JP4881597B2 - 固体撮像装置の切断方法 - Google Patents
固体撮像装置の切断方法 Download PDFInfo
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- JP4881597B2 JP4881597B2 JP2005276622A JP2005276622A JP4881597B2 JP 4881597 B2 JP4881597 B2 JP 4881597B2 JP 2005276622 A JP2005276622 A JP 2005276622A JP 2005276622 A JP2005276622 A JP 2005276622A JP 4881597 B2 JP4881597 B2 JP 4881597B2
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- 238000003384 imaging method Methods 0.000 title claims description 47
- 238000005520 cutting process Methods 0.000 title claims description 32
- 238000000034 method Methods 0.000 title claims description 28
- 239000006059 cover glass Substances 0.000 claims description 88
- 239000003795 chemical substances by application Substances 0.000 claims description 66
- 239000000853 adhesive Substances 0.000 claims description 51
- 230000001070 adhesive effect Effects 0.000 claims description 51
- 230000001681 protective effect Effects 0.000 claims description 31
- 125000006850 spacer group Chemical group 0.000 claims description 27
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000010408 film Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 6
- 238000000926 separation method Methods 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 229920001875 Ebonite Polymers 0.000 description 1
- 229920001967 Metal rubber Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- YPHMISFOHDHNIV-FSZOTQKASA-N cycloheximide Chemical compound C1[C@@H](C)C[C@H](C)C(=O)[C@@H]1[C@H](O)CC1CC(=O)NC(=O)C1 YPHMISFOHDHNIV-FSZOTQKASA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000834 fixative Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Dicing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
Claims (5)
- スペーサが形成されたカバーガラスと固体撮像素子が多数形成された固体撮像素子ウェーハとを貼り合わせ、個々の固体撮像装置に切断する固体撮像装置の切断方法において、
前記カバーガラスの前記スペーサが形成された面の反対の面の周縁部に剥離可能なマスクフィルムを貼着する工程と、
前記マスクフィルムが周縁部に貼着された面へ透明で粘着力が調整可能な仮止め剤を塗布する工程と、
前記仮止め剤が塗布された後に前記マスクフィルムを剥離する工程と、
片面に粘着力を減少させることが可能な粘着シートが貼着された透明な保護用ウェーハを前記カバーガラスの前記仮止め剤が塗布された側へ前記粘着シートを向き合わせて貼り合せる工程と、
貼り合わせられた前記カバーガラスと前記保護用ウェーハを該カバーガラス側から前記仮止め剤まで切断する工程と、
切断された前記カバーガラスへ前記固体撮像素子ウェーハを接合する工程と、
前記固体撮像素子ウェーハを前記カバーガラスへ接合した後に、前記保護用ウェーハ、前記粘着シート、及び前記仮止め剤を剥離する工程と、
前記固体撮像素子ウェーハを切断することにより個々の固体撮像装置に分割する工程と、を有することを特徴とする固体撮像装置の切断方法。 - 前記仮止め剤の塗布は、減圧された環境下で行うことを特徴とする請求項1に記載の固体撮像装置の切断方法。
- 前記粘着シートは、前記カバーガラスと前記固体撮像素子ウェーハとの位置合わせに用いるアライメントマークを確認する為の穴が所定の位置に開けられていることを特徴とする請求項1又は請求項2に記載の固体撮像装置の切断方法。
- 前記保護用ウェーハを前記カバーガラスの前記仮止め剤が塗布された側へ前記粘着シートを向き合わせて貼り合せる工程は、減圧された環境下で行い、貼り合わせが行われた後に大気圧下に戻すことを特徴とする請求項1、2、又は3のうちいずれか1項に記載の固体撮像装置の切断方法。
- 前記仮止め剤の粘着力を減少させるように調整する条件と、前記粘着シートの粘着力を減少させる条件は異なることを特徴とする請求項1、2、3、又は4のうちいずれか1項に記載の固体撮像装置の切断方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005276622A JP4881597B2 (ja) | 2005-09-22 | 2005-09-22 | 固体撮像装置の切断方法 |
CN200680039500XA CN101297403B (zh) | 2005-09-22 | 2006-09-19 | 切割固态图像拾取器件的方法 |
US12/067,584 US7659147B2 (en) | 2005-09-22 | 2006-09-19 | Method for cutting solid-state image pickup device |
EP06798275A EP1927137A4 (en) | 2005-09-22 | 2006-09-19 | METHOD FOR CUTTING A SEMICONDUCTOR IMAGE ASSEMBLY ELEMENT |
KR1020087009664A KR101317983B1 (ko) | 2005-09-22 | 2006-09-19 | 고체 촬상 장치를 절단하는 방법 |
PCT/JP2006/318891 WO2007034929A1 (en) | 2005-09-22 | 2006-09-19 | Method for cutting solid-state image pickup device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005276622A JP4881597B2 (ja) | 2005-09-22 | 2005-09-22 | 固体撮像装置の切断方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007088291A JP2007088291A (ja) | 2007-04-05 |
JP4881597B2 true JP4881597B2 (ja) | 2012-02-22 |
Family
ID=37888971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005276622A Expired - Fee Related JP4881597B2 (ja) | 2005-09-22 | 2005-09-22 | 固体撮像装置の切断方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7659147B2 (ja) |
EP (1) | EP1927137A4 (ja) |
JP (1) | JP4881597B2 (ja) |
KR (1) | KR101317983B1 (ja) |
CN (1) | CN101297403B (ja) |
WO (1) | WO2007034929A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007088292A (ja) * | 2005-09-22 | 2007-04-05 | Fujifilm Corp | 板状部材の切断方法 |
JP2010192616A (ja) * | 2009-02-17 | 2010-09-02 | Disco Abrasive Syst Ltd | 保護膜の形成方法及びウエーハの加工方法 |
JP5550380B2 (ja) * | 2010-02-25 | 2014-07-16 | キヤノン株式会社 | 固体撮像装置及び撮像装置 |
CN103000766B (zh) * | 2012-12-10 | 2016-01-20 | 中国电子科技集团公司第十一研究所 | 红外焦平面探测器铟柱的划片粘接方法 |
CN104098063A (zh) * | 2013-04-02 | 2014-10-15 | 无锡华润上华半导体有限公司 | 微机电***器件在制造过程中的加固方法 |
JP6270339B2 (ja) * | 2013-05-22 | 2018-01-31 | オリンパス株式会社 | 撮像装置、撮像装置の製造方法、及び内視鏡システム |
JP6435663B2 (ja) * | 2014-06-30 | 2018-12-12 | 凸版印刷株式会社 | 固体撮像装置の製造方法 |
JP6465666B2 (ja) * | 2015-01-22 | 2019-02-06 | 日本放送協会 | 固体撮像素子の製造方法 |
US10009523B2 (en) * | 2015-05-11 | 2018-06-26 | Samsung Electro-Mechanics Co., Ltd. | Electronic module and method of manufacturing the same |
KR101792442B1 (ko) | 2016-12-12 | 2017-10-31 | 삼성전기주식회사 | 전자 모듈과 그 제조 방법 |
CN108238441A (zh) * | 2016-12-27 | 2018-07-03 | 张家港康得新光电材料有限公司 | 膜片拾取设备 |
CN109461666B (zh) * | 2018-11-05 | 2020-11-13 | 中芯集成电路(宁波)有限公司 | 一种芯片封装方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3675402B2 (ja) * | 2001-12-27 | 2005-07-27 | セイコーエプソン株式会社 | 光デバイス及びその製造方法、光モジュール、回路基板並びに電子機器 |
JP4241160B2 (ja) | 2002-04-22 | 2009-03-18 | 富士フイルム株式会社 | 固体撮像装置の製造方法 |
JP2004063782A (ja) * | 2002-07-29 | 2004-02-26 | Fuji Photo Film Co Ltd | 固体撮像装置およびその製造方法 |
JP2004241695A (ja) * | 2003-02-07 | 2004-08-26 | Seiko Epson Corp | 光デバイスの製造方法 |
JP2004312666A (ja) * | 2003-03-25 | 2004-11-04 | Fuji Photo Film Co Ltd | 固体撮像装置及び固体撮像装置の製造方法 |
JP4019281B2 (ja) * | 2003-03-28 | 2007-12-12 | ソニー株式会社 | オーディオ装置 |
JP2005026314A (ja) * | 2003-06-30 | 2005-01-27 | Sanyo Electric Co Ltd | 固体撮像素子の製造方法 |
JP2005051018A (ja) * | 2003-07-28 | 2005-02-24 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
JP4551638B2 (ja) * | 2003-08-01 | 2010-09-29 | 富士フイルム株式会社 | 固体撮像装置の製造方法 |
WO2006101270A1 (en) * | 2005-03-25 | 2006-09-28 | Fujifilm Corporation | Solid state imaging device and manufacturing method thereof |
-
2005
- 2005-09-22 JP JP2005276622A patent/JP4881597B2/ja not_active Expired - Fee Related
-
2006
- 2006-09-19 US US12/067,584 patent/US7659147B2/en not_active Expired - Fee Related
- 2006-09-19 WO PCT/JP2006/318891 patent/WO2007034929A1/en active Application Filing
- 2006-09-19 KR KR1020087009664A patent/KR101317983B1/ko not_active IP Right Cessation
- 2006-09-19 EP EP06798275A patent/EP1927137A4/en not_active Withdrawn
- 2006-09-19 CN CN200680039500XA patent/CN101297403B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2007034929A1 (en) | 2007-03-29 |
KR101317983B1 (ko) | 2013-10-15 |
CN101297403A (zh) | 2008-10-29 |
EP1927137A4 (en) | 2011-04-20 |
EP1927137A1 (en) | 2008-06-04 |
US7659147B2 (en) | 2010-02-09 |
US20090098683A1 (en) | 2009-04-16 |
CN101297403B (zh) | 2010-05-19 |
KR20080049845A (ko) | 2008-06-04 |
JP2007088291A (ja) | 2007-04-05 |
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