HK1141821A1 - Resin composition - Google Patents

Resin composition

Info

Publication number
HK1141821A1
HK1141821A1 HK10108077.7A HK10108077A HK1141821A1 HK 1141821 A1 HK1141821 A1 HK 1141821A1 HK 10108077 A HK10108077 A HK 10108077A HK 1141821 A1 HK1141821 A1 HK 1141821A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
resin
composition
Prior art date
Application number
HK10108077.7A
Inventor
Hiroaki Kuwahara
Susumu Honda
Yoshio Bando
Chunyi Zhi
Chengchun Tang
Dmitri Golberg
Original Assignee
Teijin Ltd
Nat Inst For Materials Science
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd, Nat Inst For Materials Science filed Critical Teijin Ltd
Publication of HK1141821A1 publication Critical patent/HK1141821A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/005—Reinforced macromolecular compounds with nanosized materials, e.g. nanoparticles, nanofibres, nanotubes, nanowires, nanorods or nanolayered materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
HK10108077.7A 2007-05-25 2010-08-24 Resin composition HK1141821A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/061145 WO2008146400A1 (en) 2007-05-25 2007-05-25 Resin composition

Publications (1)

Publication Number Publication Date
HK1141821A1 true HK1141821A1 (en) 2010-11-19

Family

ID=40074682

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10108077.7A HK1141821A1 (en) 2007-05-25 2010-08-24 Resin composition

Country Status (5)

Country Link
JP (1) JPWO2008146400A1 (en)
KR (1) KR101422315B1 (en)
CN (1) CN101707914B (en)
HK (1) HK1141821A1 (en)
WO (1) WO2008146400A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5870515B2 (en) 2010-06-25 2016-03-01 三菱化学株式会社 Polycarbonate resin composition and molded article
JP2013032451A (en) * 2011-08-02 2013-02-14 Kaneka Corp High-heat conductive thermoplastic resin composition
JP6495683B2 (en) * 2015-02-26 2019-04-03 帝人株式会社 Insulating heat conductive polycarbonate resin composition
JP6717023B2 (en) * 2015-04-20 2020-07-01 三菱ケミカル株式会社 Thermally conductive material
CN104974491A (en) * 2015-06-30 2015-10-14 苏州博利迈新材料科技有限公司 UV-resistant high-temperature-resistant polycarbonate and preparation method thereof
KR102606624B1 (en) * 2015-11-19 2023-11-27 세키스이가가쿠 고교가부시키가이샤 Thermosetting materials and cured products
JP2017095293A (en) * 2015-11-19 2017-06-01 積水化学工業株式会社 Boron nitride nano tube and thermosetting material
JP6581481B2 (en) * 2015-11-19 2019-09-25 積水化学工業株式会社 Boron nitride nanotubes and thermosetting materials
JP6683485B2 (en) * 2016-01-28 2020-04-22 積水化学工業株式会社 Boron nitride nanotube material and thermosetting material
US10246623B2 (en) * 2016-09-21 2019-04-02 NAiEEL Technology Resin composition, article prepared by using the same, and method of preparing the same
US11098195B2 (en) * 2017-02-07 2021-08-24 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board
CN109066316A (en) * 2018-09-27 2018-12-21 句容市凯特电力电器有限公司 A kind of contact box of high-voltage switch cabinet
FR3112552B1 (en) * 2020-07-17 2023-04-14 Commissariat Energie Atomique Nanocomposite with polymer matrix and boron nitride nanotubes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2972882B1 (en) 1998-09-30 1999-11-08 科学技術庁無機材質研究所長 Method for producing boron nitride nanotubes
JP2003268246A (en) 2002-03-18 2003-09-25 Nissan Motor Co Ltd Resin composition and its production method
JP4273726B2 (en) * 2002-03-26 2009-06-03 東レ株式会社 Carbon nanotube-containing paste, carbon nanotube dispersed composite, and method for producing carbon nanotube dispersed composite
JP2003342476A (en) * 2002-05-27 2003-12-03 Bridgestone Corp Conductive resin material
JP2004161561A (en) * 2002-11-14 2004-06-10 National Institute For Materials Science Manufacturing process of boron nitride nanotube
JP4222048B2 (en) * 2003-02-13 2009-02-12 東レ株式会社 Carbon nanotube-containing resin composite, method for producing the same, and highly elastic film
JP2004256607A (en) * 2003-02-25 2004-09-16 Hitachi Metals Ltd Resin-reinforcing material, resin composition
CN1813023A (en) * 2003-05-22 2006-08-02 塞威公司 Nanocomposites and methods thereto
JP2005150362A (en) * 2003-11-14 2005-06-09 Dainippon Printing Co Ltd Highly thermal conductive sheet and its manufacturing method
JP2007146039A (en) * 2005-11-29 2007-06-14 Teijin Ltd Resin composition and molded article thereof
JP4911447B2 (en) * 2005-11-29 2012-04-04 帝人株式会社 Resin composition and method for producing the same
JP5069411B2 (en) * 2005-11-30 2012-11-07 帝人株式会社 Polycarbonate-based resin molded body and method for producing the same

Also Published As

Publication number Publication date
KR20100017269A (en) 2010-02-16
JPWO2008146400A1 (en) 2010-08-19
WO2008146400A1 (en) 2008-12-04
CN101707914B (en) 2012-12-12
KR101422315B1 (en) 2014-07-22
CN101707914A (en) 2010-05-12

Similar Documents

Publication Publication Date Title
EP2174969A4 (en) Resin composition
EP2246377A4 (en) Resin composition
EP2088170A4 (en) Resin composition
GB0700534D0 (en) Composition
EP2149589A4 (en) Polycarbonate resin composition
EP2163583A4 (en) Polycarbonate resin composition
EP2172500A4 (en) Polyurethane resin composition
HK1170514A1 (en) Epoxy resin composition
EP2141202A4 (en) Polycarbonate resin composition
EP2154201A4 (en) Polyamide resin composition
HK1141821A1 (en) Resin composition
GB2447980B (en) Thermosetting resin composition
EP2048201A4 (en) Resin composition
EP2226342A4 (en) Adhesive resin composition
GB0714575D0 (en) Composition
EP2305755A4 (en) Resin composition
GB0710888D0 (en) Composition
HK1148763A1 (en) Resin composition
GB0714569D0 (en) Composition
EP2204408A4 (en) Polyolefin resin composition
GB0706343D0 (en) Composition
GB0705885D0 (en) Composition
GB0702446D0 (en) Composition
EP2184325A4 (en) Thermoplastic resin composition
GB0703719D0 (en) Composition

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170525