TWI799547B - 感光性組成物、複合體、電子零件及電子零件的製造方法 - Google Patents

感光性組成物、複合體、電子零件及電子零件的製造方法 Download PDF

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Publication number
TWI799547B
TWI799547B TW108109788A TW108109788A TWI799547B TW I799547 B TWI799547 B TW I799547B TW 108109788 A TW108109788 A TW 108109788A TW 108109788 A TW108109788 A TW 108109788A TW I799547 B TWI799547 B TW I799547B
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TW
Taiwan
Prior art keywords
electronic part
complex
photosensitive composition
producing
producing electronic
Prior art date
Application number
TW108109788A
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English (en)
Chinese (zh)
Other versions
TW201940975A (zh
Inventor
垣添浩人
佐合佑一朗
Original Assignee
日商則武股份有限公司
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Publication of TW201940975A publication Critical patent/TW201940975A/zh
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Publication of TWI799547B publication Critical patent/TWI799547B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/0325—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polysaccharides, e.g. cellulose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
TW108109788A 2018-03-23 2019-03-21 感光性組成物、複合體、電子零件及電子零件的製造方法 TWI799547B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018055641 2018-03-23
JP2018-055641 2018-03-23

Publications (2)

Publication Number Publication Date
TW201940975A TW201940975A (zh) 2019-10-16
TWI799547B true TWI799547B (zh) 2023-04-21

Family

ID=68026426

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109788A TWI799547B (zh) 2018-03-23 2019-03-21 感光性組成物、複合體、電子零件及電子零件的製造方法

Country Status (4)

Country Link
JP (1) JP6814237B2 (ko)
KR (1) KR102643291B1 (ko)
CN (1) CN110297395A (ko)
TW (1) TWI799547B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7113779B2 (ja) * 2019-03-28 2022-08-05 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用
KR20220122318A (ko) * 2021-02-26 2022-09-02 코오롱인더스트리 주식회사 감광성 적층체, 감광성 적층체 제조 방법, 및 회로 기판 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011204514A (ja) * 2010-03-26 2011-10-13 Toray Ind Inc 感光性導電ペーストおよび導電性配線付き基板の製造方法
CN103069340A (zh) * 2010-12-07 2013-04-24 株式会社村田制作所 光反应性树脂组合物
TWI521307B (zh) * 2010-07-29 2016-02-11 富士軟片股份有限公司 聚合性組成物
JP2016071173A (ja) * 2014-09-30 2016-05-09 東洋紡株式会社 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル

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JP3541125B2 (ja) * 1998-05-01 2004-07-07 太陽インキ製造株式会社 アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP4062805B2 (ja) 1999-01-06 2008-03-19 東レ株式会社 焼成用感光性導電ペーストおよび微細電極パターン形成方法
JP3479463B2 (ja) * 1999-01-29 2003-12-15 太陽インキ製造株式会社 光硬化型導電性組成物及びそれを用いて電極形成したプラズマディスプレイパネル
JP2002072472A (ja) 2000-08-24 2002-03-12 Toray Ind Inc 感光性ペースト
KR100472375B1 (ko) * 2002-05-20 2005-02-21 엘지전자 주식회사 플라즈마 디스플레이 패널의 광중합형 감광성 전극페이스트 조성물 및 이를 이용한 전극 제조방법
JP3779260B2 (ja) * 2002-11-26 2006-05-24 京都エレックス株式会社 アルカリ現像型感光性樹脂組成物
JP4789426B2 (ja) * 2004-04-26 2011-10-12 太陽ホールディングス株式会社 銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン
KR100927611B1 (ko) * 2005-01-05 2009-11-23 삼성에스디아이 주식회사 감광성 페이스트 조성물, 이를 이용하여 제조된 ｐｄｐ전극, 및 이를 포함하는 ｐｄｐ
JP2006344590A (ja) 2006-05-22 2006-12-21 Noritake Co Ltd ディスプレイ電極形成用感光性黒色導電ペースト組成物並びにディスプレイ電極用黒色導電厚膜およびその形成方法
US8329066B2 (en) * 2008-07-07 2012-12-11 Samsung Sdi Co., Ltd. Paste containing aluminum for preparing PDP electrode, method of preparing the PDP electrode using the paste and PDP electrode prepared using the method
JP2012073589A (ja) * 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
JP5764371B2 (ja) * 2011-04-13 2015-08-19 株式会社カネカ 新規な感光性樹脂組成物及びその利用
JP5825963B2 (ja) * 2011-09-30 2015-12-02 太陽ホールディングス株式会社 感光性導電性樹脂組成物、感光性導電性ペーストおよび導電体パターン
JPWO2013125429A1 (ja) * 2012-02-20 2015-07-30 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN104185875B (zh) * 2012-03-28 2017-07-18 东丽株式会社 感光性导电糊剂以及带导电性配线的基板的制造方法
US20140061543A1 (en) * 2012-08-29 2014-03-06 E I Du Pont De Nemours And Company Method of manufacturing non-firing type electrode using photosensitive paste
JP5828851B2 (ja) * 2013-03-01 2015-12-09 株式会社ノリタケカンパニーリミテド 感光性ペースト
JP6406618B2 (ja) 2015-03-25 2018-10-17 株式会社大阪ソーダ 反応性樹脂組成物とその用途
KR20160120862A (ko) 2015-04-08 2016-10-19 삼성에스디아이 주식회사 터치패널 전극배선 형성용 조성물 및 이로부터 제조된 전극배선을 포함하는 터치패널

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011204514A (ja) * 2010-03-26 2011-10-13 Toray Ind Inc 感光性導電ペーストおよび導電性配線付き基板の製造方法
TWI521307B (zh) * 2010-07-29 2016-02-11 富士軟片股份有限公司 聚合性組成物
CN103069340A (zh) * 2010-12-07 2013-04-24 株式会社村田制作所 光反应性树脂组合物
JP2016071173A (ja) * 2014-09-30 2016-05-09 東洋紡株式会社 感光性導電ペースト、導電性薄膜、電気回路、及びタッチパネル

Also Published As

Publication number Publication date
JP6814237B2 (ja) 2021-01-13
JP2019168678A (ja) 2019-10-03
CN110297395A (zh) 2019-10-01
KR102643291B1 (ko) 2024-03-07
KR20190111777A (ko) 2019-10-02
TW201940975A (zh) 2019-10-16

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