KR101499926B1 - 백색 경화성 수지 조성물 - Google Patents

백색 경화성 수지 조성물 Download PDF

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Publication number
KR101499926B1
KR101499926B1 KR1020110081787A KR20110081787A KR101499926B1 KR 101499926 B1 KR101499926 B1 KR 101499926B1 KR 1020110081787 A KR1020110081787 A KR 1020110081787A KR 20110081787 A KR20110081787 A KR 20110081787A KR 101499926 B1 KR101499926 B1 KR 101499926B1
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KR
South Korea
Prior art keywords
curable resin
resin composition
mass
parts
molecule
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KR1020110081787A
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English (en)
Korean (ko)
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KR20120022639A (ko
Inventor
타카히로 츠루마키
야스유키 하세가와
나오키 오카다
Original Assignee
가부시키가이샤 다무라 세이사쿠쇼
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Publication of KR20120022639A publication Critical patent/KR20120022639A/ko
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Publication of KR101499926B1 publication Critical patent/KR101499926B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020110081787A 2010-08-18 2011-08-17 백색 경화성 수지 조성물 KR101499926B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-183332 2010-08-18
JP2010183332A JP5650460B2 (ja) 2010-08-18 2010-08-18 白色硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20120022639A KR20120022639A (ko) 2012-03-12
KR101499926B1 true KR101499926B1 (ko) 2015-03-06

Family

ID=45898108

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110081787A KR101499926B1 (ko) 2010-08-18 2011-08-17 백색 경화성 수지 조성물

Country Status (3)

Country Link
JP (1) JP5650460B2 (ja)
KR (1) KR101499926B1 (ja)
CN (1) CN102520582A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5853806B2 (ja) * 2012-03-23 2016-02-09 Jsr株式会社 感放射線性樹脂組成物、硬化膜及び硬化膜の形成方法
JP5841570B2 (ja) * 2012-10-19 2016-01-13 太陽インキ製造株式会社 硬化性樹脂組成物、ソルダーレジスト形成用硬化性樹脂組成物、硬化塗膜およびプリント配線板
KR20140050550A (ko) * 2012-10-19 2014-04-29 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 솔더 레지스트 형성용 경화성 수지 조성물, 경화 도막 및 프린트 배선판
JP6209365B2 (ja) * 2012-12-11 2017-10-04 太陽インキ製造株式会社 光硬化性樹脂組成物、ソルダーレジストおよびプリント配線板
JP6345947B2 (ja) * 2014-02-27 2018-06-20 株式会社タムラ製作所 感光性樹脂組成物
WO2016002923A1 (ja) * 2014-07-04 2016-01-07 積水化学工業株式会社 光硬化性組成物及び電子部品の製造方法
WO2017086334A1 (ja) * 2015-11-16 2017-05-26 株式会社クラレ Ｌｅｄ反射板用ポリエステル組成物、ｌｅｄ反射板、該反射板を備える発光装置
CN107531815B (zh) * 2015-11-24 2021-05-11 积水化学工业株式会社 固化性组合物及电子部件的制造方法
JP2017116787A (ja) * 2015-12-25 2017-06-29 三洋化成工業株式会社 感光性樹脂組成物
JP6646641B2 (ja) * 2017-11-16 2020-02-14 積水化学工業株式会社 非現像型レジスト硬化性組成物、プリント配線板及び電子部品の製造方法
JP6646640B2 (ja) * 2017-11-16 2020-02-14 積水化学工業株式会社 非現像型レジスト光硬化性組成物及び電子部品の製造方法
CN114437611A (zh) * 2022-01-18 2022-05-06 福斯特(嘉兴)新材料有限公司 光伏背板用反射涂料、光伏背板及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11273456A (ja) * 1998-03-26 1999-10-08 Matsushita Electric Works Ltd 電気絶縁樹脂組成物およびプリント配線板
JP2010117703A (ja) * 2008-10-17 2010-05-27 Taiyo Ink Mfg Ltd 硬化性樹脂組成物及び反射シート
JP2010169790A (ja) * 2009-01-21 2010-08-05 Tamura Seisakusho Co Ltd 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5066376B2 (ja) * 2007-02-27 2012-11-07 株式会社タムラ製作所 プリント配線板用のソルダーレジスト組成物およびプリント配線板
JP5485599B2 (ja) * 2008-08-26 2014-05-07 株式会社タムラ製作所 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板
KR101727101B1 (ko) * 2008-08-26 2017-04-14 타무라 카켄 코포레이션 감광성 수지 조성물, 프린트 배선판용의 솔더 레지스트 조성물 및 프린트 배선판
JP5419618B2 (ja) * 2009-09-28 2014-02-19 株式会社タムラ製作所 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11273456A (ja) * 1998-03-26 1999-10-08 Matsushita Electric Works Ltd 電気絶縁樹脂組成物およびプリント配線板
JP2010117703A (ja) * 2008-10-17 2010-05-27 Taiyo Ink Mfg Ltd 硬化性樹脂組成物及び反射シート
JP2010169790A (ja) * 2009-01-21 2010-08-05 Tamura Seisakusho Co Ltd 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板

Also Published As

Publication number Publication date
JP5650460B2 (ja) 2015-01-07
CN102520582A (zh) 2012-06-27
KR20120022639A (ko) 2012-03-12
JP2012041430A (ja) 2012-03-01

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