TWI561799B - Packaging method, cover structure of temperature sensing element and method for fabricating the same - Google Patents
Packaging method, cover structure of temperature sensing element and method for fabricating the sameInfo
- Publication number
- TWI561799B TWI561799B TW104127576A TW104127576A TWI561799B TW I561799 B TWI561799 B TW I561799B TW 104127576 A TW104127576 A TW 104127576A TW 104127576 A TW104127576 A TW 104127576A TW I561799 B TWI561799 B TW I561799B
- Authority
- TW
- Taiwan
- Prior art keywords
- fabricating
- same
- sensing element
- temperature sensing
- cover structure
- Prior art date
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104127576A TWI561799B (en) | 2015-08-24 | 2015-08-24 | Packaging method, cover structure of temperature sensing element and method for fabricating the same |
CN201510582194.5A CN106486385A (en) | 2015-08-24 | 2015-09-14 | Packaging method of temperature measurement assembly, cover body structure and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104127576A TWI561799B (en) | 2015-08-24 | 2015-08-24 | Packaging method, cover structure of temperature sensing element and method for fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI561799B true TWI561799B (en) | 2016-12-11 |
TW201708798A TW201708798A (en) | 2017-03-01 |
Family
ID=58227288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104127576A TWI561799B (en) | 2015-08-24 | 2015-08-24 | Packaging method, cover structure of temperature sensing element and method for fabricating the same |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106486385A (en) |
TW (1) | TWI561799B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW408495B (en) * | 1998-12-09 | 2000-10-11 | Shie Jeng Shiung | Vacuum package method of the infrared microsense device |
US20050017175A1 (en) * | 2003-07-24 | 2005-01-27 | Delphi Technologies, Inc. | Infrared sensor package |
CN101691200A (en) * | 2009-09-29 | 2010-04-07 | 中国科学院上海微***与信息技术研究所 | Low temperature vacuum encapsulation structure of non-refrigeration infrared detector and manufacturing method thereof |
CN203967072U (en) * | 2014-07-16 | 2014-11-26 | 佳霖科技股份有限公司 | For temperature, survey the wafer level packaging structure of assembly |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3435925B2 (en) * | 1995-08-25 | 2003-08-11 | ソニー株式会社 | Semiconductor device |
US6890834B2 (en) * | 2001-06-11 | 2005-05-10 | Matsushita Electric Industrial Co., Ltd. | Electronic device and method for manufacturing the same |
JP5097275B2 (en) * | 2008-10-28 | 2012-12-12 | パナソニック株式会社 | Imaging unit |
-
2015
- 2015-08-24 TW TW104127576A patent/TWI561799B/en not_active IP Right Cessation
- 2015-09-14 CN CN201510582194.5A patent/CN106486385A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW408495B (en) * | 1998-12-09 | 2000-10-11 | Shie Jeng Shiung | Vacuum package method of the infrared microsense device |
US20050017175A1 (en) * | 2003-07-24 | 2005-01-27 | Delphi Technologies, Inc. | Infrared sensor package |
CN101691200A (en) * | 2009-09-29 | 2010-04-07 | 中国科学院上海微***与信息技术研究所 | Low temperature vacuum encapsulation structure of non-refrigeration infrared detector and manufacturing method thereof |
CN203967072U (en) * | 2014-07-16 | 2014-11-26 | 佳霖科技股份有限公司 | For temperature, survey the wafer level packaging structure of assembly |
Also Published As
Publication number | Publication date |
---|---|
CN106486385A (en) | 2017-03-08 |
TW201708798A (en) | 2017-03-01 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |