WO1998010298A1 - Dispositif d'inspection d'un panneau d'affichage a cristaux liquides, procede d'inspection d'un panneau d'affichage a cristaux liquides et procede de fabrication d'un panneau d'affichage a cristaux liquides - Google Patents

Dispositif d'inspection d'un panneau d'affichage a cristaux liquides, procede d'inspection d'un panneau d'affichage a cristaux liquides et procede de fabrication d'un panneau d'affichage a cristaux liquides Download PDF

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Publication number
WO1998010298A1
WO1998010298A1 PCT/JP1997/003049 JP9703049W WO9810298A1 WO 1998010298 A1 WO1998010298 A1 WO 1998010298A1 JP 9703049 W JP9703049 W JP 9703049W WO 9810298 A1 WO9810298 A1 WO 9810298A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid crystal
inspection
crystal display
display panel
integrated circuit
Prior art date
Application number
PCT/JP1997/003049
Other languages
English (en)
Japanese (ja)
Inventor
Kozo Gyoda
Original Assignee
Seiko Epson Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corporation filed Critical Seiko Epson Corporation
Priority to KR10-1998-0703235A priority Critical patent/KR100518161B1/ko
Publication of WO1998010298A1 publication Critical patent/WO1998010298A1/fr

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

Definitions

  • Liquid crystal display panel inspection apparatus liquid crystal display panel inspection method, and liquid crystal panel manufacturing method
  • the present invention relates to an inspection device for a liquid crystal display panel, and more particularly to a structure of an inspection probe device suitable for performing a lighting inspection of a liquid crystal display panel of a type having an IC chip mounted on an external terminal portion.
  • one of two substrates constituting the panel is protruded from an outer peripheral portion of the liquid crystal display panel, and a plurality of substrates drawn out of the display area are provided on the surface of the protruding portion. It is common to have an external terminal portion formed with an external terminal.
  • the external terminals are arranged with external terminals for applying a drive voltage for causing a liquid crystal display panel to perform a display operation. Wiring from a liquid crystal drive circuit is connected to each external terminal.
  • a COG (Chip On G 1 ass) type liquid crystal display panel in which an IC chip with a built-in liquid crystal drive circuit is directly mounted on the above external terminals has is there.
  • the wiring layer pulled out from the display area of the liquid crystal display panel is connected to the first terminal group to be connected to the output terminal of the IC chip, and the position of the IC chip is set at a position facing the first terminal group.
  • a second terminal group corresponding to the input terminals is arranged. These second terminal groups are directly pulled out to the outer edge of the external terminal portion to become external terminal groups connected to an external control circuit or the like.
  • the present invention is to solve the above-mentioned problem, and the problem is that an almost complete panel inspection can be performed before mounting an IC chip in a liquid crystal display panel inspection apparatus, and at the same time, an external terminal part can be inspected. It is an object of the present invention to provide a new configuration capable of simultaneously performing a wiring pattern inspection. Disclosure of the invention
  • Means taken by the present invention to solve the above-mentioned problems include: a holder accommodating a plurality of wirings; an integrated circuit having a plurality of exposed connection terminals attached to a tip end of the holder; An inspection apparatus for a liquid crystal display panel, comprising: a plurality of inspection probes arranged in parallel with the connection terminals of a circuit, wherein the wiring is conductively connected to the inspection probes.
  • an inspection apparatus for a liquid crystal display panel comprising: a plurality of inspection probes arranged in parallel with the connection terminals of a circuit, wherein the wiring is conductively connected to the inspection probes.
  • the inspection probe may include an exposed contact terminal portion, a flexible wire connecting between the contact terminal portion and the wiring, and an elastic resin covering the flexible wire. preferable.
  • the inspection probe since the inspection probe connects the wiring and the contact terminal with a flexible wire and is covered with the elastic resin, the position of the contact terminal is set to the surface height of the external terminal. Accordingly, a reliable connection can be obtained, and the contact between the connection terminal of the integrated circuit and the external terminal can be stabilized. In addition, since it can be formed only by connecting a flexible wire and filling and curing with an elastic resin, it can be easily manufactured.
  • the integrated circuit is elastically attached to the holder.
  • the integrated circuit is elastically attached to the holder, the contact state between the connection terminal and the external terminal portion can be stabilized, and a reliable contact can be obtained.
  • the holding body has a wiring board to be connected to the liquid crystal display panel, and the wiring is a wiring layer formed on the wiring board.
  • the holding body includes a holding mechanism for holding the integrated circuit detachably.
  • the holding mechanism for detachably holding the integrated circuit, it is possible to appropriately select and inspect a different integrated circuit.
  • the integrated circuit can be removed as it is after being bonded and fixed on the external terminals, so that the integrated circuit can be mounted on the liquid crystal display panel.
  • connection terminal of the integrated circuit held by the integrated circuit holding means is brought into contact with the wiring pattern of the external terminal portion provided on the substrate of the liquid crystal panel with a predetermined pressing force
  • An electrical inspection of the liquid crystal panel is performed by supplying a liquid crystal panel inspection signal to the integrated circuit through the inspection probe,
  • the integrated circuit and the substrate are bonded via a resin adhesive in which conductive particles are dispersed, and the integrated circuit and the connection terminal are conductively connected.
  • FIG. 1 is an enlarged vertical sectional view showing a state of use of a liquid crystal display panel inspection apparatus according to the present invention.
  • FIG. 2 is an enlarged plan view of an external terminal portion of the liquid crystal display panel.
  • FIG. 3 is a partial plan view of the outer edge of the liquid crystal display panel.
  • FIG. 4 is a perspective view showing a method of forming a probe structure.
  • FIG. 5 is a longitudinal sectional view showing a state before the start of the inspection.
  • FIG. 6 is a longitudinal sectional view showing a state at the time of inspection.
  • FIG. 7 is a plan view of an inspection arm showing a different embodiment.
  • FIG. 8 is a sectional view showing an IC chip mounting process using an inspection arm.
  • FIG. 1 is an enlarged partial cross-sectional view showing a use state of a probe device according to the present embodiment.
  • the liquid crystal display panel is composed of various types of liquid crystal displays.In the illustrated example, the liquid crystal display panel includes an element substrate 10 having a wiring layer 11 connected to a pixel electrode, and a counter electrode 21. The liquid crystal layer 30 is sandwiched between the liquid crystal layer 30 and the counter substrate 20.
  • an external terminal portion 15 is formed on the outer edge of the element substrate 10 so as to extend laterally beyond the end of the counter substrate 20.
  • a plurality of first lead-out lines 12 drawn out from the display area facing the liquid crystal layer 30 and a space formed with respect to the first lead-out lines are formed.
  • the second extraction wiring 13 is formed in a predetermined pattern with the first extraction wiring 13 ⁇
  • the first extraction wiring 12 is connected to the wiring layer 11 or the counter electrode 21, and as shown in FIG.
  • the tip is a first terminal 12a formed corresponding to the output terminal of a predetermined integrated circuit chip (hereinafter simply referred to as an IC chip) A.
  • the inner end of the second lead-out wiring 13 is a second terminal 13a formed corresponding to the input terminal of the IC chip A, and the outer end of the second lead-out wiring 13 is formed.
  • the external terminal 13b is conductively connected to a connection terminal configured to be arranged in the same bit as the external terminal 13b, for example, at the connection terminal portion B opposite to the flexible circuit.
  • the external terminal section 15 is designed so that a plurality of IC chips A are arranged as shown in FIG. 3, and these IC chips A are connected to external terminals 13 b connected to a control circuit and a power supply circuit.
  • the second terminal 13a receives the control signal and the power supplied from the second terminal 13a, generates a drive signal based on the control signal and the power, and outputs the driving signal from the first terminal 12a to the wiring layer in the liquid crystal display panel. It is configured to send a driving signal to the counter electrode and the like.
  • the mark 14 is printed for positioning the IC chip A.
  • the terminal portion 15 may be formed, a portion that protrudes outward from the end of the element substrate 10 is also formed on the outer edge of the counter substrate 20, and this protruding portion (on the back side) is connected to the external terminal. It may be formed as an external terminal part 25 similar to the part 15.
  • a holding plate 40 made of an insulating material (for example, a hard resin) having a certain degree of rigidity as a holding body is mounted on a lifting mechanism (not shown) so as to be able to move up and down with high accuracy.
  • a lifting mechanism not shown
  • an air supply hole 40a penetrating vertically and a wide-opening portion 40b formed continuously below the air supply hole 40a are provided.
  • An air supply tube 41 connected to an air supply device (not shown) is connected to an upper opening of the air supply hole 40a.
  • a flexible thin film for example, an elastic sheet 42 made of a synthetic rubber sheet is attached so as to seal the wide opening 4 Ob.
  • the above-mentioned IC chip A is adhesively fixed on the outer surface of the elastic sheet 42.
  • This IC chip A may be the IC chip A itself mounted on the external terminal sections 15 and 25 shown in FIG. 2 or FIG. 3, and is not the same but has almost the same function formed for inspection. Other IC chips having the following may be used.
  • the elastic sheet 42 covering the wide-opening 40b expands downward, and the elasticity according to the gas supply pressure.
  • IC chip A can be held elastically by its characteristics.
  • a flexible circuit board 43 is adhered and fixed to the lower surface of the holding plate 40.
  • the flexible circuit board 43 has a plurality of wiring patterns 43 having a predetermined pattern formed on the surface or inside thereof. Is provided.
  • the ends of the plurality of wiring patterns 43a are connection terminal portions 43b, and the connection terminal portions 43b are provided on the lower surface side of the holding plate 40, and have the above-described wide opening. It faces the recess 40c formed behind the opening 40b.
  • connection terminal portion 43b One end of a conductive wire 44 made of a gold wire or the like is bonded to the connection terminal portion 43b.
  • the other end of the conductive wire 44 is made of a metal connection. Connected to contact terminals 45. Then, the insulating resin is recessed so as to mold the plurality of connection terminal portions 43 b and the plurality of conductive wires 44.
  • the mold body 46 After filling into 40 c, the mold body 46 is formed by solidification.
  • the molding body 46 not only fills the recess 40 c of the holding plate 40, but also covers the connecting portion between the conductive wire 44 and the contact terminal 45, and furthermore, contacts the contact terminal 4 5.
  • the lower surface 5 is configured to protrude downward from the concave portion 40c so as to be exposed.
  • FIG. 4 is a perspective view showing a method of forming the mold body 46.
  • the conductive wires 44 bonded to the connection terminals 4 3b of the wiring patterns 4 3a formed on the surface of the flexible circuit board 4 3 4 Bonded to pad 47.
  • the flexible circuit board 43 is bonded and fixed to the lower surface of the holding plate 40 shown in FIG. 1, and the insulating resin is poured into the concave portion 40c of the holding plate 40.
  • the frame plate 48 is removed, and the connection terminal 45 is joined to the exposed portion of the connection pad 47 (the portion that was in contact with the frame plate 48).
  • Inspection control device is included in the wiring pattern 4 3 a of the flexible circuit board 4 3
  • gas is supplied from the air supply device through the air supply tube 41 at a predetermined pressure, whereby the elastic sheet 42 is moved downward.
  • a lifting mechanism (not shown) for operating the holding plate 40 is used.
  • the chip A and the contact terminal 45 are lowered onto the external terminal 15 of the liquid crystal display panel.
  • the input terminal a and the output terminal b of the IC chip A are When the holding plate 40 is pressed onto the element substrate 10 so that the second terminal 13a and the first terminal 12a shown in Fig.
  • Tip A is an elastic sheath that is inflated by gas pressure.
  • the contact terminal 45 is pressed against the external terminal 15 with a predetermined strength by the elasticity of the molding body 46 by pressing the contact terminal 45 with the predetermined strength by the elasticity given by the contact 42. Pressed to.
  • the input terminal a of the IC chip A comes into contact with the second terminal 13a of the second lead-out wiring 13 and the output terminal b of the IC chip A comes out of the first lead-out wiring 12 (1)
  • the same state as when the IC chip A is mounted can be achieved.
  • the inspection can be performed via the wiring pattern 43 a of the flexible circuit board 43.
  • the flexible circuit board 43 has the same or the same structure as the flexible circuit board connected to the external terminal of the second lead-out wiring 13 so that the same state as a completed liquid crystal display device is obtained. In this state, inspection can be performed.
  • the IC chip A is brought into contact with the first terminal 12a and the second terminal 13a, and the contact terminal 45 is brought into contact with the external terminal 13b, so that the lighting inspection of the liquid crystal display panel or the like is performed. It can be performed.
  • the IC chip A is detachably held on the holding plate 40 by a method such as vacuum suction or a gripping mechanism, and the IC chip A contacts the external terminal 15 of the liquid crystal display panel. After performing the inspection, if the inspection result is good, it is possible to mount the IC chip A on the external terminal portion 15 as it is.
  • the mounting of IC chip A is provided with gripping arms 61, 62 with variable mutual distances at the tip end, and these gripping arms 61, 62 are used to mount IC chip A.
  • the inspection is performed by the inspection arm 60 which also serves as the holding plate 40.
  • the inspection arm 60 has the same probe structure as the contact terminals 45 connected to the wiring pattern 43 a of the flexible circuit board 43, similarly to the holding plate 40 described above. .
  • a structure substantially similar to the holding plate 40 of the embodiment is realized.
  • the liquid crystal display panel By lowering the inspection arm 60 onto the external terminal 15 of the liquid crystal display panel, the liquid crystal display panel can be inspected in the same manner as described above. At this time, if no defect is found in the liquid crystal display panel, then the inspection arm 60 is used as it is as a mounting head of the IC chip A.
  • anisotropic conductive adhesive sheet 70 is laid on external terminals 15 and gripping arms 61 and 6 are attached. With IC chip A sandwiched by 2 and lowered onto external terminals 15 as in the case of inspection, the input and output terminals of IC chip A and the terminals formed on external terminals 15 Are positioned so as to make regular contact via the anisotropic conductive adhesive sheet 70.
  • the anisotropic conductive adhesive sheet 70 is obtained by dispersing conductive particles in, for example, a photocurable or thermosetting resin adhesive.
  • the inspection of the liquid crystal display panel and the mounting of the IC chip A can be continuously performed by the inspection arm 60, and the mounting of the IC chip A is directly performed by the inspection arm after the mounting of the IC chip A. It is also possible to confirm.
  • Industrial applicability According to the present invention described above, in a liquid crystal display panel inspection apparatus, almost complete panel inspection can be performed before mounting an IC chip, and inspection of a wiring pattern on an external terminal portion can be simultaneously performed. Is the thing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

L'invention concerne une structure nouvelle d'un dispositif d'inspection de panneaux d'affichage à cristaux liquides. Un panneau d'affichage à cristaux liquides est inspecté pratiquement dans sa totalité au moyen dudit dispositif avant qu'y soit montée une puce de circuit intégré. En outre, des tracés de câblage placés sur des bornes extérieures peuvent être inspectés simultanément. Un conduit (40a) d'alimentation en air et une partie évasée (40b) sont ménagés sur le bord d'une plaque de maintien (40). Une feuille élastique (42) est fixée de façon à fermer la partie évasée (40b). Une puce (A) de circuit intégré est reliée et fixée à la surface extérieure de la feuille élastique (42). Une plaquette (43) flexible de circuit imprimé est reliée et fixée à la surface inférieure de la plaque de maintien (40), et des tracés (43a) de câblage sont fournis sur la plaquette (43) flexible de circuit imprimé. Des parties (43b) des bornes de connexion sont placées sur les bords des tracés (43a) de câblage, auxquels sont reliées des extrémités de fils conducteurs (44). Les autres extrémités des fils conducteurs (44) sont reliées de façon à venir au contact des bornes (45). Les parties (43b) des bornes de connexion et les fils (44) conducteurs sont encapsulés dans un moulage (46).
PCT/JP1997/003049 1996-09-02 1997-09-02 Dispositif d'inspection d'un panneau d'affichage a cristaux liquides, procede d'inspection d'un panneau d'affichage a cristaux liquides et procede de fabrication d'un panneau d'affichage a cristaux liquides WO1998010298A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR10-1998-0703235A KR100518161B1 (ko) 1996-09-02 1997-09-02 액정표시패널의검사장치,액정표시패널의검사방법및액정패널의제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8/232335 1996-09-02
JP23233596A JP3624570B2 (ja) 1996-09-02 1996-09-02 液晶表示パネルの検査装置、液晶表示パネルの検査方法及び集積回路の実装方法

Publications (1)

Publication Number Publication Date
WO1998010298A1 true WO1998010298A1 (fr) 1998-03-12

Family

ID=16937594

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1997/003049 WO1998010298A1 (fr) 1996-09-02 1997-09-02 Dispositif d'inspection d'un panneau d'affichage a cristaux liquides, procede d'inspection d'un panneau d'affichage a cristaux liquides et procede de fabrication d'un panneau d'affichage a cristaux liquides

Country Status (5)

Country Link
JP (1) JP3624570B2 (fr)
KR (1) KR100518161B1 (fr)
CN (1) CN1175271C (fr)
TW (1) TW359748B (fr)
WO (1) WO1998010298A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100911467B1 (ko) * 2002-12-31 2009-08-11 삼성전자주식회사 액정표시장치의 검사 장치
JP4219729B2 (ja) * 2003-04-25 2009-02-04 日本発條株式会社 液晶パネル用検査装置
JP4579074B2 (ja) * 2005-07-15 2010-11-10 三菱電機株式会社 フレキシブル回路基板及びこれを用いた表示装置
JP2008032958A (ja) * 2006-07-28 2008-02-14 Optrex Corp 表示パネルの点灯検査装置および点灯検査方法
KR100843126B1 (ko) * 2006-08-29 2008-07-02 주식회사 에스에프에이 평판 표시장치의 패널 검사장치 및 그 방법, 그리고 평판표시장치의 회로기판 본딩 시스템 및 그 방법
KR20060122804A (ko) * 2006-11-11 2006-11-30 윤재완 디스플레이 패널 검사용 프로브 블록
JP5347258B2 (ja) * 2007-09-28 2013-11-20 カシオ計算機株式会社 電子デバイス用機能検査装置
KR101219285B1 (ko) * 2011-01-06 2013-01-11 (주)에이앤아이 기판 검사방법 및 장치
KR101290669B1 (ko) * 2013-02-04 2013-07-29 (주)메리테크 패널 테스트용 프로브 블록
CN105867003A (zh) * 2016-06-15 2016-08-17 苏州众显电子科技有限公司 一种新型stn液晶显示屏
CN106205030B (zh) * 2016-07-25 2019-01-29 京东方科技集团股份有限公司 一种警报电路、集成电路板及警报***

Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH01170857A (ja) * 1987-12-25 1989-07-05 Tokyo Electron Ltd プローブカード
JPH02253168A (ja) * 1989-03-28 1990-10-11 Seiko Epson Corp 液晶表示パネルの点燈検査用プローブ
JPH0390081U (fr) * 1989-12-27 1991-09-13
JPH0495929A (ja) * 1990-08-08 1992-03-27 Fujitsu Ltd アクティブプローブを用いた試験装置と試験方法
JPH05218150A (ja) * 1991-11-18 1993-08-27 Tokyo Electron Yamanashi Kk プローブカード
JPH06120647A (ja) * 1992-10-06 1994-04-28 Fujitsu Ltd 半導体素子の実装方法と実装装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0489579A (ja) * 1990-07-31 1992-03-23 Morimichi Fujiyoshi プリント基板等の検査装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01170857A (ja) * 1987-12-25 1989-07-05 Tokyo Electron Ltd プローブカード
JPH02253168A (ja) * 1989-03-28 1990-10-11 Seiko Epson Corp 液晶表示パネルの点燈検査用プローブ
JPH0390081U (fr) * 1989-12-27 1991-09-13
JPH0495929A (ja) * 1990-08-08 1992-03-27 Fujitsu Ltd アクティブプローブを用いた試験装置と試験方法
JPH05218150A (ja) * 1991-11-18 1993-08-27 Tokyo Electron Yamanashi Kk プローブカード
JPH06120647A (ja) * 1992-10-06 1994-04-28 Fujitsu Ltd 半導体素子の実装方法と実装装置

Also Published As

Publication number Publication date
TW359748B (en) 1999-06-01
KR20000064315A (ko) 2000-11-06
CN1175271C (zh) 2004-11-10
KR100518161B1 (ko) 2005-12-01
JPH1078456A (ja) 1998-03-24
CN1199466A (zh) 1998-11-18
JP3624570B2 (ja) 2005-03-02

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