JPWO2008059767A1 - 光デバイス用検査装置 - Google Patents
光デバイス用検査装置 Download PDFInfo
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- JPWO2008059767A1 JPWO2008059767A1 JP2008544122A JP2008544122A JPWO2008059767A1 JP WO2008059767 A1 JPWO2008059767 A1 JP WO2008059767A1 JP 2008544122 A JP2008544122 A JP 2008544122A JP 2008544122 A JP2008544122 A JP 2008544122A JP WO2008059767 A1 JPWO2008059767 A1 JP WO2008059767A1
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- 238000007689 inspection Methods 0.000 title claims abstract description 57
- 239000000523 sample Substances 0.000 claims abstract description 85
- 238000003780 insertion Methods 0.000 claims abstract description 28
- 230000037431 insertion Effects 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 210000001747 pupil Anatomy 0.000 claims abstract description 15
- 230000000903 blocking effect Effects 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 description 11
- 230000002950 deficient Effects 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0207—Details of measuring devices
- G01M11/0214—Details of devices holding the object to be tested
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
- G01M11/0257—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2641—Circuits therefor for testing charge coupled devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
Abstract
Description
(特許文献)特開平11−26521号公報
2 センサ領域
3 電極パッド
4 光デバイス用検査装置
5 プローブカードユニット
6 レンズユニット
7 プローブ
8 メイン基板
9 ガイド板
10 プローブ挿入孔
11 瞳レンズ
12 補強板
13 ウエハ
14 光源装置
15 カンチレバー型プローブ
16 プローブカード
17 光学装置
18 検査装置
20 溝
21 樹脂
22 挿入部
23 先端部
24 スペーサ
Claims (5)
- センサ領域に複数の光センサを有する光デバイスに光源からの光を照射して試験を行う光デバイス用検査装置において、光源と上記センサ領域との間に、光学系の中心から周辺に向かうに従って照射光を傾斜させる瞳レンズを設けたことを特徴とする光デバイス用検査装置。
- プローブカードユニットとレンズユニットを備える光デバイス用検査装置であって、上記プローブカードユニットが、メイン基板、ガイド板、およびプローブを備え、
上記メイン基板および上記ガイド板には開口部が設けられ、
上記ガイド板は、上記メイン基板に対して所定の位置に固定され、複数のプローブ挿入孔が設けられ、
上記プローブは、上記ガイド板のプローブ挿入孔に挿入されて固定されており、上記挿入孔から突出している先端部が、カンチレバー型をしており、
上記レンズユニットは、瞳レンズを用いたレンズユニットであり、上記メイン基板に設けられた開口部に設置され、光学系の中心から遠ざかるに従って、検査対象物への光を傾斜させることを特徴とする光デバイス用検査装置。 - 上記ガイド板には溝部が設けられ、上記溝部の底に上記プローブ挿入孔が配置され、上記溝部で樹脂によって上記プローブが固定されていることを特徴とする請求項2に記載の光デバイス用検査装置。
- 上記レンズユニットから上記プローブに照射される光線を遮断する光遮断部材を有することを特徴とする請求項2または3に記載の光デバイス用検査装置。
- 上記光遮断部材が上記ガイド板であることを特徴とする請求項4に記載の光デバイス用検査装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008544122A JP5283266B2 (ja) | 2006-11-15 | 2007-11-09 | 光デバイス用検査装置 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006309472 | 2006-11-15 | ||
JP2006309472 | 2006-11-15 | ||
JP2007143617 | 2007-05-30 | ||
JP2007143617 | 2007-05-30 | ||
JP2008544122A JP5283266B2 (ja) | 2006-11-15 | 2007-11-09 | 光デバイス用検査装置 |
PCT/JP2007/071846 WO2008059767A1 (fr) | 2006-11-15 | 2007-11-09 | Appareil d'inspection de dispositif optique |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008059767A1 true JPWO2008059767A1 (ja) | 2010-03-04 |
JP5283266B2 JP5283266B2 (ja) | 2013-09-04 |
Family
ID=39401574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008544122A Active JP5283266B2 (ja) | 2006-11-15 | 2007-11-09 | 光デバイス用検査装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8159659B2 (ja) |
JP (1) | JP5283266B2 (ja) |
KR (1) | KR101277471B1 (ja) |
CN (1) | CN101583860B (ja) |
TW (1) | TW200829926A (ja) |
WO (1) | WO2008059767A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015021973A (ja) * | 2013-07-23 | 2015-02-02 | 旺▲夕▼科技股▲分▼有限公司 | 光電子ユニット測定用高周波プローブカード |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101556363A (zh) * | 2008-04-09 | 2009-10-14 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组制造方法 |
KR101049097B1 (ko) * | 2009-03-13 | 2011-07-15 | 광전자정밀주식회사 | 광원특성 검사 시스템 및 이를 이용한 검사방법 |
JP5530122B2 (ja) * | 2009-05-18 | 2014-06-25 | 株式会社日本マイクロニクス | 光センサの試験装置 |
TWI421502B (zh) * | 2010-06-25 | 2014-01-01 | Omnivision Tech Inc | 探針卡 |
JP6120479B2 (ja) * | 2011-11-02 | 2017-04-26 | 株式会社日本マイクロニクス | プローブカード及び検査装置 |
CN103543304B (zh) * | 2012-07-13 | 2016-05-18 | 旺矽科技股份有限公司 | 高频探针卡 |
CN103543372B (zh) * | 2012-07-13 | 2016-08-24 | 旺矽科技股份有限公司 | 光学检测装置 |
CN103543298B (zh) | 2012-07-13 | 2016-03-23 | 旺矽科技股份有限公司 | 探针固持结构及其光学检测装置 |
KR101790292B1 (ko) * | 2016-04-15 | 2017-11-20 | 주식회사 휴로 | Cis 프로브카드 및 그 제작 방법 |
JP7245721B2 (ja) | 2019-05-31 | 2023-03-24 | 株式会社アドバンテスト | 試験装置、試験方法およびプログラム |
KR20210016782A (ko) | 2019-08-05 | 2021-02-17 | 삼성전자주식회사 | 탄성부를 가진 스티프너 및 스티프너 핸들링 툴 |
JP7386190B2 (ja) | 2021-01-21 | 2023-11-24 | 株式会社アドバンテスト | 試験装置、試験方法およびプログラム |
JP7355773B2 (ja) | 2021-02-26 | 2023-10-03 | 株式会社アドバンテスト | 試験装置、試験方法およびプログラム |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0290645A (ja) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | 撮像素子の検査方法及びそれに使用する検査装置 |
JPH02304315A (ja) * | 1989-05-19 | 1990-12-18 | Nec Corp | 低温プローバ |
JPH1126521A (ja) * | 1997-07-08 | 1999-01-29 | Sony Corp | 固体撮像素子の評価装置 |
US6651325B2 (en) * | 2002-02-19 | 2003-11-25 | Industrial Technologies Research Institute | Method for forming cantilever beam probe card and probe card formed |
KR100492158B1 (ko) * | 2002-11-19 | 2005-06-02 | 삼성전자주식회사 | 웨이퍼 검사 장치 |
KR20050085408A (ko) * | 2002-12-06 | 2005-08-29 | 인터 액션 코포레이션 | 고체 촬상소자의 시험장치 |
JP2005044853A (ja) * | 2003-07-23 | 2005-02-17 | Inter Action Corp | 固体撮像素子の検査装置 |
JP4400184B2 (ja) * | 2003-11-14 | 2010-01-20 | 株式会社ニコン | 照明補助装置 |
KR20050068118A (ko) * | 2003-12-29 | 2005-07-05 | 동부아남반도체 주식회사 | 프로브 카드의 니들 검사 장치 |
JP3994989B2 (ja) * | 2004-06-14 | 2007-10-24 | セイコーエプソン株式会社 | 半導体装置、回路基板、電気光学装置および電子機器 |
JP2006222325A (ja) * | 2005-02-14 | 2006-08-24 | Nikon Corp | 光照射装置 |
JP4656393B2 (ja) * | 2005-02-23 | 2011-03-23 | 横河電機株式会社 | 光源装置 |
JP4650084B2 (ja) * | 2005-04-26 | 2011-03-16 | ソニー株式会社 | 受光デバイス測定装置および方法 |
JP2007072020A (ja) * | 2005-09-06 | 2007-03-22 | Yokogawa Electric Corp | 光源装置 |
JP4860991B2 (ja) * | 2005-11-29 | 2012-01-25 | 日本電子材料株式会社 | 光デバイス用検査装置 |
JP2007311515A (ja) * | 2006-05-18 | 2007-11-29 | Aitos Kk | 撮像素子の検査装置、光学検査ユニット装置並びに光学検査ユニット |
US7786740B2 (en) * | 2006-10-11 | 2010-08-31 | Astria Semiconductor Holdings, Inc. | Probe cards employing probes having retaining portions for potting in a potting region |
-
2007
- 2007-11-09 KR KR1020097009860A patent/KR101277471B1/ko active IP Right Grant
- 2007-11-09 US US12/515,213 patent/US8159659B2/en not_active Expired - Fee Related
- 2007-11-09 WO PCT/JP2007/071846 patent/WO2008059767A1/ja active Application Filing
- 2007-11-09 JP JP2008544122A patent/JP5283266B2/ja active Active
- 2007-11-09 CN CN2007800420805A patent/CN101583860B/zh active Active
- 2007-11-14 TW TW096143050A patent/TW200829926A/zh not_active IP Right Cessation
-
2012
- 2012-04-13 US US13/445,975 patent/US20120194211A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015021973A (ja) * | 2013-07-23 | 2015-02-02 | 旺▲夕▼科技股▲分▼有限公司 | 光電子ユニット測定用高周波プローブカード |
Also Published As
Publication number | Publication date |
---|---|
US20100053601A1 (en) | 2010-03-04 |
US20120194211A1 (en) | 2012-08-02 |
TW200829926A (en) | 2008-07-16 |
CN101583860B (zh) | 2011-03-02 |
JP5283266B2 (ja) | 2013-09-04 |
KR20090083374A (ko) | 2009-08-03 |
WO2008059767A1 (fr) | 2008-05-22 |
CN101583860A (zh) | 2009-11-18 |
TWI378241B (ja) | 2012-12-01 |
US8159659B2 (en) | 2012-04-17 |
KR101277471B1 (ko) | 2013-06-20 |
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