DE3650613D1 - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- DE3650613D1 DE3650613D1 DE3650613T DE3650613T DE3650613D1 DE 3650613 D1 DE3650613 D1 DE 3650613D1 DE 3650613 T DE3650613 T DE 3650613T DE 3650613 T DE3650613 T DE 3650613T DE 3650613 D1 DE3650613 D1 DE 3650613D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor arrangement
- semiconductor
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0922—Combination of complementary transistors having a different structure, e.g. stacked CMOS, high-voltage and low-voltage CMOS
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
- H01L27/0218—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of field effect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
- Bipolar Transistors (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60258506A JPH0671067B2 (ja) | 1985-11-20 | 1985-11-20 | 半導体装置 |
| PCT/JP1986/000579 WO1987003423A1 (en) | 1985-11-20 | 1986-11-12 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3650613D1 true DE3650613D1 (de) | 1997-05-22 |
| DE3650613T2 DE3650613T2 (de) | 1997-10-23 |
Family
ID=17321153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3650613T Expired - Fee Related DE3650613T2 (de) | 1985-11-20 | 1986-11-12 | Halbleiteranordnung |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0245515B1 (de) |
| JP (1) | JPH0671067B2 (de) |
| KR (1) | KR950007573B1 (de) |
| DE (1) | DE3650613T2 (de) |
| HK (1) | HK1003586A1 (de) |
| SG (1) | SG59995A1 (de) |
| WO (1) | WO1987003423A1 (de) |
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5173294A (en) * | 1986-11-18 | 1992-12-22 | Research Foundation Of State University Of New York | Dna probe for the identification of haemophilus influenzae |
| GB2199695B (en) * | 1987-01-06 | 1990-07-25 | Samsung Semiconductor Inc | Dynamic random access memory with selective well biasing |
| GB8713388D0 (en) * | 1987-06-08 | 1987-07-15 | Philips Electronic Associated | Semiconductor device |
| JPH01129451A (ja) * | 1987-11-16 | 1989-05-22 | Fujitsu Ltd | 半導体装置 |
| JP2788269B2 (ja) * | 1988-02-08 | 1998-08-20 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US5093707A (en) * | 1988-04-27 | 1992-03-03 | Kabushiki Kaisha Toshiba | Semiconductor device with bipolar and cmos transistors |
| US5297097A (en) | 1988-06-17 | 1994-03-22 | Hitachi Ltd. | Large scale integrated circuit for low voltage operation |
| USRE40132E1 (en) | 1988-06-17 | 2008-03-04 | Elpida Memory, Inc. | Large scale integrated circuit with sense amplifier circuits for low voltage operation |
| JP2845493B2 (ja) * | 1988-06-24 | 1999-01-13 | 株式会社東芝 | 半導体装置 |
| JPH03153070A (ja) * | 1989-11-10 | 1991-07-01 | Seiko Epson Corp | 半導体装置 |
| JPH0744231B2 (ja) * | 1989-11-10 | 1995-05-15 | 株式会社東芝 | 半導体集積回路およびその製造方法 |
| JPH07109860B2 (ja) * | 1990-01-19 | 1995-11-22 | 株式会社東芝 | 電荷転送デバイスを含む半導体装置およびその製造方法 |
| JPH07109861B2 (ja) * | 1990-01-19 | 1995-11-22 | 株式会社東芝 | 電荷転送デバイスを含む半導体装置およびその製造方法 |
| US5260228A (en) * | 1990-01-19 | 1993-11-09 | Kabushiki Kaisha Toshiba | Method of making a semiconductor device having a charge transfer device, MOSFETs, and bipolar transistors |
| KR940005725B1 (ko) * | 1990-04-13 | 1994-06-23 | 가부시키가이샤 도시바 | 반도체 기억장치 및 그 캐리어주입방지방법 |
| JPH03296260A (ja) * | 1990-04-16 | 1991-12-26 | Toshiba Corp | Ｍｏｓ型半導体装置 |
| JPH0423147U (de) * | 1990-06-20 | 1992-02-26 | ||
| JP2609743B2 (ja) * | 1990-06-28 | 1997-05-14 | 三菱電機株式会社 | 半導体装置 |
| KR940009357B1 (ko) * | 1991-04-09 | 1994-10-07 | 삼성전자주식회사 | 반도체 장치 및 그 제조방법 |
| US5248624A (en) * | 1991-08-23 | 1993-09-28 | Exar Corporation | Method of making isolated vertical pnp transistor in a complementary bicmos process with eeprom memory |
| JPH05129425A (ja) * | 1991-10-30 | 1993-05-25 | Nec Kansai Ltd | 半導体装置およびその製造方法 |
| US5595925A (en) * | 1994-04-29 | 1997-01-21 | Texas Instruments Incorporated | Method for fabricating a multiple well structure for providing multiple substrate bias for DRAM device formed therein |
| JP4037470B2 (ja) | 1994-06-28 | 2008-01-23 | エルピーダメモリ株式会社 | 半導体装置 |
| TW362275B (en) * | 1996-09-05 | 1999-06-21 | Matsushita Electronics Corp | Semiconductor device and method for producing the same |
| US6107672A (en) * | 1997-09-04 | 2000-08-22 | Matsushita Electronics Corporation | Semiconductor device having a plurality of buried wells |
| JP4012341B2 (ja) | 1999-07-14 | 2007-11-21 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
| US6901006B1 (en) | 1999-07-14 | 2005-05-31 | Hitachi, Ltd. | Semiconductor integrated circuit device including first, second and third gates |
| JP2001291779A (ja) * | 2000-04-05 | 2001-10-19 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| TWI230392B (en) | 2001-06-18 | 2005-04-01 | Innovative Silicon Sa | Semiconductor device |
| JP2004311684A (ja) * | 2003-04-07 | 2004-11-04 | Sanyo Electric Co Ltd | 半導体装置 |
| US20040228168A1 (en) | 2003-05-13 | 2004-11-18 | Richard Ferrant | Semiconductor memory device and method of operating same |
| US7335934B2 (en) | 2003-07-22 | 2008-02-26 | Innovative Silicon S.A. | Integrated circuit device, and method of fabricating same |
| US7606066B2 (en) | 2005-09-07 | 2009-10-20 | Innovative Silicon Isi Sa | Memory cell and memory cell array having an electrically floating body transistor, and methods of operating same |
| US7683430B2 (en) | 2005-12-19 | 2010-03-23 | Innovative Silicon Isi Sa | Electrically floating body memory cell and array, and method of operating or controlling same |
| US7492632B2 (en) | 2006-04-07 | 2009-02-17 | Innovative Silicon Isi Sa | Memory array having a programmable word length, and method of operating same |
| WO2007128738A1 (en) | 2006-05-02 | 2007-11-15 | Innovative Silicon Sa | Semiconductor memory cell and array using punch-through to program and read same |
| US8069377B2 (en) | 2006-06-26 | 2011-11-29 | Micron Technology, Inc. | Integrated circuit having memory array including ECC and column redundancy and method of operating the same |
| US7542340B2 (en) | 2006-07-11 | 2009-06-02 | Innovative Silicon Isi Sa | Integrated circuit including memory array having a segmented bit line architecture and method of controlling and/or operating same |
| US8264041B2 (en) | 2007-01-26 | 2012-09-11 | Micron Technology, Inc. | Semiconductor device with electrically floating body |
| US8518774B2 (en) | 2007-03-29 | 2013-08-27 | Micron Technology, Inc. | Manufacturing process for zero-capacitor random access memory circuits |
| US8064274B2 (en) | 2007-05-30 | 2011-11-22 | Micron Technology, Inc. | Integrated circuit having voltage generation circuitry for memory cell array, and method of operating and/or controlling same |
| US8085594B2 (en) | 2007-06-01 | 2011-12-27 | Micron Technology, Inc. | Reading technique for memory cell with electrically floating body transistor |
| US8194487B2 (en) | 2007-09-17 | 2012-06-05 | Micron Technology, Inc. | Refreshing data of memory cells with electrically floating body transistors |
| US8536628B2 (en) | 2007-11-29 | 2013-09-17 | Micron Technology, Inc. | Integrated circuit having memory cell array including barriers, and method of manufacturing same |
| US8349662B2 (en) | 2007-12-11 | 2013-01-08 | Micron Technology, Inc. | Integrated circuit having memory cell array, and method of manufacturing same |
| US8773933B2 (en) | 2012-03-16 | 2014-07-08 | Micron Technology, Inc. | Techniques for accessing memory cells |
| US8014195B2 (en) | 2008-02-06 | 2011-09-06 | Micron Technology, Inc. | Single transistor memory cell |
| US8189376B2 (en) | 2008-02-08 | 2012-05-29 | Micron Technology, Inc. | Integrated circuit having memory cells including gate material having high work function, and method of manufacturing same |
| US7957206B2 (en) | 2008-04-04 | 2011-06-07 | Micron Technology, Inc. | Read circuitry for an integrated circuit having memory cells and/or a memory cell array, and method of operating same |
| US7947543B2 (en) | 2008-09-25 | 2011-05-24 | Micron Technology, Inc. | Recessed gate silicon-on-insulator floating body device with self-aligned lateral isolation |
| US7933140B2 (en) | 2008-10-02 | 2011-04-26 | Micron Technology, Inc. | Techniques for reducing a voltage swing |
| US7924630B2 (en) | 2008-10-15 | 2011-04-12 | Micron Technology, Inc. | Techniques for simultaneously driving a plurality of source lines |
| US8223574B2 (en) | 2008-11-05 | 2012-07-17 | Micron Technology, Inc. | Techniques for block refreshing a semiconductor memory device |
| US8213226B2 (en) | 2008-12-05 | 2012-07-03 | Micron Technology, Inc. | Vertical transistor memory cell and array |
| US8319294B2 (en) | 2009-02-18 | 2012-11-27 | Micron Technology, Inc. | Techniques for providing a source line plane |
| US8710566B2 (en) | 2009-03-04 | 2014-04-29 | Micron Technology, Inc. | Techniques for forming a contact to a buried diffusion layer in a semiconductor memory device |
| US8748959B2 (en) | 2009-03-31 | 2014-06-10 | Micron Technology, Inc. | Semiconductor memory device |
| US8139418B2 (en) | 2009-04-27 | 2012-03-20 | Micron Technology, Inc. | Techniques for controlling a direct injection semiconductor memory device |
| US8508994B2 (en) | 2009-04-30 | 2013-08-13 | Micron Technology, Inc. | Semiconductor device with floating gate and electrically floating body |
| US8498157B2 (en) | 2009-05-22 | 2013-07-30 | Micron Technology, Inc. | Techniques for providing a direct injection semiconductor memory device |
| US8537610B2 (en) | 2009-07-10 | 2013-09-17 | Micron Technology, Inc. | Techniques for providing a semiconductor memory device |
| US9076543B2 (en) | 2009-07-27 | 2015-07-07 | Micron Technology, Inc. | Techniques for providing a direct injection semiconductor memory device |
| US8199595B2 (en) | 2009-09-04 | 2012-06-12 | Micron Technology, Inc. | Techniques for sensing a semiconductor memory device |
| US8174881B2 (en) | 2009-11-24 | 2012-05-08 | Micron Technology, Inc. | Techniques for reducing disturbance in a semiconductor device |
| US8310893B2 (en) | 2009-12-16 | 2012-11-13 | Micron Technology, Inc. | Techniques for reducing impact of array disturbs in a semiconductor memory device |
| US8416636B2 (en) | 2010-02-12 | 2013-04-09 | Micron Technology, Inc. | Techniques for controlling a semiconductor memory device |
| US8576631B2 (en) | 2010-03-04 | 2013-11-05 | Micron Technology, Inc. | Techniques for sensing a semiconductor memory device |
| US8411513B2 (en) | 2010-03-04 | 2013-04-02 | Micron Technology, Inc. | Techniques for providing a semiconductor memory device having hierarchical bit lines |
| US8369177B2 (en) | 2010-03-05 | 2013-02-05 | Micron Technology, Inc. | Techniques for reading from and/or writing to a semiconductor memory device |
| EP2548227B1 (de) | 2010-03-15 | 2021-07-14 | Micron Technology, Inc. | Verfahren zur bereitstellung einer halbleiterspeichervorrichtung |
| US8411524B2 (en) | 2010-05-06 | 2013-04-02 | Micron Technology, Inc. | Techniques for refreshing a semiconductor memory device |
| US8531878B2 (en) | 2011-05-17 | 2013-09-10 | Micron Technology, Inc. | Techniques for providing a semiconductor memory device |
| US9559216B2 (en) | 2011-06-06 | 2017-01-31 | Micron Technology, Inc. | Semiconductor memory device and method for biasing same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3916430A (en) * | 1973-03-14 | 1975-10-28 | Rca Corp | System for eliminating substrate bias effect in field effect transistor circuits |
| JPS567463A (en) * | 1979-06-29 | 1981-01-26 | Hitachi Ltd | Semiconductor device and its manufacture |
| JPS57194565A (en) * | 1981-05-25 | 1982-11-30 | Toshiba Corp | Semiconductor memory device |
| JPS5922359A (ja) * | 1982-07-29 | 1984-02-04 | Nec Corp | 集積化半導体記憶装置 |
| JPS59143359A (ja) * | 1983-01-31 | 1984-08-16 | ストレイジ、テクノロジ−、パ−トナ−ズ | Ｃｍｏｓ集積回路 |
| JPS59144168A (ja) * | 1983-02-07 | 1984-08-18 | Hitachi Ltd | バイポ−ラｍｏｓ半導体装置及びその製造法 |
-
1985
- 1985-11-20 JP JP60258506A patent/JPH0671067B2/ja not_active Expired - Lifetime
-
1986
- 1986-11-12 DE DE3650613T patent/DE3650613T2/de not_active Expired - Fee Related
- 1986-11-12 SG SG1996009506A patent/SG59995A1/en unknown
- 1986-11-12 EP EP86906927A patent/EP0245515B1/de not_active Expired - Lifetime
- 1986-11-12 WO PCT/JP1986/000579 patent/WO1987003423A1/ja active IP Right Grant
- 1986-11-12 KR KR1019870700554A patent/KR950007573B1/ko not_active IP Right Cessation
-
1998
- 1998-03-27 HK HK98102615A patent/HK1003586A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0245515B1 (de) | 1997-04-16 |
| EP0245515A4 (en) | 1990-12-27 |
| DE3650613T2 (de) | 1997-10-23 |
| JPH0671067B2 (ja) | 1994-09-07 |
| HK1003586A1 (en) | 1998-10-30 |
| KR880700468A (ko) | 1988-03-15 |
| KR950007573B1 (ko) | 1995-07-12 |
| EP0245515A1 (de) | 1987-11-19 |
| JPS62119958A (ja) | 1987-06-01 |
| WO1987003423A1 (en) | 1987-06-04 |
| SG59995A1 (en) | 1999-02-22 |
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