HK1023786A1 - Pressure sensitive adhesive double coated sheet and method of use thereof - Google Patents
Pressure sensitive adhesive double coated sheet and method of use thereofInfo
- Publication number
- HK1023786A1 HK1023786A1 HK00102925A HK00102925A HK1023786A1 HK 1023786 A1 HK1023786 A1 HK 1023786A1 HK 00102925 A HK00102925 A HK 00102925A HK 00102925 A HK00102925 A HK 00102925A HK 1023786 A1 HK1023786 A1 HK 1023786A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- sensitive adhesive
- pressure sensitive
- coated sheet
- double coated
- adhesive double
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
- Y10T156/1184—Piercing layer during delaminating [e.g., cutting, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24017098 | 1998-08-26 | ||
JP10980699A JP3784202B2 (ja) | 1998-08-26 | 1999-04-16 | 両面粘着シートおよびその使用方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1023786A1 true HK1023786A1 (en) | 2000-09-22 |
Family
ID=26449521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK00102925A HK1023786A1 (en) | 1998-08-26 | 2000-05-16 | Pressure sensitive adhesive double coated sheet and method of use thereof |
Country Status (10)
Country | Link |
---|---|
US (1) | US6398892B1 (ko) |
JP (1) | JP3784202B2 (ko) |
KR (1) | KR100655036B1 (ko) |
CN (1) | CN1147555C (ko) |
DE (1) | DE19940390A1 (ko) |
GB (1) | GB2340772B (ko) |
HK (1) | HK1023786A1 (ko) |
MY (1) | MY123333A (ko) |
SG (1) | SG82017A1 (ko) |
TW (1) | TW513480B (ko) |
Families Citing this family (71)
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US6114015A (en) * | 1998-10-13 | 2000-09-05 | Matsushita Electronic Materials, Inc. | Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
US6783620B1 (en) * | 1998-10-13 | 2004-08-31 | Matsushita Electronic Materials, Inc. | Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
JP4275254B2 (ja) | 1999-06-17 | 2009-06-10 | リンテック株式会社 | 両面粘着シートに固定された物品の剥離方法および剥離装置 |
JP4137310B2 (ja) | 1999-09-06 | 2008-08-20 | リンテック株式会社 | 両面粘着シートに固定された物品の剥離方法および剥離装置 |
JP4392732B2 (ja) | 2000-02-07 | 2010-01-06 | リンテック株式会社 | 半導体チップの製造方法 |
JP4230080B2 (ja) | 2000-02-18 | 2009-02-25 | リンテック株式会社 | ウエハ貼着用粘着シート |
JP2002033296A (ja) * | 2000-04-26 | 2002-01-31 | Lintec Corp | シリコンウエハ用の補強材および該補強材を用いたicチップの製造方法 |
JP3768069B2 (ja) * | 2000-05-16 | 2006-04-19 | 信越半導体株式会社 | 半導体ウエーハの薄型化方法 |
JP2002075937A (ja) * | 2000-08-30 | 2002-03-15 | Nitto Denko Corp | 半導体ウエハの加工方法 |
WO2002026441A1 (en) * | 2000-09-27 | 2002-04-04 | Strasbaugh, Inc. | Tool for applying resilient tape to chuck used for grinding or polishing wafers |
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DE10065686C2 (de) * | 2000-12-29 | 2002-11-14 | Infineon Technologies Ag | Verfahren zur Handhabung eines dünnen Halbleiterwafers oder Substrats |
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JP4482243B2 (ja) * | 2001-03-13 | 2010-06-16 | 株式会社新川 | ダイのピックアップ方法及びピックアップ装置 |
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JP4107417B2 (ja) | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
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JP5404992B2 (ja) * | 2006-03-20 | 2014-02-05 | 電気化学工業株式会社 | 仮固定用組成物、部材の仮固定方法とそれに用いる基材 |
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WO2014018312A1 (en) | 2012-07-26 | 2014-01-30 | 3M Innovative Properties Company | Heat de-bondable adhesive articles |
CN103035483B (zh) * | 2012-08-28 | 2015-10-14 | 上海华虹宏力半导体制造有限公司 | 一种应用于薄硅片的临时键合和解离工艺方法 |
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JP3177149B2 (ja) * | 1996-03-15 | 2001-06-18 | リンテック株式会社 | 粘着テープ用基材、該基材を用いた粘着テープ、および該基材の製造方法 |
JP3388674B2 (ja) * | 1996-04-19 | 2003-03-24 | リンテック株式会社 | エネルギー線硬化型感圧接着剤組成物およびその利用方法 |
JPH10150007A (ja) * | 1996-11-18 | 1998-06-02 | Toyo Chem Co Ltd | 半導体ウエハ固定用シート |
JP3955659B2 (ja) * | 1997-06-12 | 2007-08-08 | リンテック株式会社 | 電子部品のダイボンディング方法およびそれに使用されるダイボンディング装置 |
-
1999
- 1999-04-16 JP JP10980699A patent/JP3784202B2/ja not_active Expired - Lifetime
- 1999-08-25 DE DE19940390A patent/DE19940390A1/de not_active Ceased
- 1999-08-25 SG SG9904187A patent/SG82017A1/en unknown
- 1999-08-25 KR KR1019990035415A patent/KR100655036B1/ko not_active IP Right Cessation
- 1999-08-25 US US09/382,965 patent/US6398892B1/en not_active Expired - Lifetime
- 1999-08-25 GB GB9920154A patent/GB2340772B/en not_active Expired - Fee Related
- 1999-08-25 TW TW088114514A patent/TW513480B/zh not_active IP Right Cessation
- 1999-08-26 CN CNB991183487A patent/CN1147555C/zh not_active Expired - Fee Related
- 1999-08-26 MY MYPI99003686A patent/MY123333A/en unknown
-
2000
- 2000-05-16 HK HK00102925A patent/HK1023786A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE19940390A1 (de) | 2000-03-16 |
SG82017A1 (en) | 2001-07-24 |
GB9920154D0 (en) | 1999-10-27 |
JP2000136362A (ja) | 2000-05-16 |
KR20000017531A (ko) | 2000-03-25 |
CN1245819A (zh) | 2000-03-01 |
GB2340772B (en) | 2002-08-14 |
JP3784202B2 (ja) | 2006-06-07 |
US6398892B1 (en) | 2002-06-04 |
KR100655036B1 (ko) | 2006-12-07 |
CN1147555C (zh) | 2004-04-28 |
GB2340772A (en) | 2000-03-01 |
MY123333A (en) | 2006-05-31 |
TW513480B (en) | 2002-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20070825 |