KR101310593B1 - 마이크로 캡슐형 에폭시 수지용 경화제, 마스터 배치형 에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물 및 가공품 - Google Patents

마이크로 캡슐형 에폭시 수지용 경화제, 마스터 배치형 에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물 및 가공품 Download PDF

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Publication number
KR101310593B1
KR101310593B1 KR1020117019856A KR20117019856A KR101310593B1 KR 101310593 B1 KR101310593 B1 KR 101310593B1 KR 1020117019856 A KR1020117019856 A KR 1020117019856A KR 20117019856 A KR20117019856 A KR 20117019856A KR 101310593 B1 KR101310593 B1 KR 101310593B1
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South Korea
Prior art keywords
epoxy resin
curing agent
hardening
composition
epoxy resins
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KR1020117019856A
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English (en)
Korean (ko)
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KR20110119760A (ko
Inventor
히사나오 야마모토
요시키미 곤도
가즈유키 아이카와
Original Assignee
아사히 가세이 이-매터리얼즈 가부시키가이샤
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Publication of KR20110119760A publication Critical patent/KR20110119760A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Adhesive Tapes (AREA)
  • Organic Insulating Materials (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020117019856A 2009-02-27 2010-02-26 마이크로 캡슐형 에폭시 수지용 경화제, 마스터 배치형 에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물 및 가공품 KR101310593B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2009045753 2009-02-27
JPJP-P-2009-045753 2009-02-27
JPJP-P-2009-045768 2009-02-27
JP2009045768 2009-02-27
JPJP-P-2009-175883 2009-07-28
JP2009175883 2009-07-28
PCT/JP2010/053054 WO2010098431A1 (ja) 2009-02-27 2010-02-26 マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品

Publications (2)

Publication Number Publication Date
KR20110119760A KR20110119760A (ko) 2011-11-02
KR101310593B1 true KR101310593B1 (ko) 2013-09-23

Family

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KR1020117019856A KR101310593B1 (ko) 2009-02-27 2010-02-26 마이크로 캡슐형 에폭시 수지용 경화제, 마스터 배치형 에폭시 수지용 경화제 조성물, 일액성 에폭시 수지 조성물 및 가공품

Country Status (5)

Country Link
JP (1) JP5534615B2 (ja)
KR (1) KR101310593B1 (ja)
CN (1) CN102333808B (ja)
TW (1) TWI449723B (ja)
WO (1) WO2010098431A1 (ja)

Cited By (1)

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KR20210049310A (ko) * 2019-10-25 2021-05-06 주식회사 국일인토트 고온용 절연와셔 및 그 제조방법

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CN102604129B (zh) * 2012-03-11 2013-12-11 东华大学 一种碳纳米管在环氧树脂中的分散方法
JP6085130B2 (ja) * 2012-09-07 2017-02-22 旭化成株式会社 液状樹脂組成物、及び加工品
CN103113710B (zh) * 2013-01-28 2014-12-17 北京化工大学常州先进材料研究院 一种可常温固化环氧树脂预浸料的制备方法
TWI564316B (zh) * 2013-07-08 2017-01-01 旭化成化學股份有限公司 經改質之樹脂及樹脂組成物
EP2837645A1 (de) * 2013-08-12 2015-02-18 Basf Se Verwendung von 2,5-bisaminomethylfuran als härter für epoxidharze
JP6284721B2 (ja) * 2013-08-26 2018-02-28 株式会社Adeka エネルギー線感受性組成物
CN103483900B (zh) * 2013-09-26 2015-01-07 江苏高博智融科技有限公司 一种金属漆填料
JP2015117333A (ja) * 2013-12-19 2015-06-25 旭化成イーマテリアルズ株式会社 マスターバッチ型潜在性エポキシ樹脂硬化剤組成物及びこれを用いたエポキシ樹脂組成物
JP6331525B2 (ja) * 2014-03-14 2018-05-30 オムロン株式会社 樹脂組成物の硬化方法
JP6283568B2 (ja) * 2014-05-22 2018-02-21 旭化成株式会社 エポキシ樹脂用硬化剤、マイクロカプセル型エポキシ樹脂用硬化剤、マスターバッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物及び加工品
JP6915025B2 (ja) * 2015-11-20 2021-08-04 旭化成株式会社 封止材用エポキシ樹脂組成物、及び封止材
JP6799910B2 (ja) * 2015-11-20 2020-12-16 旭化成株式会社 封止材用エポキシ樹脂組成物、及び封止材。
JP6619628B2 (ja) * 2015-11-20 2019-12-11 旭化成株式会社 接着フィルム用エポキシ樹脂組成物。
KR101646531B1 (ko) * 2016-01-18 2016-08-08 회명산업 주식회사 에폭시 수지용 잠재성 경화제, 그 제조방법, 이를 포함하는 일액형 에폭시 수지 조성물
CN105566613A (zh) * 2016-03-08 2016-05-11 广东广山新材料有限公司 一种异氰酸酯改性环氧树脂及用途
KR101805298B1 (ko) * 2016-03-22 2017-12-05 주식회사 케이씨씨 열경화형 접착 필름
KR20180001487A (ko) * 2016-06-24 2018-01-04 에스케이디스커버리 주식회사 섬유강화 복합재료용 에폭시 수지 조성물 및 이를 이용한 프리프레그
CN107037042A (zh) * 2016-10-19 2017-08-11 中国石油化工股份有限公司 一种腐蚀监测涂层
JP7210845B2 (ja) * 2017-09-11 2023-01-24 株式会社レゾナック 接着剤フィルム収容セット及びその製造方法
RU2670233C1 (ru) * 2017-09-12 2018-10-19 Федеральное государственное бюджетное учреждение науки Южный научный центр Российской академии наук Способ получения микрокапсулированных отвердителей эпоксидных смол
JP7051454B2 (ja) * 2018-01-16 2022-04-11 大阪ガスケミカル株式会社 アミンアダクト及びその用途
CN109810616B (zh) * 2019-02-02 2021-04-23 南京顺锦新材料技术有限公司 一种高耐磨环氧陶瓷复合涂层及其制备方法
CN111704825A (zh) * 2020-07-11 2020-09-25 张家港科思创感光新材料有限公司 一种含有新型固化剂的感光阻焊油墨组合物及其应用
CN112500821B (zh) * 2020-12-29 2022-07-15 烟台信友新材料有限公司 一种紫外光固化可变操作时间单组份环氧胶及其制备方法
CN112992404B (zh) * 2021-05-06 2021-09-03 西安宏星电子浆料科技股份有限公司 一种高导电率导电浆料
CN113388227B (zh) * 2021-06-21 2023-08-04 高速铁路建造技术国家工程实验室 一种水性环氧树脂及其制备方法

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JP4877716B2 (ja) * 2005-09-29 2012-02-15 旭化成イーマテリアルズ株式会社 速硬化性エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP4911981B2 (ja) * 2006-02-03 2012-04-04 旭化成イーマテリアルズ株式会社 高含水含溶剤エポキシ樹脂用硬化剤およびエポキシ樹脂組成物

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WO2007088889A1 (ja) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation マイクロカプセル型エポキシ樹脂用硬化剤、マスタ－バッチ型エポキシ樹脂用硬化剤組成物、一液性エポキシ樹脂組成物、および加工品

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Publication number Priority date Publication date Assignee Title
KR20210049310A (ko) * 2019-10-25 2021-05-06 주식회사 국일인토트 고온용 절연와셔 및 그 제조방법
KR102311918B1 (ko) * 2019-10-25 2021-10-13 주식회사 국일인토트 고온용 절연와셔 및 그 제조방법

Also Published As

Publication number Publication date
CN102333808B (zh) 2013-11-27
WO2010098431A1 (ja) 2010-09-02
JPWO2010098431A1 (ja) 2012-09-06
KR20110119760A (ko) 2011-11-02
TW201035158A (en) 2010-10-01
WO2010098431A9 (ja) 2010-11-18
TWI449723B (zh) 2014-08-21
CN102333808A (zh) 2012-01-25
JP5534615B2 (ja) 2014-07-02

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