JP2014515955A - 内視鏡用の改良型画像センサ - Google Patents
内視鏡用の改良型画像センサ Download PDFInfo
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- JP2014515955A JP2014515955A JP2014510550A JP2014510550A JP2014515955A JP 2014515955 A JP2014515955 A JP 2014515955A JP 2014510550 A JP2014510550 A JP 2014510550A JP 2014510550 A JP2014510550 A JP 2014510550A JP 2014515955 A JP2014515955 A JP 2014515955A
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Abstract
Description
・交互の相互接続、すなわち、相互接続の冗長性を与える能力が増大されることにより製造信頼性を改善すること。
・応用または使用分野ごとに費用効率性が高いやり方でバンプピッチサイズを最大化すること。
・より大きい画素ピッチを使用する能力により、より経済的なCMOSプロセスを可能にすること。
・より効率的なバンプ技術のアクセス、すなわち複数のバスからのデータ読み出しまたは画素配列から直接のデータ読み出しを可能にすること。
・CMOSプロセスの冗長性が歩留まりを改善することを可能にすること。
・所定または一定の画素領域における局所的なADCを使用すること。
・複数の画素配列の幾何学的形状、複数のバスおよび列バンプ構成が利用されることを可能にすること。
反対に、本明細書中で言及されるとき、回路列356は、画素配列350を含む第1の基板310ではない基板上に割り当てられた空間であり、これは対応する画素列352に専用であり、対応する画素列352に電気的に接続されるまたは電気通信する少なくとも1つの支援回路370を含む。画素列352によって占められる空間は、画素列352と対応する回路列356によって占められる空間と同じまたはほぼ同じにできることが理解されよう。このようにして、第2の基板または支持用基板311は、複数の回路列356を備えることができ、各回路列356は、対応する画素列352が第1の基板310上に領域を有するのと実質的に同一または類似の占有面積の領域を第2の基板311上に備える。
そのような構成では、画素列352のアスペクト比は、回路列356のアスペクト比にほぼ等しくなるが、さらに以下に述べられるように、そのようなアスペクト比の等しさは必要とされないことにも留意されたい。図3mに見られるように、画素列は、1つの画素列の幅および6画素の長さであり、したがってアスペクト比は1/6である。回路列も、同じ1/6のアスペクト比を有する。対照的に、図3nは、回路列のアスペクト比が画素列のアスペクト比の2倍の幅であるが、たった半分の長さであり、それによって支援用回路を配置するために使用可能な実装面積をできる限りより多く与える設計を示す。図3mおよび図3nでは共に、画素列352と回路列356の両方の実装面積の領域は、アスペクト比が異なっているとしても、互いにほぼ等しい。
図3yは、間に電気的接続を示す図3uの最右列356の左側への最右列356に隣接した列からとった画素の単一の列352および回路の単一の列356の斜視図を示す。図3zは、間に電気的接続を示す図3yからとった画素の単一の列352および回路の単一の列356の正面図を示す。図3vおよび図3yは、図3uの画素配列350からとった画素列352を示す。図3vおよび図3yは、回路列356の実装面積内の相互接続321の配置についての2つのオプションを示す。図3aaに示されるように、回路列のアスペクト比はより広いが、対応する画素列352のアスペクト比より短いので、相互接続位置のオプションは、画素列352の長さの一部に利用できるだけであることに留意されたい。図3zは、複雑なバス形状の場合、それが支持する画素列352の4倍の幅および4分の1の長さを有する回路列356内のバス340に沿って4つの相互接続位置経路のオプションが存在できることを示す。したがって、回路列356のアスペクト比は画素列352のアスペクト比とは異なるが、それぞれの実装面積の領域が、ほぼ同じであり、すなわち等しいことが見られる。製造技法が改善されるまたは設計パラメータが変更されると、多かれ少なかれ領域が、回路列356の支援用回路のために必要とされ得る。
一実施形態では、画素配列を含む基板510は、画素配列を含む基板に対して遠隔に設置される支持基板520に隣接しているまたはその近くにあることができる。支持基板520は、その上に増幅器回路を備えることができ、一方、他の支援用回路は、支持基板520が画素配列基板510から離れて設置される距離よりも画素配列基板510から離れている距離で別の基板530a上により遠隔に設置することができる。一実施形態では、より遠隔に設置された基板530は、配線ビア522によって画像センサ500内の他の基板に接続することができ、または他の基板および回路と無線で通信することができる。隣接した基板同士は、バンプまたははんだボール521によって互いに接続することができる。画素配列および他の回路が徐々により効率的になるにつれて、画素配列を含む基板が全ての他の支援回路からより遠隔である画像センサを提供することが、本開示の範囲内である。そのような回路は、図10に示されており、画素配列を含む基板1010は、信号処理回路および電力回路などの支援回路をそれぞれが備える支持基板1020、1030、1040からビア1022によってより遠隔に設置される。
主に図16を参照すると、内部にリードバス構成を有する多重基板の画像センサ1600が示される。図に見られるように、基板1652は、画素配列1610を含むことができ、複数の画素列リードバスを通じて支持基板1654および1656に電気的に接続することができ、画像センサの構造は、1つまたは複数の続く基板1654および1656上に支援回路を設置することによって大いに単純化することができる。続く基板1654および1656は、第1の基板1652に近接するが、第1の基板1652の背後にあることができる。支援回路1622および1663は、例示されるように、垂直構成で基板を積み重ねることを可能にするために、続く基板1654および1656上に配置することができる。貫通基板ビアが使用されて、複数の基板のいずれかを通じて前から後ろへの通信を可能にすることができる。積層時の第2の基板1654は、第1の基板1652上に位置する画素列1650に対して専用にされる二次回路であって、それらと電気的に接続される二次回路を備えることができる。第3の基板1654は、第2の基板上の支援回路1622に対して専用にされ得る追加のデータ処理回路1663を備えることができ、第2の基板から複数の支援回路からのデータを処理することになっていてもよい。第3の基板1656上の回路1663は、第1の基板1652上の特定の画素列1650に対して専用にすることができ、または複数の画素列1650からのデータの処理に対して専用にすることができることに留意されたい。言い換えれば、第3の基板1656上に位置する回路1663は、第2の基板1654上の特定の回路1622、または第1の基板1652上の特定の画素列1650に直接対応することができる。各基板が、全基板上の回路を電気的に接続する少なくとも1つのバスを備えることができることに留意されたい。したがって、基板の各々のバス1623a〜1623cは、基板同士の間に配設された相互接続1621によって、バス1623a〜1623c間の電気的接続を引き起こすように重ね合わせることができる。
したがって、画素列リードバス2430は、対応する画素サブ列リードバス2430aおよび2430bに製造することができる。各画素サブ列2487、2488は、まず画素列バス2430aまたは2430bに接続され、次いで支援用回路2470および回路列2456に接続することができ、または各サブ列2487、2488はそれぞれ、関連した回路バス2440aおよび2440bへのそれら自体の相互接続2424aおよび2424bを介して、回路2470および回路列2456に直接接続することができる。
したがって、画素列リードバス2630は、対応する画素サブ列リードバス2630aおよび2630bに製造することができる。各画素サブ列2687、2688は、まず画素列バス2630aまたは2630bに接続され、次いで支援用回路2670および回路列2656に接続することができ、または各サブ列2687、2688はそれぞれ、関連した回路バス2640aおよび2640bへのそれら自体の相互接続2624aおよび2624bを介して、回路2670および回路列2656に直接接続することができる。
したがって、2つの支援用回路および回路列のリードバス(画素サブ列リードバス当たり1つの支援回路および回路列バス)もあり、この構成では、回路列のアスペクト比は3/2、画素サブ列のアスペクト比はやはり6/1、および画素列全体のアスペクト比が12/1である。
Claims (37)
- 管腔(lumen)と、
前記管腔の遠位端(distal tip)の近くに配設される撮像センサと
を備える内視鏡装置であって、
前記撮像センサが、
少なくとも第1の基板および第2の基板を備える複数の基板と、
前記第1の基板上に位置すると共に複数の画素列(pixel columns)を備える画素配列であって、前記複数の画素列の各々が、幅(in width)1画素および長さ(in length)複数画素として定められる、画素配列(pixel array)と、
前記第2の基板上に位置すると共に複数の回路列(circuit columns)を備える複数の支援用回路であって、1つの回路列が1つの画素列に対応し、前記複数の回路列の各々が、対応する画素列の領域と対応する領域(area)を有するものとして定められる、支援用回路(supporting circuits)と、
前記第1の基板上に存在する少なくとも1つの画素列当たり1つの画素列バス(pixel column bus)、および前記第2の基板上に存在する回路列当たり1つの回路列バス(circuit column bus)が存在する複数のバスと
を備え、
前記画素列バスの各々の少なくとも一部が、対応する回路列バスの各々の少なくとも一部と重ね合わされ(superimposed)、少なくとも1つの相互接続(interconnect)が1つの画素列バスと対応する1つの回路列バスの間の電気通信(electrical communication)を与え、
前記少なくとも1つの相互接続が、1つの画素列バスと対応する1つの回路列バスの間のどこか(anywhere)に設置され、互いに対して(with respect to each other)重ね合わされる、内視鏡(endoscopic)装置。 - 前記基板同士の間に配設される複数の相互接続をさらに備え、前記複数の相互接続が前記画素配列の画素ピッチより大きい距離で互いに対して間隔をおいて(spaced)配置される、請求項1に記載の内視鏡。
- 前記第1の基板および前記第2の基板が、揃った状態(in alignment)である、請求項1に記載の内視鏡。
- 前記第1の基板上の前記画素列のうちの1つの領域(area)が、前記第2の基板上の前記対応する回路列のうちの1つの領域とほぼ等しい、請求項1に記載の内視鏡。
- 前記第2の基板が、前記第1の基板とほぼ同じサイズである、請求項1に記載の内視鏡。
- 前記第1の基板上の前記画素列のうちの1つの領域が、前記第2の基板上の前記対応する回路列のうちの1つの領域より大きい、請求項1に記載の内視鏡。
- 前記第1の基板上の前記画素列のうちの1つの領域が、前記第2の基板上の前記対応する回路列のうちの1つの領域より小さい、請求項1に記載の内視鏡。
- 前記画素列のうちの1つのアスペクト比が、前記回路列のうちの1つのアスペクト比とほぼ同様である、請求項1に記載の内視鏡。
- 複数の相互接続が、画素列バスを対応する回路列バスに接続する、請求項1に記載の内視鏡。
- 前記画素列のうちの1つのアスペクト比が、前記回路列のうちの1つのアスペクト比とは異なる、請求項1に記載の内視鏡。
- 前記回路列のうちの1つのアスペクト比が、前記画素列のうちの1つのアスペクト比の4倍の幅および4分の1の長さである、請求項1に記載の内視鏡。
- 前記回路列のうちの1つのアスペクト比が、前記画素列のうちの1つのアスペクト比の2倍の幅および半分の長さである、請求項8に記載の内視鏡。
- 管腔と、
前記内視鏡内に配設される撮像センサと
を備える内視鏡であって、
前記撮像センサが、
第1の基板および少なくとも1つの第2の次の支持用基板を含む複数の基板と、
画素配列と、
複数の相互接続と、
複数の支援回路と
を備え、
前記複数の基板のうちの前記第1の基板が、前記画素配列を備え、
前記複数の支援用回路が、前記第1の基板に対して遠隔に配置される前記少なくとも1つの第2の次の(subsequent)支持用基板上に配設され、
前記複数の支援用回路が、前記第1の基板と前記少なくとも1つの第2の次の支持用基板との間に配設された前記複数の相互接続を介して、前記画素配列に電気的に接続されると共に前記画素配列と電気通信し、
前記第2の次の支持用基板が、撮像される対象に対して前記画素配列の背後に配設され、
前記複数の相互接続が、前記画素配列の画素ピッチより大きい距離で互いに対して間隔をおいて配置される、内視鏡。 - 前記第1の基板上に位置する前記画素配列が、複数の画素列を備え、前記複数の画素列の各々が、幅1画素および長さ複数画素として定められる、請求項13に記載の内視鏡。
- 前記第2の基板上に位置する複数の支援用回路をさらに備えると共に、複数の回路列を備え、1つの回路列が1つの画素列に対応し、前記複数の回路列の各々が、対応する画素列の領域と対応する領域を有するものとして定められる、請求項14に記載の内視鏡。
- 複数のバスをさらに備え、前記第1の基板上に存在する少なくとも1つの画素列当たり1つの画素列バス、および前記第2の基板上に存在する回路列当たり1つの画素列バスが存在する、請求項14に記載の内視鏡。
- 前記画素列バスの各々の少なくとも一部が、前記対応する回路列バスの各々の少なくとも一部と重ね合わされ、少なくとも1つの相互接続が、1つの画素列バスと対応する1つの回路列バスの間の電気通信を与え、
前記少なくとも1つの相互接続が、1つの画素列バスと対応する1つの回路列バスの間のどこかに設置され、互いに対して重ね合わされる、
請求項16に記載の内視鏡。 - 前記撮像センサが裏面照射される、請求項13に記載の内視鏡。
- 前記画素配列が、前記第1の基板の表面の実質的大部分を覆う、請求項13に記載の撮像センサ。
- 前記画素配列が、前記第1の基板の表面の25パーセントより多くを覆う、請求項13に記載の撮像センサ。
- 前記第1の基板が、主にシリコン材料で作製される、請求項13に記載の撮像センサ。
- 前記第1の基板が、主に「高Z」半導体材料(テルル化カドミウム)で作製される、請求項13に記載の撮像センサ。
- 前記第1の基板が、主にIII−V半導体材料(ガリウムヒ素)で作製される、請求項13に記載の撮像センサ。
- 前記画素配列が、複数の画素列から構成され、各画素列が複数の画素を含み、
前記画素配列内の前記複数の画素列の各々が、共通の源から読み出される第1の列から順にバスに読み出され、第2の列が、前記第2の列に対して以前に読み出された画素列とは異なると共に、前記第2の列に対して続いて読み出される画素列とは異なる第1の行から読み出される、
請求項23に記載の撮像センサ。 - 前記第1の行が、前記以前に読み出された画素列および前記続いて読みだされる画素列の行の位置から少なくとも2つの行の位置だけ離れて間隔をおいて配置される、請求項24に記載の撮像センサ。
- 管腔と、
前記管腔の前記遠位端の近くに配設される撮像センサと
を備える内視鏡装置であって、
前記撮像センサが、
少なくとも第1の基板および第2の基板を備える複数の基板と、
前記第1の基板上に位置すると共に複数の画素列を備える画素配列であって、前記複数の画素列の各々が、前記配列の寸法(dimension)を覆うのに十分な幅1画素および長さ複数画素として定められ、
前記画素列が、画素サブ列(sub-columns)に分割され、各画素サブ列が、他の画素サブ列から電気的に絶縁されるようになっている、
画素配列と、
前記第2の基板上に位置する複数の支援用回路であって、複数の回路列を含んでおり、1つの回路列が1つの画素サブ列に対応し、前記複数の回路列の各々が、対応する画素サブ列の領域と対応する領域を有するものとして定められる、支援用回路と、
前記第1の基板上に存在する少なくとも1つの画素サブ列当たりの1つの画素サブ列バス、および前記第2の基板上に存在する回路列当たり1つの画素列バスが存在する複数のバスと
を備え、
前記画素サブ列バスの各々の少なくとも一部が、対応する回路列バスの各々の少なくとも一部と重ね合わされ、少なくとも1つの相互接続が1つの画素サブ列バスと対応する1つの回路列バスの間の電気通信を与え、
前記少なくとも1つの相互接続が、1つの画素サブ列バスと対応する1つの回路列バスの間のどこかに設置され、互いに対して重ね合わされる、内視鏡装置。 - 前記基板同士の間に配設される複数の相互接続をさらに備え、前記複数の相互接続が、前記画素配列の画素ピッチより大きい距離で互いに対して間隔をおいて配置される、請求項26に記載の内視鏡。
- 前記第1の基板および前記第2の基板が、揃った状態である、請求項26に記載の内視鏡。
- 前記第1の基板上の前記画素サブ列のうちの1つの領域が、前記第2の基板上の前記対応する回路列のうちの1つの領域とほぼ等しい、請求項26に記載の内視鏡。
- 前記第2の基板が、前記第1の基板とほぼ同じサイズである、請求項26に記載の内視鏡。
- 前記第1の基板上の前記画素サブ列のうちの1つの領域が、前記第2の基板上の前記対応する回路列のうちの1つの領域より大きい、請求項26に記載の内視鏡。
- 前記第1の基板上の前記画素サブ列のうちの1つの領域が、前記第2の基板上の前記対応する回路列のうちの1つの領域より小さい、請求項26に記載の内視鏡。
- 前記画素サブ列のうちの1つのアスペクト比が、前記回路列のうちの1つのアスペクト比とほぼ同様である、請求項26に記載の内視鏡。
- 複数の相互接続が、画素サブ列バスを対応する回路列バスに接続する、請求項26に記載の内視鏡。
- 前記画素サブ列のうちの1つのアスペクト比が、前記回路列のうちの1つのアスペクト比とは異なる、請求項26に記載の内視鏡。
- 前記回路列のうちの1つのアスペクト比が、前記画素サブ列のうちの1つのアスペクト比の4倍の幅および4分の1の長さである、請求項26に記載の内視鏡。
- 前記回路列のうちの1つのアスペクト比が、前記画素サブ列のうちの1つのアスペクト比の2倍の幅および半分の長さである、請求項26に記載の内視鏡。
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US61/485,435 | 2011-05-12 | ||
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016076125A1 (ja) * | 2014-11-12 | 2016-05-19 | ソニー株式会社 | 固体撮像装置および製造方法、並びに電子機器 |
US10537234B2 (en) | 2011-05-12 | 2020-01-21 | DePuy Synthes Products, Inc. | Image sensor with tolerance optimizing interconnects |
US10701254B2 (en) | 2012-07-26 | 2020-06-30 | DePuy Synthes Products, Inc. | Camera system with minimal area monolithic CMOS image sensor |
US10881272B2 (en) | 2013-03-15 | 2021-01-05 | DePuy Synthes Products, Inc. | Minimize image sensor I/O and conductor counts in endoscope applications |
US10980406B2 (en) | 2013-03-15 | 2021-04-20 | DePuy Synthes Products, Inc. | Image sensor synchronization without input clock and data transmission clock |
JP2022031325A (ja) * | 2017-09-29 | 2022-02-18 | キヤノン株式会社 | 半導体装置および機器 |
Families Citing this family (105)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5500007B2 (ja) * | 2010-09-03 | 2014-05-21 | ソニー株式会社 | 固体撮像素子およびカメラシステム |
US9257468B2 (en) | 2012-11-21 | 2016-02-09 | Olympus Corporation | Solid-state imaging device, imaging device, and signal reading medium that accumulates an amplified signal without digitization |
JP5820627B2 (ja) | 2011-06-09 | 2015-11-24 | オリンパス株式会社 | 固体撮像装置、撮像装置、および信号読み出し方法 |
US9105548B2 (en) * | 2011-06-22 | 2015-08-11 | California Institute Of Technology | Sparsely-bonded CMOS hybrid imager |
JP5791571B2 (ja) * | 2011-08-02 | 2015-10-07 | キヤノン株式会社 | 撮像素子及び撮像装置 |
DE102011089157A1 (de) * | 2011-12-20 | 2013-06-20 | Olympus Winter & Ibe Gmbh | Videoendoskop mit seitlicher Blickrichtung und Verfahren zur Montage eines Videoendoskops |
JP6016378B2 (ja) * | 2012-02-29 | 2016-10-26 | キヤノン株式会社 | 光電変換装置、および光電変換装置を用いた撮像システム |
US8942481B2 (en) * | 2012-03-11 | 2015-01-27 | Universidad De Santiago De Compostela | Three dimensional CMOS image processor for feature detection |
US10297630B2 (en) * | 2012-06-18 | 2019-05-21 | Forza Silicon Corporation | Pinned charge transimpedance amplifier |
TWI583195B (zh) * | 2012-07-06 | 2017-05-11 | 新力股份有限公司 | A solid-state imaging device and a solid-state imaging device, and an electronic device |
CN104619237B (zh) | 2012-07-26 | 2018-03-30 | 德普伊辛迪斯制品公司 | 光不足环境中的ycbcr脉冲调制的照明方案 |
EP2992810B1 (en) | 2012-07-26 | 2021-11-10 | DePuy Synthes Products, Inc. | Continuous video in a light deficient environment |
JP2014107448A (ja) * | 2012-11-28 | 2014-06-09 | Nikon Corp | 積層半導体装置の製造方法および積層半導体製造装置 |
US8946784B2 (en) * | 2013-02-18 | 2015-02-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for image sensor packaging |
JP2014179433A (ja) * | 2013-03-14 | 2014-09-25 | Toshiba Corp | 半導体装置 |
CA2906821A1 (en) | 2013-03-15 | 2014-09-18 | Olive Medical Corporation | Scope sensing in a light controlled environment |
CA2906802A1 (en) | 2013-03-15 | 2014-09-18 | Olive Medical Corporation | Noise aware edge enhancement |
JP2014179892A (ja) * | 2013-03-15 | 2014-09-25 | Nikon Corp | 撮像装置 |
JP6404318B2 (ja) | 2013-03-15 | 2018-10-10 | デピュイ・シンセス・プロダクツ・インコーポレイテッド | レーザーパルスの積算光エネルギー制御 |
ES2914064T3 (es) | 2013-03-15 | 2022-06-07 | Depuy Synthes Products Inc | Trocar de visualización para su uso con endoscopio angulado |
JP6339172B2 (ja) * | 2013-03-15 | 2018-06-06 | デピュイ・シンセス・プロダクツ・インコーポレイテッド | 内視鏡適用のためのソフトウェアを使用した画像回転 |
AU2014233515B2 (en) | 2013-03-15 | 2018-11-01 | DePuy Synthes Products, Inc. | Super resolution and color motion artifact correction in a pulsed color imaging system |
TWI659652B (zh) | 2013-08-05 | 2019-05-11 | 新力股份有限公司 | 攝像裝置、電子機器 |
KR102065633B1 (ko) * | 2013-08-12 | 2020-01-13 | 삼성전자 주식회사 | 이미지 센서, 이의 동작 방법, 및 이를 포함하는 시스템 |
KR101782334B1 (ko) * | 2013-11-25 | 2017-09-27 | 캐논 가부시끼가이샤 | 촬상 소자, 촬상장치 및 휴대전화기 |
JP6463944B2 (ja) * | 2013-11-25 | 2019-02-06 | キヤノン株式会社 | 撮像素子、撮像装置及び携帯電話機 |
JP6413235B2 (ja) * | 2013-12-06 | 2018-10-31 | 株式会社ニコン | 撮像素子および撮像装置 |
US9479717B2 (en) * | 2014-02-18 | 2016-10-25 | Semiconductor Components Industries, Llc | Image sensor array with external charge detection circuitry |
WO2015143453A1 (en) * | 2014-03-21 | 2015-09-24 | Olive Medical Corporation | Card edge connector for an imaging sensor |
KR102397254B1 (ko) | 2014-03-28 | 2022-05-12 | 인튜어티브 서지컬 오퍼레이션즈 인코포레이티드 | 수술 장면의 정량적인 3차원 영상 |
KR102397670B1 (ko) | 2014-03-28 | 2022-05-16 | 인튜어티브 서지컬 오퍼레이션즈 인코포레이티드 | 정량적 3차원 영상화에 기초한 햅틱 피드백을 갖는 수술 시스템 |
JP6854237B2 (ja) | 2014-03-28 | 2021-04-07 | インテュイティブ サージカル オペレーションズ, インコーポレイテッド | 視野内の器具の定量的三次元視覚化 |
KR102405687B1 (ko) | 2014-03-28 | 2022-06-07 | 인튜어티브 서지컬 오퍼레이션즈 인코포레이티드 | 수술용 임플란트의 정량적 3차원 영상화 및 프린팅 |
JP6609616B2 (ja) | 2014-03-28 | 2019-11-20 | インテュイティブ サージカル オペレーションズ, インコーポレイテッド | マルチポートの視点からの手術シーンの定量的な3次元イメージング |
US9652575B2 (en) * | 2014-04-07 | 2017-05-16 | Omnivision Technologies, Inc. | Floorplan-optimized stacked image sensor and associated methods |
TWI648986B (zh) * | 2014-04-15 | 2019-01-21 | 日商新力股份有限公司 | 攝像元件、電子機器 |
JP6245474B2 (ja) | 2014-04-21 | 2017-12-13 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器 |
US9757015B2 (en) * | 2014-04-23 | 2017-09-12 | Omnivision Technologies, Inc. | Imaging systems and methods for using in spatially constrained locations |
US10264199B2 (en) * | 2014-07-15 | 2019-04-16 | Brillnics Inc. | Solid-state imaging device, method for producing solid-state imaging device, and electronic apparatus using photoelectric conversion elements |
US9379159B2 (en) | 2014-10-15 | 2016-06-28 | Omnivision Technologies, Inc. | Method of fabricating multi-wafer image sensor |
WO2016067386A1 (ja) * | 2014-10-29 | 2016-05-06 | オリンパス株式会社 | 固体撮像装置 |
DE112015005326T5 (de) * | 2015-01-21 | 2017-08-31 | Olympus Corporation | Endoskopvorrichtung |
US10869592B2 (en) | 2015-02-23 | 2020-12-22 | Uroviu Corp. | Handheld surgical endoscope |
WO2016137624A1 (en) * | 2015-02-24 | 2016-09-01 | Rambus Inc. | Depth measurement using a phase grating |
JP6295983B2 (ja) * | 2015-03-05 | 2018-03-20 | ソニー株式会社 | 半導体装置およびその製造方法、並びに電子機器 |
KR20160112775A (ko) * | 2015-03-20 | 2016-09-28 | 에스케이하이닉스 주식회사 | 이미지 센서 |
WO2016151792A1 (ja) * | 2015-03-25 | 2016-09-29 | オリンパス株式会社 | 固体撮像装置 |
US10389961B2 (en) * | 2015-04-09 | 2019-08-20 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device |
KR102513628B1 (ko) * | 2015-04-24 | 2023-03-24 | 소니그룹주식회사 | 고체 촬상 소자, 반도체 장치, 및, 전자 기기 |
DE112015006389T5 (de) * | 2015-05-01 | 2017-12-28 | Olympus Corporation | Bildgebungsvorrichtung |
AU2016264606B2 (en) * | 2015-05-19 | 2020-09-03 | Magic Leap, Inc. | Semi-global shutter imager |
JP6651720B2 (ja) * | 2015-07-10 | 2020-02-19 | 株式会社ニコン | 撮像素子および撮像装置 |
KR102422224B1 (ko) | 2015-07-31 | 2022-07-18 | 삼성전자주식회사 | 적층형 이미지 센서 및 이를 포함하는 시스템 |
CN113143355A (zh) | 2015-09-04 | 2021-07-23 | 美多斯国际有限公司 | 多护罩脊柱进入*** |
US11439380B2 (en) | 2015-09-04 | 2022-09-13 | Medos International Sarl | Surgical instrument connectors and related methods |
US11744447B2 (en) | 2015-09-04 | 2023-09-05 | Medos International | Surgical visualization systems and related methods |
US11672562B2 (en) | 2015-09-04 | 2023-06-13 | Medos International Sarl | Multi-shield spinal access system |
US10987129B2 (en) | 2015-09-04 | 2021-04-27 | Medos International Sarl | Multi-shield spinal access system |
DE102015115812A1 (de) * | 2015-09-18 | 2017-03-23 | Osram Opto Semiconductors Gmbh | Bauelement sowie Verfahren zur Herstellung eines Bauelements |
CN108140649B (zh) * | 2015-10-01 | 2022-05-06 | 奥林巴斯株式会社 | 摄像元件、内窥镜以及内窥镜*** |
US11297258B2 (en) * | 2015-10-01 | 2022-04-05 | Qualcomm Incorporated | High dynamic range solid state image sensor and camera system |
US10686003B2 (en) * | 2015-12-31 | 2020-06-16 | General Electric Company | Radiation detector assembly |
CN105847713A (zh) * | 2016-04-07 | 2016-08-10 | 天津大学 | 基于一维解码读出的3d堆叠结构图像传感器读出方法 |
CN105744185A (zh) * | 2016-04-07 | 2016-07-06 | 天津大学 | 基于交叉容错读出的3d堆叠结构图像传感器读出方法 |
JP6673034B2 (ja) * | 2016-06-06 | 2020-03-25 | 株式会社島津製作所 | X線撮影装置およびx線検出器 |
JP6677594B2 (ja) * | 2016-06-30 | 2020-04-08 | キヤノン株式会社 | 光電変換装置 |
DE102016212797A1 (de) * | 2016-07-13 | 2018-01-18 | Robert Bosch Gmbh | Lichtsensormodul, Verfahren zum Betreiben eines Lichtsensormoduls und Verfahren zum Herstellen eines Lichtsensormoduls |
US11832797B2 (en) | 2016-09-25 | 2023-12-05 | Micronvision Corp. | Endoscopic fluorescence imaging |
US11350816B2 (en) | 2020-09-13 | 2022-06-07 | Micron Vision Corp. | Portable and ergonomic endoscope with disposable cannula |
US11330973B2 (en) | 2017-09-25 | 2022-05-17 | Micronvision Corp | Portable and ergonomic endoscope with disposable cannula |
WO2018058013A1 (en) * | 2016-09-25 | 2018-03-29 | Xiaolong Ouyang | Endoscopic fluorescence imaging |
US11684248B2 (en) | 2017-09-25 | 2023-06-27 | Micronvision Corp. | Endoscopy/stereo colposcopy medical instrument |
EP3324545B1 (en) * | 2016-11-22 | 2024-04-24 | ams AG | Image sensor and method for readout of an image sensor |
US9961279B1 (en) | 2016-12-20 | 2018-05-01 | Omnivision Technologies, Inc. | Blooming free high dynamic range image sensor read out architecture using in-frame multi-bit exposure control |
US9955091B1 (en) * | 2016-12-20 | 2018-04-24 | Omnivision Technologies, Inc. | High dynamic range image sensor read out architecture using in-frame multi-bit exposure control |
KR102664014B1 (ko) * | 2016-12-23 | 2024-05-09 | 삼성전자주식회사 | 이미지를 촬영하는 센서 및 그 제어 방법 |
BR112019013148A2 (pt) * | 2016-12-27 | 2019-12-10 | Depuy Synthes Products Inc | sistemas, métodos e dispositivos para fornecer iluminação em um ambiente de imageamento endoscópico |
US10418406B2 (en) * | 2016-12-29 | 2019-09-17 | Raytheon Company | Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit |
US10075663B2 (en) * | 2017-01-20 | 2018-09-11 | Semiconductor Components Industries, Llc | Phase detection pixels with high speed readout |
US10965831B2 (en) * | 2017-05-25 | 2021-03-30 | Sony Semiconductor Solutions Corporation | Optical head, optical head scanning device, and method for driving optical head scanning device |
KR102374111B1 (ko) * | 2017-08-21 | 2022-03-14 | 삼성전자주식회사 | 이미지 센서를 제조하는 방법 및 시스템 |
WO2019058637A1 (ja) * | 2017-09-19 | 2019-03-28 | オリンパス株式会社 | 内視鏡および内視鏡システム |
US11980342B2 (en) | 2020-11-12 | 2024-05-14 | Micronvision Corp. | Minimally invasive endoscope |
US11771304B1 (en) | 2020-11-12 | 2023-10-03 | Micronvision Corp. | Minimally invasive endoscope |
GB2606047B (en) * | 2017-09-29 | 2023-02-15 | Canon Kk | Image sensor and image capturing apparatus |
JP6991816B2 (ja) * | 2017-09-29 | 2022-01-13 | キヤノン株式会社 | 半導体装置および機器 |
JP6929750B2 (ja) * | 2017-09-29 | 2021-09-01 | キヤノン株式会社 | 撮像装置、撮像システム、移動体 |
US10692179B2 (en) * | 2017-11-17 | 2020-06-23 | Semiconductor Components Industries, Llc | Methods and apparatus for signal distribution in an image sensor |
WO2019132961A1 (en) * | 2017-12-29 | 2019-07-04 | Intel Corporation | Microelectronic assemblies |
CN112236071A (zh) | 2018-02-21 | 2021-01-15 | 美多斯国际有限公司 | 外科可视化***和相关方法 |
WO2019171488A1 (ja) * | 2018-03-07 | 2019-09-12 | Tdk株式会社 | 電磁波センサ |
US10497630B2 (en) * | 2018-04-05 | 2019-12-03 | Texas Instruments Incorporated | High density wafer level test module |
CN109246372A (zh) * | 2018-10-22 | 2019-01-18 | 天津大学 | 基于分块并行容错结构的3d堆叠图像传感器 |
JP2020123795A (ja) * | 2019-01-30 | 2020-08-13 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置および電子機器 |
JP7358079B2 (ja) * | 2019-06-10 | 2023-10-10 | キヤノン株式会社 | 撮像装置、撮像システムおよび半導体チップ |
US11903563B2 (en) | 2019-06-20 | 2024-02-20 | Cilag Gmbh International | Offset illumination of a scene using multiple emitters in a fluorescence imaging system |
US11931009B2 (en) | 2019-06-20 | 2024-03-19 | Cilag Gmbh International | Offset illumination of a scene using multiple emitters in a hyperspectral imaging system |
US11788963B2 (en) * | 2019-06-20 | 2023-10-17 | Cilag Gmbh International | Minimizing image sensor input/output in a pulsed fluorescence imaging system |
US11531112B2 (en) * | 2019-06-20 | 2022-12-20 | Cilag Gmbh International | Offset illumination of a scene using multiple emitters in a hyperspectral, fluorescence, and laser mapping imaging system |
JP6957559B2 (ja) * | 2019-06-24 | 2021-11-02 | キヤノン株式会社 | 半導体装置および機器 |
EP4003138A4 (en) | 2019-07-25 | 2023-08-30 | Uroviu Corp. | DISPOSABLE ENDOSCOPY CANNULA WITH INTEGRATED FORCEPS |
KR20210046885A (ko) * | 2019-10-18 | 2021-04-29 | 삼성전자주식회사 | 이미지 센서, 카메라 모듈, 및 전자 기기 |
US11624653B2 (en) | 2020-12-03 | 2023-04-11 | Artilux, Inc. | Multi-application optical sensing apparatus and method thereof |
JP2022089432A (ja) * | 2020-12-04 | 2022-06-16 | Tdk株式会社 | 電磁波センサ |
FR3119707A1 (fr) * | 2021-02-08 | 2022-08-12 | Trixell | Détecteur numérique à intégration numérique de charges |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07136109A (ja) * | 1993-11-18 | 1995-05-30 | Olympus Optical Co Ltd | 内視鏡装置 |
JP2006025852A (ja) * | 2004-07-12 | 2006-02-02 | Texas Instr Japan Ltd | 内視鏡用撮像モジュール |
JP2010252396A (ja) * | 2010-07-26 | 2010-11-04 | Sony Corp | 撮像装置 |
JP2010273757A (ja) * | 2009-05-27 | 2010-12-09 | Zycube:Kk | イメージセンサ応用装置 |
Family Cites Families (605)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5339275A (en) | 1970-12-28 | 1994-08-16 | Hyatt Gilbert P | Analog memory system |
US3796220A (en) | 1972-03-24 | 1974-03-12 | H Bredemeier | Stereo laser endoscope |
US3858577A (en) | 1974-04-05 | 1975-01-07 | Univ Southern California | Fiber optic laser light delivery system |
US4011403A (en) | 1976-03-30 | 1977-03-08 | Northwestern University | Fiber optic laser illuminators |
JPS5336980A (en) | 1976-09-16 | 1978-04-05 | Olympus Optical Co | Light source for endscope |
JPS5850030B2 (ja) | 1979-03-08 | 1983-11-08 | 日本放送協会 | 光電変換装置およびそれを用いた固体撮像板 |
JPS5647014A (en) | 1979-09-25 | 1981-04-28 | Olympus Optical Co Ltd | Connector for lighting light transmission |
JPS5689230A (en) | 1979-12-20 | 1981-07-20 | Olympus Optical Co | Light source apparatus for endoscope |
JPS57164031A (en) | 1981-04-01 | 1982-10-08 | Olympus Optical Co | Light source apparatus for endoscope |
US4436095A (en) | 1981-12-22 | 1984-03-13 | Thomson-Csf Broadcast, Inc. | Method and apparatus for imaging a body |
JPS6041944A (ja) | 1983-08-17 | 1985-03-05 | 富士写真光機株式会社 | 内視鏡用光源装置 |
JPS6083028A (ja) | 1983-10-13 | 1985-05-11 | Fuji Photo Film Co Ltd | ハロゲン化銀写真感光材料 |
JPS6083051A (ja) | 1983-10-13 | 1985-05-11 | Fuji Xerox Co Ltd | 複写機におけるトナ−ボトル |
JPS60137342A (ja) | 1983-12-27 | 1985-07-20 | オリンパス光学工業株式会社 | 電子スコ−プ |
US4589404A (en) | 1984-01-03 | 1986-05-20 | Medical Dynamics, Inc. | Laser endoscope |
US4600940A (en) | 1984-02-07 | 1986-07-15 | Circon Corporation | Video camera for use with an endoscope and method for making same |
CA1182438A (en) | 1984-06-11 | 1985-02-12 | David J. Walsh | Light source for diagnostic test |
DE3526993A1 (de) | 1984-07-31 | 1986-02-13 | Olympus Optical Co., Ltd., Tokio/Tokyo | Blendenanordnung einer lichtquelle fuer ein endoskop |
KR890001908B1 (ko) | 1985-09-19 | 1989-05-31 | 가부시끼가이샤 도시바 | Tv식 내시경 장치의 광 펄스 조사장치 |
US4670653A (en) | 1985-10-10 | 1987-06-02 | Rockwell International Corporation | Infrared detector and imaging system |
JPH0664243B2 (ja) | 1986-04-30 | 1994-08-22 | オリンパス光学工業株式会社 | 内視鏡 |
DE3715417A1 (de) | 1986-05-13 | 1987-11-19 | Olympus Optical Co | Halbleiter-bilderzeugungsvorrichtung, sowie hiermit ausgestattetes endoskop |
US5010876A (en) | 1986-06-02 | 1991-04-30 | Smith & Nephew Dyonics, Inc. | Arthroscopic surgical practice |
JPS6343639A (ja) | 1986-08-11 | 1988-02-24 | オリンパス光学工業株式会社 | 電子内視鏡 |
JPS6363426A (ja) | 1986-09-04 | 1988-03-19 | オリンパス光学工業株式会社 | 電子内視鏡 |
US4832003A (en) | 1986-09-12 | 1989-05-23 | Olympus Optical Co., Ltd. | Electronic endoscope tip |
US4831444A (en) | 1986-11-06 | 1989-05-16 | Olympus Optical Co., Ltd. | Video camera device with separate camera head and signal processing circuit |
US4800424A (en) | 1986-11-13 | 1989-01-24 | Olympus Optical Co., Ltd. | Endoscope light source apparatus with a light emitting timing delaying circuit |
DE3743920A1 (de) | 1986-12-26 | 1988-07-14 | Olympus Optical Co | Endoskopeinrichtung |
US4918521A (en) | 1987-01-20 | 1990-04-17 | Olympus Optical Co., Ltd. | Solid state imaging apparatus |
JP2610256B2 (ja) | 1987-01-26 | 1997-05-14 | 株式会社東芝 | 内視鏡の光源装置 |
US4845555A (en) | 1987-02-13 | 1989-07-04 | Olympus Optical Co., Ltd. | Electronic endoscope apparatus |
US4853772A (en) | 1987-02-26 | 1989-08-01 | Olympus Optical Co., Ltd. | Electronic endoscope apparatus having isolated patient and secondary circuitry |
US4888639A (en) | 1987-05-22 | 1989-12-19 | Olympous Optical Co., Ltd. | Endoscope apparatus having integrated disconnectable light transmitting and image signal transmitting cord |
IL83213A (en) | 1987-07-16 | 1991-08-16 | Technion Res & Dev Foundation | Intelligent scan image sensor |
DE3724761C1 (de) | 1987-07-25 | 1988-09-15 | Wolf Gmbh Richard | Video-Endoskop |
US5021888A (en) | 1987-12-18 | 1991-06-04 | Kabushiki Kaisha Toshiba | Miniaturized solid state imaging device |
US5237403A (en) | 1988-02-04 | 1993-08-17 | Asahi Kogaku Kogyo Kabushiki Kaisha | Light source system for endoscope |
US5065444A (en) | 1988-02-08 | 1991-11-12 | Northrop Corporation | Streak removal filtering method and apparatus |
US4938205A (en) | 1988-05-27 | 1990-07-03 | The University Of Connecticut | Endoscope with traced raster and elemental photodetectors |
US5200838A (en) | 1988-05-27 | 1993-04-06 | The University Of Connecticut | Lateral effect imaging system |
DE3842361A1 (de) | 1988-12-16 | 1990-06-28 | Philips Patentverwaltung | Anordnung zum uebertragen digitaler fernsehsignale |
USRE33854E (en) | 1989-02-03 | 1992-03-24 | sterilizable sheathpe with .[.heat.]. | |
JPH0617942B2 (ja) | 1989-02-15 | 1994-03-09 | 株式会社東芝 | 電子内視鏡装置 |
US5010038A (en) | 1989-06-29 | 1991-04-23 | Digital Equipment Corp. | Method of cooling and powering an integrated circuit chip using a compliant interposing pad |
US4954878A (en) | 1989-06-29 | 1990-09-04 | Digital Equipment Corp. | Method of packaging and powering integrated circuit chips and the chip assembly formed thereby |
JP2991299B2 (ja) | 1989-08-04 | 1999-12-20 | 株式会社東芝 | 内視鏡装置 |
US5103497A (en) | 1989-11-14 | 1992-04-07 | Hicks John W | Flying spot endoscope |
US5133035A (en) | 1989-11-14 | 1992-07-21 | Hicks John W | Multifiber endoscope with multiple scanning modes to produce an image free of fixed pattern noise |
US5196938A (en) | 1989-11-20 | 1993-03-23 | Eastman Kodak Company | Solid state fast frame recorder having independently selectable frame rate and exposure |
US5227662A (en) | 1990-05-24 | 1993-07-13 | Nippon Steel Corporation | Composite lead frame and semiconductor device using the same |
JP3216650B2 (ja) | 1990-08-27 | 2001-10-09 | オリンパス光学工業株式会社 | 固体撮像装置 |
US5168863A (en) | 1990-08-27 | 1992-12-08 | Medical Concepts, Inc. | Sterile endoscopic system |
US5115309A (en) | 1990-09-10 | 1992-05-19 | At&T Bell Laboratories | Method and apparatus for dynamic channel bandwidth allocation among multiple parallel video coders |
JP3164609B2 (ja) | 1990-10-31 | 2001-05-08 | オリンパス光学工業株式会社 | 内視鏡装置 |
JP2577260Y2 (ja) | 1990-11-20 | 1998-07-23 | 旭光学工業株式会社 | 内視鏡用光源装置 |
JP3034019B2 (ja) | 1990-11-26 | 2000-04-17 | 旭光学工業株式会社 | 内視鏡の先端部 |
JP2842687B2 (ja) | 1990-11-27 | 1999-01-06 | 旭光学工業株式会社 | 電子内視鏡の先端部 |
JP2537587Y2 (ja) | 1990-11-27 | 1997-06-04 | 旭光学工業株式会社 | 内視鏡の先端部 |
DE4105326A1 (de) | 1991-02-21 | 1992-09-03 | Wolf Gmbh Richard | Endoskop mit proximal ankuppelbarer kamera |
US5313306A (en) | 1991-05-13 | 1994-05-17 | Telerobotics International, Inc. | Omniview motionless camera endoscopy system |
US5188094A (en) | 1991-09-30 | 1993-02-23 | Adair Edwin Lloyd | Heat sterilizable electronic video endoscope |
JPH05199989A (ja) | 1991-10-25 | 1993-08-10 | Asahi Optical Co Ltd | 内視鏡の先端部 |
US5241170A (en) | 1992-02-19 | 1993-08-31 | Itt Corporation | Fiber optic imaging device and methods |
JPH05268534A (ja) | 1992-03-23 | 1993-10-15 | Sony Corp | 黒レベルクランプ回路 |
US5289555A (en) | 1992-06-18 | 1994-02-22 | Sanso David W | Optical-fibre cable coupler for endoscope light source |
US5402768A (en) | 1992-09-01 | 1995-04-04 | Adair; Edwin L. | Endoscope with reusable core and disposable sheath with passageways |
US5381784A (en) | 1992-09-30 | 1995-01-17 | Adair; Edwin L. | Stereoscopic endoscope |
US5400267A (en) | 1992-12-08 | 1995-03-21 | Hemostatix Corporation | Local in-device memory feature for electrically powered medical equipment |
AU5827094A (en) | 1992-12-09 | 1994-07-04 | Graeme Cocks | Electronic video endoscope with non-synchronous exposure |
DE69416829D1 (de) | 1993-04-07 | 1999-04-08 | Ahern John M | Endoskop mit einem an seiner spitze angeordneten ccd-farbsensor |
US5896166A (en) | 1993-06-02 | 1999-04-20 | Envision Medical Corporation | Remote CCD video camera with non-volatile digital memory |
US5437087A (en) | 1993-08-03 | 1995-08-01 | Bell Atlantic Network Services, Inc. | Method of attaching an interduct to aduct |
US5397746A (en) | 1993-11-03 | 1995-03-14 | Intel Corporation | Quad flat package heat slug composition |
JP3362530B2 (ja) | 1993-12-16 | 2003-01-07 | セイコーエプソン株式会社 | 樹脂封止型半導体装置およびその製造方法 |
US5523786A (en) | 1993-12-22 | 1996-06-04 | Eastman Kodak Company | Color sequential camera in which chrominance components are captured at a lower temporal rate than luminance components |
US5471515A (en) | 1994-01-28 | 1995-11-28 | California Institute Of Technology | Active pixel sensor with intra-pixel charge transfer |
US6166768A (en) | 1994-01-28 | 2000-12-26 | California Institute Of Technology | Active pixel sensor array with simple floating gate pixels |
US5841126A (en) | 1994-01-28 | 1998-11-24 | California Institute Of Technology | CMOS active pixel sensor type imaging system on a chip |
US6021172A (en) | 1994-01-28 | 2000-02-01 | California Institute Of Technology | Active pixel sensor having intra-pixel charge transfer with analog-to-digital converter |
US6456326B2 (en) | 1994-01-28 | 2002-09-24 | California Institute Of Technology | Single chip camera device having double sampling operation |
US5949483A (en) | 1994-01-28 | 1999-09-07 | California Institute Of Technology | Active pixel sensor array with multiresolution readout |
US5461425A (en) | 1994-02-15 | 1995-10-24 | Stanford University | CMOS image sensor with pixel level A/D conversion |
US5522006A (en) | 1994-04-20 | 1996-05-28 | Fuji Photo Optical Co., Ltd. | Endoscopic light source connector |
US5576781A (en) | 1994-05-16 | 1996-11-19 | Deleeuw; Paul | Disposable camera |
IL110595A0 (en) | 1994-08-09 | 1994-11-11 | Applitic Ltd | A random access multispectral video and illumination system |
US5784099A (en) | 1994-09-13 | 1998-07-21 | Intel Corporation | Video camera and method for generating time varying video images in response to a capture signal |
US5748234A (en) | 1994-09-13 | 1998-05-05 | Intel Corporation | Video processing system and method |
US5550595A (en) | 1994-12-16 | 1996-08-27 | Intel Corporation | Apparatus and method for motion estimation with enhanced camera interface |
US5665959A (en) | 1995-01-13 | 1997-09-09 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Adminstration | Solid-state image sensor with focal-plane digital photon-counting pixel array |
US5614763A (en) | 1995-03-13 | 1997-03-25 | Zetetic Institute | Methods for improving performance and temperature robustness of optical coupling between solid state light sensors and optical systems |
GB9505305D0 (en) * | 1995-03-16 | 1995-05-03 | Philips Electronics Uk Ltd | Electronic devices comprising an array |
US5625210A (en) | 1995-04-13 | 1997-04-29 | Eastman Kodak Company | Active pixel sensor integrated with a pinned photodiode |
JP3054576B2 (ja) | 1995-04-26 | 2000-06-19 | シャープ株式会社 | 半導体装置 |
US6023315A (en) | 1995-07-04 | 2000-02-08 | Sharp Kabushiki Kaisha | Spatial light modulator and directional display |
US5787298A (en) | 1995-08-18 | 1998-07-28 | General Magic, Inc. | Bus interface circuit for an intelligent low power serial bus |
JPH09140664A (ja) | 1995-11-20 | 1997-06-03 | Osada Res Inst Ltd | 歯科用口腔内観察カメラ |
US5763943A (en) * | 1996-01-29 | 1998-06-09 | International Business Machines Corporation | Electronic modules with integral sensor arrays |
US6018364A (en) | 1996-02-06 | 2000-01-25 | Analog Devices Inc | Correlated double sampling method and apparatus |
US5868664A (en) | 1996-02-23 | 1999-02-09 | Envision Medical Corporation | Electrically isolated sterilizable endoscopic video camera head |
US5990506A (en) | 1996-03-20 | 1999-11-23 | California Institute Of Technology | Active pixel sensors with substantially planarized color filtering elements |
US5880777A (en) | 1996-04-15 | 1999-03-09 | Massachusetts Institute Of Technology | Low-light-level imaging and image processing |
JP3535660B2 (ja) | 1996-06-28 | 2004-06-07 | キヤノン株式会社 | 画像読取り装置および画像読取り方法 |
US5879289A (en) | 1996-07-15 | 1999-03-09 | Universal Technologies International, Inc. | Hand-held portable endoscopic camera |
US5754313A (en) | 1996-07-17 | 1998-05-19 | Welch Allyn, Inc. | Imager assembly |
US5734418A (en) | 1996-07-17 | 1998-03-31 | Welch Allyn, Inc. | Endoscope with tab imager package |
US5857963A (en) | 1996-07-17 | 1999-01-12 | Welch Allyn, Inc. | Tab imager assembly for use in an endoscope |
US6017354A (en) | 1996-08-15 | 2000-01-25 | Stryker Corporation | Integrated system for powered surgical tools |
US7018331B2 (en) | 1996-08-26 | 2006-03-28 | Stryker Corporation | Endoscope assembly useful with a scope-sensing light cable |
US7815436B2 (en) | 1996-09-04 | 2010-10-19 | Immersion Corporation | Surgical simulation interface device and method |
US5887049A (en) | 1996-11-12 | 1999-03-23 | California Institute Of Technology | Self-triggered X-ray sensor |
AU6532298A (en) | 1996-11-12 | 1998-06-22 | California Institute Of Technology | Semiconductor imaging sensor with on-chip encryption |
US6142930A (en) | 1997-01-13 | 2000-11-07 | Asahi Kogaku Kogyo Kabushiki Kaisha | Electronic endoscope having compact construction |
US5990469A (en) | 1997-04-02 | 1999-11-23 | Gentex Corporation | Control circuit for image array sensors |
US6215517B1 (en) | 1997-04-14 | 2001-04-10 | Asahi Kogaku Kogyo Kabushiki Kaisha | Electronic endoscope system |
IL121450A0 (en) | 1997-08-01 | 1998-02-08 | Smollett Neil | Ophthalmic surgical equipment |
US6327493B1 (en) | 1997-08-28 | 2001-12-04 | Olympus Optical Co., Ltd. | Light scanning devices of a water-tight structure to be inserted into a body cavity to obtain optical information on inside of a biological tissue |
US5929901A (en) | 1997-10-06 | 1999-07-27 | Adair; Edwin L. | Reduced area imaging devices incorporated within surgical instruments |
US6043839A (en) | 1997-10-06 | 2000-03-28 | Adair; Edwin L. | Reduced area imaging devices |
US6211904B1 (en) | 1997-09-11 | 2001-04-03 | Edwin L. Adair | Surgical devices incorporating reduced area imaging devices |
US6059776A (en) | 1997-09-23 | 2000-05-09 | Gatto; Dom L. | Electrosurgical laser shears |
JPH1199126A (ja) | 1997-09-29 | 1999-04-13 | Olympus Optical Co Ltd | 電子内視鏡 |
US6606122B1 (en) | 1997-09-29 | 2003-08-12 | California Institute Of Technology | Single chip camera active pixel sensor |
US7002621B2 (en) | 1997-10-06 | 2006-02-21 | Adair Edwin L | Communication devices incorporating reduced area imaging devices |
US6982742B2 (en) | 1997-10-06 | 2006-01-03 | Adair Edwin L | Hand-held computers incorporating reduced area imaging devices |
US20110034769A1 (en) | 1997-10-06 | 2011-02-10 | Micro-Imaging Solutions Llc | Reduced area imaging device incorporated within wireless endoscopic devices |
US6005619A (en) | 1997-10-06 | 1999-12-21 | Photobit Corporation | Quantum efficiency improvements in active pixel sensors |
US7030904B2 (en) | 1997-10-06 | 2006-04-18 | Micro-Medical Devices, Inc. | Reduced area imaging device incorporated within wireless endoscopic devices |
US5986693A (en) | 1997-10-06 | 1999-11-16 | Adair; Edwin L. | Reduced area imaging devices incorporated within surgical instruments |
US6310642B1 (en) | 1997-11-24 | 2001-10-30 | Micro-Medical Devices, Inc. | Reduced area imaging devices incorporated within surgical instruments |
US6424369B1 (en) | 1997-10-06 | 2002-07-23 | Edwin L. Adair | Hand-held computers incorporating reduced area imaging devices |
US6452626B1 (en) | 1997-10-06 | 2002-09-17 | Edwin L. Adair | Communication devices incorporating reduced area imaging devices |
US6982740B2 (en) | 1997-11-24 | 2006-01-03 | Micro-Medical Devices, Inc. | Reduced area imaging devices utilizing selected charge integration periods |
US6369812B1 (en) | 1997-11-26 | 2002-04-09 | Philips Medical Systems, (Cleveland), Inc. | Inter-active viewing system for generating virtual endoscopy studies of medical diagnostic data with a continuous sequence of spherical panoramic views and viewing the studies over networks |
US7009646B1 (en) | 1997-12-16 | 2006-03-07 | Micron Technology, Inc. | Three-sided buttable CMOS image sensor |
US7598686B2 (en) | 1997-12-17 | 2009-10-06 | Philips Solid-State Lighting Solutions, Inc. | Organic light emitting diode methods and apparatus |
US6073043A (en) | 1997-12-22 | 2000-06-06 | Cormedica Corporation | Measuring position and orientation using magnetic fields |
JP2001527372A (ja) | 1997-12-31 | 2001-12-25 | ジェンテクス・コーポレーション | 車両視覚システム |
US6704049B1 (en) | 1998-02-23 | 2004-03-09 | Micron Technology, Inc. | Interpolator for a CMOS image sensor using a digital register |
KR100278285B1 (ko) | 1998-02-28 | 2001-01-15 | 김영환 | 씨모스 이미지센서 및 그 제조방법 |
US6809766B1 (en) | 1998-03-11 | 2004-10-26 | Micro Technology, Inc. | Look ahead rolling shutter system in CMOS sensors |
US6166367A (en) | 1998-03-26 | 2000-12-26 | Photobit Corporation | Programmable analog arithmetic circuit for imaging sensor |
US6906745B1 (en) | 1998-04-23 | 2005-06-14 | Micron Technology, Inc. | Digital exposure circuit for an image sensor |
US6977684B1 (en) | 1998-04-30 | 2005-12-20 | Canon Kabushiki Kaisha | Arrangement of circuits in pixels, each circuit shared by a plurality of pixels, in image sensing apparatus |
WO1999058044A1 (en) | 1998-05-13 | 1999-11-18 | Inbae Yoon | Penetrating endoscope and endoscopic surgical instrument with cmos image sensor and display |
TW400657B (en) | 1998-06-09 | 2000-08-01 | United Microelectronics Corp | The manufacture method of CMOS sensor device |
TW381345B (en) | 1998-06-15 | 2000-02-01 | United Microelectronics Corp | CMOS semiconductor sensor structure and the manufacturing method thereof |
US6485414B1 (en) | 1998-07-13 | 2002-11-26 | Ceramoptec Industries, Inc. | Color video diagnostic system for mini-endoscopes |
US6028330A (en) | 1998-08-04 | 2000-02-22 | Dyna Image Corporation | CMOS sensor having a structure to reduce white pixels |
US6419626B1 (en) | 1998-08-12 | 2002-07-16 | Inbae Yoon | Surgical instrument endoscope with CMOS image sensor and physical parameter sensor |
US6879340B1 (en) | 1998-08-19 | 2005-04-12 | Micron Technology Inc. | CMOS imager with integrated non-volatile memory |
US6239456B1 (en) | 1998-08-19 | 2001-05-29 | Photobit Corporation | Lock in pinned photodiode photodetector |
US6515321B1 (en) | 1998-08-24 | 2003-02-04 | United Microelectronics Corp. | Structure of a complementary metal oxide semiconductor sensor |
US6404048B2 (en) | 1998-09-03 | 2002-06-11 | Micron Technology, Inc. | Heat dissipating microelectronic package |
US6096573A (en) | 1998-11-05 | 2000-08-01 | United Microelectronics Corp. | Method of manufacturing a CMOS sensor |
US6118142A (en) | 1998-11-09 | 2000-09-12 | United Microelectronics Corp. | CMOS sensor |
US6740870B1 (en) | 1998-11-18 | 2004-05-25 | Micron Technology, Inc. | Clear plastic packaging in a CMOS active pixel image sensor |
US6059793A (en) | 1998-11-20 | 2000-05-09 | Pagedas; Anthony C. | Reusable laproscopic retrieval mechanism and method for use |
US6690410B1 (en) | 1999-06-09 | 2004-02-10 | Olympus Optical Co., Ltd. | Image processing unit with expandable image signal processing capability and endoscopic imaging system |
US6799065B1 (en) | 1998-12-08 | 2004-09-28 | Intuitive Surgical, Inc. | Image shifting apparatus and method for a telerobotic system |
US6144542A (en) | 1998-12-15 | 2000-11-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | ESD bus lines in CMOS IC's for whole-chip ESD protection |
JP4178634B2 (ja) | 1998-12-22 | 2008-11-12 | ソニー株式会社 | 映像信号伝送装置、映像信号伝送方法、映像信号撮像装置および映像信号処理装置 |
US6207984B1 (en) | 1998-12-23 | 2001-03-27 | United Microelectronics Corp. | CMOS sensor |
JP2000210251A (ja) | 1999-01-21 | 2000-08-02 | Olympus Optical Co Ltd | 内視鏡装置 |
JP3693843B2 (ja) | 1999-02-25 | 2005-09-14 | 株式会社日立製作所 | 液晶表示装置 |
WO2000052765A1 (en) | 1999-03-01 | 2000-09-08 | Photobit Corporation | Active pixel sensor with fully-depleted buried photoreceptor |
US6445022B1 (en) | 1999-04-23 | 2002-09-03 | Micron Technology, Inc. | Increasing pixel conversion gain in CMOS image sensors |
US6198087B1 (en) | 1999-05-03 | 2001-03-06 | Iteris, Inc. | CMOS imager with light shield |
EP1099405B1 (en) | 1999-05-18 | 2005-08-03 | Olympus Corporation | Endoscope |
JP3394742B2 (ja) | 1999-05-31 | 2003-04-07 | オリンパス光学工業株式会社 | 内視鏡用データファイリングシステム |
US6194260B1 (en) | 1999-06-02 | 2001-02-27 | United Microelectronics Corp. | Method of forming a CMOS sensor |
US6294775B1 (en) | 1999-06-08 | 2001-09-25 | University Of Washington | Miniature image acquistion system using a scanning resonant waveguide |
DE29910795U1 (de) | 1999-06-21 | 1999-09-02 | Richard Wolf Gmbh, 75438 Knittlingen | Elektronisches Endoskop |
WO2001011343A1 (en) | 1999-08-06 | 2001-02-15 | Cambridge Research & Instrumentation Inc. | Spectral imaging system |
US6333205B1 (en) | 1999-08-16 | 2001-12-25 | Micron Technology, Inc. | CMOS imager with selectively silicided gates |
US6299622B1 (en) | 1999-08-19 | 2001-10-09 | Fox Hollow Technologies, Inc. | Atherectomy catheter with aligned imager |
US6796939B1 (en) | 1999-08-26 | 2004-09-28 | Olympus Corporation | Electronic endoscope |
US8317689B1 (en) | 1999-09-13 | 2012-11-27 | Visionscope Technologies Llc | Miniature endoscope system |
US6139489A (en) | 1999-10-05 | 2000-10-31 | Ethicon Endo-Surgery, Inc. | Surgical device with integrally mounted image sensor |
DE19947812C2 (de) | 1999-10-05 | 2001-11-22 | Winter & Ibe Olympus | Beleuchtungseinrichtung für Endoskope mit Helligkeitssteuerung |
US6272269B1 (en) | 1999-11-16 | 2001-08-07 | Dn Labs Inc. | Optical fiber/waveguide illumination system |
EP1107422A3 (de) | 1999-12-03 | 2003-08-13 | Heraeus Med GmbH | Verfahren zum Betrieb einer Leuchte, insbesondere für medizinische Anwendungen, sowie Leuchte mit Entladungslampe |
JP3467013B2 (ja) * | 1999-12-06 | 2003-11-17 | キヤノン株式会社 | 固体撮像装置 |
US20010030744A1 (en) | 1999-12-27 | 2001-10-18 | Og Technologies, Inc. | Method of simultaneously applying multiple illumination schemes for simultaneous image acquisition in an imaging system |
JP4191355B2 (ja) | 2000-02-10 | 2008-12-03 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
US7009634B2 (en) | 2000-03-08 | 2006-03-07 | Given Imaging Ltd. | Device for in-vivo imaging |
US7151568B2 (en) | 2000-03-15 | 2006-12-19 | Omron Corporation | Displacement sensor |
IL138632A (en) | 2000-09-21 | 2008-06-05 | Minelu Zonnenschein | A multi-eyed endoscope |
EP1143706A3 (en) | 2000-03-28 | 2007-08-01 | Fujitsu Limited | Image sensor with black level control and low power consumption |
WO2001078377A1 (en) | 2000-04-06 | 2001-10-18 | Koninklijke Philips Electronics N.V. | Front-end device for ccd with hybrid sampler |
IL135571A0 (en) | 2000-04-10 | 2001-05-20 | Doron Adler | Minimal invasive surgery imaging system |
US6441482B1 (en) | 2000-04-11 | 2002-08-27 | Omnivision Technologies, Inc. | Biometric device with integrated CMOS image sensor |
JP3664939B2 (ja) | 2000-04-14 | 2005-06-29 | 富士通株式会社 | Cmosイメージセンサ及びその製造方法 |
KR100386609B1 (ko) | 2000-04-28 | 2003-06-02 | 주식회사 하이닉스반도체 | 씨모스 이미지 센서 및 그의 제조 방법 |
US20010040632A1 (en) | 2000-05-09 | 2001-11-15 | Yang David Xiao Dong | Multiple sampling via a time-indexed method to achieve wide dynamic ranges |
JP3791894B2 (ja) | 2000-05-12 | 2006-06-28 | オリンパス株式会社 | 内視鏡画像ファイリングシステム |
US6552322B1 (en) | 2000-05-16 | 2003-04-22 | Micron Technology, Inc. | Shared photodetector pixel image sensor |
US6961461B2 (en) | 2000-05-17 | 2005-11-01 | Tidal Photonics, Inc. | Apparatus and method for measurement, encoding and displaying of object color for digital imaging |
DE10026392A1 (de) | 2000-05-27 | 2001-11-29 | Leica Microsystems | Verfahren und Anordnung zur Kodierung von Livebildern in der Mikroskopie |
JP3713418B2 (ja) | 2000-05-30 | 2005-11-09 | 光正 小柳 | 3次元画像処理装置の製造方法 |
US7555333B2 (en) | 2000-06-19 | 2009-06-30 | University Of Washington | Integrated optical scanning image acquisition and display |
US6717151B2 (en) | 2000-07-10 | 2004-04-06 | Canon Kabushiki Kaisha | Image pickup apparatus |
US6303421B1 (en) | 2000-07-17 | 2001-10-16 | United Microelectronics Corp. | Method of manufacturing CMOS sensor |
JP2002076314A (ja) | 2000-08-30 | 2002-03-15 | Texas Instr Japan Ltd | 超小型撮像装置 |
US6967725B2 (en) | 2000-10-13 | 2005-11-22 | Lucent Technologies Inc. | System and method for optical scanning |
US6410377B1 (en) | 2000-11-06 | 2002-06-25 | Ching-Chun Hwang | Method for integrating CMOS sensor and high voltage device |
US6856712B2 (en) | 2000-11-27 | 2005-02-15 | University Of Washington | Micro-fabricated optical waveguide for use in scanning fiber displays and scanned fiber image acquisition |
JP4608766B2 (ja) | 2000-11-27 | 2011-01-12 | ソニー株式会社 | 固体撮像素子の駆動方法、及びカメラ |
US7184084B2 (en) | 2001-02-26 | 2007-02-27 | Florida Atlantic University | Method and apparatus for image sensing with CCD |
JP3691764B2 (ja) | 2001-03-07 | 2005-09-07 | オリンパス株式会社 | オートクレーブ装置 |
JP2002336190A (ja) | 2001-03-12 | 2002-11-26 | Olympus Optical Co Ltd | 内視鏡 |
US7102682B2 (en) | 2001-04-25 | 2006-09-05 | Hewlett-Packard Development Company, L.P. | Exposure control in a digital camera |
JP2002329851A (ja) * | 2001-05-01 | 2002-11-15 | Canon Inc | 撮像モジュールとその製造方法、および撮像モジュールを備えた撮像機器 |
US7616986B2 (en) | 2001-05-07 | 2009-11-10 | University Of Washington | Optical fiber scanner for performing multimodal optical imaging |
KR20030029103A (ko) | 2001-05-11 | 2003-04-11 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 병렬 데이터 프로세싱을 위한 장치 및 이러한 장치를포함하는 카메라 시스템 |
US6512280B2 (en) | 2001-05-16 | 2003-01-28 | Texas Instruments Incorporated | Integrated CMOS structure for gate-controlled buried photodiode |
EP1392193B1 (de) | 2001-06-07 | 2009-12-09 | Kaltenbach & Voigt GmbH | Medizinisches oder dentalmedizinisches instrument und/oder versorgungsgerät und/oder pflegegerät für das medizinische oder dentalmedizinische instrument |
US20030007686A1 (en) | 2001-06-29 | 2003-01-09 | Roever Jens A. | Combined color space matrix transformation and FIR filter |
US6976954B2 (en) | 2001-06-29 | 2005-12-20 | Pentax Corporation | Endoscope system |
JP4390096B2 (ja) | 2001-07-06 | 2009-12-24 | 富士フイルム株式会社 | 内視鏡装置 |
TNSN02063A1 (en) | 2001-07-07 | 2005-12-23 | Egyptian Natural Oil Co Natoil | The medical effect of jojoba oil |
US7331523B2 (en) | 2001-07-13 | 2008-02-19 | Hand Held Products, Inc. | Adaptive optical image reader |
US7280139B2 (en) | 2001-07-20 | 2007-10-09 | Micron Technology, Inc. | Double sampling active pixel sensor with double sampling temperature sensor |
US7106377B2 (en) | 2001-07-25 | 2006-09-12 | Hewlett-Packard Development Company, L.P. | Image capturing device capable of single pixel exposure duration control |
TW506103B (en) | 2001-08-06 | 2002-10-11 | Au Optronics Corp | Bump layout on a chip |
US6921920B2 (en) | 2001-08-31 | 2005-07-26 | Smith & Nephew, Inc. | Solid-state light source |
JP3869692B2 (ja) | 2001-09-03 | 2007-01-17 | ペンタックス株式会社 | 電子内視鏡装置および電子内視鏡システム |
US6692431B2 (en) | 2001-09-07 | 2004-02-17 | Smith & Nephew, Inc. | Endoscopic system with a solid-state light source |
US7295578B1 (en) | 2001-09-12 | 2007-11-13 | Lyle James D | Method and apparatus for synchronizing auxiliary data and video data transmitted over a TMDS-like link |
US7027092B2 (en) * | 2001-09-17 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Image capture and storage device |
US6835173B2 (en) | 2001-10-05 | 2004-12-28 | Scimed Life Systems, Inc. | Robotic endoscope |
JP3938675B2 (ja) | 2001-10-26 | 2007-06-27 | オリンパス株式会社 | 光源装置 |
US7088398B1 (en) | 2001-12-24 | 2006-08-08 | Silicon Image, Inc. | Method and apparatus for regenerating a clock for auxiliary data transmitted over a serial link with video data |
US8423110B2 (en) | 2002-01-09 | 2013-04-16 | Boston Scientific Scimed, Inc. | Imaging device and related methods |
US6899675B2 (en) | 2002-01-15 | 2005-05-31 | Xillix Technologies Corp. | Fluorescence endoscopy video systems with no moving parts in the camera |
US7545434B2 (en) | 2002-02-04 | 2009-06-09 | Hewlett-Packard Development Company, L.P. | Video camera with variable image capture rate and related methodology |
JP3992504B2 (ja) | 2002-02-04 | 2007-10-17 | 富士通株式会社 | Cmosイメージセンサ |
US7196391B2 (en) * | 2002-02-05 | 2007-03-27 | E-Phocus, Inc. | MOS or CMOS sensor with micro-lens array |
US20060164533A1 (en) | 2002-08-27 | 2006-07-27 | E-Phocus, Inc | Electronic image sensor |
US6730900B2 (en) | 2002-02-05 | 2004-05-04 | E-Phocus, Inc. | Camera with MOS or CMOS sensor array |
US6809358B2 (en) | 2002-02-05 | 2004-10-26 | E-Phocus, Inc. | Photoconductor on active pixel image sensor |
US6588884B1 (en) | 2002-02-08 | 2003-07-08 | Eastman Kodak Company | Tri-layer thermal actuator and method of operating |
DE10209922A1 (de) | 2002-03-07 | 2003-10-02 | Infineon Technologies Ag | Elektronisches Modul, Nutzen mit zu vereinzelnden elektronischen Modulen und Verfahren zu deren Herstellung |
US7230247B2 (en) | 2002-03-08 | 2007-06-12 | Hamamatsu Photonics K.K. | Detector |
US9510740B2 (en) | 2002-03-12 | 2016-12-06 | Karl Storz Endovision, Inc. | Auto recognition of a shaver blade for medical use |
US8194122B2 (en) | 2002-03-12 | 2012-06-05 | Karl Storz Imaging, Inc. | Universal scope reader |
EP2319387A1 (en) | 2002-03-18 | 2011-05-11 | Optim, Inc. | Sterilization apparatus |
US7899681B2 (en) | 2002-03-29 | 2011-03-01 | 3M Innovative Properties Company | Electronic management of sterilization process information |
DE10214809A1 (de) | 2002-04-04 | 2003-10-23 | Wolf Gmbh Richard | Festkörpervideokamera und Helligkeitsregelung dafür |
EP2380487B1 (en) | 2002-04-17 | 2021-03-31 | Covidien LP | Endoscope structures for navigating to a target in branched structure |
US7087902B2 (en) | 2002-04-19 | 2006-08-08 | Rensselaer Polytechnic Institute | Fresnel lens tomographic imaging |
US7106367B2 (en) | 2002-05-13 | 2006-09-12 | Micron Technology, Inc. | Integrated CMOS imager and microcontroller |
US7202899B2 (en) | 2002-05-21 | 2007-04-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method to prevent white pixels in a CMOS image sensor |
US7794394B2 (en) | 2002-05-22 | 2010-09-14 | Beth Israel Deaconess Medical Center | Device for wavelength-selective imaging |
US7283566B2 (en) | 2002-06-14 | 2007-10-16 | Silicon Image, Inc. | Method and circuit for generating time stamp data from an embedded-clock audio data stream and a video clock |
US6720810B1 (en) | 2002-06-14 | 2004-04-13 | Xilinx, Inc. | Dual-edge-correcting clock synchronization circuit |
US7248281B2 (en) | 2002-07-16 | 2007-07-24 | Fujinon Corporation | Electronic endoscope apparatus which superimposes signals on power supply |
TW567716B (en) | 2002-07-30 | 2003-12-21 | Powerchip Semiconductor Corp | CMOS light sensor and operation method thereof |
US7525168B2 (en) | 2002-08-27 | 2009-04-28 | E-Phocus, Inc. | CMOS sensor with electrodes across photodetectors at approximately equal potential |
KR100508086B1 (ko) | 2002-09-11 | 2005-08-17 | 삼성전자주식회사 | 씨모스 이미지 센서 및 그 제조방법 |
US20040078494A1 (en) | 2002-09-25 | 2004-04-22 | Lennox Edward Alex | System and apparatus for implementing devices interfacing higher speed networks using lower speed network components |
AU2003275336A1 (en) | 2002-09-30 | 2004-04-23 | Power Medical Interventions, Inc. | Self-contained sterilizable surgical system |
CN1234234C (zh) | 2002-09-30 | 2005-12-28 | 松下电器产业株式会社 | 固体摄像器件及使用该固体摄像器件的设备 |
JP2004134974A (ja) | 2002-10-09 | 2004-04-30 | Amtran Technology Co Ltd | 表示器の水平同期信号と垂直同期信号との調整方法及びその調整装置 |
US7386084B2 (en) | 2002-11-06 | 2008-06-10 | Broadcom Corporation | Method and system for pattern-independent phase adjustment in a clock and data recovery (CDR) circuit |
US6974715B2 (en) | 2002-12-27 | 2005-12-13 | Hynix Semiconductor Inc. | Method for manufacturing CMOS image sensor using spacer etching barrier film |
US20040169771A1 (en) | 2003-01-02 | 2004-09-02 | Washington Richard G | Thermally cooled imaging apparatus |
WO2004068218A2 (en) | 2003-01-24 | 2004-08-12 | University Of Washington | Optical beam scanning system for compact image display or image acquisition |
JP2004241490A (ja) | 2003-02-04 | 2004-08-26 | Seiko Epson Corp | センサチップ及び画像処理装置 |
US7744528B2 (en) | 2003-02-26 | 2010-06-29 | Infinite Biomedical Technologies, Llc | Methods and devices for endoscopic imaging |
JP4483344B2 (ja) | 2003-03-13 | 2010-06-16 | チッソ株式会社 | シルセスキオキサン骨格を有する化合物およびその重合体 |
US7229201B2 (en) | 2003-03-26 | 2007-06-12 | Optim Inc. | Compact, high-efficiency, high-power solid state light source using a single solid state light-emitting device |
US8118732B2 (en) | 2003-04-01 | 2012-02-21 | Boston Scientific Scimed, Inc. | Force feedback control system for video endoscope |
US7591783B2 (en) | 2003-04-01 | 2009-09-22 | Boston Scientific Scimed, Inc. | Articulation joint for video endoscope |
US7578786B2 (en) | 2003-04-01 | 2009-08-25 | Boston Scientific Scimed, Inc. | Video endoscope |
US20050222499A1 (en) | 2003-04-01 | 2005-10-06 | Banik Michael S | Interface for video endoscope system |
US20040199052A1 (en) | 2003-04-01 | 2004-10-07 | Scimed Life Systems, Inc. | Endoscopic imaging system |
US7166871B2 (en) | 2003-04-15 | 2007-01-23 | Luminus Devices, Inc. | Light emitting systems |
JP2006514501A (ja) | 2003-04-17 | 2006-04-27 | ノキア コーポレイション | 改善されたカメラ付き移動電話機 |
KR100523671B1 (ko) | 2003-04-30 | 2005-10-24 | 매그나칩 반도체 유한회사 | 이중 게이트절연막을 구비하는 씨모스 이미지 센서 및그의 제조 방법 |
ATE553690T1 (de) | 2003-05-01 | 2012-05-15 | Given Imaging Ltd | Panorama-gesichtsfeld-darstellungsvorrichtung |
US7339982B2 (en) | 2003-05-13 | 2008-03-04 | Agilent Technologies, Inc. | Modular, jitter-tolerant data acquisition and processing systems |
JP4541299B2 (ja) * | 2003-05-23 | 2010-09-08 | 浜松ホトニクス株式会社 | 光検出装置 |
JP4233386B2 (ja) | 2003-05-26 | 2009-03-04 | シャープ株式会社 | 情報リソースサーバ、および情報リソース提供方法 |
US7369167B2 (en) * | 2003-06-02 | 2008-05-06 | Micron Technology, Inc. | Photo diode ID for CMOS imagers |
KR100539234B1 (ko) | 2003-06-11 | 2005-12-27 | 삼성전자주식회사 | 투명 고분자 소재를 적용한 씨모스형 이미지 센서 모듈 및그 제조방법 |
US6897082B2 (en) | 2003-06-16 | 2005-05-24 | Micron Technology, Inc. | Method of forming well for CMOS imager |
IL156715A0 (en) | 2003-06-30 | 2004-01-04 | Medigus Ltd | Autoclavable imager assembly |
ES2436199T3 (es) | 2003-07-28 | 2013-12-27 | Synergetics, Inc. | Fuente de iluminación y de láser y método de transmisión de la luz de iluminación y de la luz de tratamiento con láser |
US20050027164A1 (en) | 2003-07-29 | 2005-02-03 | Scimed Life Systems, Inc. | Vision catheter |
US20050038322A1 (en) | 2003-08-11 | 2005-02-17 | Scimed Life Systems | Imaging endoscope |
US6812949B1 (en) | 2003-08-14 | 2004-11-02 | Eastman Kodak Company | Imaging apparatus and method for exposing a photosensitive material |
KR100535926B1 (ko) | 2003-09-22 | 2005-12-09 | 동부아남반도체 주식회사 | 씨모스 이미지 센서 제조 방법 |
US20050234302A1 (en) | 2003-09-26 | 2005-10-20 | Mackinnon Nicholas B | Apparatus and methods relating to color imaging endoscope systems |
WO2005031436A1 (en) | 2003-09-26 | 2005-04-07 | Tidal Photonics, Inc. | Apparatus and methods relating to expanded dynamic range imaging endoscope systems |
KR100562293B1 (ko) | 2003-10-01 | 2006-03-22 | 동부아남반도체 주식회사 | 씨모스 이미지 센서 및 이의 제조 방법 |
KR20050032438A (ko) | 2003-10-01 | 2005-04-07 | 동부아남반도체 주식회사 | Cmos 이미지 센서 및 그 제조 방법 |
JP4144578B2 (ja) | 2003-10-15 | 2008-09-03 | ソニー株式会社 | 固体撮像装置、画素信号処理方法 |
JP4635191B2 (ja) | 2003-10-21 | 2011-02-16 | 国立大学法人静岡大学 | 超解像画素電極の配置構造及び信号処理方法 |
US20050168941A1 (en) | 2003-10-22 | 2005-08-04 | Sokol John L. | System and apparatus for heat removal |
KR100508864B1 (ko) | 2003-10-23 | 2005-08-17 | 동부아남반도체 주식회사 | 씨모스 이미지 센서 및 이의 제조 방법 |
US7232712B2 (en) | 2003-10-28 | 2007-06-19 | Dongbu Electronics Co., Ltd. | CMOS image sensor and method for fabricating the same |
US20070094303A1 (en) | 2003-11-05 | 2007-04-26 | Arthur Zwingenberger | System for management of processed instruments |
US7443437B2 (en) | 2003-11-26 | 2008-10-28 | Micron Technology, Inc. | Image sensor with a gated storage node linked to transfer gate |
US7317955B2 (en) | 2003-12-12 | 2008-01-08 | Conmed Corporation | Virtual operating room integration |
US7901348B2 (en) | 2003-12-12 | 2011-03-08 | University Of Washington | Catheterscope 3D guidance and interface system |
EP1705903A1 (en) | 2004-01-13 | 2006-09-27 | Matsushita Electric Industrial Co., Ltd. | Solid state image pickup device and camera using the same |
US7446812B2 (en) | 2004-01-13 | 2008-11-04 | Micron Technology, Inc. | Wide dynamic range operations for imaging |
JP2005211159A (ja) | 2004-01-27 | 2005-08-11 | Fujinon Corp | 電子内視鏡装置 |
JP4426854B2 (ja) | 2004-01-27 | 2010-03-03 | 富士フイルム株式会社 | 電子内視鏡装置 |
US7002231B2 (en) | 2004-02-02 | 2006-02-21 | Micron Technology, Inc. | Barrier regions for image sensors |
JP3813961B2 (ja) | 2004-02-04 | 2006-08-23 | オリンパス株式会社 | 内視鏡用信号処理装置 |
WO2005082226A1 (ja) | 2004-02-27 | 2005-09-09 | Olympus Corporation | 内視鏡 |
US7273452B2 (en) | 2004-03-04 | 2007-09-25 | Scimed Life Systems, Inc. | Vision catheter system including movable scanning plate |
US7522208B2 (en) | 2004-03-10 | 2009-04-21 | Seiko Epson Corporation | Electronic equipment and digital camera |
US20050206755A1 (en) | 2004-03-17 | 2005-09-22 | Fuji Photo Film Co., Ltd. | Solid-state imaging device |
ATE556644T1 (de) | 2004-03-23 | 2012-05-15 | California Inst Of Techn | Vorwärts abtastende abbildungs-lichtfasersonde |
US7405763B2 (en) | 2004-03-24 | 2008-07-29 | Omnivision Technologies, Inc. | Mobile devices having an image sensor for charging a battery |
US7976462B2 (en) | 2004-04-06 | 2011-07-12 | Integrated Endoscopy, Inc. | Endoscope designs and methods of manufacture |
EP1742486A4 (en) | 2004-04-16 | 2009-11-11 | Iwane Lab Ltd | SUPPRESSED SURPLUS IMAGE DETECTION APPARATUS |
US7773110B2 (en) | 2004-04-16 | 2010-08-10 | Fujinon Corporation | Electronic endoscope apparatus |
JP4370199B2 (ja) | 2004-05-13 | 2009-11-25 | オリンパス株式会社 | 内視鏡装置及び内視鏡用アダプタ |
WO2005112735A2 (en) | 2004-05-14 | 2005-12-01 | Ethicon Endo-Surgery, Inc. | Device employing camera connector |
US7303528B2 (en) | 2004-05-18 | 2007-12-04 | Scimed Life Systems, Inc. | Serialization of single use endoscopes |
IL162251A0 (en) | 2004-05-31 | 2005-11-20 | Medigus Ltd | A reusable laparoscopic or endoscopic camera head |
JP4379230B2 (ja) | 2004-07-07 | 2009-12-09 | ソニー株式会社 | 固体撮像素子装置及び信号処理方法 |
KR100606954B1 (ko) | 2004-07-08 | 2006-08-01 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서의 포토다이오드 제조방법 |
JP2006026234A (ja) | 2004-07-20 | 2006-02-02 | Olympus Corp | 生体内撮像装置および生体内撮像システム |
JP4349232B2 (ja) * | 2004-07-30 | 2009-10-21 | ソニー株式会社 | 半導体モジュール及びmos型固体撮像装置 |
US7645635B2 (en) | 2004-08-16 | 2010-01-12 | Micron Technology, Inc. | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages |
IL170404A (en) | 2004-08-26 | 2012-03-29 | C2Cure Inc | Wireless determination of endoscope orientation |
WO2006029090A2 (en) | 2004-09-02 | 2006-03-16 | Proteus Biomedical, Inc. | Methods and apparatus for tissue activation and monitoring |
WO2006137867A1 (en) | 2004-09-17 | 2006-12-28 | California Institute Of Technology | Fabrication method for back-illuminated cmos or ccd imagers made from soi wafer |
JP4649155B2 (ja) | 2004-09-22 | 2011-03-09 | キヤノン株式会社 | 撮像装置及び撮像方法 |
US8480566B2 (en) | 2004-09-24 | 2013-07-09 | Vivid Medical, Inc. | Solid state illumination for endoscopy |
US8556806B2 (en) | 2004-09-24 | 2013-10-15 | Vivid Medical, Inc. | Wavelength multiplexing endoscope |
US8858425B2 (en) | 2004-09-24 | 2014-10-14 | Vivid Medical, Inc. | Disposable endoscope and portable display |
US8827899B2 (en) | 2004-09-24 | 2014-09-09 | Vivid Medical, Inc. | Disposable endoscopic access device and portable display |
US8602971B2 (en) | 2004-09-24 | 2013-12-10 | Vivid Medical. Inc. | Opto-Electronic illumination and vision module for endoscopy |
KR100630704B1 (ko) | 2004-10-20 | 2006-10-02 | 삼성전자주식회사 | 비평면 구조의 트랜지스터를 구비한 cmos 이미지 센서및 그 제조 방법 |
US7227469B2 (en) | 2004-11-22 | 2007-06-05 | Sdgi Holdings, Inc. | Surgical instrument tray shipping tote identification system and methods of using same |
US8615038B2 (en) | 2004-12-06 | 2013-12-24 | Nokia Corporation | Video coding, decoding and hypothetical reference decoder |
KR100684870B1 (ko) | 2004-12-07 | 2007-02-20 | 삼성전자주식회사 | 씨모스 이미지 센서 및 그 형성 방법 |
US7568619B2 (en) | 2004-12-15 | 2009-08-04 | Alcon, Inc. | System and method for identifying and controlling ophthalmic surgical devices and components |
KR101199100B1 (ko) | 2004-12-30 | 2012-11-08 | 인텔렉츄얼 벤처스 투 엘엘씨 | 소스 팔로워에서 비대칭적인 웰의 배치를 갖는 씨모스이미지센서 |
US7551059B2 (en) * | 2005-01-06 | 2009-06-23 | Goodrich Corporation | Hybrid infrared detector array and CMOS readout integrated circuit with improved dynamic range |
EP1845835B1 (en) | 2005-01-27 | 2014-11-19 | Covidien LP | Endoscope with miniature imaging arrangement |
WO2006084279A2 (en) | 2005-02-04 | 2006-08-10 | University Of Florida Research Foundation, Inc. | Single fiber endoscopic full-field optical coherence tomography (oct) imaging probe |
KR100598015B1 (ko) | 2005-02-07 | 2006-07-06 | 삼성전자주식회사 | 공유 구조 상보성 금속 산화막 반도체 액티브 픽셀 센서어레이의 레이 아웃 |
JP2006218129A (ja) | 2005-02-10 | 2006-08-24 | Olympus Corp | 手術支援システム |
US7189961B2 (en) | 2005-02-23 | 2007-03-13 | University Of Washington | Scanning beam device with detector assembly |
US7568628B2 (en) | 2005-03-11 | 2009-08-04 | Hand Held Products, Inc. | Bar code reading device with global electronic shutter control |
EP1860869B1 (en) | 2005-03-18 | 2013-05-08 | Nikon Corporation | Digital camera |
WO2006101378A1 (en) | 2005-03-25 | 2006-09-28 | Lg Electronics Inc. | Light emitting device |
KR100723485B1 (ko) | 2005-04-11 | 2007-05-31 | 삼성전자주식회사 | 씨모스 이미지센서 및 그 제조 방법 |
US9204830B2 (en) | 2005-04-15 | 2015-12-08 | Surgisense Corporation | Surgical instruments with sensors for detecting tissue properties, and system using such instruments |
GB2425424B (en) | 2005-04-22 | 2010-09-29 | Single Use Surgical Ltd | Disposable flexible endoscope |
US8675125B2 (en) | 2005-04-27 | 2014-03-18 | Parellel Consulting Limited Liability Company | Minimized-thickness angular scanner of electromagnetic radiation |
US8648287B1 (en) | 2005-05-27 | 2014-02-11 | Rambus Inc. | Image sensor using single photon jots and processor to create pixels |
TWI429066B (zh) * | 2005-06-02 | 2014-03-01 | Sony Corp | Semiconductor image sensor module and manufacturing method thereof |
US7770799B2 (en) | 2005-06-03 | 2010-08-10 | Hand Held Products, Inc. | Optical reader having reduced specular reflection read failures |
JP4501790B2 (ja) | 2005-06-15 | 2010-07-14 | トヨタ自動車株式会社 | 車両の減速度制御装置 |
US7599439B2 (en) | 2005-06-24 | 2009-10-06 | Silicon Image, Inc. | Method and system for transmitting N-bit video data over a serial link |
US7798959B2 (en) | 2005-07-05 | 2010-09-21 | Hoya Corporation | Endoscope light source unit with light quantity control |
US7522341B2 (en) | 2005-07-12 | 2009-04-21 | Micron Technology, Inc. | Sharing of microlenses among pixels in image sensors |
JP4410168B2 (ja) | 2005-07-15 | 2010-02-03 | 三菱電機株式会社 | 画像処理装置 |
JP2007043433A (ja) | 2005-08-03 | 2007-02-15 | Renesas Technology Corp | 半導体集積回路装置 |
JPWO2007018098A1 (ja) | 2005-08-05 | 2009-02-19 | オリンパスメディカルシステムズ株式会社 | 発光ユニット |
JP4761882B2 (ja) | 2005-08-10 | 2011-08-31 | オプティスキャン ピーティーワイ リミテッド | 走査型共焦点内視鏡システムおよび該システムの画像表示範囲調整方法 |
US7511257B2 (en) | 2005-08-24 | 2009-03-31 | Aptina Imaging Corporation | Method and apparatus providing and optical guide in image sensor devices |
JP2007067666A (ja) | 2005-08-30 | 2007-03-15 | Alps Electric Co Ltd | Agc回路 |
KR100734272B1 (ko) | 2005-08-30 | 2007-07-02 | 삼성전자주식회사 | 옵티컬 블랙 영역의 크기를 줄인 cmos 이미지 센서 |
KR100752185B1 (ko) | 2005-10-13 | 2007-08-24 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그 제조방법 |
JP4752447B2 (ja) | 2005-10-21 | 2011-08-17 | ソニー株式会社 | 固体撮像装置およびカメラ |
US7749799B2 (en) | 2005-11-15 | 2010-07-06 | California Institute Of Technology | Back-illuminated imager and method for making electrical and optical connections to same |
WO2007067163A1 (en) | 2005-11-23 | 2007-06-14 | University Of Washington | Scanning beam with variable sequential framing using interrupted scanning resonance |
KR100737916B1 (ko) | 2005-12-19 | 2007-07-10 | 삼성전자주식회사 | 이미지 센서 그리고 그것을 위한 테스트 시스템 및 테스트방법 |
KR100720472B1 (ko) | 2005-12-29 | 2007-05-22 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그 제조방법 |
KR100760913B1 (ko) | 2005-12-29 | 2007-09-21 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 이의 제조 방법 |
US7821553B2 (en) * | 2005-12-30 | 2010-10-26 | International Business Machines Corporation | Pixel array, imaging sensor including the pixel array and digital camera including the imaging sensor |
KR100755666B1 (ko) | 2006-01-03 | 2007-09-05 | 삼성전자주식회사 | 이미지 센서 및 이미지 센서의 제조 방법 |
JP4768448B2 (ja) | 2006-01-13 | 2011-09-07 | 富士フイルム株式会社 | 撮像装置 |
EP1809025A3 (en) | 2006-01-17 | 2007-08-15 | STMicroelectronics (Research & Development) Limited | Memory enhanced image sensor |
JP4834412B2 (ja) | 2006-02-03 | 2011-12-14 | 富士フイルム株式会社 | 固体撮像装置およびこれを用いた電子内視鏡 |
US8152718B2 (en) | 2006-02-07 | 2012-04-10 | Boston Scientific Scimed, Inc. | Medical device light source |
JP2007214191A (ja) * | 2006-02-07 | 2007-08-23 | Sumitomo Heavy Ind Ltd | 放射線検出器および放射線検査装置 |
JP2007214772A (ja) | 2006-02-08 | 2007-08-23 | Canon Inc | 画像信号処理装置 |
US20070197873A1 (en) | 2006-02-21 | 2007-08-23 | Karl Storz Gmbh & Co. Kg | Wireless optical endoscopic device |
US20070276187A1 (en) | 2006-02-27 | 2007-11-29 | Wiklof Christopher A | Scanned beam imager and endoscope configured for scanning beams of selected beam shapes and/or providing multiple fields-of-view |
US7935050B2 (en) | 2006-02-27 | 2011-05-03 | Microvision, Inc. | Endoscope tips, scanned beam endoscopes using same, and methods of use |
JP2007228460A (ja) | 2006-02-27 | 2007-09-06 | Mitsumasa Koyanagi | 集積センサを搭載した積層型半導体装置 |
JP2007241772A (ja) | 2006-03-09 | 2007-09-20 | Seiko Epson Corp | 画像出力装置、画像出力方法、および、プログラム |
US7608874B2 (en) | 2006-03-17 | 2009-10-27 | Sharp Laboratories Of America, Inc. | Fully isolated photodiode stack |
US20070225556A1 (en) | 2006-03-23 | 2007-09-27 | Ethicon Endo-Surgery, Inc. | Disposable endoscope devices |
US8519566B2 (en) | 2006-03-28 | 2013-08-27 | Wireless Environment, Llc | Remote switch sensing in lighting devices |
US8649848B2 (en) | 2006-03-28 | 2014-02-11 | The United States Of America, As Represented By The Secretary Of The Air Force | Synchronization of illumination source and sensor for improved visualization of subcutaneous structures |
US20120035434A1 (en) | 2006-04-12 | 2012-02-09 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Control of a lumen traveling device in a body tube tree |
US7435217B2 (en) | 2006-04-17 | 2008-10-14 | Microvision, Inc. | Scanned beam imagers and endoscopes with positionable light collector |
ATE415852T1 (de) | 2006-04-21 | 2008-12-15 | Fondazione Torino Wireless | Endoskop mit einem digitalen betrachtungssystem |
US7796174B1 (en) * | 2006-04-25 | 2010-09-14 | Ball Aerospace & Technologies Corp. | Hybrid imager |
WO2007136859A2 (en) | 2006-05-19 | 2007-11-29 | Avantis Medical Systems, Inc. | Device and method for reducing effects of video artifacts |
KR100757654B1 (ko) | 2006-05-26 | 2007-09-10 | 매그나칩 반도체 유한회사 | 시모스 이미지 센서 및 그 제조 방법 |
US7618176B2 (en) | 2006-06-22 | 2009-11-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Solid state light source adapted for remote illumination |
US7989915B2 (en) | 2006-07-11 | 2011-08-02 | Teledyne Licensing, Llc | Vertical electrical device |
US7443296B2 (en) | 2006-07-21 | 2008-10-28 | Alcon, Inc. | Smart connector system for surgical machine |
US7830434B2 (en) | 2006-08-16 | 2010-11-09 | Intematix Corporation | Semiconductor color image sensor responsive at shorter wavelengths |
JP4289377B2 (ja) * | 2006-08-21 | 2009-07-01 | ソニー株式会社 | 物理量検出装置及び撮像装置 |
WO2008031089A2 (en) | 2006-09-08 | 2008-03-13 | Sarnoff Corporation | System and method for high performance image processing |
US8049256B2 (en) * | 2006-10-05 | 2011-11-01 | Omnivision Technologies, Inc. | Active pixel sensor having a sensor wafer connected to a support circuit wafer |
US7768562B2 (en) | 2006-10-10 | 2010-08-03 | Micron Technology, Inc. | Method, apparatus and system providing imager vertical binning and scaling using column parallel sigma-delta digital conversion |
KR100780545B1 (ko) | 2006-10-17 | 2007-11-30 | 동부일렉트로닉스 주식회사 | 씨모스 이미지센서 및 그 제조방법 |
KR100830582B1 (ko) | 2006-11-13 | 2008-05-22 | 삼성전자주식회사 | 디지털 더블 샘플링 방법 및 그것을 수행하는 씨모스이미지 센서 그리고 그것을 포함하는 디지털 카메라 |
US8184190B2 (en) | 2006-11-28 | 2012-05-22 | Youliza, Gehts B.V. Limited Liability Company | Simultaneous global shutter and correlated double sampling read out in multiple photosensor pixels |
US7675097B2 (en) * | 2006-12-01 | 2010-03-09 | International Business Machines Corporation | Silicide strapping in imager transfer gate device |
US20080136945A1 (en) | 2006-12-06 | 2008-06-12 | Altasens, Inc. | Apparatus and method for reducing dark current |
US8498695B2 (en) | 2006-12-22 | 2013-07-30 | Novadaq Technologies Inc. | Imaging system with a single color image sensor for simultaneous fluorescence and color video endoscopy |
US8514278B2 (en) | 2006-12-29 | 2013-08-20 | Ge Inspection Technologies Lp | Inspection apparatus having illumination assembly |
US7606346B2 (en) | 2007-01-04 | 2009-10-20 | General Electric Company | CT detector module construction |
US8305432B2 (en) | 2007-01-10 | 2012-11-06 | University Of Washington | Scanning beam device calibration |
US8101903B2 (en) | 2007-01-23 | 2012-01-24 | Micron Technology, Inc. | Method, apparatus and system providing holographic layer as micro-lens and color filter array in an imager |
JP4871153B2 (ja) | 2007-01-29 | 2012-02-08 | パナソニック株式会社 | ヘッド分離型カメラおよびカメラヘッド |
WO2008097902A2 (en) | 2007-02-05 | 2008-08-14 | Novian Health, Inc. | Interstitial laser therapy kits and interstitial laser therapy control system |
US20080200758A1 (en) | 2007-02-09 | 2008-08-21 | Skeletal Dynamics, Inc. | Endo-surgical Device and Method |
US20080218609A1 (en) | 2007-03-07 | 2008-09-11 | Altasens, Inc. | Cross-coupled differential Dac-based black clamp circuit |
US7760258B2 (en) | 2007-03-07 | 2010-07-20 | Altasens, Inc. | Apparatus and method for stabilizing image sensor black level |
US7923763B2 (en) | 2007-03-08 | 2011-04-12 | Teledyne Licensing, Llc | Two-dimensional time delay integration visible CMOS image sensor |
WO2008111395A1 (ja) | 2007-03-09 | 2008-09-18 | Nec Corporation | クロックレス伝送システムおよびクロックレス伝送方法 |
JP2008235478A (ja) | 2007-03-19 | 2008-10-02 | Nikon Corp | 撮像素子 |
JP5034610B2 (ja) | 2007-03-30 | 2012-09-26 | ソニー株式会社 | 固体撮像装置、固体撮像装置の信号処理方法および撮像装置 |
US7583872B2 (en) | 2007-04-05 | 2009-09-01 | University Of Washington | Compact scanning fiber device |
US7923801B2 (en) | 2007-04-18 | 2011-04-12 | Invisage Technologies, Inc. | Materials, systems and methods for optoelectronic devices |
US7488928B2 (en) * | 2007-04-20 | 2009-02-10 | Alexander Krymski | Image sensor circuits and methods with multiple readout lines per column of pixel circuits |
US8398540B2 (en) | 2007-05-10 | 2013-03-19 | Technion Research & Development Foundation Ltd. | Semi disposable endoscope |
GB0709026D0 (en) | 2007-05-10 | 2007-06-20 | Isis Innovation | High speed imaging with slow scan cameras using pixel level dynami shuttering |
US9629607B2 (en) | 2007-05-15 | 2017-04-25 | General Electric Company | Packaging and fluid filling of ultrasound imaging catheters |
JP4385060B2 (ja) | 2007-05-16 | 2009-12-16 | シャープ株式会社 | 固体撮像装置および電子情報機器 |
JP5142703B2 (ja) | 2007-05-21 | 2013-02-13 | キヤノン株式会社 | 撮像装置及びその処理方法 |
US7999866B2 (en) | 2007-05-21 | 2011-08-16 | Canon Kabushiki Kaisha | Imaging apparatus and processing method thereof |
US8212884B2 (en) | 2007-05-22 | 2012-07-03 | University Of Washington | Scanning beam device having different image acquisition modes |
JP4353275B2 (ja) | 2007-05-22 | 2009-10-28 | セイコーエプソン株式会社 | アナログフロントエンド回路及び電子機器 |
JP5094207B2 (ja) | 2007-05-23 | 2012-12-12 | 株式会社日立産機システム | 複数台で運転をする電気ホイスト |
US7884871B2 (en) | 2007-06-15 | 2011-02-08 | Aptina Imaging Corporation | Images with high speed digital frame transfer and frame processing |
JP2009017459A (ja) | 2007-07-09 | 2009-01-22 | Fujifilm Corp | Ccd型固体撮像素子及びその駆動方法並びに撮像装置 |
US7930580B2 (en) | 2007-07-11 | 2011-04-19 | Altasens, Inc. | Controlling timing dependencies in a mixed signal system-on-a-chip (SOC) |
US8896712B2 (en) | 2007-07-20 | 2014-11-25 | Omnivision Technologies, Inc. | Determining and correcting for imaging device motion during an exposure |
US8098375B2 (en) | 2007-08-06 | 2012-01-17 | Lumencor, Inc. | Light emitting diode illumination system |
SG150395A1 (en) * | 2007-08-16 | 2009-03-30 | Micron Technology Inc | Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices |
JP2009060501A (ja) | 2007-09-03 | 2009-03-19 | Fujifilm Corp | バッキング材、超音波探触子、超音波内視鏡、超音波診断装置、及び、超音波内視鏡装置 |
US20090074265A1 (en) | 2007-09-17 | 2009-03-19 | Capsovision Inc. | Imaging review and navigation workstation system |
US20090076329A1 (en) | 2007-09-17 | 2009-03-19 | Wei Su | Disposable Stereoscopic Endoscope System |
WO2009049324A1 (en) | 2007-10-11 | 2009-04-16 | Avantis Medical Systems, Inc. | Method and device for reducing the fixed pattern noise of a digital image |
JP2009100380A (ja) | 2007-10-18 | 2009-05-07 | Hitachi Kokusai Electric Inc | 撮像装置 |
EP2207595A4 (en) | 2007-10-19 | 2012-10-24 | Lockheed Corp | SYSTEM AND METHOD FOR THE TREATMENT OF ANIMAL TISSUE USING LASER LIGHT |
US20090108176A1 (en) | 2007-10-24 | 2009-04-30 | Altasens, Inc. | Global shutter pixel circuit with transistor sharing for CMOS image sensors |
JP4618291B2 (ja) | 2007-11-30 | 2011-01-26 | ソニー株式会社 | 送信装置、受信装置および受信装置における操作情報送信方法 |
US7855748B2 (en) | 2007-12-03 | 2010-12-21 | Altasens, Inc. | Reference voltage generation in imaging sensors |
US20090154886A1 (en) | 2007-12-13 | 2009-06-18 | Microvision, Inc. | Multi-zone scanned-beam imager |
EP2072003B1 (en) | 2007-12-17 | 2016-08-10 | Olympus Corporation | Image display apparatus and image display system |
US7924330B2 (en) | 2007-12-20 | 2011-04-12 | Aptina Imaging Corporation | Methods and apparatuses for double sided dark reference pixel row-wise dark level non-uniformity compensation in image signals |
TW200930066A (en) | 2007-12-21 | 2009-07-01 | Altek Corp | Digital photogrphic camera with brightness compensation and compensation method thereof |
US8144226B2 (en) | 2008-01-04 | 2012-03-27 | AltaSens, Inc | Two-by-two pixel structure in an imaging system-on-chip |
US7960768B2 (en) | 2008-01-17 | 2011-06-14 | Aptina Imaging Corporation | 3D backside illuminated image sensor with multiplexed pixel structure |
KR101435522B1 (ko) | 2008-01-23 | 2014-09-02 | 삼성전자 주식회사 | 바이오 칩 |
US20090192390A1 (en) | 2008-01-24 | 2009-07-30 | Lifeguard Surgical Systems | Common bile duct surgical imaging system |
US7800192B2 (en) * | 2008-02-08 | 2010-09-21 | Omnivision Technologies, Inc. | Backside illuminated image sensor having deep light reflective trenches |
US8101978B2 (en) * | 2008-02-08 | 2012-01-24 | Omnivision Technologies, Inc. | Circuit and photo sensor overlap for backside illumination image sensor |
US7901974B2 (en) | 2008-02-08 | 2011-03-08 | Omnivision Technologies, Inc. | Masked laser anneal during fabrication of backside illuminated image sensors |
JP5117878B2 (ja) | 2008-02-13 | 2013-01-16 | 富士フイルム株式会社 | 内視鏡光源装置 |
US20090208143A1 (en) | 2008-02-19 | 2009-08-20 | University Of Washington | Efficient automated urothelial imaging using an endoscope with tip bending |
US20090212397A1 (en) | 2008-02-22 | 2009-08-27 | Mark Ewing Tuttle | Ultrathin integrated circuit and method of manufacturing an ultrathin integrated circuit |
JP2009195602A (ja) | 2008-02-25 | 2009-09-03 | Fujinon Corp | 電子通信システム及び内視鏡システム |
JP5614791B2 (ja) | 2008-02-28 | 2014-10-29 | 日本電気株式会社 | 伝送方法、伝送回路及び伝送システム |
JP2009212423A (ja) | 2008-03-06 | 2009-09-17 | Seiko Epson Corp | 光源装置及び画像表示装置並びに光量補正方法 |
JP2009207806A (ja) | 2008-03-06 | 2009-09-17 | Fujinon Corp | 内視鏡の光源装置 |
US20090227847A1 (en) | 2008-03-07 | 2009-09-10 | John Tepper | Tunable Light Controller |
US7781716B2 (en) * | 2008-03-17 | 2010-08-24 | Eastman Kodak Company | Stacked image sensor with shared diffusion regions in respective dropped pixel positions of a pixel array |
US7656230B2 (en) | 2008-03-21 | 2010-02-02 | Qualcomm, Incorporated | Quadrature output low noise transconductance amplifier having differential input |
US7834306B2 (en) | 2008-03-24 | 2010-11-16 | Altasens, Inc. | Dark current and lag reduction |
WO2009120228A1 (en) | 2008-03-24 | 2009-10-01 | General Electric Company | Image processing systems and methods for surgical applications |
US20090265490A1 (en) | 2008-04-04 | 2009-10-22 | Tarun Setya | High-Speed Video Serializer and Deserializer |
GB0806427D0 (en) | 2008-04-09 | 2008-05-14 | Cmosis Nv | Parallel analog-to-digital conversion in pixel arrays |
JP5424570B2 (ja) | 2008-04-10 | 2014-02-26 | Hoya株式会社 | 電子内視鏡用プロセッサ、ビデオスコープ及び電子内視鏡装置 |
TWI373107B (en) | 2008-04-24 | 2012-09-21 | Hannstar Display Corp | Chip having a driving integrated circuit and liquid crystal display having the same |
AU2009243918A1 (en) | 2008-05-07 | 2009-11-12 | Signostics Limited | Docking system for medical diagnostic scanning using a handheld device |
US20090278963A1 (en) | 2008-05-08 | 2009-11-12 | Altasens, Inc. | Apparatus and method for column fixed pattern noise (FPN) correction |
US7663115B2 (en) | 2008-05-16 | 2010-02-16 | Dalsa Corporation | Semiconductor device with a CMOS image sensor, apparatus comprising such a semiconductor device and method of manufacturing such a device |
US8757812B2 (en) | 2008-05-19 | 2014-06-24 | University of Washington UW TechTransfer—Invention Licensing | Scanning laser projection display devices and methods for projecting one or more images onto a surface with a light-scanning optical fiber |
ATE506000T1 (de) | 2008-06-04 | 2011-05-15 | Fujifilm Corp | Beleuchtungsvorrichtung zur verwendung in endoskopen |
US9531156B2 (en) | 2008-06-18 | 2016-12-27 | Versatile Power, Inc. | Endoscopic light source |
JP2010010478A (ja) | 2008-06-27 | 2010-01-14 | Fujifilm Corp | 光電変換装置、光電変換装置の製造方法及び撮像装置 |
US8164657B2 (en) | 2008-06-27 | 2012-04-24 | AltaSens, Inc | Pixel or column fixed pattern noise mitigation using partial or full frame correction with uniform frame rates |
US8068152B2 (en) | 2008-06-27 | 2011-11-29 | Altasens, Inc. | Pixel or column fixed pattern noise mitigation using partial or full frame correction |
CN101314154A (zh) | 2008-07-01 | 2008-12-03 | 攀钢集团研究院有限公司 | 一种清除雾化器堵塞物的方法 |
US20100026824A1 (en) | 2008-07-29 | 2010-02-04 | Shenlin Chen | Image sensor with reduced red light crosstalk |
KR20100012677A (ko) * | 2008-07-29 | 2010-02-08 | 주식회사 동부하이텍 | 이미지 센서 및 이의 제조 방법 |
US8211732B2 (en) | 2008-09-11 | 2012-07-03 | Omnivision Technologies, Inc. | Image sensor with raised photosensitive elements |
GB2463866A (en) * | 2008-09-24 | 2010-03-31 | Wai Hung Chan | High-speed CMOS image sensors |
US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
US9271331B2 (en) | 2008-11-05 | 2016-02-23 | Telefonaktiebolaget L M Ericsson (Publ) | Conditional execution of commands |
US20100121142A1 (en) | 2008-11-12 | 2010-05-13 | Ouyang Xiaolong | Minimally Invasive Imaging Device |
US8179984B2 (en) | 2008-11-12 | 2012-05-15 | Mediatek Inc. | Multifunctional transmitters |
WO2010059197A2 (en) | 2008-11-18 | 2010-05-27 | Stryker Corporation | Endoscopic led light source having a feedback control system |
WO2010065344A1 (en) | 2008-11-25 | 2010-06-10 | Refocus Imaging, Inc. | System of and method for video refocusing |
GB0821873D0 (en) | 2008-12-01 | 2009-01-07 | Univ St Andrews | Apparatus and method for obtaining an image of a fluorescent pattern under ambient light |
US20100137684A1 (en) | 2008-12-03 | 2010-06-03 | Hoya Corporation | Endoscope system with scanning function |
US7952096B2 (en) | 2008-12-08 | 2011-05-31 | Omnivision Technologies, Inc. | CMOS image sensor with improved backside surface treatment |
US7795650B2 (en) | 2008-12-09 | 2010-09-14 | Teledyne Scientific & Imaging Llc | Method and apparatus for backside illuminated image sensors using capacitively coupled readout integrated circuits |
US20100157117A1 (en) * | 2008-12-18 | 2010-06-24 | Yu Wang | Vertical stack of image sensors with cutoff color filters |
JP5342869B2 (ja) | 2008-12-22 | 2013-11-13 | Hoya株式会社 | 内視鏡装置、内視鏡照明装置、画像形成装置、内視鏡照明装置の作動方法および画像形成装置の作動方法 |
JP2010142597A (ja) | 2008-12-22 | 2010-07-01 | Hoya Corp | 内視鏡装置 |
US8203581B2 (en) | 2009-01-07 | 2012-06-19 | Janlincia Llc | Method of LED dimming using ambient light feedback |
GB2467118A (en) | 2009-01-19 | 2010-07-28 | Sony Espana Sa | Video conferencing image compensation apparatus to compensate for the effect of illumination by the display of the scene in front of the display |
JP5254830B2 (ja) | 2009-02-03 | 2013-08-07 | キヤノン株式会社 | 撮像装置及びその制御方法及びプログラム |
US7883910B2 (en) | 2009-02-03 | 2011-02-08 | Industrial Technology Research Institute | Light emitting diode structure, LED packaging structure using the same and method of forming the same |
US20100194860A1 (en) * | 2009-02-03 | 2010-08-05 | Bit Cauldron Corporation | Method of stereoscopic 3d image capture using a mobile device, cradle or dongle |
GB0902822D0 (en) | 2009-02-19 | 2009-04-08 | Cmosis Nv | Analog-to-digital conversation in pixel arrays |
JP2010200109A (ja) | 2009-02-26 | 2010-09-09 | Canon Inc | 撮像装置、制御方法、及びプログラム |
KR101094246B1 (ko) | 2009-03-16 | 2011-12-19 | 이재웅 | 넓은 동적범위를 갖는 씨모스 이미지 센서 |
ATE543215T1 (de) * | 2009-03-24 | 2012-02-15 | Sony Corp | Festkörper-abbildungsvorrichtung, ansteuerverfahren für festkörper- abbildungsvorrichtung und elektronische vorrichtung |
JP4941490B2 (ja) * | 2009-03-24 | 2012-05-30 | ソニー株式会社 | 固体撮像装置、及び電子機器 |
JP4900736B2 (ja) | 2009-03-31 | 2012-03-21 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
JP4850924B2 (ja) | 2009-04-16 | 2012-01-11 | シャープ株式会社 | カプセルトナーの製造方法 |
WO2010126790A1 (en) | 2009-04-27 | 2010-11-04 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | A novel multi-point scan architecture |
JP2010266580A (ja) | 2009-05-13 | 2010-11-25 | Hoya Corp | 共焦点光学システム |
JP5511220B2 (ja) * | 2009-05-19 | 2014-06-04 | キヤノン株式会社 | 固体撮像装置 |
US20100305406A1 (en) | 2009-05-26 | 2010-12-02 | Ori Braun | System, device and method for gynecological use |
TW201044226A (en) | 2009-06-10 | 2010-12-16 | Weistech Technology Co Ltd | Integrated wired/wireless virtual unit control apparatus and method |
EP2353491B1 (en) | 2009-06-15 | 2016-03-30 | Olympus Corporation | Subject intra-corporeal introduction device and in-vivo information acquiring system |
JP5447939B2 (ja) | 2009-07-29 | 2014-03-19 | 日立化成株式会社 | 感光性樹脂組成物及び感光性フィルム |
JP5401205B2 (ja) | 2009-08-10 | 2014-01-29 | 富士フイルム株式会社 | 内視鏡装置 |
US8648932B2 (en) | 2009-08-13 | 2014-02-11 | Olive Medical Corporation | System, apparatus and methods for providing a single use imaging device for sterile environments |
US20120120282A1 (en) | 2009-08-14 | 2012-05-17 | Goris Andrew C | Reducing Temporal Aliasing |
JP2011071481A (ja) | 2009-08-28 | 2011-04-07 | Fujifilm Corp | 固体撮像装置,固体撮像装置の製造方法,デジタルスチルカメラ,デジタルビデオカメラ,携帯電話,内視鏡 |
JP5521721B2 (ja) | 2009-08-28 | 2014-06-18 | ソニー株式会社 | 撮像素子およびカメラシステム |
JP5564857B2 (ja) | 2009-08-31 | 2014-08-06 | Jfeスチール株式会社 | 減衰強化型圧延機 |
US8520100B2 (en) | 2009-09-03 | 2013-08-27 | Tower Semiconductor Ltd. | CMOS image sensor pixel without internal sample/hold circuit |
US20120140302A1 (en) | 2009-09-03 | 2012-06-07 | University Of Florida Research Foundation, Incorpo | Mems-based optical image scanning apparatus, methods, and systems |
WO2011033513A1 (en) | 2009-09-16 | 2011-03-24 | Medigus Ltd. | Small diameter video camera heads and visualization probes and medical devices containing them |
WO2011041728A2 (en) | 2009-10-01 | 2011-04-07 | Jacobsen Stephen C | Needle delivered imaging device |
US9168054B2 (en) | 2009-10-09 | 2015-10-27 | Ethicon Endo-Surgery, Inc. | Surgical generator for ultrasonic and electrosurgical devices |
JP5404346B2 (ja) | 2009-11-30 | 2014-01-29 | Hoya株式会社 | 撮像装置、電子スコープ、及び電子内視鏡システム |
US8624999B2 (en) | 2009-12-01 | 2014-01-07 | Ricoh Company, Ltd. | Imaging apparatus |
KR101709941B1 (ko) | 2009-12-02 | 2017-02-27 | 삼성전자주식회사 | 이미지 센서, 이를 포함하는 이미지 처리 장치, 및 이미지 센서 제조 방법 |
WO2011087801A1 (en) | 2009-12-22 | 2011-07-21 | Integrated Endoscopy, Inc. | Endoscope with different color light sources |
US20110181709A1 (en) | 2009-12-22 | 2011-07-28 | Integrated Endoscopy, Inc. | Systems and methods for endoscopic imaging with monochromatic detector |
US20110184239A1 (en) | 2009-12-22 | 2011-07-28 | Integrated Endoscopy, Inc. | Methods and systems for disabling an endoscope after use |
US8444272B2 (en) | 2010-01-25 | 2013-05-21 | Corning Incorporated | Multi-projector system using multiplexed illumination |
JP5393554B2 (ja) | 2010-03-23 | 2014-01-22 | 富士フイルム株式会社 | 電子内視鏡システム |
JP5438571B2 (ja) | 2010-03-24 | 2014-03-12 | 富士フイルム株式会社 | 電子内視鏡システム |
WO2011120014A1 (en) | 2010-03-25 | 2011-09-29 | Olive Medical Corporation | System and method for providing a single use imaging device for medical applications |
JP5384409B2 (ja) | 2010-03-30 | 2014-01-08 | 富士フイルム株式会社 | 内視鏡装置におけるcmos撮像素子の作動方法 |
US8698887B2 (en) | 2010-04-07 | 2014-04-15 | Olympus Corporation | Image pickup apparatus, endoscope and manufacturing method for image pickup apparatus |
CN102984992A (zh) | 2010-05-10 | 2013-03-20 | 纳纳米德有限责任公司 | 用于检查身体腔的内表面或对身体腔的内表面成像的方法和内窥镜装置 |
WO2011143264A1 (en) | 2010-05-10 | 2011-11-17 | Nanamed,Llc | Method and device for imaging an interior surface of an intracorporeal cavity |
US20110292258A1 (en) | 2010-05-28 | 2011-12-01 | C2Cure, Inc. | Two sensor imaging systems |
JP2011250926A (ja) | 2010-06-01 | 2011-12-15 | Fujifilm Corp | 電子内視鏡システム |
JP5463210B2 (ja) | 2010-06-07 | 2014-04-09 | 富士フイルム株式会社 | 内視鏡システム |
JP2011259305A (ja) | 2010-06-10 | 2011-12-22 | Toshiba Corp | 固体撮像装置 |
US20120004508A1 (en) | 2010-07-02 | 2012-01-05 | Mcdowall Ian | Surgical illuminator with dual spectrum fluorescence |
GB2481970A (en) | 2010-07-06 | 2012-01-18 | St Microelectronics Res & Dev Ltd | Image sensor with sample and hold circuitry for noise reduction |
US8405748B2 (en) | 2010-07-16 | 2013-03-26 | Omnivision Technologies, Inc. | CMOS image sensor with improved photodiode area allocation |
US8165351B2 (en) | 2010-07-19 | 2012-04-24 | General Electric Company | Method of structured light-based measurement |
US9375139B2 (en) | 2010-07-29 | 2016-06-28 | Cannuflow, Inc. | Arthroscopic system |
JP5534997B2 (ja) | 2010-08-03 | 2014-07-02 | 富士フイルム株式会社 | 電子内視鏡システム |
US20120041534A1 (en) | 2010-08-10 | 2012-02-16 | Boston Scientific Scimed, Inc. | Stent delivery system with integrated camera |
US9277855B2 (en) | 2010-08-10 | 2016-03-08 | Boston Scientific Scimed, Inc. | Endoscopic system for enhanced visualization |
JP4657379B1 (ja) | 2010-09-01 | 2011-03-23 | 株式会社ナックイメージテクノロジー | 高速度ビデオカメラ |
JP5810493B2 (ja) * | 2010-09-03 | 2015-11-11 | ソニー株式会社 | 半導体集積回路、電子機器、固体撮像装置、撮像装置 |
JP2012085715A (ja) | 2010-10-18 | 2012-05-10 | Fujifilm Corp | 内視鏡装置 |
JP5431294B2 (ja) | 2010-11-16 | 2014-03-05 | 富士フイルム株式会社 | 内視鏡装置 |
JP5721406B2 (ja) | 2010-11-24 | 2015-05-20 | Hoya株式会社 | 走査型共焦点内視鏡システム |
JP2012147164A (ja) | 2011-01-11 | 2012-08-02 | Olympus Corp | 固体撮像装置 |
JP2012155019A (ja) | 2011-01-24 | 2012-08-16 | Brother Ind Ltd | 走査型画像表示装置 |
JP5750982B2 (ja) | 2011-04-12 | 2015-07-22 | ウシオ電機株式会社 | プロジェクタ用光源装置 |
IL229397A (en) | 2011-05-12 | 2016-04-21 | Deputy Synthes Products Inc | Image sensor with tolerance for connectivity optimization |
EP2708021B1 (en) | 2011-05-12 | 2019-07-10 | DePuy Synthes Products, Inc. | Image sensor with tolerance optimizing interconnects |
US8823846B2 (en) | 2011-05-17 | 2014-09-02 | Altasens, Inc. | Pausing digital readout of an optical sensor array |
JP2013017040A (ja) | 2011-07-04 | 2013-01-24 | Toshiba Corp | 画像処理装置及び固体撮像装置 |
JP5791571B2 (ja) * | 2011-08-02 | 2015-10-07 | キヤノン株式会社 | 撮像素子及び撮像装置 |
RU2014113330A (ru) | 2011-09-06 | 2015-10-20 | Конинклейке Филипс Н.В. | Оптический биосенсор с множеством сенсорных зон |
JP2013078377A (ja) | 2011-09-30 | 2013-05-02 | Fujifilm Corp | 内視鏡システム及び内視鏡の外部制御装置 |
JP5861868B2 (ja) | 2011-11-04 | 2016-02-16 | ソニー株式会社 | 電子回路および電子回路の製造方法 |
US8890945B2 (en) | 2011-11-14 | 2014-11-18 | Omnivision Technologies, Inc. | Shared terminal of an image sensor system for transferring image data and control signals |
CH705952B1 (de) | 2011-12-23 | 2017-06-15 | Awaiba Consultadoria Desenvolvimento E Comércio De Componentes Microelectrónicos Unipessoal Lda | Endoskopanordnung. |
US8629794B2 (en) | 2012-02-28 | 2014-01-14 | Silicon Laboratories Inc. | Integrated circuit and system including current-based communication |
US8754358B2 (en) | 2012-03-02 | 2014-06-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMOS sensor array |
US9277205B2 (en) | 2012-05-14 | 2016-03-01 | Intuitive Surgical Operations, Inc. | Single-chip sensor multi-function imaging |
WO2014018948A2 (en) | 2012-07-26 | 2014-01-30 | Olive Medical Corporation | Camera system with minimal area monolithic cmos image sensor |
US20140052004A1 (en) | 2012-08-15 | 2014-02-20 | Arthrex, Inc. | Endoscopic camera illumination system and method |
JP6164836B2 (ja) | 2012-12-25 | 2017-07-19 | Hoya株式会社 | 内視鏡 |
US9105550B2 (en) | 2013-01-11 | 2015-08-11 | Digimarc Corporation | Next generation imaging methods and systems |
US9136300B2 (en) | 2013-01-11 | 2015-09-15 | Digimarc Corporation | Next generation imaging methods and systems |
JP2014165845A (ja) | 2013-02-27 | 2014-09-08 | Sony Corp | 電子機器、制御方法、及び、イメージセンサ |
EP2967285B1 (en) | 2013-03-15 | 2023-08-16 | DePuy Synthes Products, Inc. | Image sensor synchronization without input clock and data transmission clock |
JP6419774B2 (ja) | 2013-03-15 | 2018-11-07 | デピュイ・シンセス・プロダクツ・インコーポレイテッド | 内視鏡適用における画像センサi/o及びコンダクタ数の最少化 |
JP5863709B2 (ja) | 2013-06-04 | 2016-02-17 | 富士フイルム株式会社 | 内視鏡システム |
GB2516971A (en) | 2013-08-09 | 2015-02-11 | St Microelectronics Res & Dev | A Pixel |
JPWO2015063988A1 (ja) | 2013-10-30 | 2017-03-09 | 株式会社Joled | 表示装置の電源断方法および表示装置 |
JP2015109588A (ja) | 2013-12-05 | 2015-06-11 | 株式会社東芝 | 信号処理装置及び撮像システム |
EP3231349A4 (en) | 2014-11-27 | 2018-08-22 | Olympus Corporation | Encapsulated endoscope and encapsulated endoscope system |
CN109923857B (zh) | 2016-11-14 | 2021-05-11 | 富士胶片株式会社 | 摄像装置、摄像方法及记录介质 |
US10721426B2 (en) * | 2017-08-31 | 2020-07-21 | Canon Kabushiki Kaisha | Solid-state image sensor, image capture apparatus and image capture method |
GB2606047B (en) * | 2017-09-29 | 2023-02-15 | Canon Kk | Image sensor and image capturing apparatus |
US10641868B2 (en) | 2017-11-07 | 2020-05-05 | Stmicroelectronics (Crolles 2) Sas | RGB and Z photo-diode pixel array kernel organization |
JP7146483B2 (ja) | 2018-06-27 | 2022-10-04 | ソニーセミコンダクタソリューションズ株式会社 | 受光装置およびその制御方法、並びに電子機器 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07136109A (ja) * | 1993-11-18 | 1995-05-30 | Olympus Optical Co Ltd | 内視鏡装置 |
JP2006025852A (ja) * | 2004-07-12 | 2006-02-02 | Texas Instr Japan Ltd | 内視鏡用撮像モジュール |
JP2010273757A (ja) * | 2009-05-27 | 2010-12-09 | Zycube:Kk | イメージセンサ応用装置 |
JP2010252396A (ja) * | 2010-07-26 | 2010-11-04 | Sony Corp | 撮像装置 |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11432715B2 (en) | 2011-05-12 | 2022-09-06 | DePuy Synthes Products, Inc. | System and method for sub-column parallel digitizers for hybrid stacked image sensor using vertical interconnects |
US11848337B2 (en) | 2011-05-12 | 2023-12-19 | DePuy Synthes Products, Inc. | Image sensor |
US10537234B2 (en) | 2011-05-12 | 2020-01-21 | DePuy Synthes Products, Inc. | Image sensor with tolerance optimizing interconnects |
US10863894B2 (en) | 2011-05-12 | 2020-12-15 | DePuy Synthes Products, Inc. | System and method for sub-column parallel digitizers for hybrid stacked image sensor using vertical interconnects |
US11682682B2 (en) | 2011-05-12 | 2023-06-20 | DePuy Synthes Products, Inc. | Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects |
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US11109750B2 (en) | 2011-05-12 | 2021-09-07 | DePuy Synthes Products, Inc. | Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects |
US11179029B2 (en) | 2011-05-12 | 2021-11-23 | DePuy Synthes Products, Inc. | Image sensor with tolerance optimizing interconnects |
US10701254B2 (en) | 2012-07-26 | 2020-06-30 | DePuy Synthes Products, Inc. | Camera system with minimal area monolithic CMOS image sensor |
US11766175B2 (en) | 2012-07-26 | 2023-09-26 | DePuy Synthes Products, Inc. | Camera system with minimal area monolithic CMOS image sensor |
US11089192B2 (en) | 2012-07-26 | 2021-08-10 | DePuy Synthes Products, Inc. | Camera system with minimal area monolithic CMOS image sensor |
US10881272B2 (en) | 2013-03-15 | 2021-01-05 | DePuy Synthes Products, Inc. | Minimize image sensor I/O and conductor counts in endoscope applications |
US11253139B2 (en) | 2013-03-15 | 2022-02-22 | DePuy Synthes Products, Inc. | Minimize image sensor I/O and conductor counts in endoscope applications |
US11344189B2 (en) | 2013-03-15 | 2022-05-31 | DePuy Synthes Products, Inc. | Image sensor synchronization without input clock and data transmission clock |
US10980406B2 (en) | 2013-03-15 | 2021-04-20 | DePuy Synthes Products, Inc. | Image sensor synchronization without input clock and data transmission clock |
US11903564B2 (en) | 2013-03-15 | 2024-02-20 | DePuy Synthes Products, Inc. | Image sensor synchronization without input clock and data transmission clock |
WO2016076125A1 (ja) * | 2014-11-12 | 2016-05-19 | ソニー株式会社 | 固体撮像装置および製造方法、並びに電子機器 |
US10070086B2 (en) | 2014-11-12 | 2018-09-04 | Sony Corporation | Solid-state imaging device, method of manufacturing the same, and electronic device |
JP2022031325A (ja) * | 2017-09-29 | 2022-02-18 | キヤノン株式会社 | 半導体装置および機器 |
JP7293323B2 (ja) | 2017-09-29 | 2023-06-19 | キヤノン株式会社 | 半導体装置および機器 |
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