CN102520582A - 白色固化性树脂组合物 - Google Patents

白色固化性树脂组合物 Download PDF

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Publication number
CN102520582A
CN102520582A CN201110242545XA CN201110242545A CN102520582A CN 102520582 A CN102520582 A CN 102520582A CN 201110242545X A CN201110242545X A CN 201110242545XA CN 201110242545 A CN201110242545 A CN 201110242545A CN 102520582 A CN102520582 A CN 102520582A
Authority
CN
China
Prior art keywords
resin composition
mass parts
hardening resin
molecule
white hardening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110242545XA
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English (en)
Chinese (zh)
Inventor
鹤卷孝博
长谷川靖幸
冈田直树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Publication of CN102520582A publication Critical patent/CN102520582A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN201110242545XA 2010-08-18 2011-08-17 白色固化性树脂组合物 Pending CN102520582A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-183332 2010-08-18
JP2010183332A JP5650460B2 (ja) 2010-08-18 2010-08-18 白色硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
CN102520582A true CN102520582A (zh) 2012-06-27

Family

ID=45898108

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110242545XA Pending CN102520582A (zh) 2010-08-18 2011-08-17 白色固化性树脂组合物

Country Status (3)

Country Link
JP (1) JP5650460B2 (ja)
KR (1) KR101499926B1 (ja)
CN (1) CN102520582A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103777465B (zh) * 2012-10-19 2017-04-12 太阳油墨制造株式会社 固化性树脂组合物、固化涂膜以及印刷电路板
CN108352435A (zh) * 2015-11-16 2018-07-31 株式会社可乐丽 Led反射板用聚酯组合物、led反射板、具备该反射板的发光装置
CN110079196A (zh) * 2014-07-04 2019-08-02 积水化学工业株式会社 光固化性组合物及电子部件的制造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5853806B2 (ja) * 2012-03-23 2016-02-09 Jsr株式会社 感放射線性樹脂組成物、硬化膜及び硬化膜の形成方法
JP5841570B2 (ja) * 2012-10-19 2016-01-13 太陽インキ製造株式会社 硬化性樹脂組成物、ソルダーレジスト形成用硬化性樹脂組成物、硬化塗膜およびプリント配線板
JP6209365B2 (ja) * 2012-12-11 2017-10-04 太陽インキ製造株式会社 光硬化性樹脂組成物、ソルダーレジストおよびプリント配線板
JP6345947B2 (ja) * 2014-02-27 2018-06-20 株式会社タムラ製作所 感光性樹脂組成物
CN107531815B (zh) * 2015-11-24 2021-05-11 积水化学工业株式会社 固化性组合物及电子部件的制造方法
JP2017116787A (ja) * 2015-12-25 2017-06-29 三洋化成工業株式会社 感光性樹脂組成物
JP6646641B2 (ja) * 2017-11-16 2020-02-14 積水化学工業株式会社 非現像型レジスト硬化性組成物、プリント配線板及び電子部品の製造方法
JP6646640B2 (ja) * 2017-11-16 2020-02-14 積水化学工業株式会社 非現像型レジスト光硬化性組成物及び電子部品の製造方法
CN114437611A (zh) * 2022-01-18 2022-05-06 福斯特(嘉兴)新材料有限公司 光伏背板用反射涂料、光伏背板及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11273456A (ja) * 1998-03-26 1999-10-08 Matsushita Electric Works Ltd 電気絶縁樹脂組成物およびプリント配線板
JP2008211036A (ja) * 2007-02-27 2008-09-11 Tamura Kaken Co Ltd 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板
CN101676800A (zh) * 2008-08-26 2010-03-24 田村化研株式会社 感光性树脂组合物、印刷布线板用的阻焊剂组合物及印刷布线板
JP2010117703A (ja) * 2008-10-17 2010-05-27 Taiyo Ink Mfg Ltd 硬化性樹脂組成物及び反射シート
JP2010169790A (ja) * 2009-01-21 2010-08-05 Tamura Seisakusho Co Ltd 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5485599B2 (ja) * 2008-08-26 2014-05-07 株式会社タムラ製作所 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板
JP5419618B2 (ja) * 2009-09-28 2014-02-19 株式会社タムラ製作所 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11273456A (ja) * 1998-03-26 1999-10-08 Matsushita Electric Works Ltd 電気絶縁樹脂組成物およびプリント配線板
JP2008211036A (ja) * 2007-02-27 2008-09-11 Tamura Kaken Co Ltd 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板
CN101676800A (zh) * 2008-08-26 2010-03-24 田村化研株式会社 感光性树脂组合物、印刷布线板用的阻焊剂组合物及印刷布线板
JP2010117703A (ja) * 2008-10-17 2010-05-27 Taiyo Ink Mfg Ltd 硬化性樹脂組成物及び反射シート
JP2010169790A (ja) * 2009-01-21 2010-08-05 Tamura Seisakusho Co Ltd 感光性樹脂組成物、プリント配線板用のソルダーレジスト組成物およびプリント配線板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103777465B (zh) * 2012-10-19 2017-04-12 太阳油墨制造株式会社 固化性树脂组合物、固化涂膜以及印刷电路板
CN110079196A (zh) * 2014-07-04 2019-08-02 积水化学工业株式会社 光固化性组合物及电子部件的制造方法
CN108352435A (zh) * 2015-11-16 2018-07-31 株式会社可乐丽 Led反射板用聚酯组合物、led反射板、具备该反射板的发光装置

Also Published As

Publication number Publication date
JP5650460B2 (ja) 2015-01-07
KR101499926B1 (ko) 2015-03-06
KR20120022639A (ko) 2012-03-12
JP2012041430A (ja) 2012-03-01

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Application publication date: 20120627