TWI384015B - A polyimide precursor, a photosensitive polyimide precursor composition, a photosensitive dry film, and a flexible printed circuit board using the same - Google Patents

A polyimide precursor, a photosensitive polyimide precursor composition, a photosensitive dry film, and a flexible printed circuit board using the same Download PDF

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Publication number
TWI384015B
TWI384015B TW98113793A TW98113793A TWI384015B TW I384015 B TWI384015 B TW I384015B TW 98113793 A TW98113793 A TW 98113793A TW 98113793 A TW98113793 A TW 98113793A TW I384015 B TWI384015 B TW I384015B
Authority
TW
Taiwan
Prior art keywords
photosensitive
polyimine precursor
precursor
group
bis
Prior art date
Application number
TW98113793A
Other languages
English (en)
Chinese (zh)
Other versions
TW201006867A (en
Inventor
Kuon Miyazaki
Takashi Hayakawa
Akihiro Kato
Hideaki Takahashi
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201006867A publication Critical patent/TW201006867A/zh
Application granted granted Critical
Publication of TWI384015B publication Critical patent/TWI384015B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Engineering & Computer Science (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
TW98113793A 2008-05-09 2009-04-24 A polyimide precursor, a photosensitive polyimide precursor composition, a photosensitive dry film, and a flexible printed circuit board using the same TWI384015B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008124016 2008-05-09

Publications (2)

Publication Number Publication Date
TW201006867A TW201006867A (en) 2010-02-16
TWI384015B true TWI384015B (zh) 2013-02-01

Family

ID=41264612

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98113793A TWI384015B (zh) 2008-05-09 2009-04-24 A polyimide precursor, a photosensitive polyimide precursor composition, a photosensitive dry film, and a flexible printed circuit board using the same

Country Status (5)

Country Link
JP (2) JP5417323B2 (ja)
KR (1) KR101308811B1 (ja)
CN (1) CN102015835A (ja)
TW (1) TWI384015B (ja)
WO (1) WO2009136557A1 (ja)

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JP5758300B2 (ja) * 2009-11-16 2015-08-05 旭化成イーマテリアルズ株式会社 ポリイミド前駆体を含む感光性樹脂組成物、感光性フィルム、カバーレイ、及びフレキシブルプリント配線板並びにその積層体
JP4878662B2 (ja) * 2010-04-28 2012-02-15 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
JP5691657B2 (ja) * 2011-03-04 2015-04-01 日油株式会社 感光性樹脂組成物およびその用途
KR101864914B1 (ko) * 2011-03-31 2018-06-05 닛산 가가쿠 고교 가부시키 가이샤 액정 배향제, 및 그것을 사용한 액정 배향막
JP5751025B2 (ja) * 2011-05-31 2015-07-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置
JP5748638B2 (ja) * 2011-11-04 2015-07-15 旭化成イーマテリアルズ株式会社 ポリイミド前駆体又はポリイミド及び感光性樹脂組成物
TWI486335B (zh) * 2011-12-29 2015-06-01 Eternal Materials Co Ltd 鹼產生劑
JP5884551B2 (ja) * 2012-02-27 2016-03-15 日油株式会社 感光性樹脂組成物およびその用途
JP6343989B2 (ja) * 2013-03-21 2018-06-20 東洋紡株式会社 透明ポリエステルイミド樹脂フィルム、並びにこれに用いる樹脂および樹脂組成物
TWI671343B (zh) * 2014-06-27 2019-09-11 日商富士軟片股份有限公司 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置
JP2016080803A (ja) * 2014-10-14 2016-05-16 太陽インキ製造株式会社 ドライフィルムおよびフレキシブルプリント配線板
TWI754734B (zh) * 2017-03-29 2022-02-11 日商富士軟片股份有限公司 感光性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體裝置
JP6968196B2 (ja) * 2017-11-28 2021-11-17 旭化成株式会社 ネガ型感光性樹脂組成物及びその製造方法、並びに硬化レリーフパターンの製造方法
JP6810677B2 (ja) 2017-12-05 2021-01-06 信越化学工業株式会社 新規テトラカルボン酸二無水物、ポリイミド樹脂及びその製造方法、感光性樹脂組成物、パターン形成方法及び硬化被膜形成方法、層間絶縁膜、表面保護膜、電子部品
JP6958332B2 (ja) * 2017-12-20 2021-11-02 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
CN110857332B (zh) * 2018-08-22 2022-10-21 臻鼎科技股份有限公司 高分子树脂、高分子树脂组合物及覆铜板
KR20220015327A (ko) 2020-07-30 2022-02-08 주식회사 엘지화학 바인더 수지, 포지티브형 감광성 수지 조성물, 절연막 및 반도체 장치
WO2022039028A1 (ja) * 2020-08-17 2022-02-24 東レ株式会社 感光性樹脂組成物、硬化物、表示装置、半導体装置及び硬化物の製造方法
CN116789590B (zh) * 2023-06-25 2024-02-02 波米科技有限公司 一种含哌啶基团的二胺化合物及其制备方法和应用

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TW200626636A (en) * 2005-01-28 2006-08-01 Sony Chemicals Corp Polyimide compound and flexible wiring board
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Publication number Priority date Publication date Assignee Title
JPH10330723A (ja) * 1997-05-28 1998-12-15 Hitachi Chem Co Ltd 接着フィルム
TW200626636A (en) * 2005-01-28 2006-08-01 Sony Chemicals Corp Polyimide compound and flexible wiring board
JP2007217476A (ja) * 2006-02-14 2007-08-30 Kaneka Corp 新規なポリイミド樹脂

Also Published As

Publication number Publication date
WO2009136557A1 (ja) 2009-11-12
TW201006867A (en) 2010-02-16
JP5603977B2 (ja) 2014-10-08
JPWO2009136557A1 (ja) 2011-09-08
KR101308811B1 (ko) 2013-09-13
JP2013241607A (ja) 2013-12-05
KR20100125467A (ko) 2010-11-30
CN102015835A (zh) 2011-04-13
JP5417323B2 (ja) 2014-02-12

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