5.
- FIG. 10 is an electric circuit diagram for explaining the electrical configuration of the illumination device A1.
- a series circuit of the plurality of LED groups 31A is connected to a power supply unit 60 as a constant current power supply.
- the power supply unit 60 includes a surge protection circuit 61, a filter circuit 62, a rectifier circuit 63, a control circuit 64, and a reverse voltage protection circuit 65.
- the surge protection circuit 61 includes a fuse 69 interposed in one of a pair of power supply lines 67 and 68 connected to the commercial AC power supply 66 and a varistor 70 connected between the power supply lines 67 and 68. is doing. With this configuration, the power supply unit 60 is protected from lightning surges and the like.
- the filter circuit 62 includes an inductor 71 interposed between power supply lines 67 and 68 and capacitors 72 and 73 connected between the power supply lines 67 and 68 on both sides of the inductor 71, respectively. With this configuration, a filter process for removing noise transmitted from the AC power supply is performed.
- the rectifier circuit 63 is configured by bridge-connecting four diodes 74. With this configuration, the rectifier circuit 63 performs full-wave rectification on the alternating current from the feeder lines 67 and 68.
- the control circuit 64 includes a constant current driver 75 constituted by an integrated circuit (IC), smoothing capacitors 76 to 78, and a current setting resistance element 79. Power is supplied to the power supply terminals 75 a and 75 b of the constant current driver 75 from the rectifier circuit 63 via the DC power supply lines 80 and 81.
- a smoothing capacitor 76 is connected between the DC power supply lines 80 and 81. The smoothing capacitor 76 smoothes the input voltage to the constant current driver 75.
- a smoothing capacitor 77 is connected between one DC power supply line 82 and the control terminal 75 c of the constant current driver 75. The smoothing capacitor 77 has a function of smoothing the voltage inside the constant current driver 75.
- a pair of output lines 84 and 85 are connected between the output terminals 75d and 75e of the constant current driver 75 and the pair of output terminals 82 and 83 of the control circuit 64, respectively.
- a smoothing capacitor 78 is connected between these output lines 84 and 85.
- the smoothing capacitor 78 smoothes the output voltage of the constant current driver 75.
- a current setting resistor element 79 is connected between the negative output terminal 75e (output line 85) and the control terminal 75c.
- the constant current driver 75 operates so that a constant current having a magnitude corresponding to the resistance value of the current setting resistance element 79 flows between the output terminals 75d and 75e. Therefore, a resistance element having an appropriate resistance value may be selected according to a required current value and connected as the current setting resistance element 79.
- the reverse voltage protection circuit 65 includes a pair of Zener diodes 86 and 87 connected in series between the output lines 84 and 85.
- the reverse voltage protection circuit 65 prevents the reverse voltage from being applied to the LED module 3 when a reverse voltage is applied between the output lines 84 and 85, thereby protecting the LED module 3 from destruction.
- a series circuit of a plurality of LED groups 31 ⁇ / b> A is connected between the output terminals 82 and 83 via lead wires 88 and 89.
- the plurality of LED modules 3 constituting each LED group 31 ⁇ / b> A are connected to the power supply unit 60 in parallel. Therefore, the constant current controlled current supplied from the power supply unit 60 is distributed to the plurality of LED modules 3 constituting each group 31A.
- the current (drive current) flowing through each LED module 3 is determined by the current value supplied by the power supply unit 60 and the number (parallel number) of LED modules 3 in each group 31A. Therefore, the resistance value of the current setting resistance element 79 and the number (parallel number) of LED modules 3 constituting each group 31A are set so that the drive current of each LED module 3 becomes a desired value (for example, 4 mA). Just design.
- action of illuminating device A1 is demonstrated.
- light is emitted from the planar light source unit 3 ⁇ / b> A formed by the plurality of LED modules 3.
- the light emitted from the planar light source unit 3A travels around the normal direction of the surface of the substrate 1, and does not travel in any direction.
- the reflector 4 for directing light to a desired range can be made smaller than a downlight including a point light source typified by a halogen lamp, for example. Therefore, the size of the lighting device A1 can be reduced, and the installation space of the ceiling to which the lighting device A1 is attached can be saved. If the LED modules 3 are arranged in a staggered manner, it is suitable for obtaining uniform surface light emission.
- the magnitude of the current If flowing through the LED module 3 is a relatively low current of about 4.0 mA.
- the luminous efficiency reaches a level of less than 70 Lm / W.
- 7.0 W of electric power is applied as the lighting device A1
- a brightness of 413 Lm is realized even if there is a loss due to absorption, light leakage, or the like that the lighting device A1 inevitably has.
- This luminous efficiency is 59 Lm / W, which is significantly higher than that of a light source using a filament such as a halogen lamp, and can achieve remarkable power saving.
- FIG. 11 shows the relationship between the current If flowing through one LED module 3 and the luminous efficiency Ef.
- the prototype A has the above-described configuration in which 603 LED modules 3 are mounted on the substrate 1.
- Prototype Example B has a configuration in which 302 LED modules 3 are mounted on substrate 1 by thinning out every other LED module 3 from Prototype Example A.
- the number (parallel number) of LED modules 3 constituting each LED group 31A is approximately halved, and accordingly, the drive current in each LED module 3 is twice the drive current 4 mA of Prototype Example A (8 mA). It has become. More specifically, a total of 9 groups of 5 groups 31A composed of 34 LED modules 3 and 4 groups composed of 33 LED modules 3 are connected in series, and 302 in total.
- the LED module 3 is used.
- another thinning method is also possible. For example, nine groups composed of 34 LED modules 3 may be connected in series, and a total of 306 LED modules 3 may be used.
- the prototype example C is configured such that every other LED module 3 is further thinned from the prototype example B, and 153 LED modules 3 are mounted on the substrate 1.
- the number (parallel number) of the LED modules 3 constituting each LED group 31A is about one-fourth that of the prototype A, and accordingly, the drive current in each LED module 3 is the prototype A. It is 16 mA, which is four times that in the case of.
- the LED modules 3 are evenly thinned out from the prototype A, and the number thereof is reduced to one fifth.
- the number of LED modules 3 constituting each LED group 31A is about one-fifth that in the case of the prototype A, and accordingly, the drive current in each LED module 3 is about 5 in the case of the prototype A. It is double 20.8 mA.
- “Power consumption” is the power consumption of all the LED modules 3.
- “1 m illuminance” is the illuminance (Lx) measured at a position 1 m away from the exit side opening 42 of the reflector 4 in the normal direction of the substrate 1.
- “Lx / W” is a value obtained by dividing 1 m illuminance by power consumption, and corresponds to the luminous efficiency of the entire lighting device.
- “Illuminance unevenness” represents the degree of unevenness of the illuminance distribution. The relationship between the number of LED modules 3 and illuminance is shown in FIG. From this figure and Table 1 described above, it can be seen that there is no substantial difference in illuminance between prototype examples A and B.
- the prototype examples A and B there is no significant difference in luminous efficiency between the prototype examples A and B. Therefore, although the prototype A is more advantageous in terms of the luminous efficiency of the individual LED modules 3, since there is no difference in overall illuminance and luminous efficiency, the prototype B with a smaller number of LED modules 3 is more cost effective. This is advantageous in that it can be reduced and the number of manufacturing steps can be reduced.
- FIG. 13 is a diagram for explaining how to obtain illuminance unevenness, and a histogram of illuminance is shown.
- the procedure for obtaining the illuminance unevenness is as follows. First, the illuminance is obtained at a plurality of different positions on a square light receiving surface (a surface perpendicular to the normal direction) having a side of 3 m centering on a position 1 m away from the exit side opening 42 of the reflector 4 in the normal direction of the substrate 1. taking measurement. Next, a frequency distribution for each illuminance value is obtained, and a histogram as shown in FIG. 13 is created. Then, a straight line L1 connecting the lowest frequency position a and the second lowest frequency position b is obtained.
- FIG. 14 shows the relationship between the number of LED modules 3 and uneven illuminance.
- the illuminance unevenness is 5% or less, but in Prototype Examples C and D, the illuminance unevenness exceeds 10%.
- the illuminance unevenness is large, when there is an object close to the illumination device A1, a shade pattern such as a stripe pattern is observed on the surface of the object. More specifically, when the downlight is installed on the ceiling near the wall surface, a shading pattern due to uneven illuminance may be formed on the wall surface. Therefore, it is preferable if the illuminance unevenness of the prototype examples A and B can be suppressed.
- FIG. 15 is a graph showing the relationship between the drive current, 1 m illuminance, and illuminance unevenness of each LED module 3 based on Table 1 described above. From FIG. 15, by setting the drive current per LED module 3, that is, per LED chip 31, to 8 mA or less, necessary illuminance can be secured and uneven illuminance can be suppressed within an allowable range. I understand. On the other hand, in the prototype A, the mounting number density of the LED modules 3 is about 31 / cm 2 , or the occupied area ratio is about 39%. In Prototype Example B, the mounting number density of the LED modules 3 is about 15 / cm 2 , or the occupied area ratio is about 20%.
- the mounting number density of the LED modules 3 is about 8 / cm 2 , or the occupied area ratio is about 10%.
- the LED module 3 has a mounting number density of about 6 / cm 2 or an occupied area ratio of about 8%.
- the mounting number density and the occupied area ratio in the range of prototype examples A and B are preferable, even in the case of prototype examples C and D, the planar light source unit 3A could be visually recognized as a light emitting surface that emits uniform light.
- the mounting number density is 5 pieces / cm 2 or more (preferably 12 pieces / cm 2 or more, more preferably 25 pieces / cm 2 or more), or the occupied area ratio is set. It is suitable to be 6% or more (preferably 15% or more, more preferably 30% or more).
- the mounting number density for Prototype Example A was obtained by the calculation formula “603 pieces / (2.5 cm ⁇ 2.5 cm ⁇ 3.14)”. Moreover, the exclusive area ratio for the prototype A is obtained by the calculation formula “(603 ⁇ 1.6 mm ⁇ 0.8 mm) / (2.5 cm ⁇ 2.5 cm ⁇ 3.14)”. For the other prototypes, the above numerical values can be obtained by the same calculation formula. Further, in the above-described lighting device A1, by providing the skew connecting portion 25, the plurality of LED modules 3 arranged in the order in the x direction are connected so as to belong to a plurality of groups connected in series to each other. Can do. Arranging the plurality of LED modules 3 in an orderly manner is important for obtaining uniform surface light emission.
- Connecting the plurality of LED modules 3 so as to belong to a plurality of groups connected in series with each other makes the magnitude of the current If flowing through each LED module 3 low and suitable for high-efficiency light emission. It is convenient to set the voltage between the electrode 21A and the cathode electrode 21B to about 27 V, which makes constant current control relatively easy.
- the arrangement in the x direction of the plurality of anode folded portions 24 ⁇ / b> A and the plurality of cathode folded portions 24 ⁇ / b> B is reversed with the straight connection portion 26 as a boundary.
- the anode folded portion 24A and the cathode folded portion 24B are arranged so as to face the anode electrode 21A and the cathode electrode 21B. Therefore, the anode connecting portion 27A and the cathode connecting portion 27B extending from the anode electrode 21A and the cathode electrode 21B can be shortened.
- the horizontal axis is a radius R centered on the front surface of the illumination device A1 on the irradiation surface 1 m away from the illumination device A1, and the vertical axis is the relative illuminance B on the irradiation surface.
- the horizontal axis is a radius R centered on the front surface of the illumination device A1 on the irradiation surface 1 m away from the illumination device A1, and the vertical axis is the relative illuminance B on the irradiation surface.
- FIG. 16B shows the relative illuminance B in each case where the distance H and the diameter D2 are the following combinations.
- 18A to 18D are graphs showing the results of measuring the irradiance in the reflector 4 whose dimensions are determined as shown in No. 1 to No. 9 below.
- No. 10 is the relative illuminance when there is no reflector.
- “Irradiance” is a value on a square light-receiving surface with a side of 3 m centering on a position 1 m away from the exit-side opening 42 of the reflector 4 in the normal direction of the substrate 1.
- the “position” on the horizontal axis of each graph represents a deviation from the center position of the square light receiving surface as described above.
- the coefficient of variation obtained by dividing the standard deviation of the measured voltage Vf by the average value is 0.79, 4.6, 6.1, 5.4 in the order of the current If of 10, 100, 200, 300 mA. there were.
- the larger the variation coefficient the greater the variation in voltage Vf in each measurement.
- the variation is significantly smaller when the current If is 10 mA than when the current If is other than that.
- the current If flowing through the LED module 3 is 4.0 mA, which is even lower than 10 mA. Therefore, it can be estimated that the variation in the voltage Vf is very small.
- the temperature of the substrate 1 was 50 to 60 ° C.
- the temperature of the substrate 1 is 40 to 45 ° C. This is because the heat radiation to the housing 5 is higher in the present embodiment in which the LED modules 3 (LED chips 31), which are heat sources, are mounted in a more dispersed manner even if the input power is the same. It is thought that it is from.
- the heat radiation at the time of illumination can be performed comparatively advantageously.
- the light from the illumination device A1 can be made more uniform.
- 19 to 27 show another example of the lighting device and its components according to the present invention.
- the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment, and the description thereof is omitted.
- FIG. 19 shows another example of the substrate 1, the wiring pattern 2, and the plurality of LED modules 3.
- the substrate 1 has a substantially oval shape. Further, the shape of the wiring pattern 2 is different from the above-described embodiment.
- the mounting density of the plurality of LED modules 3 is the same as in the above-described embodiment. According to such a configuration, it is possible to increase the number of substrates 1 that can be created from the material that is the basis of the substrate 1, which is preferable for reducing the manufacturing cost.
- the LED module 3 shown in the figure has a width of 0.6 mm, a length of 1.0 mm, and a thickness of 0.2 mm, and is configured as a small and very thin LED module. . If such an LED module 3 is used and the gap between adjacent LED modules 3 is about 0.5 mm, the number density of the LED modules 3 can be increased to at least 60 / cm 2 . Such a configuration is suitable for visually recognizing the planar light source unit 3A as a light emitting surface that emits more uniform light.
- the LED module 3 corresponds to Type B in the graph shown in FIG. This type of LED module 3 can be expected to increase luminous efficiency as the current If decreases. When the power consumption as the lighting device A1 is the same, the current If can be reduced by increasing the mounting density.
- FIGS. 23 and 24 show another example of the substrate 1, the wiring pattern 2, and the plurality of LED modules 3.
- the dimensions of the substrate 1 are the same as those in the above-described example, but the configurations of the wiring pattern 2 and the LED module 3 are different from those in the above-described embodiment.
- the LED module 3 includes leads 35A and 35B and a reflector 36.
- the leads 35A and 35B are plate-like members made of, for example, a Cu—Ni alloy.
- the LED chip 31 is mounted on the lead 35B, and the lead 35A is electrically connected to the LED chip 31 through a wire.
- the reflector 36 is made of, for example, a white resin.
- the lower surfaces of the leads 35A and 35B are exposed from the reflector 36, and are used as mounting terminals for surface mounting the LED module 3.
- the size of the LED module 3 is 4.0 mm ⁇ 2.0 mm.
- the cathode straight portion 23B is relatively wide. More specifically, as shown in FIG. 23 in plan view, the width is such that the LED chip 31 and the cathode straight portion 23B overlap. In addition, the cathode straight part 23B faces the entire back surface of the lead 35B. In addition, in the case of the configuration using the LED module 3 incorporated so that the polarity of the LED chip 31 is opposite to the LED chip 31 of the present embodiment, the anode linear portion 23A is replaced with the cathode linear portion 23B. It may be wide enough to overlap with the LED chip 31.
- the wiring pattern 2 has an anode widened portion 23Aa and a cathode widened portion 23Ba.
- the anode widened portion 23Aa is electrically connected to the anode straight portion 23A
- the cathode widened portion 23Ba is electrically connected to the cathode straight portion 23B.
- the anode widened portion 23 ⁇ / b> Aa and the cathode widened portion 23 ⁇ / b> Ba are disposed near the end of the substrate 1, and the outer edges thereof are shaped along the outer edge of the substrate 1.
- the mounting number density is about 3.0 / cm 2 and the occupation area ratio is about 24%.
- the planar light source unit 3A that can be visually recognized when surface emission is performed, for example, as compared with a configuration in which about six LED modules 3 are mounted.
- the clearance between the LED modules 3 of the present embodiment is about 0.5 mm, the occupied area ratio can be increased to about 70%.
- Such a configuration is suitable for visually recognizing the planar light source unit 3A as a light emitting surface that emits extremely uniform light.
- the heat from the LED chip 31 is suitably transmitted to the cathode straight portion 23B through the lead 35B. Since the cathode straight portion 23B itself is wide, heat from the LED chip 31 can be quickly diffused. Further, the anode widened portion 23Aa and the cathode widened portion 23Ba can promote the dissipation of heat transmitted from the anode straight portion 23A and the cathode straight portion 23B to the outside. With such a configuration, in the present embodiment, heat from the LED module 3 can be efficiently radiated.
- FIG. 25 shows still another example of the substrate 1, the wiring pattern 2, and the plurality of LED modules 3.
- the substrate 1 shown in the figure has an outer shape of about 102 mm, and is used for an illumination device A1 having a size suitable for installation in an opening of about ⁇ 150 mm opened in a ceiling or the like.
- the diameter D1 of the opening 41 of the reflector 4 is set to about 70 mm.
- the wiring pattern 2 has a plurality of non-conducting heat dissipation portions 28.
- the non-conductive heat radiating portion 28 is not electrically connected to either the anode straight portion 23A or the cathode straight portion 23B, and is disposed near the end of the substrate 1 with respect to the anode straight portion 23A and the cathode straight portion 23B.
- Each non-conducting heat radiating portion 28 has an outer edge along the outer edge of the substrate 1. Also with such a configuration, the planar light source unit 3A can be viewed as a light emitting surface.
- FIG. 26 shows a lighting device according to the second embodiment of the present invention.
- the illuminating device A2 of this embodiment differs in the structure of the housing
- the housing 5 of the present embodiment has a bottom portion 51 and a cylindrical portion 52, and has a structure in which these are integrally connected.
- the substrate 1 is in contact with the bottom 51.
- FIG. 27 shows an illumination device according to the third embodiment of the present invention.
- the illuminating device A3 of this embodiment is a separate power supply type in which the power supply unit is arranged separately from the illuminating device main body. Therefore, the housing 5 as in the above-described embodiment is not provided. Thereby, since a lighting apparatus main body can be made low-profile, construction is possible even when the installation space is limited.
- each part of the lighting device can be varied in design in various ways.
- a configuration having a plurality of LED modules 3 that emit light having different wavelengths may be employed.
- the ratio of the LED module 3 that emits the light bulb color and the LED module 3 that emits the daylight color is controlled individually.
- the LED module 3 is not limited to the one provided with one LED chip 31, and may be configured to include, for example, three LED chips 31 that emit red light, green light, and blue light.
- the rated power of the lighting devices A1 to A3 can be easily changed by reducing the number of the LED modules 3 without changing the configuration of the substrate 1 and the wiring pattern 2. For example, if the LED modules 3 of the lighting device A1 are mounted so as to be removed at a ratio of one to three, the rated power can be reduced to 2/3. Alternatively, if the LED modules 3 of the lighting devices A1 to A3 are mounted so as to be removed at a ratio of two to three, the rated power can be reduced to 1/3.
- a lens may be provided on the exit side opening 41 side of the reflector 4 so that the light generated from the LED module 3 is collected or diffused. If the color of the substrate 1 and the color of the resist covering the wiring pattern 2 are appropriately applied, an arbitrary pattern or character can appear when the LED module 3 is not lit.
- the shape of the substrate 1 is not limited to a circle, and may be various shapes such as a rectangular shape represented by a square and a polygonal shape such as a hexagon.
- the use of the lighting device is not limited to the downlight, and can be used for various uses in which light is emitted from the planar light source unit.
- 28 to 30 show an LED lamp as a lighting device according to a fourth embodiment of the present invention.
- the LED lamp A11 of this embodiment includes a substrate 101, a plurality of LED modules 103, a heat dissipation member 111, a power supply substrate 104, a plurality of power supply components 105, a case 106, and a pair of bases 107.
- it is used by attaching to a general fluorescent lamp lighting fixture.
- the substrate 101 is made of, for example, glass epoxy resin and is formed in a long rectangular shape.
- the substrate 101 is laminated on the heat radiating member 111 and attached to the heat radiating member 111 using, for example, screws.
- As the substrate 101 an aluminum plate whose surface is subjected to insulation treatment may be used.
- a plurality of LED modules 103 are mounted on the upper surface 101 a of the substrate 101. As shown in FIG. 30, in the present embodiment, the plurality of LED modules 103 are arranged along a plane including the central axis O ⁇ b> 1 of the case 106. As shown in FIG. 31, the plurality of LED modules 103 are arranged in a staggered manner. As shown in FIGS.
- the LED module 103 includes an LED chip 131, a resin package 132, a substrate 133, and a pair of mounting terminals 134.
- the LED module 103 has a width of 0.6 mm, a length of 1.0 mm, and a thickness of 0.2 mm, and is configured as a small and very thin LED module.
- the substrate 133 has a substantially rectangular shape in plan view, and is an insulating substrate made of, for example, glass epoxy resin.
- An LED chip 131 is mounted on the surface of the substrate 133.
- a pair of mounting terminals 134 are formed on the back surface of the substrate 133.
- the thickness of the substrate 133 is about 0.05 to 0.08 mm.
- the LED chip 131 is a light source of the LED module 103 and can emit visible light, for example.
- the resin package 132 is for protecting the LED chip 131.
- the resin package 132 is made of, for example, an epoxy resin having translucency with respect to the light from the LED chip 131, or a translucent resin containing a fluorescent material that emits light of different wavelengths when excited by the light from the LED chip 131. It is molded using.
- the LED module 103 can emit white light by mixing blue light from the LED chip 131 and yellow light from the fluorescent material contained in the resin package 132.
- the fluorescent material materials emitting red light and green light may be used instead of materials emitting yellow light.
- a wiring pattern 102 is formed on the substrate 101.
- the wiring pattern 102 is made of, for example, a metal film such as copper, and is for mounting a plurality of LED modules 103 and supplying power to them.
- the wiring pattern 102 has a plurality of pad portions 122.
- a portion of the wiring pattern 102 other than the portion for mounting the LED module 103 is covered with an insulating layer (not shown) having a high reflectance such as a white resist.
- the plurality of pad portions 122 are portions where a plurality of LED modules 103 are mounted.
- the pad portion 122 includes an anode straight portion 123A (black in the drawing) and a cathode straight portion 123B (grey in the drawing).
- the anode straight portion 123A and the cathode straight portion 123B each extend in the longitudinal direction X, and are arranged in parallel in the width direction Y with an interval therebetween. Thereby, all of the plurality of pad portions 122 extend along the longitudinal direction X. Further, many of the plurality of pad portions 122 are arranged in parallel with a gap in the width direction Y. Further, some pad portions 122 are arranged in series at intervals in the longitudinal direction X.
- the LED module 103 is mounted on the pad portion 122 by soldering, for example, one of the pair of mounting terminals 134 to the anode straight portion 123A and the other to the cathode straight portion 123B. Thereby, the plurality of LED modules 103 mounted on one pad portion 122 are connected in parallel to each other. In addition, two groups of a plurality of LED modules 103 connected in parallel are arranged across the skew connecting portion 125. In the two pad portions 122 arranged on both sides of the skew connecting portion 125, the arrangement of the anode straight portion 123A and the cathode straight portion 123B is the same in the width direction Y.
- the skew connecting portion 125 connects the anode straight portion 123 ⁇ / b> A of one pad portion 122 and the cathode straight portion 123 ⁇ / b> B of the other pad portion 122. Thereby, the plurality of LED modules 103 belonging to these two groups are connected in series with each other.
- a plurality of LED modules 103 that is, a plurality of LED chips 131 are connected as shown in FIG.
- the plurality of LED modules 103 are divided into a plurality of groups 131A.
- the group 131A includes a plurality of LED modules 103 connected in parallel to each other. These groups 131A are connected to each other in series.
- a series circuit of the plurality of groups 131A is connected to a power supply unit formed on the power supply substrate 104 (see FIG. 29). As this power supply unit, the same unit as the constant current power supply unit shown in FIG. 10 can be applied.
- each LED module 103 (LED chip 131) is 20 mA, whereas the actually flowing current If is, for example, 4.0 mA or less.
- the naked eye does not visually recognize the set of point light sources but visually recognizes the surface light emission. That is, the area where the plurality of LED modules 103 are mounted constitutes a planar light source unit 103A.
- the number of LED modules 103 mounted is 600 or more. More preferably, the number of mounted LED modules 103 is 1000 or more, 4000 or more, 8000 or more, and further 12000 or more. In the case where the LED lamp A11 has a size equivalent to a 20-type straight tube fluorescent lamp (substrate is about 1.7 cm ⁇ 58 cm), the number of LED modules 103 mounted is 290 or more. More preferably, the number of LED modules 103 mounted is 480 or more, 1900 or more, 3900 or more, and further 5800 or more.
- the number of LED modules 103 mounted is 200 or more. More preferably, the number of mounted LED modules 103 is 330 or more, 1300 or more, 2700 or more, and further 4000 or more.
- the number of mounted LED modules 103 is 150 or more. More preferably, the number of mounted LED modules 103 is 250 or more, 1000 or more, 2000 or more, and further 3000 or more.
- the gap between adjacent LED modules 103 is the case where the distance between the LED modules is shortened, and the distance is about 0.5 mm.
- the number of LED modules 103 mounted on the area of the substrate 101 1.7 cm ⁇ 120 cm: corresponding to the opening area where the planar light source unit faces the illumination space
- approximately 60 / cm 2 (12000 / (1. 7 cm ⁇ 120 cm) when an interval is provided between the LED modules 103, the number of LED modules 103 mounted on the area of the substrate 101 is about 5 / cm 2 .
- the LED module 103 is further provided with a sufficient space, the number density of the LED modules 103 with respect to the area of the substrate 101 is about 3 / cm 2 .
- the number of LED modules mounted on the area of the substrate 101 is preferably in the range of about 3 / cm 2 to 60 / cm 2 .
- the number of LED modules mounted on the area of the substrate 101 is preferably in the range of about 3 / cm 2 to 60 / cm 2 .
- 5 pieces / cm 2 , 20 pieces / cm 2 , 40 pieces / cm 2, etc. correspond.
- the upper limit is preferably about 36% (0.1 cm ⁇ 0.06 cm ⁇ 12000 / (1.7 cm ⁇ 120 cm)). Further, when the distance between the LED modules is set so that the number of LED modules 103 mounted on the area of the substrate 101 is about 3 / cm 2 , the occupation ratio of the total area of the LED modules 103 to the area of the substrate 101 is About 1.8% (0.1 cm ⁇ 0.06 cm ⁇ 600 / (1.7 cm ⁇ 120 cm)). Therefore, in this case, the occupation ratio of the total area of the LED module 103 to the area of the substrate 101 is preferably about 1.8% or more.
- the number of mounted LED modules 103 (number of columns) in the width direction Y is at least three or more. When the gap between adjacent LED modules 103 is about 0.5 mm, the number of rows reaches 15 rows. More preferably, the mounting number density, which is the mounting number of LED modules 103 per unit length in the longitudinal direction X, is larger than the mounting number density per unit length in the width direction Y. In addition, the occupation ratio of the LED module 103 in the longitudinal direction X is preferably larger than the occupation ratio in the width direction Y. In order to achieve such a configuration, the LED module 103 may have a longitudinal direction along the longitudinal direction X of the substrate 101.
- the heat radiating member 111 is made of, for example, A1l, and has an elongated block shape extending along the longitudinal direction X of the substrate 101 as shown in FIGS. As clearly shown in FIG. 30, the heat radiating member 111 has a hollow semicircular cross section.
- a power supply board 104 and a plurality of power supply components are stored in the hollow portion of the heat dissipation member 111.
- the power supply substrate 104 is made of, for example, glass epoxy resin and is formed in a long rectangular shape.
- the plurality of power supply components 105 function as a power supply circuit for lighting the LED module 103 and are mounted on both surfaces of the power supply substrate 104.
- the plurality of power supply components 105 include an AC / DC converter 151 and other functional components 152 such as a capacitor and a resistor.
- the AC components supplied from the commercial power supply are converted into a DC constant current and supplied to the LED module 103. It is comprised as follows.
- the AC / DC converter 151 occupies a larger space than other components mounted on the power supply board 104.
- the case 106 is for housing the substrate 101 and the heat radiating member 111, and has a straight cylindrical shape with a circular cross section, as clearly shown in FIG. On the inner surface of the case 106, a pair of projecting pieces 161 projecting inward are integrally formed. Case 106 having such a configuration is made of a synthetic resin such as polycarbonate, and is integrally formed by extrusion molding.
- the substrate 101 is restricted from moving in the direction perpendicular to the central axis O ⁇ b> 1 (upward in the figure) with respect to the case 106 by the upper surface 101 a contacting the protruding piece 161.
- the substrate 101 and the heat dissipation member 111 and the power supply substrate 104 are accommodated in the case 106 by inserting the substrate 101 and the heat dissipation member 111 into the case 106 below the protruding piece 161 while sliding.
- the pair of caps 107 are for supplying power from a commercial AC power source by being mounted on a socket of a fluorescent lamp lighting fixture.
- the base 107 includes a bottomed cylindrical cover body 171, a resin block 172 accommodated and held in a hollow portion of the cover body 171, and two terminals 173.
- the heat radiating member 111 is supported by a pair of caps 107.
- the terminal 173 and the power supply substrate 104 are connected by an electric wire.
- the terminal 173 is provided so as to penetrate the cover body 171 and the resin block 172.
- One end portion (outer end portion) of the terminal 173 is a portion that fits into the insertion port of the socket of the fluorescent lamp lighting fixture, and the other end portion of the terminal 173 is between the wiring 102 of the substrate 101. Electrical continuity is achieved.
- the operation of the LED lamp A11 will be described.
- light is emitted from the planar light source unit 103 ⁇ / b> A formed by the plurality of LED modules 103.
- the light from the planar light source unit 103A is light having uniform brightness as a whole, unlike a plurality of bright shining points being recognized. .
- uniform light can be emitted from the LED lamp A11 without providing the case 106 with a strong diffusion function. This is suitable for suppressing the attenuation of light by the case 106, and the luminous efficiency of the LED lamp A11 can be increased.
- the number of LED modules 103 mounted be the above-described number, density, or occupation ratio.
- the fact that the LED modules 103 are more densely arranged in the longitudinal direction X than in the width direction Y is that light from the LED lamp A11 having a straight tube shape appears uneven in the longitudinal direction X. It is suitable to suppress the occurrence.
- the LED module 103 As the magnitude of the current If flowing through the LED module 103 (LED chip 131), a value of 4.0 mA or less is a relatively low current. In the case of the LED module 103 having a specification to be used in the present embodiment, the smaller the current If, the smaller the proportion of input power consumed for heat generation. That is, as in the case of the first embodiment described above, the LED module 103 can obtain excellent luminous efficiency when driven with a current of 8 mA or less (more preferably 4 mA or less). In other words, when the LED module 103 (LED chip 131) is driven with a current of 20% or less (more preferably 40% or less) of the rated current, an excellent luminous efficiency can be obtained.
- the LED module 103 it is preferable to drive the LED module 103 with a current of 8 mA (40% of the rated current) or less (more preferably 4 mA (20% of the rated current) or less).
- the skew connecting portion 125 By providing the skew connecting portion 125, it is possible to connect the plurality of LED modules 103 arranged in the longitudinal direction X so as to belong to a plurality of groups connected in series with each other. Arranging the plurality of LED modules 103 in an orderly manner is important for obtaining uniform surface light emission. Connecting the plurality of LED modules 103 so as to belong to a plurality of groups connected in series with each other makes the magnitude of the current If flowing through each LED module 103 low and suitable for high-efficiency light emission. It is convenient to set the voltage between the electrode 121A and the cathode electrode 121B to about 27 V, which is relatively easy to perform constant current control.
- the substrate temperature is 50 to 60 ° C.
- the temperature of the substrate 101 is 40 to 45 ° C. This is considered to be because heat radiation is promoted in the present embodiment in which the LED chips 131 that are heat sources are mounted in a more dispersed manner even when the input power is the same.
- the heat radiation at the time of illumination can be performed comparatively advantageously.
- a pair of protruding pieces 161 are provided inside the case 106, and these protruding pieces 161 abut against the upper surface 101 a at both ends in the width direction Y of the substrate 101, thereby The movement of the case 106 in the direction perpendicular to the central axis O1 (the radial direction of the case 106) is restricted.
- the substrate 101 can be positioned relative to the case 106 only by inserting the substrate 101 into the case 106. Therefore, the assembly work of the LED lamp A11 can be easily performed.
- FIG. 36 shows a modification of the arrangement configuration of the LED modules 103 in the LED lamp A11.
- most of the plurality of LED modules 103 emit white light as described above, and a small amount of LED modules 103r emit red light.
- the LED modules 103r are discretely arranged across the LED modules 103 that emit a predetermined number of white light. According to such a configuration, it is possible to emit light having a deep color and so-called color rendering properties, which is deeper than white light obtained by mixing only blue light and yellow light.
- the LED module 103 has a plan view dimension of 1.6 mm ⁇ 0.8 mm and a height of about 0.55 mm. In this case, if the gap between adjacent LED modules 103 is 0.5 mm, the occupation ratio of the total area of the LED modules 103 to the area of the substrate 101 can be increased to about 47%.
- the LED module 103 includes a case 135.
- the case 135 is made of, for example, white resin, and has a reflective surface 135a surrounding the LED chip 131 and the resin package 132.
- the reflective surface 135a is for reflecting light that travels laterally from the LED chip 131 so as to be directed upward.
- the LED module 103 belongs to a relatively high luminance type.
- the LED module 103 has a size in plan view of 4.0 mm ⁇ 2.0 mm and a height of about 0.55 mm. In this case, if the gap between adjacent LED modules 103 is 0.5 mm, the occupation ratio of the total area of the LED modules 103 to the area of the substrate 101 can be increased to about 70%.
- the LED lamp A12 of this embodiment is different from the fourth embodiment described above in the configuration of the substrate 101 and the heat dissipation member 111.
- a flexible wiring board composed of a relatively thin resin layer (not shown) and a metal wiring layer (not shown) is used as the substrate 101.
- Such a substrate 101 is rich in flexibility and is wound around a heat radiation member 111 having a cylindrical shape. For this reason, the width direction y of the board
- substrate 101 is the circumferential direction of the heat radiating member 111 in this embodiment.
- the metal wiring layer of the substrate 101 has the same configuration as the wiring pattern 102 of the above-described embodiment, and a plurality of LED modules 103 are mounted.
- the plurality of LED modules 103 are arranged in a staggered pattern at a high density. Even in such an embodiment, the luminous efficiency of the LED lamp A12 can be increased.
- the LED lamp A12 has a form in which the entire surface of the cylinder emits light when the plurality of LED modules 103 emit light. For this reason, the diffusion function by the case 106 can be further weakened. This leads to an increase in the transmittance of the case 106 and is advantageous in increasing the luminous efficiency of the LED lamp A12.
- the area of the substrate 101 on which the LED module 103 can be mounted can be dramatically increased, which is suitable for increasing the number of mounted LED modules 103.
- the number of LED modules 103 mounted is about 9400 when the LED lamp A12 is equivalent to the 10 type, about 12,500 when the LED lamp is 15 type, about 18000 when the 20 type is, and about 40 types. Can be increased to 37,000.
- the LED lamp A13 of the present embodiment is different from the above-described embodiment in the configuration of the heat dissipation member 111 and the arrangement of the plurality of electronic components 105.
- a plurality of recesses 111a are formed on the surface of the heat dissipation member 111, and have a shape with irregularities.
- the recess 111 a is formed over substantially the entire length of the heat dissipation member 111 along the longitudinal direction x of the substrate 101.
- the power supply substrate 104 is attached to the substrate 101 by a plurality of metal leads 141.
- one end of the plurality of leads 141 is fixed to both longitudinal ends of the power supply substrate 104 by soldering, and the other end is a pad (not shown) provided on the upper surface 101 a of the substrate 101. Soldered.
- the power supply substrate 104 is disposed away from the substrate 101 or the heat dissipation member 111. Note that the wiring of the substrate 101 and the wiring of the power supply substrate 104 are electrically connected via leads 141.
- the protruding piece 161 is biased downward (in the radial direction) from the central axis O1 of the case 106, protrudes in a plane parallel to the central axis O1, and extends in the direction along the central axis O1. It extends.
- the substrate 101 is in a position offset from the central axis O1 of the case 106 to the side opposite to the upper surface 101a, and the power supply substrate 104 is positioned in the vicinity of the central axis O1 of the case 106.
- the width dimension of the power supply substrate 104 can be made larger than the width dimension of the substrate 101.
- the substrate 101, the heat dissipation member 111, and the power supply substrate 104 are accommodated in the case 106 by inserting the substrate 101 and the heat dissipation member 111 into the case 106 below the projecting piece 161.
- the base 107 includes a bottomed cylindrical cover body 171, a resin block 172 accommodated and held in a hollow portion of the cover body 171, and two terminals 173.
- a recess 172 a is formed in the resin block 172, and the base 107 is attached to the heat dissipating member 111 by inserting the end portion X in the longitudinal direction of the heat dissipating member 111 into the recess 172 a. Thereby, in the LED lamp A13, the heat dissipation member 111 is supported by the pair of caps 107.
- a partially cylindrical gap is provided between the cover body 171 and the resin block 172, and both ends in the longitudinal direction X of the case 106 are inserted into the gap when the base 107 is attached to the heat dissipation member 111. ing.
- a gap is provided between the front end edge 106 a of the case 106 in the longitudinal direction X and the end edge 172 b of the resin block 172.
- the AC / DC converter 151 having a relatively large size can be appropriately arranged in the case 106. Further, even if the case 106 is thermally expanded, it is possible to suppress interference with the base 107.
- the LED lamp according to the present invention is not limited to the embodiment described above. The specific configuration of each part of the LED lamp according to the present invention can be varied in design in various ways.
- a configuration having a plurality of LED modules 103 that emit light having different wavelengths may be employed.
- the LED module 103 which emits a light bulb color and the LED module 103 which emits a daylight color.
- the LED module 103 is not limited to the one provided with one LED chip 131, and may be configured to include, for example, three LED chips 131 that emit red light, green light, and blue light.
- A1, A2, A3 ... Illumination device D1 ... (substrate side opening) diameter, D2 ... (exit side opening) diameter, x ... (second) direction, y ... (first) direction, H ... distance, 1 ... substrate DESCRIPTION OF SYMBOLS 2 ... Wiring pattern, 3 ... LED module, 3A ... Planar light source part, 4 ... Reflector, 5 ... Housing, 6 ... Connector, 7 ... Holder, 8 ... Support substrate, 9 ... Support
- Varistor 71 ... Inductor, 72,73 ... Capacitor, 74 ... Diode 75 ... Constant current driver, 75a, 75b ... Power supply terminal, 75c ... Control terminal, 75d, 75e ... Output terminal, 76-78 ... Smoothing capacitor, 79 ... Current setting resistor element, 80, 81 ... DC power supply line, 82 , 83 ... Output terminal, 84, 85 ... Output line, 86, 87 ... Lead wire, A11, A12, A13 ... LED lamp, 101 ... Substrate, 101a ... Upper surface, 102 ... Wiring pattern , 103, 103r ... LED module, 103A ... planar light source unit, 104 ...
- power supply board 104a ... upper surface, 104b ... lower surface, 105 ... power supply component, 106 ... case, 107 ... base, 111 ... heat dissipation member, 122 ... pad part , 123A ... straight line portion of anode, 123B ... straight line portion of cathode, 125 ... skewed connection portion, 131 ... LED chip, 131A ... group, 132 ... resin package, 133 ... substrate, 134 ... mounting terminal, 151 ... AC / DC converter, 161 ... projecting piece, 171 ... cover body, 172 ... resin block, 173 ... terminal
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- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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- Led Devices (AREA)
Abstract
Description
較して、エネルギー効率が劣っていた。
また、ハロゲンランプからあらゆる方向に出射する光を所望の方向に向かわせるには、上記リフレクタの形状は、たとえば断面放物線状の比較的大きなものとなってしまう。したがって、上記照明装置を取り付けるためには、天井に相応のスペースを確保することが必要であった。
この発明の一つの具体的な目的は、エネルギー効率が優れており、省スペース化を図ることが可能な照明装置を提供することである。
この発明の他の具体的な目的は、均一な輝度の光を発し、かつ発光効率を高めることが可能なLEDランプの形態の照明装置を提供することである。
また、LEDチップ1個当たりの駆動電流が大きい場合には、個々のLEDチップの輝度が大きくなり、照度むらが生じるおそれがある。より具体的には、照明装置から近距離にある物体表面(たとえば壁面)に縞状等の濃淡模様が形成されるおそれがある。これに対して、1チップ当たりの駆動電流を前述の範囲に設計すると、照度むらを効果的に抑制することができる。すなわち、発光効率の向上および照度むらの抑制を併せて達成することができる。
より具体的には、上記照明装置は、上記複数のLEDチップに電流を供給する定電流電源をさらに含み、上記複数のグループが上記定電流電源に直列に接続されていてもよい。これにより、定電流電源から供給される電流は、各グループにおいて、並列接続された複数のLEDチップに分配される。したがって、個々のLEDチップの駆動電流は、各グループを構成するLEDチップの個数(並列数)に応じた値となる。
この場合に、上記開口面積に対する上記複数のLEDモジュールの占有面積割合が、20%以上であることが好ましい。
また、本発明の好ましい実施形態においては、上記複数のLEDモジュールは、上記1対の実装端子が第1方向において離間する姿勢で、それぞれが上記第1方向と直角である第2方向に沿うように互いに平行に配置された複数の列をなすように配置されている。このような構成によれば、均一な面発光を実現するのに有利である。
本発明の好ましい実施の形態においては、上記基板には、それぞれが、上記第2方向に延びており、かつ上記第1方向に離間して平行に配置されたアノード直線部およびカソード直線部からなる、複数のパッド部と、上記複数のパッド部のうち上記第2方向において隣り合い、かつ上記第1方向においてそれぞれのアノード直線部およびカソード直線部が同じ側に配置されたものの一方の上記アノード直線部と他方の上記カソード直線部を連結する斜行連結部と、を有する配線パターンが形成されており、上記複数のLEDモジュールは、上記アノード直線部および上記カソード直線部にまたがるように実装されている。
本発明の好ましい実施の形態においては、上記配線パターンは、上記複数のパッド部のうち上記第2方向において隣り合い、かつ上記第1方向においてそれぞれのアノード直線部およびカソード直線部が反対側に配置されたものの一方の上記アノード直線部と他方の上記カソード直線部を連結する直行連結部をさらに有する。
本発明の好ましい実施の形態においては、上記配線パターンは、上記基板の端部寄りに配置されており、上記基板の端縁に沿った外形を有するアノード拡幅部およびカソード拡幅部の少なくともいずれかを有する。このような構成によれば、上記LEDチップから発生した熱を上記アノード拡幅部および上記カソード拡幅部の少なくともいずれかを介して放散するのに適している。
本発明の好ましい実施の形態においては、上記基板は円形状であり、上記基板の上記複数のLEDチップが搭載された面の法線方向に向かって末広がり状とされ、かつ上記面状光源部を囲むリフレクタをさらに備えており、上記リフレクタの上記基板側の基板側開口直径D1と上記基板とは反対側の出射側開口直径D2とが、0.5≦D1/D2≦0.69であり、かつ上記基板側開口および上記出射側開口の距離Hと上記出射側開口直径D2とが、0.3≦H/D2≦0.55とされている。このような構成によれば、上記照明装置によって、明瞭かつ均一に照射するのに好ましい。
本発明の好ましい実施の形態においては、上記リフレクタの基板側開口面積に対する上記複数のLEDチップの搭載個数密度が、25個/cm2以上である。
本発明の好ましい実施の形態においては、上記リフレクタの基板側開口面積に対する上記複数のLEDチップの搭載個数密度が、60個/cm2以上である。
本発明の好ましい実施の形態においては、上記リフレクタの基板側開口面積に対する上記複数のLEDモジュールの占有面積割合が、70%以上である。
このような構成によれば、上記面状光源部を複数の点光源の集合ではなく、発光面として視認させるのに好ましい。上記搭載個数密度が、60個/cm2以上または上記占有面積割合が、70%以上であるという構成は、上記LEDモジュール間に0.5mm程度の隙間を確保しても実現可能であり、上記LEDモジュールを上記基板に搭載するためのいわゆるマウンターとして一般的なものを用いることができるという利点がある。
上記リフレクタの表面は、凹凸状の金属面とされている。このような構成によれば、上記照明装置からの光を均一化するのに有利である。
本発明の好ましい実施の形態においては、上記各LEDモジュールは、その平面視寸法が1.6mm×0.8mm以下である。
本発明の好ましい実施の形態においては、上記各LEDモジュールは、その高さが0.2mm以下である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールの個数が、4000個以上である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールの個数が、8000個以上である。
本発明の第3の側面によって提供される照明装置は、帯状の基板と、上記基板に配置された複数のLEDチップと、を備えるLEDランプの形態を有する。このLEDランプは、それぞれが、1以上の上記LEDチップと、互いに離間配置された1対の実装端子とを有する複数のLEDモジュールを備えている。そして、LEDランプは、20形直管形蛍光ランプ相当の形状およびサイズを有している。上記複数のLEDモジュールの個数は、290個以上である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールの個数が、1900個以上である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールの個数が、3900個以上である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールの個数が、5800個以上である
本発明の第4の側面によって提供される照明装置は、帯状の基板と、上記基板に配置された複数のLEDチップと、を備えるLEDランプの形態を有する。このLEDランプは、それぞれが、1以上の上記LEDチップと、互いに離間配置された1対の実装端子とを有する複数のLEDモジュールを備えている。そして、LEDランプは、15形直管形蛍光ランプ相当の形状およびサイズを有している。上記複数のLEDモジュールの個数は、200個以上である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールの個数が、1300個以上である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールの個数が、2700個以上である。
本発明の第5の側面によって提供される照明装置は、帯状の基板と、上記基板に配置された複数のLEDチップと、を備えるLEDランプとしての形態を有している。このLEDランプは、それぞれが、1以上の上記LEDチップと、互いに離間配置された1対の実装端子とを有する複数のLEDモジュールを備えている。LEDランプは、10形直管形蛍光ランプ相当の形状およびサイズを有している。上記複数のLEDモジュールの個数は、150個以上である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールの個数が、1000個以上である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールの個数が、2000個以上である。
本発明の好ましい実施の形態においては、上記各LEDモジュールは、その平面視寸法が1.0mm×0.6mm以下である。
本発明の好ましい実施の形態においては、上記各LEDモジュールは、その平面視寸法が1.6mm×0.8mm以下である。
本発明の第6の側面によって提供されるLEDランプは、帯状の基板と、上記基板に配置された複数のLEDチップと、を備えるLEDランプとしての形態を有している。このLEDランプは、それぞれが、1以上の上記LEDチップと、互いに離間配置された1対の実装端子とを有する複数のLEDモジュールを備えている。上記基板の面積に対する上記複数のLEDモジュールの搭載個数密度は、3.0個/cm2以上である。
本発明の好ましい実施の形態においては、上記基板の面積に対する上記複数のLEDモジュールの搭載個数密度が、20個/cm2以上である。
本発明の好ましい実施の形態においては、上記基板の面積に対する上記複数のLEDモジュールの搭載個数密度が、40個/cm2以上である。
本発明の好ましい実施の形態においては、上記基板の幅方向における上記複数のLEDモジュールの搭載個数が3個以上である。
本発明の好ましい実施の形態においては、上記基板の長手方向における上記複数のLEDモジュールの搭載個数密度が、上記基板の幅方向における上記複数のLEDモジュールの搭載個数密度よりも大である。
本発明の好ましい実施の形態においては、上記各LEDモジュールは、その平面視寸法が1.6mm×0.8mm以下である。
本発明の好ましい実施の形態においては、上記各LEDモジュールは、その高さが0.2mm以下である。
本発明の好ましい実施の形態においては、上記基板の面積に対する上記複数のLEDモジュールの占有面積割合が、45%以上である。
本発明の好ましい実施の形態においては、上記基板の面積に対する上記複数のLEDモジュールの占有面積割合が、70%以上である。
本発明の好ましい実施の形態においては、上記各LEDモジュールは、その平面視寸法が1.6mm×0.8mm以下である。
本発明の好ましい実施の形態においては、上記各LEDモジュールは、その高さが0.2mm以下である。
本発明の好ましい実施の形態においては、上記複数のLEDモジュールは、発する光の波長が互いに異なるものを含む。
本発明の好ましい実施の形態においては、上記各LEDチップに流れる電流は、その定格電流の20%以下である。
本発明の好ましい実施の形態においては、上記基板を収容する断面円形管状のケースをさらに有する。
本発明の好ましい実施の形態においては、それぞれが、1以上の上記LEDチップと、互いに離間配置された1対の実装端子とを有する複数のLEDモジュールを備えており、上記複数のLEDモジュールは、上記1対の実装端子が上記基板の幅方向において離間する姿勢で、それぞれが上記基板の長手方向に沿うように互いに平行に配置された複数の列をなすように配置されている。
本発明の好ましい実施の形態においては、上記基板は、樹脂層と金属配線層とが積層された可撓性を有するフレキシブル配線基板であり、かつ断面形状が、円形状または円弧形状とされている。
このような構成によれば、複数のLEDチップ(あるいは複数のLEDモジュール)から発せられる光は、肉眼によっては点光源からの光とは認識されず、面状光として認識指される。このため、たとえば複数の点光源からの光を面光源と見せかけるほどの拡散を、この面状光に対しては行う必要がない。したがって、上記LEDランプからの光を不当に減衰してしまうことを回避可能であり、上記LEDランプの発光効率を高めることができる。また、上記複数のLEDチップの搭載数が多いほど、各LEDチップに流す電流値を相対的に小さくすることができる。これは、上記LEDチップに投入したエネルギーのうち発熱に消費される割合を小さくするのに有利であり、上記LEDランプの発光効率を高めるのに適している。
図3に示すように、基板1には、配線パターン2が形成されている。配線パターン2は、たとえば銅などの金属膜からなり、複数のLEDモジュール3を実装し、これらに電力供給するためのものである。配線パターン2は、アノード電極21A、カソード電極21B、複数のパッド部22、複数のアノード折り返し部24A、複数のカソード折り返し部24B、複数の斜行連結部25、直行連結部26、アノード接続部27A、およびカソード接続部27Bを有している。配線パターン2のうちLEDモジュール3を実装するための部分以外の部分は、たとえば白色レジストなどの高反射率を有する絶縁層(図示略)によって覆われている。
複数のパッド部22は、複数のLEDモジュール3が実装される部分である。パッド部22は、アノード直線部23A(図中黒色)およびカソード直線部23B(図中灰色)からなる。アノード直線部23Aおよびカソード直線部23Bは、それぞれがx方向に延びており、x方向に直交するy方向に間隔をおいて平行に配置されている。これにより、複数のパッド部22は、すべてがx方向に沿って延びている。また、複数のパッド部22の多くは、y方向に間隔を隔てて平行に配置されている。さらに、いくつかのパッド部22どうしは、x方向に間隔をおいて直列に配置されている。
図4に示すS1部においては、斜行連結部25を挟んで、並列に接続された複数のLEDモジュール3からなる2つのグループが配置されている。斜行連結部25を挟んで両側に配置された2つのパッド部22は、y方向においてアノード直線部23Aおよびカソード直線部23Bの配置が同じである。斜行連結部25は、一方のパッド部22のアノード直線部23Aと他方のパッド部22のカソード直線部23Bとを連結している。これにより、これらの2つのグループに属する複数のLEDモジュール3は、互いに直列に接続されている。
筐体5は、たとえばアルミからなり、基板1およびリフレクタ4を支持している。LEDモジュール3の発光時には、LEDモジュール3からの熱が基板1を介してリフレクタ4および筐体5に伝えられる。これにより、LEDモジュール3の放熱促進を図っている。コネクタ6は、照明装置A1が天井に設置されるときに、建造物側のコネクタ(図示略)と接続されるものである。ホルダ7は、たとえばステンレス(SUS301)製のプレートを折り曲げ加工したものである。ホルダ7は、照明装置A1を天井に取り付ける際に、天井の一部と係合することにより、照明装置A1を保持する。
サージ保護回路61は、商用交流電源66に接続される一対の給電線67,68の一方に介装されたヒューズ69と、それらの給電線67,68の間に接続されたバリスタ70とを有している。この構成により、当該電源ユニット60を雷サージ等から保護している。
整流回路63は、4個のダイオード74をブリッジ接続して構成されている。この構成によって、整流回路63は、給電線67,68からの交流を全波整流する。
出力端子82,83の間に、リード線88,89を介して、複数のLEDグループ31Aの直列回路が接続される。各LEDグループ31Aを構成する複数のLEDモジュール3は、電源ユニット60に対して、並列に接続されている。したがって、電源ユニット60から供給される定電流制御された電流は、各グループ31Aを構成する複数のLEDモジュール3に分配される。よって、個々のLEDモジュール3に流れる電流(駆動電流)は、電源ユニット60が供給する電流値と、各グループ31AにおけるLEDモジュール3の個数(並列数)とで決まる。そこで、個々のLEDモジュール3の駆動電流が所望の値(たとえば4mA)となるように、電流設定用抵抗素子79の抵抗値および各グループ31Aを構成するLEDモジュール3の個数(並列数)とを設計すればよい。
本実施形態によれば、上記複数のLEDモジュール3が構成する面状光源部3Aから光が発せられる。この面状光源部3Aから発せられる光は、基板1の表面の法線方向を中心として進行するものであり、あらゆる方向に向かうものではない。このため、たとえばハロゲンランプに代表される点光源を備えるダウンライトと比べて、所望の範囲に光を向かわせるためのリフレクタ4を小さくすることが可能である。したがって、照明装置A1の小型化が可能であり、照明装置A1を取り付ける天井の設置スペースを省スペース化することができる。また、LEDモジュール3を千鳥状に配置すれば、均一な面発光を得るのに適している。
LEDモジュール3の個数と照度との関係を図12に示す。この図および前述の表1から、試作例A,B間で照度に実質的な差がないことが分かる。しかも、表1から、試作例A,B間で、発光効率についても有意な差が認められない。したがって、個々のLEDモジュール3の発光効率では試作例Aの方が有利ではあるが、全体の照度および発光効率に差がないことから、LEDモジュール3の個数が少ない試作例Bの方が、コストを削減でき、かつ、製造工数を削減できる点で有利である。
一方、上記試作例Aでは、LEDモジュール3の上記搭載個数密度が31個/cm2程度、あるいは上記占有面積割合が39%程度である。また、上記試作例Bでは、LEDモジュール3の上記搭載個数密度が15個/cm2程度、あるいは上記占有面積割合が20%程度である。さらに、上記試作例Cでは、LEDモジュール3の上記搭載個数密度が8個/cm2程度、あるいは上記占有面積割合が10%程度である。そして、上記試作例Dでは、LEDモジュール3の上記搭載個数密度が6個/cm2程度、あるいは上記占有面積割合が8%程度である。試作例A,Bの範囲の搭載個数密度および占有面積割合が好ましいが、試作例C,Dの場合でも、面状光源部3Aを均一な光を発する発光面として視認することができた。このような均一な面発光を得るには、上記搭載個数密度を5個/cm2以上(好ましくは12個/cm2以上、より好ましくは25個/cm2以上)、あるいは上記占有面積割合を6%以上(好ましくは15%以上、より好ましくは30%以上)とすることが好適である。
また、前述の照明装置A1では、斜行連結部25を備えることにより、x方向に整然と並べられた複数のLEDモジュール3を、互いに直列に接続された複数のグループに属するように、接続することができる。複数のLEDモジュール3を整然と配置することは、均一な面発光を得るのに重要である。複数のLEDモジュール3を互いに直列に接続された複数のグループに属するように接続することは、個々のLEDモジュール3に流す電流Ifの大きさを高効率発光に適した低電流とするとともに、アノード電極21Aおよびカソード電極21B間の電圧を、定電流制御を比較的行いやすい27V程度とするのに都合がよい。
H=50mm、D2=100mm
H=45mm、D2=100mm
H=40mm、D2=100mm
H=55mm、D2=97mm
H=50mm、D2=97mm
H=45mm、D2=97mm
H=40mm、D2=97mm
H=55mm、D2=95mm
H=50mm、D2=95mm
H=45mm、D2=95mm
H=40mm、D2=95mm
H=55mm、D2=90mm
H=50mm、D2=90mm
H=45mm、D2=90mm
H=40mm、D2=90mm
H=0mm、D2=0mm
図17は、D1=60mm、D2=100mmの場合(D1/D2=0.6)に、距離Hをさまざまな値としたときの効率を調べた結果を示す。「効率」とは、ここでは、全出射光量のうち、基板1の法線方向においてリフレクタ4の出射側開口42から1m離れた位置を中心とする一辺3mの正方形受光面に入る光量の割合である。H≧30mmの範囲において高い効率が実現されており、H≧40mmの範囲では、距離Hを大きくしても効率にほとんど変化がない。したがって、低背化の観点から、H=30~40mmとすることが好ましい。
(D1/D2=0.58、H/D2=0.39)
No.2 D1=52mm D2=90mm H=40mm
(D1/D2=0.58、H/D2=0.44)
No.3 D1=52mm D2=90mm H=45mm
(D1/D2=0.58、H/D2=0.50)
No.4 D1=47mm D2=90mm H=35mm
(D1/D2=0.52、H/D2=0.39)
No.5 D1=47mm D2=90mm H=40mm
(D1/D2=0.52、H/D2=0.44)
No.6 D1=47mm D2=90mm H=45mm
(D1/D2=0.52、H/D2=0.50)
No.7 D1=42mm D2=90mm H=35mm
(D1/D2=0.47、H/D2=0.39)
No.8 D1=42mm D2=90mm H=40mm
(D1/D2=0.47、H/D2=0.44)
No.9 D1=42mm D2=90mm H=45mm
(D1/D2=0.47、H/D2=0.50)
No.11 D1=62mm D2=100mm H=55mm
(D1/D2=0.62、H/D2=0.55)
No.12 D1=62mm D2=100mm H=40mm
(D1/D2=0.62、H/D2=0.40)
No.13 D1=62mm D2=90mm H=40mm
(D1/D2=0.69、H/D2=0.44)
No.14 D1=52mm D2=90mm H=40mm
(D1/D2=0.58、H/D2=0.44)
天井穴の直径を100mmとしたとき、射出側開口42の直径D2は90mm程度の大きさをとることができる。この際にD1=52mmとしたときは、図18Aに示すように、射出側開口面から基板1までの距離HをH=35mm、H=40mm、H=45mmと変化させた場合、それぞれの放射照度はNo.1、No.2、No.3に示す波形の値となり、いずれもほぼ同じ値になる。
さらに、図18Cに示すように、D1=42mmとしたときは、H=35mm、H=40mm、H=45mmと変化させた場合、D1=47mmとした場合に比較してよりいっそう放射照度にばらつきが生じてしまう。
一方、D2=90mm、H=40mmとしたままでD1=62mmとすると、No.13に示す波形の放射照度のように、No.14の波形が示す放射照度と比較して、集光の効果が小さくなり、直下の放射照度が弱くなってしまう。
また、各LEDモジュール3に流す電流Ifを小さくすることは、電流Ifを所望の大きさとするための電圧Vfのバラツキを小さくするのに有利であることが、発明者らの研究により判明した。発明者らは、複数個のLEDモジュール3について、電流Ifを10,100,200,300mAに制御したときの電圧Vfを測定しそのバラツキを評価した。その結果、測定された電圧Vfの標準偏差を平均値で割った変動係数は、電流Ifが10,100,200,300mAの順に、0.79、4.6、6.1、5.4であった。変動係数が大きいほど各測定における電圧Vfのバラツキが大きいことを意味する。本計測においては、電流Ifが10mAのときが、それ以外のときと比べて顕著にバラツキが小さい。本実施形態においては、LEDモジュール3に流れる電流Ifは、10mAよりもさらに低い4.0mAであることから、電圧Vfのバラツキが非常に小さいと推測できる。
図19~図27は、本発明に係る照明装置およびその構成部品の他の例を示している。これらの図面において上記実施形態と同一または類似の要素には、上記実施形態と同一の符号を付し、その説明を省略する。
図24に示すように、このLEDモジュール3は、リード35A,35Bおよびリフレクタ36を備えている。リード35A,35Bは、たとえばCu-Ni合金からなる板状部材である。リード35Bには、LEDチップ31が搭載されており、リード35Aは、ワイヤを介してLEDチップ31と導通している。リフレクタ36は、たとえば白色樹脂からなる。リード35A,35Bの下面は、リフレクタ36から露出しており、LEDモジュール3を面実装するための実装端子として用いられている。LEDモジュール3は、そのサイズが、4.0mm×2.0mmである。
このような構成によっても、面状光源部3Aを発光面として視認させることができる。非導通放熱部28を設けることにより、基板1の一部が不当に高温となることを回避することができる。
図26は、本発明の第2実施形態に基づく照明装置を示している。本実施形態の照明装置A2は、筐体5の構成が上述した実施形態と異なっている。本実施形態の筐体5は、底部51および筒部52を有しており、これらが一体的に繋がった構造とされている。底部51には、基板1が接している。
図27は、本発明の第3実施形態に基づく照明装置を示している。本実施形態の照明装置A3は、電源ユニットが照明装置本体とは別に配置される電源別置型である。そのため、前述の実施形態のような筐体5が設けられていない。これにより、照明装置本体を低背化できるので、設置スペースが限られている場合でも施工が可能となる。
たとえば、すべてのLEDモジュール3が同一の波長の光を発する構成のほかに、互いに異なる波長の光を発する複数のLEDモジュール3を備える構成であってもよい。たとえば、電球色を発するLEDモジュール3と昼光色を発するLEDモジュール3とを備える構成としてもよい。この場合、電球色を発するLEDモジュール3と昼光色を発するLEDモジュール3とのうち実際に発光させる割合や、電流Ifの大きさを個々に制御することにより、電球色、温白色、白色、昼白色、昼光色の光を任意に照射することが可能である。あるいは、白色のLEDモジュール3を囲むようにたとえば緑色のLEDモジュール3を配置すれば、常時は、白色のLEDモジュール3を発光させ、緊急時には、緑色のLEDモジュール3を発光させるという使い方ができる。LEDモジュール3は、1つのLEDチップ31を備えるものに限定されず、たとえば赤色光、緑色光、青色光を発する3つのLEDチップ31を備える構成としてもよい。
基板1の色や、配線パターン2を覆うレジストの色を適宜塗り分ければ、LEDモジュール3の非点灯時に任意の模様や文字が現れる構成とすることができる。
基板1の形状は円形に限定されず、正方形に代表される矩形状、六角形などの多角形状などさまざまな形状であってもよい。
図28~図30は、本発明の第4実施形態に係る照明装置としてのLEDランプを示している。本実施形態のLEDランプA11は、基板101、複数のLEDモジュール103、放熱部材111、電源基板104、複数の電源部品105、ケース106、および一対の口金107を備えており、たとえば直管形蛍光ランプの代替として一般用蛍光ランプ照明器具に取り付けて用いられる。
基板101の上面101aには、複数のLEDモジュール103が実装されている。図30に示すように、本実施形態においては、複数のLEDモジュール103は、ケース106の中心軸O1を含む平面に沿って配置されている。図31に示すように、複数のLEDモジュール103は、千鳥状に配置されている。図32~図34に示すように、LEDモジュール103は、LEDチップ131、樹脂パッケージ132、基板133、および1対の実装端子134を備えている。LEDモジュール103は、幅が0.6mm、長さが1.0mm、厚さが0.2mmとされており、小型でありかつ非常に薄型のLEDモジュールとして構成されている。
LEDランプA11が、20形(基板が1.7cm×58cm程度)の直管形蛍光ランプ相当のサイズである場合、LEDモジュール103の搭載個数は、290個以上である。より好ましくは、LEDモジュール103の搭載個数は、480個以上、1900個以上、3900個以上、さらには5800個以上である。
LEDランプA11が、10形(基板が1.7cm×33cm程度)の直管形蛍光ランプ相当のサイズである場合、LEDモジュール103の搭載個数は、150個以上である。より好ましくは、LEDモジュール103の搭載個数は、250個以上、1000個以上、2000個以上、さらには3000個以上である。
電源基板104は、たとえばガラスエポキシ樹脂製であり、長矩形状に形成されている。複数の電源部品105は、LEDモジュール103を点灯させるための電源回路として機能するものであり、電源基板104の両面に実装されている。複数の電源部品105は、AC/DCコンバータ151と、コンデンサや抵抗器などの他の機能部品152とを含み、商用電源から供給される交流を直流定電流に変換してLEDモジュール103に供給するように構成されたものである。AC/DCコンバータ151は、電源基板104に実装される他の部品に比べて、空間に占めるサイズが大きい。
本実施形態によれば、上記複数のLEDモジュール103が構成する面状光源部103Aから光が発せられる。たとえば複数の点光源から発せられる光を観察した場合に、複数の鋭く輝く輝点が認識されるのとは異なり、面状光源部103Aからの光は、全体に均一な輝度を有する光である。このため、たとえばケース106に強力な拡散機能を持たせることなく、LEDランプA11から均一な光を出射することが可能である。これは、ケース106による光の減衰を抑制するのに適しており、LEDランプA11の発光効率を高めることができる。
本実施形態においては、基板101として、比較的薄肉の樹脂層(図示略)と金属配線層(図示略)とからなるフレキシブル配線基板が用いられている。このような基板101は、可撓性に富んでおり、円筒形状とされた放熱部材111に巻きつけられている。このため、基板101の幅方向yは、本実施形態においては放熱部材111の周方向となっている。
このような実施形態によってもLEDランプA12の発光効率を高めることができる。LEDランプA12は、複数のLEDモジュール103が発光することにより、円筒の表面全体が発光するような形態を呈する。このため、ケース106による拡散機能をさらに弱めることが可能である。これは、ケース106の透過率を高めることに繋がり、LEDランプA12の発光効率を高めるのに有利である。
本実施形態においては、図47によく表れているように、放熱部材111の表面には複数の凹部111aが形成されており、凹凸を有する形状となっている。凹部111aは、基板101の長手方向xに沿って放熱部材111のほぼ全長にわたって形成されている。
本発明に係るLEDランプは、上述した実施形態に限定されるものではない。本発明に係るLEDランプの各部の具体的な構成は、種々に設計変更自在である。
この出願は、
2008年8月11日に日本国特許庁に提出された特願2008-206865号、
2008年12月12日に日本国特許庁に提出された特願2008-317048号、
2008年12月22日に日本国特許庁に提出された特願2008-324837号、
2009年1月9日に日本国特許庁に提出された特願2009-3727号、および
2009年4月27日に日本国特許庁に提出された特願2009-108334号、
に対応しており、これらの出願の全開示はここに引用により組み込まれるものとする。
Claims (85)
- 基板と、
照明空間に所定の開口面積で臨み、上記開口面積に対する搭載個数密度が3個/cm2以上となるように上記基板に配置された複数のLEDチップを含む面状光源部と、
を備える、照明装置。 - 上記複数のLEDチップは、1チップ当たりの駆動電流が、当該チップの定格電流の40%以下である、請求項1に記載の照明装置。
- 上記複数のLEDチップは、1チップ当たりの駆動電流が、当該チップの定格電流の20%以下である、請求項1に記載の照明装置。
- 上記複数のLEDチップは、1チップ当たりの駆動電流が、当該チップの定格電流の20±3%の範囲内の値である、請求項1に記載の照明装置。
- 上記複数のLEDチップは、1チップあたりの駆動電流が8mA以下である、請求項1に記載の照明装置。
- 上記複数のLEDチップは、1チップ当たりの駆動電流が4mA以下である、請求項1に記載の照明装置。
- 上記複数のLEDチップは、互いに直列に接続された複数のグループに属しており、
上記各グループに属する上記複数のLEDチップは、互いに並列に接続されている、請求項1~6のいずれか一項に記載の照明装置。 - 上記複数のLEDチップに電流を供給する定電流電源をさらに含み、
上記複数のグループが上記定電流電源に直列に接続されている、請求項7に記載の照明装置。 - 上記各グループのLEDチップの個数が、LEDチップ1個当たりの駆動電流が当該チップの定格電流の40%以下となるように選択されている、請求項8に記載の照明装置。
- 上記各グループのLEDチップの個数が、LEDチップ1個当たりの駆動電流が当該チップの定格電流の20%以下となるように選択されている、請求項8に記載の照明装置。
- 上記各グループのLEDチップの個数が、LEDチップ1個当たりの駆動電流が当該チップの定格電流の20%±3%の範囲内の値となるように選択されている、請求項8に記載の照明装置。
- 上記各グループのLEDチップの個数が、LEDチップ1個当たりの駆動電流が8mA以下となるように選択されている、請求項8に記載の照明装置。
- 上記各グループのLEDチップの個数が、LEDチップ1個当たりの駆動電流が4mA以下となるように選択されている、請求項8に記載の照明装置。
- それぞれが、1以上の上記LEDチップと、互いに離間配置された1対の実装端子とを有する複数のLEDモジュールを備えている、請求項1~13のいずれか一項に記載の照明装置。
- 上記開口面積に対する上記複数のLEDモジュールの占有面積割合が、20%以上である、請求項14に記載の照明装置。
- 上記複数のLEDモジュールは、上記1対の実装端子が第1方向において離間する姿勢で、それぞれが上記第1方向と直角である第2方向に沿うように互いに平行に配置された複数の列をなすように配置されている、請求項14または15に記載の照明装置。
- 上記複数のLEDモジュールは、千鳥状に配置されている、請求項16に記載の照明装置。
- 上記基板には、
それぞれが、上記第2方向に延びており、かつ上記第1方向に離間して平行に配置されたアノード直線部およびカソード直線部からなる、複数のパッド部と、
上記複数のパッド部のうち上記第2方向において隣り合い、かつ上記第1方向においてそれぞれのアノード直線部およびカソード直線部が同じ側に配置されたものの一方の上記アノード直線部と他方の上記カソード直線部を連結する斜行連結部と、
を有する配線パターンが形成されており、
上記複数のLEDモジュールは、上記アノード直線部および上記カソード直線部にまたがるように実装されている、請求項16または17に記載の照明装置。 - 上記配線パターンは、上記第1方向において隣り合う上記アノード直線部を連結するアノード折り返し部、および上記第1方向において隣り合う上記カソード直線部を連結するカソード折り返し部を有する、請求項18に記載の照明装置。
- 上記配線パターンは、上記複数のパッド部のうち上記第2方向において隣り合い、かつ上記第1方向においてそれぞれのアノード直線部およびカソード直線部が反対側に配置されたものの一方の上記アノード直線部と他方の上記カソード直線部を連結する直行連結部をさらに有する、請求項18または19に記載の照明装置。
- 上記複数のパッド部に対して上記第2方向一方寄りに配置された、アノード電極およびカソード電極をさらに備える、請求項20に記載の照明装置
- 上記カソード直線部または上記アノード直線部が、平面視において上記各LEDモジュールの上記LEDチップと重なる幅とされている、請求項18~21のいずれか一項に記載の照明装置。
- 上記配線パターンは、上記基板の端部寄りに配置されており、上記基板の端縁に沿った外形を有するアノード拡幅部およびカソード拡幅部の少なくともいずれかを有する、請求項18~22のいずれか一項に記載の照明装置。
- 上記配線パターンは、上記アノード直線部および上記カソード直線部と非導通とされており、かつ上記アノード直線部および上記カソード直線部に対して上記基板の端部寄りに位置する非導通放熱部を有する、請求項18~23のいずれか一項に記載の照明装置。
- 上記基板は円形状であり、
上記基板の上記複数のLEDチップが搭載された面の法線方向に向かって末広がり状とされ、かつ上記面状光源部を囲むリフレクタをさらに備えており、
上記リフレクタの上記基板側の基板側開口直径D1と上記基板とは反対側の出射側開口直径D2とが、0.5≦D1/D2≦0.69であり、かつ上記基板側開口および上記出射側開口の距離Hと上記出射側開口側直径D2とが、0.3≦H/D2≦0.55とされている、請求項1ないし24のいずれか一項に記載の照明装置。 - 上記リフレクタの基板側開口面積に対する上記複数のLEDチップの搭載個数密度が、3.0個/cm2以上である、請求項25に記載の照明装置。
- 上記リフレクタの基板側開口面積に対する上記複数のLEDチップの搭載個数密度が、25個/cm2以上である、請求項25に記載の照明装置。
- 上記リフレクタの基板側開口面積に対する上記複数のLEDチップの搭載個数密度が、60個/cm2以上である、請求項25に記載の照明装置。
- 1以上の上記LEDチップと、互いに離間配置された1対の実装端子とを有する複数のLEDモジュールを備えており、
上記リフレクタの基板側開口面積に対する上記複数のLEDモジュールの占有面積割合が、30%以上である、請求項25に記載の照明装置。 - それぞれが、1以上の上記LEDチップと、互いに離間配置された1対の実装端子とを有する複数のLEDモジュールを備えており、
上記リフレクタの基板側開口面積に対する上記複数のLEDモジュールの占有面積割合が、70%以上である、請求項25に記載の照明装置。 - 上記基板に対して上記リフレクタとは反対側に配置されており、
上記基板が接する底部と、上記底部に一体的に繋がる筒部とを有する、金属からなる筐体をさらに備える、請求項25~30のいずれか一項に記載の照明装置。 - 上記リフレクタの表面は、凹凸状の金属面とされている、請求項25~31のいずれか一項に記載の照明装置。
- 上記基板が帯状の基板であり、
40形直管形蛍光ランプ相当の形状およびサイズを有し、かつ、
上記複数のLEDモジュールの個数が600個以上である、請求項14または15に記載の照明装置。 - 上記各LEDモジュールは、その平面視寸法が1.0mm×0.6mm以下である、請求項33に記載の照明装置。
- 上記各LEDモジュールは、その平面視寸法が1.6mm×0.8mm以下である、請求項33に記載の照明装置。
- 上記各LEDモジュールは、その高さが0.2mm以下である、請求項33~35のいずれか一項に記載の照明装置。
- 上記複数のLEDモジュールの個数が、1000個以上である、請求項33~36のいずれか一項に記載の照明装置。
- 上記複数のLEDモジュールの個数が、4000個以上である、請求項33~36のいずれか一項に記載の照明装置。
- 上記複数のLEDモジュールの個数が、8000個以上である、請求項33~36のいずれか一項に記載の照明装置。
- 上記複数のLEDモジュールの個数が、12000個以上である、請求項33~36のいずれか一項に記載の照明装置。
- 上記基板が帯状の基板であり、
20形直管形蛍光ランプ相当の形状およびサイズを有し、かつ、
上記複数のLEDモジュールの個数が290個以上である、請求項14または15に記載の照明装置。 - 上記複数のLEDモジュールの個数が、480個以上である、請求項41に記載の照明装置。
- 上記複数のLEDモジュールの個数が、1900個以上である、請求項41に記載の照明装置。
- 上記複数のLEDモジュールの個数が、3900個以上である、請求項41に記載の照明装置。
- 上記複数のLEDモジュールの個数が、5800個以上である、請求項41に記載の照明装置。
- 上記基板が帯状の基板であり、
15形直管形蛍光ランプ相当の形状およびサイズを有し、かつ、
上記複数のLEDモジュールの個数が200個以上である、請求項14または15に記載の照明装置。 - 上記複数のLEDモジュールの個数が、330個以上である、請求項46に記載の照明装置。
- 上記複数のLEDモジュールの個数が、1300個以上である、請求項46に記載の照明装置。
- 上記複数のLEDモジュールの個数が、2700個以上である、請求項46に記載の照明装置。
- 上記複数のLEDモジュールの個数が、4000個以上である、請求項46に記載の照明装置。
- 上記基板が帯状の基板であり、
10形直管形蛍光ランプ相当の形状およびサイズを有し、かつ、
上記複数のLEDモジュールの個数が150個以上である、請求項14または15記載の照明装置。 - 上記複数のLEDモジュールの個数が、250個以上である、請求項51に記載の照明装置。
- 上記複数のLEDモジュールの個数が、1000個以上である、請求項51に記載の照明装置。
- 上記複数のLEDモジュールの個数が、2000個以上である、請求項51に記載の照明装置。
- 上記複数のLEDモジュールの個数が、3000個以上である、請求項51に記載の照明装置。
- 上記各LEDモジュールは、その平面視寸法が1.0mm×0.6mm以下である、請求項41~55のいずれか一項に記載の照明装置。
- 上記各LEDモジュールは、その平面視寸法が1.6mm×0.8mm以下である、請求項41~55のいずれか一項に記載の照明装置。
- 上記各LEDモジュールは、その高さが0.2mm以下である、請求項41~57のいずれか一項に記載の照明装置。
- 上記基板が帯状の基板であり、
上記基板の面積に対する上記複数のLEDモジュールの搭載個数密度が、3.0個/cm2以上である、請求項14または15に記載の照明装置。 - 上記基板の面積に対する上記複数のLEDモジュールの搭載個数密度が、5.0個/cm2以上である、請求項59に記載の照明装置。
- 上記基板の面積に対する上記複数のLEDモジュールの搭載個数密度が、20個/cm2以上である、請求項59に記載の照明装置。
- 上記基板の面積に対する上記複数のLEDモジュールの搭載個数密度が、40個/cm2以上である、請求項59に記載の照明装置。
- 上記基板の面積に対する上記複数のLEDモジュールの搭載個数密度が、60個/cm2以上である、請求項59に記載の照明装置。
- 上記基板の幅方向における上記複数のLEDモジュールの搭載個数が3個以上である、請求項59~63のいずれか一項に記載の照明装置。
- 上記基板の長手方向における上記複数のLEDモジュールの搭載個数密度が、上記基板の幅方向における上記複数のLEDモジュールの搭載個数密度よりも大である、請求項59~63のいずれか一項に記載の照明装置。
- 上記各LEDモジュールは、その平面視寸法が1.0mm×0.6mm以下である、請求項59~65のいずれか一項に記載の照明装置。
- 上記各LEDモジュールは、その平面視寸法が1.6mm×0.8mm以下である、請求項59~65のいずれか一項に記載の照明装置。
- 上記各LEDモジュールは、その高さが0.2mm以下である、請求項59~67のいずれか一項に記載の照明装置。
- 上記基板が帯状の基板であり、
上記基板の面積に対する上記複数のLEDモジュールの占有面積割合が、20%以上であり、かつ、
上記各LEDモジュールの平面視寸法が4.0mm×2.0mm以下である、請求項14または15に記載の照明装置。 - 上記基板が帯状の基板であり、
上記基板の面積に対する上記複数のLEDモジュールの占有面積割合が、30%以上である、請求項14または15に記載の照明装置。 - 上記基板の面積に対する上記複数のLEDモジュールの占有面積割合が、35%以上である、請求項70に記載の照明装置。
- 上記基板の面積に対する上記複数のLEDモジュールの占有面積割合が、45%以上である、請求項70に記載の照明装置。
- 上記基板の面積に対する上記複数のLEDモジュールの占有面積割合が、70%以上である、請求項70に記載の照明装置。
- 上記各LEDモジュールは、その平面視寸法が1.0mm×0.6mm以下である、請求項70~73のいずれか一項に記載の照明装置。
- 上記各LEDモジュールは、その平面視寸法が1.6mm×0.8mm以下である、請求項70~73のいずれか一項に記載の照明装置。
- 上記各LEDモジュールは、その高さが0.2mm以下である、請求項70~75のいずれか一項に記載の照明装置。
- 上記基板の長手方向における上記複数のLEDモジュールの占有割合が、上記基板の幅方向における上記複数のLEDモジュールの占有割合よりも大である、請求項69~76のいずれか一項に記載の照明装置。
- 上記複数のLEDモジュールは、発する光の波長が互いに異なるものを含む、請求項33~77のいずれか一項に記載の照明装置。
- 上記複数のLEDモジュールは、白色光を発する複数のLEDモジュールと、これら白色光を発する複数のLEDモジュールものよりも全体に占める割合が小であり、かつ離散的に配置された、赤色光を発する複数のLEDモジュールと、を含む、請求項78に記載の照明装置。
- 上記基板が帯状の基板である、
請求項1~15のいずれか一項に記載の照明装置。 - 上記基板を収容する断面円形管状のケースをさらに有する、請求項80に記載の照明装置。
- それぞれが、1以上の上記LEDチップと、互いに離間配置された1対の実装端子とを有する複数のLEDモジュールを備えており、
上記複数のLEDモジュールは、上記1対の実装端子が上記基板の幅方向において離間する姿勢で、それぞれが上記基板の長手方向に沿うように互いに平行に配置された複数の列をなすように配置されている、請求項33~81のいずれか一項に記載の照明装置。 - 上記複数のLEDモジュールは、千鳥状に配置されている、請求項82に記載の照明装置。
- 上記基板は、樹脂層と金属配線層とが積層された可撓性を有するフレキシブル配線基板であり、かつ断面形状が、円形状または円弧形状とされている、請求項33~83のいずれか一項に記載の照明装置。
- 上記ケースは直管状とされており、かつ、このケースには、その中心軸に平行な面内において対をなすようにして内側に突出する突出片が一体形成されており、
上記基板は、上記突出片によって上記ケースに対する半径方向の移動が規制される、請求項81に記載の照明装置。
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Also Published As
Publication number | Publication date |
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US9732916B2 (en) | 2017-08-15 |
US20160178174A1 (en) | 2016-06-23 |
US20170152996A1 (en) | 2017-06-01 |
CN102119296B (zh) | 2013-06-19 |
JP5671590B2 (ja) | 2015-02-18 |
US9587813B2 (en) | 2017-03-07 |
US20110175536A1 (en) | 2011-07-21 |
JP2018049844A (ja) | 2018-03-29 |
US8915610B2 (en) | 2014-12-23 |
JP2017195210A (ja) | 2017-10-26 |
JP2013258161A (ja) | 2013-12-26 |
US9303833B2 (en) | 2016-04-05 |
JP5380451B2 (ja) | 2014-01-08 |
JP6251445B2 (ja) | 2017-12-20 |
US10295126B2 (en) | 2019-05-21 |
TW201024596A (en) | 2010-07-01 |
US20150138773A1 (en) | 2015-05-21 |
JP2016197602A (ja) | 2016-11-24 |
JP6014800B2 (ja) | 2016-10-26 |
JPWO2010018682A1 (ja) | 2012-01-26 |
JP2015092490A (ja) | 2015-05-14 |
US20170314742A1 (en) | 2017-11-02 |
JP6666893B2 (ja) | 2020-03-18 |
CN102119296A (zh) | 2011-07-06 |
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