TW200615556A - Electronic component testing apparatus and method for configuring electronic component testing apparatus - Google Patents

Electronic component testing apparatus and method for configuring electronic component testing apparatus

Info

Publication number
TW200615556A
TW200615556A TW094124931A TW94124931A TW200615556A TW 200615556 A TW200615556 A TW 200615556A TW 094124931 A TW094124931 A TW 094124931A TW 94124931 A TW94124931 A TW 94124931A TW 200615556 A TW200615556 A TW 200615556A
Authority
TW
Taiwan
Prior art keywords
electronic component
testing apparatus
test
component testing
modules
Prior art date
Application number
TW094124931A
Other languages
English (en)
Other versions
TWI287099B (en
Inventor
Kazuyuki Yamashita
Yoshiyuki Masuo
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200615556A publication Critical patent/TW200615556A/zh
Application granted granted Critical
Publication of TWI287099B publication Critical patent/TWI287099B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
TW094124931A 2004-07-23 2005-07-22 Electronic component testing apparatus and method for configuring electronic component testing apparatus TWI287099B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004215802 2004-07-23

Publications (2)

Publication Number Publication Date
TW200615556A true TW200615556A (en) 2006-05-16
TWI287099B TWI287099B (en) 2007-09-21

Family

ID=35785360

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124931A TWI287099B (en) 2004-07-23 2005-07-22 Electronic component testing apparatus and method for configuring electronic component testing apparatus

Country Status (8)

Country Link
US (3) US7919974B2 (zh)
JP (3) JP4537400B2 (zh)
KR (2) KR101009966B1 (zh)
CN (3) CN1989416A (zh)
DE (1) DE112005001751T5 (zh)
MY (1) MY140086A (zh)
TW (1) TWI287099B (zh)
WO (2) WO2006009253A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452316B (zh) * 2010-01-29 2014-09-11 Hon Hai Prec Ind Co Ltd 熱量失效除錯系統及其溫度控制裝置
TWI457569B (zh) * 2008-12-19 2014-10-21 Semes Co Ltd 探針台
TWI464429B (zh) * 2011-09-06 2014-12-11 Seiko Epson Corp 處理器及零件檢查裝置
US11579189B2 (en) 2020-07-21 2023-02-14 ADVANIEST Corporation Electronic component handling apparatus and electronic component testing apparatus

Families Citing this family (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100541546B1 (ko) * 2003-07-14 2006-01-10 삼성전자주식회사 반도체 디바이스 테스트장치
CN1989416A (zh) * 2004-07-23 2007-06-27 株式会社爱德万测试 电子器件试验装置以及电子器件试验装置的编制方法
JP2007064841A (ja) * 2005-08-31 2007-03-15 Advantest Corp 電子部品試験装置用のキャリブレーションボード
JP4881316B2 (ja) * 2005-11-09 2012-02-22 株式会社アドバンテスト 電子部品試験装置、及び、電子部品試験装置のコンタクトアームの最適押付条件設定方法
WO2007057944A1 (ja) 2005-11-15 2007-05-24 Advantest Corporation 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法
US8402317B1 (en) 2005-12-22 2013-03-19 The Math Works, Inc. Viewing multi-dimensional metric data from multiple test cases
US8279204B1 (en) 2005-12-22 2012-10-02 The Mathworks, Inc. Viewer for multi-dimensional data from a test environment
US7746060B2 (en) * 2005-12-28 2010-06-29 Advantest Corporation Attachment apparatus, test head, and electronic device test system
WO2007083356A1 (ja) * 2006-01-17 2007-07-26 Advantest Corporation 電子部品試験装置及び電子部品の試験方法
CN101395487A (zh) * 2006-03-02 2009-03-25 株式会社爱德万测试 移动装置及电子部件测试装置
KR100790988B1 (ko) * 2006-04-11 2008-01-03 삼성전자주식회사 테스트 환경의 안정적 온도유지가 가능한 반도체 소자검사용 핸들러
WO2008012889A1 (en) * 2006-07-27 2008-01-31 Advantest Corporation Electronic component transfer method and electronic component handling device
JP4818891B2 (ja) * 2006-11-28 2011-11-16 日本エンジニアリング株式会社 バーンイン装置
WO2008068798A1 (ja) * 2006-11-30 2008-06-12 Advantest Corporation 電子部品ハンドリング装置、電子部品ハンドリングシステムおよび電子部品試験方法
US7589520B2 (en) * 2006-12-05 2009-09-15 Delta Design, Inc. Soak profiling
KR100923252B1 (ko) * 2007-08-22 2009-10-27 세크론 주식회사 테스트 핸들러에서 반도체 장치들을 이송하는 방법 및 장치
KR101350999B1 (ko) * 2007-08-23 2014-01-14 세메스 주식회사 반도체 장치의 테스트 방법 및 이를 수행하기 위한 테스트핸들러
US8757250B2 (en) * 2007-09-14 2014-06-24 Advantest Corporation Advanced thermal control interface
EP2081034B1 (en) * 2008-01-16 2014-03-12 ISMECA Semiconductor Holding SA Arrangement and method for handling electronic components
JP4471011B2 (ja) * 2008-03-11 2010-06-02 セイコーエプソン株式会社 部品試験装置及び部品搬送方法
US7851721B2 (en) * 2009-02-17 2010-12-14 Asm Assembly Automation Ltd Electronic device sorter comprising dual buffers
TWI384223B (zh) * 2009-02-18 2013-02-01 Keystone Electronics Corp 用於最終測試的裝置及方法
TWI401766B (zh) * 2009-03-23 2013-07-11 Evertechno Co Ltd 試驗處理機及其零件移送方法
JP4482616B1 (ja) 2009-08-07 2010-06-16 株式会社アドバンテスト 試験装置および試験方法
ITMI20100022A1 (it) * 2010-01-13 2011-07-14 Eles Semiconductor Equipment S P A Sistema integrato per testare dispositivi elettronici
JP2011163807A (ja) * 2010-02-05 2011-08-25 Advantest Corp 電子部品試験装置
US8598888B2 (en) * 2010-05-04 2013-12-03 Electro Scientific Industries, Inc. System and method for improved testing of electronic devices
FR2962606B1 (fr) 2010-07-09 2020-09-25 Denso Corp Machine électrique tournante améliorée pour assurer une protection contre les coupures d'alimentation électrique
CN102375112A (zh) * 2010-08-17 2012-03-14 华东科技股份有限公司 半导体元件测试方法
KR101188347B1 (ko) 2010-11-19 2012-10-05 주식회사 이안하이텍 디스플레이 패널용 에이징 검사 시스템 및 이를 이용한 에이징 검사 방법
CN102680745A (zh) * 2011-03-10 2012-09-19 致茂电子股份有限公司 电子元件测试***及其切换装置
KR101149759B1 (ko) * 2011-03-14 2012-06-01 리노공업주식회사 반도체 디바이스의 검사장치
US20120249172A1 (en) * 2011-03-31 2012-10-04 Electro Scientific Industries, Inc. Alignment system for electronic device testing
US9817062B2 (en) * 2011-05-19 2017-11-14 Celerint, Llc. Parallel concurrent test system and method
CN103547934B (zh) * 2011-05-19 2016-12-14 塞勒林特有限责任公司 并行并发测试***和方法
WO2012173093A1 (ja) * 2011-06-16 2012-12-20 株式会社 村田製作所 電子部品の特性測定方法
JP5745981B2 (ja) 2011-09-26 2015-07-08 三菱電機株式会社 半導体チップテスト方法、半導体チップテスト装置
JP2013137284A (ja) * 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2013137285A (ja) 2011-12-28 2013-07-11 Advantest Corp ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置
US20130200915A1 (en) 2012-02-06 2013-08-08 Peter G. Panagas Test System with Test Trays and Automated Test Tray Handling
US9519007B2 (en) * 2012-02-10 2016-12-13 Asm Technology Singapore Pte Ltd Handling system for testing electronic components
KR101968984B1 (ko) * 2012-03-16 2019-08-26 (주)테크윙 사이드도킹식 테스트핸들러
CN103302037B (zh) * 2012-03-16 2016-01-13 泰克元有限公司 测试分选机
KR101334766B1 (ko) * 2012-04-12 2013-11-29 미래산업 주식회사 반도체 소자 핸들링 시스템
KR101334767B1 (ko) * 2012-04-12 2013-11-29 미래산업 주식회사 반도체 소자 핸들링 시스템
KR101334765B1 (ko) * 2012-04-18 2013-11-29 미래산업 주식회사 반도체 소자 핸들링 시스템
US9250293B2 (en) * 2012-07-09 2016-02-02 Infineon Technologies Ag Capacitive test device and method for capacitive testing a component
US10976359B2 (en) * 2012-09-01 2021-04-13 Promptlink Communications, Inc. Functional verification process and universal platform for high-volume reverse logistics of CPE devices
US20140088909A1 (en) * 2012-09-27 2014-03-27 Robert P. Howell System and method of determining a parameter of a measured electronic device
CN103809128A (zh) * 2012-11-08 2014-05-21 中兴通讯股份有限公司 一种电源自动测试及老化生产线
TWI456220B (zh) * 2012-12-27 2014-10-11 Chroma Ate Inc 具有乾燥環境之測試機台
US11284063B2 (en) 2012-12-28 2022-03-22 Promptlink Communications, Inc. Video quality analysis and detection of blockiness, artifacts and color variation for high-volume testing of devices using automated video testing system
CN103926480A (zh) * 2013-01-10 2014-07-16 致茂电子(苏州)有限公司 具有干燥环境的测试机台
JP6267928B2 (ja) 2013-10-29 2018-01-24 東京エレクトロン株式会社 ウエハ検査装置の整備用台車及びウエハ検査装置の整備方法
CN105917452B (zh) * 2013-11-27 2019-06-07 塞勒林特有限责任公司 用于半导体器件处理机吞吐量优化的方法和***
KR102090004B1 (ko) * 2014-01-07 2020-03-17 삼성전자 주식회사 반도체 테스트 장치와 이의 동작 방법
US9638749B2 (en) * 2014-06-06 2017-05-02 Advantest Corporation Supporting automated testing of devices in a test floor system
US9678148B2 (en) 2014-06-06 2017-06-13 Advantest Corporation Customizable tester having testing modules for automated testing of devices
US9933454B2 (en) * 2014-06-06 2018-04-03 Advantest Corporation Universal test floor system
US9618570B2 (en) 2014-06-06 2017-04-11 Advantest Corporation Multi-configurable testing module for automated testing of a device
US9618574B2 (en) * 2014-06-06 2017-04-11 Advantest Corporation Controlling automated testing of devices
KR101670051B1 (ko) * 2014-07-08 2016-10-28 피에스케이 주식회사 처리 장치 및 방법
JP2016023939A (ja) * 2014-07-16 2016-02-08 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
US9651458B2 (en) 2014-09-19 2017-05-16 Swisslog Logistics Inc. Method and system for auto safety verification of AGV sensors
CN104596026B (zh) * 2014-12-15 2017-07-11 四川长虹电器股份有限公司 一种空调运行参数监测设备
KR102284233B1 (ko) * 2015-02-25 2021-08-03 (주)테크윙 전자부품 처리 시스템
SG10201505439TA (en) * 2015-07-10 2017-02-27 Aem Singapore Pte Ltd A configurable electronic device tester system
CN106829359A (zh) * 2015-09-30 2017-06-13 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置
KR102391516B1 (ko) * 2015-10-08 2022-04-27 삼성전자주식회사 반도체 테스트 장치
CN105548787B (zh) * 2015-11-30 2018-12-28 东莞市冠佳电子设备有限公司 电源自动测试***
US10177021B2 (en) * 2016-01-13 2019-01-08 Nxp B.V. Integrated circuits and methods therefor
KR102482700B1 (ko) * 2016-03-11 2022-12-28 삼성전자주식회사 반도체 패키지 테스트 방법
US10444270B2 (en) * 2016-03-11 2019-10-15 Samsung Electronics Co., Ltd. Systems for testing semiconductor packages
KR102548782B1 (ko) * 2016-07-26 2023-06-27 세메스 주식회사 반도체 소자 테스트 장치
KR102548788B1 (ko) * 2016-08-10 2023-06-27 세메스 주식회사 반도체 소자 테스트 장치
CN106405361B (zh) * 2016-08-24 2020-09-11 通富微电子股份有限公司 一种芯片测试方法及装置
CN107807296B (zh) * 2016-09-09 2021-01-22 泰克元有限公司 用于测试电子部件的分选机
KR102664951B1 (ko) * 2016-09-09 2024-05-10 (주)테크윙 전자부품 테스트용 핸들러
KR101956779B1 (ko) * 2017-01-17 2019-03-11 한국항공우주산업 주식회사 모듈화를 통한 자동시험장비의 운용 시스템
CN106841016A (zh) * 2017-01-17 2017-06-13 中科赛凌（北京）科技有限公司 一种具有环境试验测试功能的流水生产线
CN108535620A (zh) * 2017-03-02 2018-09-14 叶秀慧 应用静电载具测试半导体制品的机构
US10782348B2 (en) * 2017-03-10 2020-09-22 Keithley Instruments, Llc Automatic device detection and connection verification
JP2019027923A (ja) * 2017-07-31 2019-02-21 セイコーエプソン株式会社 押圧装置、電子部品搬送装置および電子部品検査装置
JP6986916B2 (ja) * 2017-10-04 2021-12-22 新東エスプレシジョン株式会社 検査装置及び検査方法
TWI631651B (zh) * 2017-10-20 2018-08-01 鴻勁精密股份有限公司 具承置單元之輸送裝置及其應用之測試分類設備
US10816572B2 (en) * 2018-01-12 2020-10-27 Rohde & Schwarz Gmbh & Co. Kg Radio frequency measuring device module and radio frequency measuring device
CN108499894A (zh) * 2018-03-30 2018-09-07 江苏富联通讯技术有限公司 一种短行程产品测试平台及其测试方法
KR101940484B1 (ko) * 2018-05-21 2019-04-10 (주) 액트 원전 제어계측카드의 전자부품 열화 평가장치 및 방법
CN108761236A (zh) * 2018-05-28 2018-11-06 北京智芯微电子科技有限公司 Rfid标签在高低温条件下的性能测试***和测试方法
US11348816B2 (en) * 2018-07-31 2022-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for die container warehousing
US11488848B2 (en) * 2018-07-31 2022-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated semiconductor die vessel processing workstations
JP7143201B2 (ja) 2018-12-14 2022-09-28 株式会社アドバンテスト センサ試験装置
JP7240869B2 (ja) 2018-12-14 2023-03-16 株式会社アドバンテスト センサ試験システム
JP7123244B2 (ja) * 2019-03-29 2022-08-22 平田機工株式会社 測定装置
JP7143246B2 (ja) * 2019-05-23 2022-09-28 株式会社アドバンテスト 電子部品ハンドリング装置及び電子部品試験装置
TWI700499B (zh) * 2019-07-17 2020-08-01 美商第一檢測有限公司 晶片測試系統
TWI706148B (zh) * 2019-07-17 2020-10-01 美商第一檢測有限公司 晶片測試方法
KR20210025226A (ko) * 2019-08-27 2021-03-09 삼성전자주식회사 테스트 모듈, 테스트 핸들러 및 테스트 핸들러를 이용한 반도체 소자의 테스트 방법
CN110658802B (zh) * 2019-09-04 2023-06-27 申通南车(上海)轨道交通车辆维修有限公司 一种地铁列车牵引***核心触发线路板智能检测设备
TWI745775B (zh) * 2019-11-01 2021-11-11 美商第一檢測有限公司 晶片測試裝置及晶片測試系統
KR102568005B1 (ko) * 2020-05-08 2023-08-28 (주)에이피텍 테스트 공정 모듈화 인라인 시스템
EP4150354A1 (en) * 2020-05-14 2023-03-22 Cohu GmbH An automated test system for testing singulated electronic components and a method of testing singulated electronic components
KR102360923B1 (ko) * 2020-06-29 2022-02-10 주식회사 메리테크 디바이스 고온 에이징 테스트 시스템
JP2022021241A (ja) * 2020-07-21 2022-02-02 株式会社アドバンテスト 電子部品ハンドリング装置及び電子部品試験装置
CN112325920B (zh) * 2020-11-06 2021-11-23 北京清大天达光电科技股份有限公司 一种传感器芯片标定测试调度方法及***
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DE102021111837A1 (de) 2021-05-06 2022-11-10 LAW-NDT Meß- und Prüfsysteme GmbH Prüfanlage für eine Mehrzahl von vereinzelbaren Prüfobjekten
TWI784603B (zh) * 2021-06-29 2022-11-21 牧德科技股份有限公司 物件之分類方法
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TWI832311B (zh) * 2022-06-30 2024-02-11 美商金士頓數位股份有限公司 用於積體電路裝置的自動化測試系統及自動化測試方法

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289133A (ja) * 1988-05-16 1989-11-21 Hitachi Ltd 半導体装置の搬送基板およびそれを用いた半導体装置の製造方法
JPH0712948Y2 (ja) * 1990-01-29 1995-03-29 株式会社アドバンテスト 部品試験装置
JP3012853B2 (ja) * 1990-09-14 2000-02-28 株式会社富士通宮城エレクトロニクス 半導体試験装置のハンドラー
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling
JPH06120316A (ja) * 1992-08-21 1994-04-28 Fujitsu Ltd 部品の試験方法
JP3238246B2 (ja) 1993-05-31 2001-12-10 東京エレクトロン株式会社 半導体ウエハの検査リペア装置及びバーンイン検査装置
JPH0836025A (ja) * 1993-10-19 1996-02-06 Advantest Corp ローダ及びアンローダの機能設定が可変なダイナミックテストハンドラの制御方法。
JPH07225255A (ja) * 1994-02-14 1995-08-22 Sony Corp 半導体製造装置
US5589953A (en) * 1994-06-24 1996-12-31 Nikon Corporation Image input system having an auto-feeder including loading magazine and discharge magazine arranged side by side and method
JPH08262102A (ja) * 1995-03-23 1996-10-11 Advantest Corp Ｉｃテスタ用ハンドラにおけるデバイス再検査方法
JP3379077B2 (ja) * 1995-08-04 2003-02-17 株式会社アドバンテスト Ｉｃ試験装置
DE19680913C2 (de) * 1995-09-04 1999-06-17 Advantest Corp Halbleiterbauelement-Transport- und -Handhabungseinrichtung
JP3134738B2 (ja) * 1995-09-28 2001-02-13 安藤電気株式会社 ハンドリングシステム
JP3007290B2 (ja) * 1996-01-19 2000-02-07 オリオン機械株式会社 組立式ライン型環境試験装置及びその組立方法
JP3017073B2 (ja) * 1996-01-19 2000-03-06 オリオン機械株式会社 各試験モジュールを用いたライン型環境試験装置の試験方法
JP3417528B2 (ja) * 1996-04-05 2003-06-16 株式会社アドバンテスト Ｉｃ試験装置
JPH09304476A (ja) * 1996-05-20 1997-11-28 Fujitsu Ltd 電子部品の試験方法及び試験装置
KR100245799B1 (ko) * 1997-06-30 2000-03-02 윤종용 검사조건 자동 작성 및 전송시 스템 및 방법
TW379285B (en) * 1997-07-02 2000-01-11 Advantest Corp Testing device for semiconductor components and the testing trays used in the testing apparatus
JPH1123659A (ja) * 1997-07-07 1999-01-29 Nec Corp 半導体装置のテストシステム
TW369692B (en) * 1997-12-26 1999-09-11 Samsung Electronics Co Ltd Test and burn-in apparatus, in-line system using the apparatus, and test method using the system
US6396295B1 (en) * 1998-06-02 2002-05-28 Integrated Silicon Solution, Inc. System and method for combining integrated circuit final test and marking
JP4299383B2 (ja) * 1998-06-25 2009-07-22 株式会社アドバンテスト Ｉｃ試験装置
TW533316B (en) * 1998-12-08 2003-05-21 Advantest Corp Testing device for electronic device
JP2000214217A (ja) * 1999-01-21 2000-08-04 Toshiba Microelectronics Corp 半導体試験方法および半導体テストシステム
JP2000241495A (ja) * 1999-02-22 2000-09-08 Matsushita Electric Works Ltd 自動エージング検査装置
US6629282B1 (en) * 1999-11-05 2003-09-30 Advantest Corp. Module based flexible semiconductor test system
KR100308907B1 (ko) 1999-11-15 2001-11-02 윤종용 저속 가입자 확장형 시스템
JP2001175526A (ja) * 1999-12-20 2001-06-29 Ando Electric Co Ltd Ｉｃ試験システム、及びｉｃ試験方法
US6651204B1 (en) 2000-06-01 2003-11-18 Advantest Corp. Modular architecture for memory testing on event based test system
JP4570208B2 (ja) * 2000-06-13 2010-10-27 株式会社アドバンテスト 試験済み電子部品の分類制御方法
JP2002071755A (ja) * 2000-08-28 2002-03-12 Advantest Corp 半導体試験装置
US6518745B2 (en) * 2000-10-10 2003-02-11 Mirae Corporation Device test handler and method for operating the same
JP2002174659A (ja) 2000-12-06 2002-06-21 Ando Electric Co Ltd Ｉｃテストシステム
JP4789125B2 (ja) * 2000-12-07 2011-10-12 株式会社アドバンテスト 電子部品試験用ソケットおよびこれを用いた電子部品試験装置
TW518705B (en) * 2000-12-27 2003-01-21 Tokyo Electron Ltd Workpiece transfer system, transfer method, vacuum chuck, and wafer centering method
JP2002228713A (ja) * 2001-01-31 2002-08-14 Ando Electric Co Ltd オートハンドラ及びそのトレー搬送方法
CN1384366A (zh) 2001-04-29 2002-12-11 株式会社鼎新 基于模块的灵活的半导体测试***
KR100436213B1 (ko) * 2001-12-17 2004-06-16 미래산업 주식회사 반도체 소자 테스트 핸들러용 소자 정렬장치
US6897670B2 (en) * 2001-12-21 2005-05-24 Texas Instruments Incorporated Parallel integrated circuit test apparatus and test method
JP2003329741A (ja) * 2002-05-16 2003-11-19 Toshiba Microelectronics Corp 半導体製品の管理システム
US6744267B2 (en) 2002-07-16 2004-06-01 Nptest, Llc Test system and methodology
JP3494642B2 (ja) 2002-12-16 2004-02-09 株式会社アドバンテスト Ｉｃ試験装置
KR100495819B1 (ko) * 2003-06-14 2005-06-16 미래산업 주식회사 반도체 소자 테스트 핸들러의 소자 안착장치
US20070159532A1 (en) * 2004-03-31 2007-07-12 Advantest Corporation Image sensor test apparatus
DE112004002826T5 (de) * 2004-06-08 2007-04-26 Advantest Corporation Bildsensor-Prüfsystem
CN1989416A (zh) * 2004-07-23 2007-06-27 株式会社爱德万测试 电子器件试验装置以及电子器件试验装置的编制方法
WO2007000799A1 (ja) * 2005-06-27 2007-01-04 Advantest Corporation コンタクタ、該コンタクタを備えたコンタクトストラクチャ、プローブカード、試験装置、コンタクトストラクチャ製造方法、及び、コンタクトストラクチャ製造装置
JP4537394B2 (ja) * 2006-02-13 2010-09-01 株式会社アドバンテスト コンタクトプッシャ、コンタクトアーム及び電子部品試験装置
US7405582B2 (en) * 2006-06-01 2008-07-29 Advantest Corporation Measurement board for electronic device test apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI457569B (zh) * 2008-12-19 2014-10-21 Semes Co Ltd 探針台
TWI452316B (zh) * 2010-01-29 2014-09-11 Hon Hai Prec Ind Co Ltd 熱量失效除錯系統及其溫度控制裝置
TWI464429B (zh) * 2011-09-06 2014-12-11 Seiko Epson Corp 處理器及零件檢查裝置
US11579189B2 (en) 2020-07-21 2023-02-14 ADVANIEST Corporation Electronic component handling apparatus and electronic component testing apparatus
TWI831009B (zh) * 2020-07-21 2024-02-01 日商阿德潘鐵斯特股份有限公司 電子元件處理裝置以及電子元件測試裝置

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