TWI456220B - 具有乾燥環境之測試機台 - Google Patents

具有乾燥環境之測試機台 Download PDF

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Publication number
TWI456220B
TWI456220B TW101150472A TW101150472A TWI456220B TW I456220 B TWI456220 B TW I456220B TW 101150472 A TW101150472 A TW 101150472A TW 101150472 A TW101150472 A TW 101150472A TW I456220 B TWI456220 B TW I456220B
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TW
Taiwan
Prior art keywords
test
carrying device
objects
tested
buffer
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TW101150472A
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English (en)
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TW201425957A (zh
Inventor
Hsin Yi Wu
Hsuan Jen Shen
Chien Ming Chen
Yang Chin Yi Ou
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Chroma Ate Inc
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Application filed by Chroma Ate Inc filed Critical Chroma Ate Inc
Priority to TW101150472A priority Critical patent/TWI456220B/zh
Priority to US14/108,176 priority patent/US9470749B2/en
Publication of TW201425957A publication Critical patent/TW201425957A/zh
Application granted granted Critical
Publication of TWI456220B publication Critical patent/TWI456220B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/42—Low-temperature sample treatment, e.g. cryofixation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)

Claims (9)

  1. 一種具有乾燥環境之測試機台，係用以測試複數個待測物，該測試機台包含：一測試站，係用以對該些待測物進行一測試程序；一緩衝承載裝置，係鄰近設置於該測試站之一側，該緩衝承載裝置用以容納該些待測物，以對該些待測物進行一溫度調控處理；一傳輸承載裝置，係鄰近設置於該測試站之另一側，可沿一傳送方向往復移動，該傳輸承載裝置用以傳送該些待測物進出該測試站，並可對該些待測物進行一回溫處理；一搬運機構，用以將該些待測物搬運至該緩衝承載裝置、該測試站及該傳輸承載裝置，該搬運機構包含：一第一搬運臂，用以將該些待測物自該傳輸承載裝置搬運至該緩衝承載裝置以進行該溫度調控處理，自該緩衝承載裝置搬運至該測試站以進行該測試程序，以及自該測試站搬運至該傳輸承載裝置以進行該回溫處理；以及一第二搬運臂，用以將該些待測物自該傳輸承載裝置搬運至該緩衝承載裝置以進行該溫度調控處理，自該緩衝承載裝置搬運至該測試站以進行該測試程序，以及自該測試站搬運至該傳輸承載裝置以進行該回溫處理；以及一乾燥氣體導流機構，係導引一乾燥氣體包圍該測試站、該緩衝承載裝置、該傳輸承載裝置及該搬運機構，用以產生乾燥環境防止結露。
  2. 如申請專利範圍第1項所述之測試機台，其中，該第一搬運臂自該傳輸承載裝置移動至該緩衝承載裝置時，該第二搬運臂在該測試站進行該測試程序或等待，當該第一搬運臂自該緩衝承載裝置移動至該測試站時，該第二搬運臂自該測試站移動至該傳輸承載裝置。
  3. 如申請專利範圍第1項所述之測試機台，其中，該傳輸承載裝置包含一輸入容納部以及一輸出容納部，該搬運機構將該些待測物自該輸入容納部搬運至該緩衝承載裝置以進行該溫度調控處理，以及自該測試站搬運至該輸出容納部以進行該回溫處理。
  4. 如申請專利範圍第3項所述之測試機台，其中，該輸出容納部係設有一加熱裝置，該加熱裝置係用以進行該回溫處理。
  5. 如申請專利範圍第1項所述之測試機台，其中，該緩衝承載裝置包含複數個容納部，該緩衝承載裝置可沿該傳送方向往復移動，用以提供該搬運機構將該些待測物分別搬運至該複數個容納部。
  6. 如申請專利範圍第1項所述之測試機台，其中，該緩衝承載裝置係設有一溫度控制器，用以進行該溫度調控處理。
  7. 如申請專利範圍第1項所述之測試機台，另包含一下壓機構，用以對容納於該緩衝承載裝置之該些待測物之上表面進行該溫度調控處理。
  8. 如申請專利範圍第1項所述之測試機台，其中，該傳輸承載裝置包含一定位機構，用以對待測物進行一定位調整。
  9. 一種具有乾燥環境之測試機台，係用以測試複數個待測物，該測試機台包含：一測試站，係用以對該些待測物進行一測試程序；一緩衝承載裝置，係鄰近設置於該測試站之一側，該緩衝承載裝置用以容納該些待測物，以對該些待測物進行一溫度調控處理；一傳輸承載裝置，係鄰近設置於該測試站之另一側，可沿一傳送方向往復移動，該傳輸承載裝置用以傳送該些待測物進出該測試站，並可對該些待測物進行一回溫處理，該傳輸承載裝置係設有一加熱裝置，該加熱裝置係用以進行該回溫處理；一搬運機構，用以將該些待測物搬運至該緩衝承載裝置、該測試站及該傳輸承載裝置；以及一乾燥氣體導流機構，係導引一乾燥氣體包圍該測試站、該緩衝承載裝置、該傳輸承載裝置及該搬運機構，用以產生乾燥環境防止結露。
TW101150472A 2012-12-27 2012-12-27 具有乾燥環境之測試機台 TWI456220B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101150472A TWI456220B (zh) 2012-12-27 2012-12-27 具有乾燥環境之測試機台
US14/108,176 US9470749B2 (en) 2012-12-27 2013-12-16 Test apparatus with dry environment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101150472A TWI456220B (zh) 2012-12-27 2012-12-27 具有乾燥環境之測試機台

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TW201425957A TW201425957A (zh) 2014-07-01
TWI456220B true TWI456220B (zh) 2014-10-11

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6945336B2 (ja) * 2017-04-24 2021-10-06 東京エレクトロン株式会社 ウエハ検査装置
TWI701436B (zh) * 2017-11-24 2020-08-11 鴻勁精密股份有限公司 具防結露偵控單元之測試裝置及其應用之測試分類設備

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW507257B (en) * 2001-02-01 2002-10-21 Task Technology Inc IC sample delivery procedure of IC testing processor and its structure
TWI274029B (en) * 2006-03-16 2007-02-21 Hon Tech Inc Testing machine for integrated circuits
CN1989415A (zh) * 2004-07-23 2007-06-27 株式会社爱德万测试 电子器件试验装置
CN101650374B (zh) * 2008-08-12 2011-07-20 中茂电子(深圳)有限公司 具变温装置的半导体组件测试座及测试机台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004354341A (ja) * 2003-05-30 2004-12-16 Denso Corp 環境試験装置及び環境試験方法
US20050030052A1 (en) * 2003-08-06 2005-02-10 International Business Machines Corporation Temperature and condensation control system for functional tester
US7595630B2 (en) * 2005-09-26 2009-09-29 Finisar Corporation Automated laser header testing
US8733186B2 (en) * 2009-12-02 2014-05-27 Air Dynamics Industrial Systems Corporation Sand and dust environmental testing system
JP5942459B2 (ja) * 2012-02-14 2016-06-29 セイコーエプソン株式会社 ハンドラー、及び部品検査装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW507257B (en) * 2001-02-01 2002-10-21 Task Technology Inc IC sample delivery procedure of IC testing processor and its structure
CN1989415A (zh) * 2004-07-23 2007-06-27 株式会社爱德万测试 电子器件试验装置
TWI274029B (en) * 2006-03-16 2007-02-21 Hon Tech Inc Testing machine for integrated circuits
CN101650374B (zh) * 2008-08-12 2011-07-20 中茂电子(深圳)有限公司 具变温装置的半导体组件测试座及测试机台

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Publication number Publication date
TW201425957A (zh) 2014-07-01
US20140182397A1 (en) 2014-07-03
US9470749B2 (en) 2016-10-18

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