WO2006132243A1 - Dispositif de contrôle - Google Patents

Dispositif de contrôle Download PDF

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Publication number
WO2006132243A1
WO2006132243A1 PCT/JP2006/311327 JP2006311327W WO2006132243A1 WO 2006132243 A1 WO2006132243 A1 WO 2006132243A1 JP 2006311327 W JP2006311327 W JP 2006311327W WO 2006132243 A1 WO2006132243 A1 WO 2006132243A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
inspection
wiring pattern
inspection apparatus
negative pressure
Prior art date
Application number
PCT/JP2006/311327
Other languages
English (en)
Japanese (ja)
Inventor
Shigeki Ishikawa
Yosuke Mabune
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Publication of WO2006132243A1 publication Critical patent/WO2006132243A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Definitions

  • the present invention relates to an inspection for conducting a continuity test on a thin film film-like inspection object having a plurality of conductive regions including a wiring pattern used for input or output of an electric signal formed on the surface. Relates to the device.
  • TCP Tepe and Arrier Package
  • TAB Tape Automated Bondmg
  • COF and hip On Film
  • This TCP is formed by mounting a semiconductor chip such as an LSI (Large Scale Integrated Circuit) on a thin film substrate having a predetermined wiring pattern formed on the surface.
  • a technique for performing a disconnection inspection using a non-contact type sensor As a technique for solving the above-described problems, a technique for performing a disconnection inspection using a non-contact type sensor. A technique is also disclosed (see, for example, Patent Document 2).
  • a predetermined AC signal is supplied to a circuit composed of a connection electrode provided for an inspection object and a sensor having an electrode that forms a capacitive coupling with the connection electrode. Then, a change in capacitance between the electrode to be inspected and the sensor electrode caused by the disconnection is detected as a change in the detection level of the electric signal.
  • Patent Document 1 Japanese Patent Laid-Open No. 8-184631
  • Patent Document 2 JP-A-4-244976
  • the above-described film substrate has a very small material thickness and high flexibility as compared with a conventional semiconductor substrate. Therefore, when used in a liquid crystal display, the entire apparatus must be miniaturized. On the other hand, it has the advantage of being able to cause deformation such as warping and undulation because it is thin and lacks rigidity.
  • the present invention has been made in view of the above, and an object of the present invention is to provide an inspection apparatus that can detect a disconnection of an inspection target that is thin and has low rigidity with high accuracy. Means for solving the problem
  • one embodiment of the present invention is a method in which a plurality of conductive regions including a wiring pattern used for input or output of an electrical signal are formed on a surface, and mounted.
  • An inspection apparatus for performing a continuity inspection of the wiring pattern on a thin film film inspection target on which a predetermined semiconductor chip is mounted, wherein at least one of an input and an output of an electric signal is in contact with the wiring pattern A plurality of conductive contacts to be performed; a holder member that accommodates the plurality of conductive contacts in an arrangement corresponding to the wiring pattern; and the plurality of conductive contacts to be contacted when performing the continuity test.
  • Wiring Flattening means for flattening a region near the pattern.
  • the flattening unit may flatten the wiring pattern by applying pressure to the wiring pattern.
  • the flattening means includes a plurality of pressing members that are elastically urged and retracted in an axial direction so as to be accommodated in the holder member.
  • the member may have a larger protruding amount from the holder member than the conductive contact in a state where the member is not in contact with the inspection object.
  • the pressing member when the continuity test is performed, abuts at least one of the surfaces inside and in the vicinity of a chip mounting area where a predetermined semiconductor chip is mounted during mounting. It may be provided at the position.
  • the holder member includes a first holder member that accommodates the plurality of conductive contacts, and a second holder member that accommodates the pressing member. You may have.
  • the pressing member may be provided at a position in contact with a peripheral portion of the wiring pattern that is in contact with the plurality of conductive contacts when the continuity test is performed.
  • the pressing member may be made of a resin with a contact portion contacting the inspection object.
  • the flattening means may include negative pressure applying means for applying a negative pressure to the inspection object.
  • the negative pressure applying means at the time of performing the continuity test, at least inside and in the vicinity of a chip mounting area where a predetermined semiconductor chip is mounted at the time of mounting.
  • the negative pressure applying means may apply a negative pressure to a peripheral portion of the wiring pattern in contact with the plurality of conductive contacts when performing the continuity test.
  • the negative pressure applying means includes a plurality of holes formed at predetermined positions, and a receiving table on which a part of the inspection target is placed, and a hole formed in the receiving table. Multiple holes provided And a suction unit that performs suction by negative pressure through the unit.
  • the continuity test may include a disconnection test using a non-contact sensor.
  • the plurality of conductive contacts that make contact with the wiring pattern to be inspected in the form of a thin film and perform at least one of input and output of an electric signal
  • the plurality of conductive elements A holder member that accommodates the contacts in an arrangement corresponding to the wiring pattern, and a flattening means for flattening a region near the wiring pattern that contacts the plurality of conductive contacts when the continuity test is performed.
  • FIG. 1 is a diagram showing a configuration of a main part of an inspection apparatus according to Embodiment 1 of the present invention.
  • FIG. 2 is a view in the direction of arrow A in FIG.
  • FIG. 3 is a diagram showing a configuration of a film substrate to be inspected.
  • FIG. 4 is a cross-sectional view showing a configuration of a conductive contact applied to the inspection apparatus according to Embodiment 1 of the present invention.
  • FIG. 5 is a cross-sectional view showing a structure of a presser member applied to the inspection apparatus according to Embodiment 1 of the present invention.
  • FIG. 6 is an explanatory view showing a state in which a deformed film substrate is flattened by a peripheral edge pressing member.
  • FIG. 7 is an explanatory view showing a state in which the conductive contact is connected to the wiring pattern of the film substrate.
  • FIG. 8 is a diagram showing a state of the inspection apparatus after the film substrate is flattened.
  • FIG. 9 is a top view showing a configuration of a cradle that forms part of the inspection apparatus according to Embodiment 2 of the present invention.
  • FIG. 10 is a cross-sectional view taken along line BB in FIG.
  • FIG. 11 is a view showing a state where a film substrate is placed on a cradle and negative pressure is applied.
  • FIG. 12 is a top view showing a configuration of a cradle that forms part of an inspection apparatus according to a modification of the second embodiment of the present invention.
  • FIG. 13 is a cross-sectional view taken along line CC of FIG.
  • FIG. 1 is a diagram showing the configuration of the main part of the inspection apparatus according to Embodiment 1 of the present invention.
  • the inspection apparatus shown in FIG. 1 has a contact unit 1 for inputting / outputting electric signals to / from an inspection object and a thin film substrate 2 to be inspected, and a contact unit for inspection. And a cradle 3 for sandwiching the film substrate 2 with the pedestal 1.
  • FIG. 2 is a view in the direction of arrow A in FIG. 1, and is a bottom view showing the configuration of the bottom surface portion of the contact unit 1.
  • the contact unit 1 is installed corresponding to the wiring pattern of the film substrate 2, and establishes an electrical connection between the film substrate 2 and an inspection circuit (not shown) for inspecting the electrical characteristics of the film substrate 2.
  • a plurality of conductive contacts 14 are provided.
  • the contact unit 1 is used as a presser member that is urged and urged so as to expand and contract with respect to the axial direction.
  • a plurality of center part pressing members 16 to be attached, and a plurality of peripheral part pressing members 17 to press the peripheral part of the wiring pattern of the film substrate 2 to the cradle 3 are provided.
  • the conductive contact 14 and the peripheral edge pressing member 17 are accommodated and held in a substantially rectangular parallelepiped holder member 11 (first holder member).
  • the center pressing member 16 is accommodated and held in a holder member 12 (second holder member) that is fitted in the hollow portion of the holder member 11.
  • These holder members 11 and 12 are fixed and supported integrally with the base member 13 by using screws or the like.
  • the axial directions of the conductive contact 14 and the peripheral edge pressing member 17 held by the holder member 11 are all parallel. Also, the axial direction of the center pressing member 16 held by the holder member 12 is also parallel to the axial direction of the conductive contact 14 and the peripheral pressing member 17. As described above, the axial directions of the conductive contact 14, the center pressing member 16, and the peripheral pressing member 17 are preferably parallel to each other, but the present invention is applied only when force is applied. Of course not.
  • FIG. 3 is a diagram showing a configuration of the film substrate 2 to be inspected.
  • the film substrate 2 shown in the figure has a thickness of several tens; a polyimide tape having a thickness of about zm (micrometer) and a plurality of wiring patterns 22 along a longitudinal direction of a long tape-like base material 21 formed thereon. Are arranged regularly.
  • the wiring pattern 22 has a one-to-one correspondence between the inner lead 23 connected to the semiconductor chip during mounting, the connection electrode 25 used for electrical connection with an external device, and the inner lead 23 and the connection electrode 25. And outer leads 24 to be connected.
  • a predetermined semiconductor chip is mounted at the time of mounting on the side near the center of the group of wiring patterns 22 and the end of each inner lead 23 that is different from the end connected to the outer lead 24.
  • a chip mounting area 26 is provided.
  • This chip mounting area 26 is TAB In this case, it is called a device hole and has a rectangular opening.
  • the chip mounting area 26 is made of the same material as the surrounding area, not the opening. Needless to say, the arrangement pattern of the connection electrodes 25 on the film substrate 2 completely corresponds to the arrangement pattern in the holder member 11 of the conductive contact 14.
  • FIG. 4 is a cross-sectional view showing a configuration of the conductive contact 14.
  • the conductive contact 14 shown in the figure has needle-like members 141 and 142 disposed at both ends thereof, and these needle-like members 141 and 142 are connected and biased by a panel member 143.
  • the needle-like members 141 and 142 and the panel member 143 are made of a conductive material such as metal. Further, the needle-like members 141, 142 and the panel member 143 are accommodated and held in the opening 111 of the holder member 11 so as to have the same axis, and the tip force of the needle-like member 141 on the S film substrate 2 side.
  • the tip of the needle-like member 142 is connected to a lead wire 15 accommodated in the opening 131 of the base member 13 and receives supply of an electric signal or the like through the lead wire 15.
  • the needle-like member 141 positioned vertically below the needle-like member 142 and the panel member 143 is provided with a flange portion 14 la and serves to prevent the holder member 11 from being removed.
  • the holder member 11 that holds the conductive contact 14 is configured by superposing the first member 11a and the second member l ib. For this reason, it is possible to easily attach or replace the conductive contact 14 to the opening 11 1.
  • a center-holding member 16 shown in FIG. 5 is in contact with the film substrate 2 and can be expanded and contracted within a predetermined range in a direction parallel to the expansion and contraction direction of the conductive contact 14, and one end of the plunger 161.
  • the center pressing member 16 is fitted and held in a receptacle-type pipe member 71.
  • This pipe member 71 is provided in a socket 72 that is provided in each of the third member 12a and the fourth member 12b constituting the holder member 12 and is fitted in the openings 121a and 121b that communicate coaxially. Contained.
  • the openings 121a is an opening, and the other is a closed end.
  • the opening 121b is an open end at both ends.
  • the plunger 161 of the center pressing member 16 has a cylindrical contact portion 161a that contacts the film substrate 2 and a diameter substantially the same as the inner diameter of the pipe member 71.
  • the protruding portion 161b that protrudes and the distal end portion 161c that fits into the connector portion of the receptacle-type noise member 71 and serves to prevent the plunger 161 from being removed from the noise member 71 are coaxially connected to the protruding portion 161b and the distal end portion 161c.
  • a rod-shaped connecting portion 161d is coaxially connected to the protruding portion 161b and the distal end portion 161c.
  • the tip portion 161c is in contact with the end portion of the panel member 162 that is also housed and held in the pipe member 71, and the contact portion 16la is the surface of the film substrate 2 and the inner portion of the chip mounting region 26 and As the contact unit 1 descends, it gradually enters the inside of the pipe member 71. For this reason, the protrusion amount of the contact portion 161a from the holder member 12 gradually decreases.
  • the panel member 162 has a function of mitigating that the plunger 161 is displaced at a stroke due to the resistance from the film substrate 2.
  • the contact portion 161a of the plunger 161 only needs to be formed of a material having insulating properties such as grease.
  • the diameter R of the contact portion 161a at the tip of the center pressing member 16 is preferably large enough to avoid the wiring pattern 22, and is specifically about 1 to 2 mm.
  • the diameter R of the contact portion 161a of the center pressing member 16 should be determined depending on which package the film substrate 2 is applied to. For example, when the film substrate 2 is applied to TAB, the chip mounting region 26 forms an opening, and therefore the diameter R of the contact portion 161a must be larger than the width of the opening. On the other hand, when applied to the film substrate 2 force SCOF, even if the diameter R of the contact portion 161a is smaller than the width of the chip mounting region 26, the region can be flattened. It is more preferable that the value is smaller than the width of the chip mounting area 26. In this sense, for example, the diameter of the contact portion 171a of the peripheral portion pressing member 17 may be different from the diameter of the contact portion 161a of the center portion pressing member 16.
  • the center pressing member 16 and the peripheral pressing member 17 have the same structure.
  • the peripheral edge pressing member 17 includes a plunger 171 (abutting portion 171a, projecting portion 171b, tip portion 171c, connecting portion 17 Id) and a panel member 172 having the same configuration as the plunger 161 and the panel member 162, respectively.
  • the peripheral edge pressing member 17 is also accommodated in the pipe member 71 in the holder member 12. The point that the pipe member 71 is held by the socket 72 embedded in the holder member 12 is the same as in the case of the center pressing member 16.
  • the conductive contact 14, the center pressing member 16, and the peripheral pressing member 17 that also project the bottom force of each holder of the contact unit 1 are in contact with the film substrate 2, and in this state,
  • the amount of protrusion H of the plunger 161 and 171 from the bottom of the main body of the contact unit 1 is the amount of protrusion h from the bottom of the main body of the contact unit 1 of the needle member 141 of the conductive contact 14 (see FIG. 4).
  • H> h which is larger than
  • a non-contact type sensor 31 is disposed on the surface of the central portion of the cradle 3 (see FIG. 1).
  • This sensor 31 is formed by using one or more thin electrode forces, a metal conductor such as a copper plate or an iron plate, and a thin film insulating film such as PET.
  • the connection electrode 25 can be capacitively coupled.
  • the surface area of the sensor 31 exposed on the mounting surface of the film substrate 2 of the cradle 3 is slightly larger than the area of the chip mounting area 26.
  • FIGS. 6 and 7 show that when the contact unit 1 according to the first embodiment is used to inspect the film substrate 2, the contact unit 1 is lowered to the wiring pattern 22 of the film substrate 2.
  • FIG. 6 is an explanatory view showing a situation when the contact 14 is brought into contact with the contact 14; Of these, FIG. 6 shows that the film substrate 2 that has undergone deformation such as warping or undulation is flattened by the peripheral-side pressing member 17. Shows the situation. Further, FIG. 7 shows a state where the conductive contact 14 is brought into contact with the wiring pattern 22 (connection electrode 25 thereof) by further lowering the contact unit 1 after reaching the state of FIG. .
  • FIG. 6 will be described. Since the bottom surface of the contact portion 171a of the peripheral edge pressing member 17 protrudes downward from the tip end portion of the conductive contact 14, when the contact unit 1 is lowered, the peripheral edge pressing member 17 First reaches the film substrate 2 and starts pressing the film substrate 2 downward. At this time, since the film substrate 2 is pressed by the elastic force of the panel member 172 having the same configuration as the panel member 16 2 (see FIG. 5) of the center pressing member 16, the impact applied to the film substrate 2 is not affected. The film substrate 2 can be returned to its original flat shape while being softened.
  • the solid line in FIG. 6 shows a state in which the inner region of the peripheral edge pressing member 17 is generally flattened. Although not shown, since the center pressing member 16 performs the same operation as the peripheral edge pressing member 17, the area near the chip mounting area 26 is flattened in the same manner as described above. Nah ...
  • the protruding amount of the conductive contact 14 from the holder member 11 may be designed in view of this point. That is, the protruding amount h of the conductive contact 14 from the holder member 11 in the initial state is the thickness of the film substrate 2 (the thickness of the base material 21 and the wiring pattern 22) and the contact unit 1 such as the center pressing member 16 or the like. Determine the optimum value after considering the amount of protrusion H from the top!
  • FIG. 8 is a view of the state shown in FIG. 7 when the contact unit 1 is viewed as a whole.
  • the portion of the film substrate 2 that is pressed by the center pressing member 16 and the peripheral pressing member 17 is substantially flat, so the positional relationship between the sensor 31 and the film substrate 2 Is almost constant. Therefore, the change in the capacitance due to the deformation of the film substrate 2 becomes almost negligible, the operation sensitivity of the sensor 31 is improved, and the operation is stabilized.
  • a plurality of conductive contacts that contact at least one of input and output of electrical signals in contact with the wiring pattern of (inspection target) and the plurality of conductive contacts are parallel to each other in the axial direction.
  • a flat plate means it is possible to detect a disconnection of a thin film substrate having a low rigidity with high accuracy. As a result, the reliability of the inspection itself can be improved.
  • a peripheral edge pressing member that presses the peripheral edge of the wiring pattern is provided, so that the conductive contact of the film substrate during inspection is provided. Deformation such as warpage and undulation in the region near the contacting surface can be eliminated, and the contact state of the peripheral portion with the conductive contact can be ensured. As a result, the contact between the individual conductive contacts and the contact electrode is uniform, so that the wear of a plurality of conductive contacts is made uniform without the wear of a specific conductive contact progressing quickly. It is possible to improve the durability of the inspection apparatus itself.
  • FIG. 9 is a top view showing a configuration of a cradle that forms part of the inspection apparatus according to the second embodiment.
  • FIG. 10 is a cross-sectional view taken along line BB in FIG.
  • the cradle 4 shown in these drawings includes a mounting portion 41 on which the film substrate 2 is mounted, and a negative pressure that is fixed to the mounting portion 41. And a suction part 42 to which a suction nozzle is attached.
  • the same non-contact type sensor 31 as described in the first embodiment is embedded in the substantially central portion of the surface of the mounting portion 41, and at the periphery of the sensor 31 on the surface of the mounting portion 41.
  • Has holes 43 for negative pressure suction in FIG. 9, six holes 43 are formed).
  • a plurality of holes 44 (12 in FIG. 9) are also formed near the edge of the surface of the mounting portion 41.
  • Each hole 43 and 44 communicates with a vacuum hole 46 (described later) of the suction part 42 through a communication passage 45.
  • the diameter of the holes 43 and 44 is about 1 mm.
  • the suction part 42 has a vacuum hole 46 formed in the surface facing the mounting part 41, and the bottom surface of the vacuum hole part 46 is open at the surface not facing the mounting part 41. It communicates with a through-hole portion 421 having.
  • a suction nozzle 47 is attached to the through-hole portion 421.
  • the nozzle 47 is connected to a vacuum generating device such as a vacuum pump 49 via a hose 48.
  • FIG. 11 is a diagram showing a state in which the film substrate 2 is placed on the cradle 4 and the negative pressure is increased by the vacuum pump 49.
  • the holder member 51 is fixedly supported by the base member 52.
  • the holder member 51 can accommodate a plurality of conductive contacts 14 according to the wiring pattern 22 of the film substrate 2 (the lead wire 15 is omitted).
  • the film substrate is fixed substantially parallel to the cradle.
  • the distance between the sensor and the film substrate is almost constant, which improves the operational sensitivity of the sensor embedded in the cradle and stabilizes its operation.
  • the disconnection inspection can be performed accurately and reliably, and the progress of wear of the conductive contact is substantially uniform. As a result, durability can be improved.
  • FIG. 12 is a top view showing a configuration of a cradle applied to an inspection apparatus according to a modification of the second embodiment.
  • FIG. 13 is a cross-sectional view taken along the line CC in FIG.
  • a groove portion 63 that surrounds the vicinity of the sensor 31 is provided in the mounting portion 61, and holes 64 are formed at predetermined intervals on the bottom surface of the groove portion 63.
  • six holes 64 are formed.
  • four groove portions 65 are provided along the four corners of the placement portion 61 at the peripheral portion of the placement portion 61, and holes 66 are formed at predetermined intervals on the bottom surface of each groove portion 65. (In FIG. 12, there are three holes 66 in one groove 65).
  • the diameters of the grooves 63 and 65 are about lmm, and their depths are about the same.
  • Each of the holes 64 and 66 communicates with the vacuum hole 46 of the suction part 42 through the communication passage 67.
  • the configuration of the suction part 42 is the same as that of the second embodiment, and the point that it is connected to the vacuum pump 49 via the nozzle 47 and the hose 48 is the same as that of the second embodiment.
  • the best mode for carrying out the present invention has been described in detail for the first and second embodiments.
  • the present invention should not be limited only by these two embodiments.
  • only one of the center pressing member and the peripheral edge pressing member as the flattening means provided in the inspection apparatus according to the present invention may be provided.
  • the accuracy of the sensor can be particularly improved.
  • only the peripheral edge pressing member is provided, it is possible to suppress variation in wear of the conductive contact and to realize stable contact with the film substrate. it can.
  • the various pressing members described in the first embodiment and the second embodiment You may comprise the test
  • the conductive contact applied to the inspection apparatus according to the present invention is not limited to the above-described conductive contact 14 (see FIG. 4). In other words, any of various types of conventionally known conductive contacts can be applied to the inspection apparatus according to the present invention.
  • the present invention can include various embodiments and the like not described herein, and V, V, within the scope not departing from the technical idea specified by the claims. It is possible to make various design changes.
  • the inspection apparatus applies to a thin film-like inspection target in which a plurality of conductive regions including a wiring pattern used for input or output of an electric signal are formed on the surface. It is useful for the continuity inspection of the wiring pattern, and is particularly suitable for detecting the disconnection of the thin object and lack of rigidity.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention concerne un dispositif de contrôle qui détecte une déconnexion d’un mince objet de contrôle de faible rigidité avec grande précision. Le dispositif de contrôle comprend une pluralité de contacts conducteurs mis en contact avec un schéma de câblage de type film mince d’un objet de contrôle pour effectuer au moins une entrée ou une sortie d’un signal électrique, un élément de support destiné à recevoir la pluralité de contacts conducteurs dans un agencement correspondant au schéma de câblage, et un moyen destiné à aplanir la zone proche du schéma de câblage mis en contact avec la pluralité de contacts conducteurs lors de la connexion électrique de contrôle.
PCT/JP2006/311327 2005-06-08 2006-06-06 Dispositif de contrôle WO2006132243A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005168593A JP5244288B2 (ja) 2005-06-08 2005-06-08 検査装置
JP2005-168593 2005-06-08

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Publication Number Publication Date
WO2006132243A1 true WO2006132243A1 (fr) 2006-12-14

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JP (1) JP5244288B2 (fr)
TW (1) TWI307411B (fr)
WO (1) WO2006132243A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111951877A (zh) * 2019-05-16 2020-11-17 第一检测有限公司 检测设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8225683B2 (en) * 2007-09-28 2012-07-24 Lam Research Corporation Wafer bow metrology arrangements and methods thereof
JP2012112904A (ja) * 2010-11-26 2012-06-14 Micronics Japan Co Ltd プローブカード並びに半導体検査装置及び半導体検査方法
JP2012220451A (ja) * 2011-04-13 2012-11-12 Seiken Co Ltd 検査ユニット

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59122555U (ja) * 1983-02-08 1984-08-17 株式会社フジクラ プリント回路板検査装置
JPH03199976A (ja) * 1989-12-27 1991-08-30 Toshiba Corp プローブカード
JPH05288802A (ja) * 1992-04-09 1993-11-05 Fuji Electric Co Ltd 半導体チップの電気特性検査方法およびウェーハプローバ
JP2000009785A (ja) * 1998-06-25 2000-01-14 Onishi Denshi Kk プリント基板検査装置
JP2001296325A (ja) * 2000-04-18 2001-10-26 Hioki Ee Corp 回路基板検査方法および回路基板検査装置
WO2003087852A1 (fr) * 2002-04-16 2003-10-23 Nhk Spring Co., Ltd. Support destine a un contact conducteur
JP2004271237A (ja) * 2003-03-05 2004-09-30 Tdk Corp 検査装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714927Y2 (ja) * 1988-11-17 1995-04-10 日置電機株式会社 回路基板検査装置におけるピンボード構造
JPH10206480A (ja) * 1997-01-20 1998-08-07 Okano Denki Kk 導体回路基板検査装置における導体回路基板の支持方法
JP2000266799A (ja) * 1999-03-15 2000-09-29 Taiyo Kogyo Kk プリント基板検査装置
JP2003185695A (ja) * 2001-12-20 2003-07-03 Seiko Epson Corp 配線パターン検査方法および配線パターン検査装置
JP2003322670A (ja) * 2002-04-30 2003-11-14 Kyoritsu Denki Kk プリント基板検査装置
JP4264310B2 (ja) * 2003-08-06 2009-05-13 日本電産リード株式会社 基板検査装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59122555U (ja) * 1983-02-08 1984-08-17 株式会社フジクラ プリント回路板検査装置
JPH03199976A (ja) * 1989-12-27 1991-08-30 Toshiba Corp プローブカード
JPH05288802A (ja) * 1992-04-09 1993-11-05 Fuji Electric Co Ltd 半導体チップの電気特性検査方法およびウェーハプローバ
JP2000009785A (ja) * 1998-06-25 2000-01-14 Onishi Denshi Kk プリント基板検査装置
JP2001296325A (ja) * 2000-04-18 2001-10-26 Hioki Ee Corp 回路基板検査方法および回路基板検査装置
WO2003087852A1 (fr) * 2002-04-16 2003-10-23 Nhk Spring Co., Ltd. Support destine a un contact conducteur
JP2004271237A (ja) * 2003-03-05 2004-09-30 Tdk Corp 検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111951877A (zh) * 2019-05-16 2020-11-17 第一检测有限公司 检测设备

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