KR940006225A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR940006225A
KR940006225A KR1019930009788A KR930009788A KR940006225A KR 940006225 A KR940006225 A KR 940006225A KR 1019930009788 A KR1019930009788 A KR 1019930009788A KR 930009788 A KR930009788 A KR 930009788A KR 940006225 A KR940006225 A KR 940006225A
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South Korea
Prior art keywords
semiconductor element
tab tape
semiconductor
resin
semiconductor device
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KR1019930009788A
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English (en)
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KR970004321B1 (ko
Inventor
후미오 구라이시
노리오 와다
히로후미 우찌다
Original Assignee
이노우에 사다오
신꼬오 덴기 고오교오 가부시끼가이샤
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Publication of KR940006225A publication Critical patent/KR940006225A/ko
Application granted granted Critical
Publication of KR970004321B1 publication Critical patent/KR970004321B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

본 발명은 봉지수지내에서 반도체소자가 경사지는 것등을 방지할 수 있고 장치전체의 휘임, 아우터리드가 구부러지는 것등을 방지할 수 있는 반도체장치를 제공함은 목적으로 한다.
TAB테이프(10)의 인너리드(12)에 반도체소자(14)를 탑재하고 이 반도체소자(14)를 봉지수지(4)로 봉지한 반도체 장치(2)에 있어서 반도체소자(14)를 사이에 끼우고 양쪽에 방열체(17,18)가 봉지수지(4)로 고착되고 적어도 한쪽방열체(18)가 반도체소자연 대응하는 부위에 반도체소자(14)의 봉지수지(4) 내에서 경사지는 것을 방지하기 위하여 소자면에 근접하는 돌출부(20)를 갖고 있다.

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예를 나타낸 단면도,
제2도는 방열체의 평면도,
제3도는 제1실시에에 있어서의 반도체 장치의 평면도.

Claims (6)

  1. TAB테이프의 인너리드에 반도체소자를 탑재하고 이 반도체소자를 봉지수지로 봉지한 반도체장치에 있어서, 상기 반도체소자를 사이에 끼우고 양쪽에 방열체가 봉지수지로 고착되고 적어도 한쪽 방열체가 반도체소자면에 대응하는 부위에 반도체소자의 봉지수지내에서 경사지는 것을 방지하기 위하여 반도체소자면에 근접하는 돌출부를 갖고 있는 것을 특징으로 하는 반도체장치.
  2. 제1항에 있어서, 상기 양방열체의 주연부가 TAB테이프쪽으로 절곡되고 이 절곡된 주연부에 절연물을 거쳐서 TAB테이프가 사이에 끼워져 있는 것을 특징으로 하는 반도체 장치.
  3. 제1항 또는 2항에 있어서, 상기 양방열체중의 한쪽 방열체가 그 주연부에서 접착제에 의해서 TAB테이프에 접착되어 있는 것을 특징으로 하는 반도체 장치.
  4. 제1항 또는 2항에 있어서, 상기 양방열체중에서 TAB테이프의 리드쪽에 위치하는 방열체의 주연부가 절연물을 거쳐서 상기 TAB테이프를 사이에 끼워 눌으고, 이 절연물 및 방열체의 주연부가 수지봉지시에 수지가 금형밖으로 누출되는 것을 방지하는 댐부로 형성되어 있는 것을 특징으로 하는 반도체 장치.
  5. 제1항 또는 2항에 있어서, 상기 방열체의 적어도 한쪽을 접지리드에 접속한 것을 특징으로 하는 반도체장치.
  6. TAB테이프의 인너리드에 반도체소자를 탑재하고 이 반도체소자를 봉지수지로 봉지한 반도체장치에 있어서, 상기 반도체소자를 사이에 끼우고 적어도 한쪽에 방열체가 봉지수지로 고착되고 이 적어도 한쪽의 방열체가 반도체소자면에 대응하는 부위에 반도체소자면에 직접 또는 간접으로 맞닿아 지지하는 소자지지부와 반도체 소자 보다도 외측의 TAB테이프부분에 직접 또는 간접으로 맞닿아 지지하는 TAB테이프지지부를 갖는 것을 특징으로 하는 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930009788A 1992-06-04 1993-06-01 반도체 장치 KR970004321B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP92-170176 1992-06-04
JP17017692 1992-06-04
JP01693693A JP3322429B2 (ja) 1992-06-04 1993-01-06 半導体装置
JP93-16936 1993-01-06

Publications (2)

Publication Number Publication Date
KR940006225A true KR940006225A (ko) 1994-03-23
KR970004321B1 KR970004321B1 (ko) 1997-03-26

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KR1019930009788A KR970004321B1 (ko) 1992-06-04 1993-06-01 반도체 장치

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US (1) US5365107A (ko)
EP (1) EP0573297A3 (ko)
JP (1) JP3322429B2 (ko)
KR (1) KR970004321B1 (ko)

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EP0573297A3 (en) 1993-12-29
KR970004321B1 (ko) 1997-03-26
US5365107A (en) 1994-11-15

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