KR970013389A - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR970013389A
KR970013389A KR1019960034436A KR19960034436A KR970013389A KR 970013389 A KR970013389 A KR 970013389A KR 1019960034436 A KR1019960034436 A KR 1019960034436A KR 19960034436 A KR19960034436 A KR 19960034436A KR 970013389 A KR970013389 A KR 970013389A
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package
semiconductor device
heat sink
adhesive
semiconductor
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KR1019960034436A
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KR100444559B1 (ko
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유키노부 와타야
히데토 이소노
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이데이 노부유키
소니 가부시기가이샤
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Publication of KR100444559B1 publication Critical patent/KR100444559B1/ko

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    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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Abstract

요형(凹型) 형상으로 수지성형된 패키지를 사용하는 고체촬상장치 등의 반도체장치에 있어서, 동작시의 반도체 칩의 온도상승을 낮게 억제한다.
요형 형상으로 수지성형된 패키지(1)의 요부(凹部)(la)의 저부에 방열판(4)을 매입한다. 요부(la)의 저면상에 탑재되는 CCD칩(2)의 중앙부의 아래의 부분의 패키지(1)에 개구(lb)를 배설하고, 이 개구(lb)를 통하여 CCD칩(2)과 방열판(4)과를 접착제(3)에 의하여 접착한다. 접착제(3)로서는, 패키지(1)를 구성하는 수지보다 열전도율이 큰 것을 사용한다.

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 도 1의 Ⅳ-Ⅳ선에 따른 단면도.

Claims (7)

  1. 요형(凹型) 형상으로 수지성형된 패키지의 요부(凹部)의 저면상에 반도체칩이 탑재되고, 상기 패키지가 기밀봉지(氣密封止)된 구조를 가지는 반도체장치에 있어, 상기 요부의 저부의 상기 패키지내 또는 상기 요부의 저면상에 방열판이 배설되고, 상기 반도체칩과 상기 방열판이 상기 패키지를 구성하는 수지보다 열전도율이 큰 접착제에 의하여 접착되어 있는 것을 특징으로 하는 반도체장치.
  2. 청구항 1에 있어서, 상기 요부의 저부의 상기 패키지내에 상기 방열판이 매입되고, 상기 요부의 저부의 상기 패키지에 상기 방열판의 일부가 노출되도록 배설된 개구를 통하여 상기 반도체칩과 상기 방열판이 상기 접착제에 의하여 접착되어 있는 것을 특징으로 하는 반도체장치.
  3. 청구항 1에 있어서, 상기 요부의 저면상에 상기 방열판이 배설되고, 상기 방열판상에 상기 반도체칩이 상기 접착제에 의하여 접착되어 있는 것을 특징으로 하는 반도체장치.
  4. 청구항 1에 있어서, 상기 패키지를 구성하는 수지는 에폭시수지이고, 상기 접착제는 에폭시수지를 주성분으로 하고, 금속으로 이루어지는 필러를 함유하는 접착제인 것을 특징으로 하는 반도체장치.
  5. 청구항 1에 있어서, 상기 방열판은 리드프레임의 일부로 이루어지는 것을 특징으로 하는 반도체장치.
  6. 청구항 1에 있어서, 상기 방열판의 외형은 상기 반도체칩의 외형보다 큰 것을 특징으로 하는 반도체장치.
  7. 청구항 1에 있어서, 상기 반도체장치는 고체촬상장치인 것을 특징으로 하는 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960034436A 1995-08-25 1996-08-20 반도체장치 KR100444559B1 (ko)

Applications Claiming Priority (2)

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JP95-240987 1995-08-25
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US6392309B1 (en) 2002-05-21
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JPH0964251A (ja) 1997-03-07

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