TWI561799B - Packaging method, cover structure of temperature sensing element and method for fabricating the same - Google Patents

Packaging method, cover structure of temperature sensing element and method for fabricating the same

Info

Publication number
TWI561799B
TWI561799B TW104127576A TW104127576A TWI561799B TW I561799 B TWI561799 B TW I561799B TW 104127576 A TW104127576 A TW 104127576A TW 104127576 A TW104127576 A TW 104127576A TW I561799 B TWI561799 B TW I561799B
Authority
TW
Taiwan
Prior art keywords
fabricating
same
sensing element
temperature sensing
cover structure
Prior art date
Application number
TW104127576A
Other languages
Chinese (zh)
Other versions
TW201708798A (en
Inventor
Chung-I Chiang
Yun-Kuei Chiu
Original Assignee
Chiang Chung I
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chiang Chung I filed Critical Chiang Chung I
Priority to TW104127576A priority Critical patent/TWI561799B/en
Priority to CN201510582194.5A priority patent/CN106486385A/en
Application granted granted Critical
Publication of TWI561799B publication Critical patent/TWI561799B/en
Publication of TW201708798A publication Critical patent/TW201708798A/en

Links

TW104127576A 2015-08-24 2015-08-24 Packaging method, cover structure of temperature sensing element and method for fabricating the same TWI561799B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104127576A TWI561799B (en) 2015-08-24 2015-08-24 Packaging method, cover structure of temperature sensing element and method for fabricating the same
CN201510582194.5A CN106486385A (en) 2015-08-24 2015-09-14 Packaging method of temperature measurement assembly, cover body structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104127576A TWI561799B (en) 2015-08-24 2015-08-24 Packaging method, cover structure of temperature sensing element and method for fabricating the same

Publications (2)

Publication Number Publication Date
TWI561799B true TWI561799B (en) 2016-12-11
TW201708798A TW201708798A (en) 2017-03-01

Family

ID=58227288

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104127576A TWI561799B (en) 2015-08-24 2015-08-24 Packaging method, cover structure of temperature sensing element and method for fabricating the same

Country Status (2)

Country Link
CN (1) CN106486385A (en)
TW (1) TWI561799B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW408495B (en) * 1998-12-09 2000-10-11 Shie Jeng Shiung Vacuum package method of the infrared microsense device
US20050017175A1 (en) * 2003-07-24 2005-01-27 Delphi Technologies, Inc. Infrared sensor package
CN101691200A (en) * 2009-09-29 2010-04-07 中国科学院上海微***与信息技术研究所 Low temperature vacuum encapsulation structure of non-refrigeration infrared detector and manufacturing method thereof
CN203967072U (en) * 2014-07-16 2014-11-26 佳霖科技股份有限公司 For temperature, survey the wafer level packaging structure of assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3435925B2 (en) * 1995-08-25 2003-08-11 ソニー株式会社 Semiconductor device
US6890834B2 (en) * 2001-06-11 2005-05-10 Matsushita Electric Industrial Co., Ltd. Electronic device and method for manufacturing the same
JP5097275B2 (en) * 2008-10-28 2012-12-12 パナソニック株式会社 Imaging unit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW408495B (en) * 1998-12-09 2000-10-11 Shie Jeng Shiung Vacuum package method of the infrared microsense device
US20050017175A1 (en) * 2003-07-24 2005-01-27 Delphi Technologies, Inc. Infrared sensor package
CN101691200A (en) * 2009-09-29 2010-04-07 中国科学院上海微***与信息技术研究所 Low temperature vacuum encapsulation structure of non-refrigeration infrared detector and manufacturing method thereof
CN203967072U (en) * 2014-07-16 2014-11-26 佳霖科技股份有限公司 For temperature, survey the wafer level packaging structure of assembly

Also Published As

Publication number Publication date
CN106486385A (en) 2017-03-08
TW201708798A (en) 2017-03-01

Similar Documents

Publication Publication Date Title
EP3252447A4 (en) Temperature sensor
GB2556170B (en) Integrated pressure and temperature sensor
EP3401658A4 (en) Temperature sensor
EP3556872A4 (en) Temperature sensor
EP3533072A4 (en) Temperature sensors
EP3104376A4 (en) Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor
HK1221204A1 (en) Package and method for manufacturing same
GB201518809D0 (en) Temperature sensor
EP3431944A4 (en) Temperature sensor
HK1258959A1 (en) Trim element comprising temperature sensor
SG11201504863WA (en) Sensor, method for forming the same, and method of controlling the same
GB2541933B (en) Temperature measuring method
GB201522790D0 (en) Temperature sensor
EP3115759A4 (en) Temperature sensor and temperature sensor manufacturing method
EP3264056A4 (en) Temperature sensor
EP3245506A4 (en) Temperature sensor
SG11201703811WA (en) Adorning element and method for manufacturing the same
TWI562344B (en) Image sensing devie and method for fabricating the same
EP3438627A4 (en) Temperature sensor
GB2547978B (en) Temperature measurement
GB201715505D0 (en) Temperature monitoring
EP3367079A4 (en) Temperature sensing body
TWI562309B (en) Semiconductor structure and method for fabricating the same
EP3410087A4 (en) Temperature sensor
EP3396340A4 (en) Temperature sensor

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees