TWI340754B - Process and ink for making electronic devices - Google Patents

Process and ink for making electronic devices

Info

Publication number
TWI340754B
TWI340754B TW092125054A TW92125054A TWI340754B TW I340754 B TWI340754 B TW I340754B TW 092125054 A TW092125054 A TW 092125054A TW 92125054 A TW92125054 A TW 92125054A TW I340754 B TWI340754 B TW I340754B
Authority
TW
Taiwan
Prior art keywords
parts
ink
etch
alloy
resistant ink
Prior art date
Application number
TW092125054A
Other languages
English (en)
Other versions
TW200422356A (en
Inventor
Alan John Hopper
Mark Robert James
Original Assignee
Fujifilm Imaging Colorants Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Imaging Colorants Ltd filed Critical Fujifilm Imaging Colorants Ltd
Publication of TW200422356A publication Critical patent/TW200422356A/zh
Application granted granted Critical
Publication of TWI340754B publication Critical patent/TWI340754B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
TW092125054A 2002-09-20 2003-09-10 Process and ink for making electronic devices TWI340754B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0221892.3A GB0221892D0 (en) 2002-09-20 2002-09-20 Process

Publications (2)

Publication Number Publication Date
TW200422356A TW200422356A (en) 2004-11-01
TWI340754B true TWI340754B (en) 2011-04-21

Family

ID=9944478

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092125054A TWI340754B (en) 2002-09-20 2003-09-10 Process and ink for making electronic devices

Country Status (11)

Country Link
US (1) US7427360B2 (zh)
EP (1) EP1543083B1 (zh)
JP (1) JP2005539391A (zh)
KR (1) KR100966508B1 (zh)
CN (1) CN1694934A (zh)
AT (1) ATE335796T1 (zh)
AU (1) AU2003260741A1 (zh)
DE (1) DE60307485T2 (zh)
GB (1) GB0221892D0 (zh)
TW (1) TWI340754B (zh)
WO (1) WO2004026977A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595697B (zh) * 2011-06-17 2017-08-11 富士金股份有限公司 電化學元件的製造方法以及電化學元件的製造裝置

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1633823B1 (en) * 2003-05-30 2008-10-29 FUJIFILM Imaging Colorants Limited Process for etching a metal or alloy surface
ATE467665T1 (de) 2003-08-25 2010-05-15 Dip Tech Ltd Tinte für keramische oberflächen
US7208830B2 (en) * 2004-06-30 2007-04-24 Intel Corporation Interconnect shunt used for current distribution and reliability redundancy
FR2882491B1 (fr) 2005-02-23 2009-04-24 Eads Space Transp Sas Soc Par Procede pour former des motifs electriquement conducteurs sur une surface non developpable d'un substrat isolant, et dispositif obtenu
JP5430051B2 (ja) 2005-12-28 2014-02-26 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
PT2248673E (pt) * 2006-01-19 2012-12-24 Ikonics Corp Métodos digitais de texturização de moldes, materiais, e substratos
DE102006022722B4 (de) 2006-05-12 2010-06-17 Hueck Engraving Gmbh & Co. Kg Verfahren und Vorrichtung zur Oberflächenstrukturierung eines Pressbleches oder eines Endlosbandes
US7803420B2 (en) 2006-12-01 2010-09-28 Applied Materials, Inc. Methods and apparatus for inkjetting spacers in a flat panel display
GB0719464D0 (en) 2007-10-04 2007-11-14 Sun Chemical Bv An ink jet and a method of ink jet printing
KR101215459B1 (ko) * 2008-03-27 2012-12-26 도쿄 프린팅 잉크 엠에프지. 캄파니 리미티드 에칭 레지스트용 잉크젯 잉크 조성물
JP5518311B2 (ja) * 2008-08-26 2014-06-11 日新製鋼株式会社 エッチングレジスト用インクジェットインキ組成物
JP4335955B1 (ja) * 2008-05-16 2009-09-30 日立マクセル株式会社 エネルギー線硬化型インク組成物
EP2182786B1 (en) * 2008-11-04 2011-07-13 Rohm and Haas Electronic Materials LLC Improved hot melt compositions
CN101481616B (zh) * 2009-02-05 2013-07-10 广州市和携化工科技有限公司 金属及金属氧化物蚀刻油墨及其制备方法与应用
US8628679B2 (en) * 2010-01-20 2014-01-14 Phoenix Inks And Coatings, Llc High-definition demetalization process
CN103547639B (zh) * 2011-02-24 2016-08-17 柯尼卡美能达株式会社 活性光线固化型喷墨油墨及图像形成方法
BE1020757A3 (fr) * 2012-06-19 2014-04-01 Agc Glass Europe Methode de fabrication d'une feuille de verre depolie selectivement.
CN103517566A (zh) * 2012-06-28 2014-01-15 昆山联滔电子有限公司 非导电载体上的导体轨道的制造方法
EP2703180B1 (en) * 2012-08-27 2016-01-06 Agfa Graphics Nv Free radical radiation curable liquids for de-inking substrates
US9453139B2 (en) 2013-08-20 2016-09-27 Rohm And Haas Electronic Materials Llc Hot melt compositions with improved etch resistance
CN103762049A (zh) * 2013-11-01 2014-04-30 成都顺康三森电子有限责任公司 半导体陶瓷化学镀镍镍电极外沿去除的方法
EP2915856B1 (en) * 2014-03-03 2019-10-16 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
CN104494310B (zh) * 2014-09-16 2017-04-12 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印***及控制方法
EP3000853B1 (en) * 2014-09-29 2020-04-08 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing conductive patterns
EP3210946B1 (en) * 2016-02-29 2020-07-08 Agfa-Gevaert Method of manufacturing an etched glass article
CN105733361B (zh) * 2016-04-29 2019-05-03 珠海天威新材料股份有限公司 一种抗蚀刻喷墨墨水及其应用
EP3296368B1 (en) 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
WO2019079037A1 (en) * 2017-10-17 2019-04-25 Kateeva, Inc. INK COMPOSITIONS HAVING HIGH QUANTUM POINT CONCENTRATIONS FOR DISPLAY DEVICES
KR20200116151A (ko) * 2018-03-02 2020-10-08 아그파-게바에르트 엔.브이. 인쇄 회로 기판을 제조하기 위한 잉크젯 잉크
EP3533844B1 (en) 2018-03-02 2022-09-28 Agfa-Gevaert Nv Inkjet inks for manufacturing printed circuit boards
US11359102B2 (en) * 2018-03-27 2022-06-14 Sun Chemical Corporation UV-curable compositions comprising cleavage type photoinitiators
US20220010156A1 (en) 2018-11-20 2022-01-13 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
EP3656824A1 (en) 2018-11-26 2020-05-27 Agfa-Gevaert Nv Radiation curable inkjet for manufacturing printed circuit boards
CN113056528A (zh) 2018-11-26 2021-06-29 爱克发-格法特公司 新型光引发剂
EP3686252A1 (en) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
EP3912439B1 (en) 2019-02-14 2024-04-03 Orbotech Ltd. A method and apparatus for preparing a pcb product having highly dense conductors
EP3757175A1 (en) 2019-06-28 2020-12-30 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
EP3757174B1 (en) 2019-06-28 2022-04-20 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
WO2021089358A1 (en) 2019-11-07 2021-05-14 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
EP3901226A1 (en) 2020-04-21 2021-10-27 Agfa-Gevaert Nv Method of manufacturing printed circuit boards
EP4032958A1 (en) 2021-01-25 2022-07-27 Agfa-Gevaert Nv Radiation curable inkjet inks
EP4190866A1 (en) 2021-12-02 2023-06-07 Agfa-Gevaert Nv Radiation curable inkjet inks
WO2024017926A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
WO2024017864A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
WO2024017881A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
WO2024017925A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
CN116239914A (zh) * 2022-09-09 2023-06-09 广东东溢新材料科技有限公司 一种水性白色油墨及其制备方法与应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270985A (en) * 1978-07-21 1981-06-02 Dynachem Corporation Screen printing of photopolymerizable inks
US4416974A (en) * 1979-12-05 1983-11-22 Hercules Incorporated Radiation curable ceramic pigment composition
JP2620954B2 (ja) * 1988-04-22 1997-06-18 日本合成化学工業株式会社 紫外線硬化型インキ
JPH01278585A (ja) 1988-04-30 1989-11-08 Somar Corp 紫外線硬化性レジストインキ
US5204383A (en) * 1990-03-28 1993-04-20 Kuraray Co., Ltd. Dental adhesives
GB9123070D0 (en) 1991-10-30 1991-12-18 Domino Printing Sciences Plc Ink
JPH0675374A (ja) * 1992-07-02 1994-03-18 Showa Denko Kk 光硬化性材料及び硬化方法
JPH06237063A (ja) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
US5371148A (en) * 1993-06-23 1994-12-06 Union Carbide Chemicals & Plastics Technology Corporation Reactive polymers having pendant flexible side chains prepared from ethylenically unsaturated carbodiimides
JPH0766530A (ja) * 1993-08-26 1995-03-10 Olympus Optical Co Ltd パターン形成方法
JP3799069B2 (ja) * 1993-12-14 2006-07-19 キヤノン株式会社 エッチングレジスト性組成物、これを用いたパターン形成方法及び配線基板の製造方法
GB9725928D0 (en) 1997-12-05 1998-02-04 Xaar Plc Radiation curable ink jet ink compositions
GB9725929D0 (en) 1997-12-05 1998-02-04 Xaar Plc Radiation curable ink jet ink compositions
JPH11340129A (ja) * 1998-05-28 1999-12-10 Seiko Epson Corp パターン製造方法およびパターン製造装置
JP2001288387A (ja) * 2000-04-05 2001-10-16 Sony Chem Corp 電離放射線硬化型インクジェット用インク及びその印画物
JP2001324803A (ja) * 2000-05-15 2001-11-22 Mitsubishi Chemicals Corp 赤外光感受性エッチングまたは鍍金用レジスト
MXPA03003997A (es) * 2000-11-09 2004-02-12 3M Innovative Properties Co Composiciones fluidas de tinta, eyectables, curables por radiacion, resistentes a la intemperie, particularmente adecuadas para aplicaciones exteriores.
JP2002179967A (ja) * 2000-12-18 2002-06-26 Dainippon Ink & Chem Inc 紫外線硬化型ジェットインク組成物及びその製造方法
GB2371551B (en) 2001-01-29 2003-07-30 Sericol Ltd A printing ink

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI595697B (zh) * 2011-06-17 2017-08-11 富士金股份有限公司 電化學元件的製造方法以及電化學元件的製造裝置

Also Published As

Publication number Publication date
ATE335796T1 (de) 2006-09-15
EP1543083A1 (en) 2005-06-22
EP1543083B1 (en) 2006-08-09
AU2003260741A1 (en) 2004-04-08
DE60307485D1 (de) 2006-09-21
US7427360B2 (en) 2008-09-23
WO2004026977A1 (en) 2004-04-01
TW200422356A (en) 2004-11-01
JP2005539391A (ja) 2005-12-22
KR20050057463A (ko) 2005-06-16
CN1694934A (zh) 2005-11-09
GB0221892D0 (en) 2002-10-30
KR100966508B1 (ko) 2010-06-29
US20060154033A1 (en) 2006-07-13
DE60307485T2 (de) 2007-04-12

Similar Documents

Publication Publication Date Title
TWI340754B (en) Process and ink for making electronic devices
TWI318231B (en) Ink jet printing process and solder mask ink composition
ATE412714T1 (de) Verfahren zum ätzen einer metall- oder metalllegierung oberfläche
US8460852B2 (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
JP2005539390A5 (zh)
JP2005539391A5 (zh)
JPH1020493A (ja) 光重合性熱硬化性樹脂組成物
US7338751B2 (en) Process for producing printed wiring board and photosensitive resin composition used in the same
KR101514900B1 (ko) 감광성 수지 조성물, 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
KR102608204B1 (ko) 프린트 배선판용의 경화성 절연성 조성물, 드라이 필름, 경화물, 프린트 배선판 및 프린트 배선판용의 경화성 절연성 조성물의 제조 방법
GB0221891D0 (en) Process
CN100401189C (zh) 光固化性·热固化性树脂组合物
JP2005539389A5 (zh)
CN116904063B (zh) Pcb光刻用uv固化水性抗蚀刻油墨的制备与应用方法
KR100421068B1 (ko) 액상 광경화성 조성물, 수계 광경화성 조성물 및 이들을사용하는 레지스트 패턴 형성 방법
KR100499836B1 (ko) 광중합성열경화성수지조성물
JP2750399B2 (ja) 耐熱性感光性樹脂組成物
JP5624288B2 (ja) スルーホール付きプリント配線板の製造方法
JP2764459B2 (ja) エポキシ（メタ）アクリレート、これを含む樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JPS61223073A (ja) 活性エネルギ−線硬化性被覆組成物
JPH06157713A (ja) 不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees