CN1541231A - 固态硅烷偶合剂组合物,其制造方法和含有其的树脂组合物 - Google Patents
固态硅烷偶合剂组合物,其制造方法和含有其的树脂组合物 Download PDFInfo
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- CN1541231A CN1541231A CNA038005751A CN03800575A CN1541231A CN 1541231 A CN1541231 A CN 1541231A CN A038005751 A CNA038005751 A CN A038005751A CN 03800575 A CN03800575 A CN 03800575A CN 1541231 A CN1541231 A CN 1541231A
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- coupling agent
- silane coupling
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/04—Oxygen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
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- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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- Paints Or Removers (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
实施例9-1 | 实施例9-2 | 实施例9-3 | 比较例3 | 比较例5 | |
剪切粘结强度(N/cm2) | 335 | 321 | 404 | 255 | 245 |
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP312712/2002 | 2002-10-28 | ||
JP2002312712A JP2004143383A (ja) | 2002-10-28 | 2002-10-28 | 固形シランカップリング剤組成物、その製造方法およびそれを含有する樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1541231A true CN1541231A (zh) | 2004-10-27 |
CN100357333C CN100357333C (zh) | 2007-12-26 |
Family
ID=32171144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038005751A Expired - Fee Related CN100357333C (zh) | 2002-10-28 | 2003-08-05 | 固态硅烷偶合剂组合物,其制造方法和含有其的树脂组合物 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7109273B2 (zh) |
EP (1) | EP1469022B1 (zh) |
JP (1) | JP2004143383A (zh) |
KR (1) | KR100575323B1 (zh) |
CN (1) | CN100357333C (zh) |
CA (1) | CA2447858C (zh) |
TW (1) | TWI254049B (zh) |
WO (1) | WO2004037880A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101512421B (zh) * | 2006-09-07 | 2011-05-11 | 三井化学株式会社 | 液晶密封剂、使用其的液晶显示面板的制造方法、以及液晶显示面板 |
CN104812867A (zh) * | 2012-09-14 | 2015-07-29 | 东京应化工业株式会社 | 用于太阳热发电***的载热体组合物 |
CN105985711A (zh) * | 2015-03-18 | 2016-10-05 | 关西涂料株式会社 | 粉体涂料组合物和涂膜形成方法 |
CN108530591A (zh) * | 2018-04-20 | 2018-09-14 | 苏州兴业材料科技股份有限公司 | 3d砂型打印用碱酚醛树脂的制备方法 |
Families Citing this family (11)
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KR100806420B1 (ko) * | 2001-12-29 | 2008-02-21 | 주식회사 케이씨씨 | 반도체소자 봉지용 에폭시 수지 조성물 |
JP2006342270A (ja) * | 2005-06-09 | 2006-12-21 | Osaka Univ | 有機無機ハイブリッド |
JP2007262235A (ja) * | 2006-03-28 | 2007-10-11 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
KR100816679B1 (ko) * | 2006-12-13 | 2008-03-27 | 제일모직주식회사 | 천연섬유 강화 폴리유산 수지 조성물 |
JP2011514255A (ja) * | 2008-03-18 | 2011-05-06 | ナノ−エックス ゲーエムベーハー | 高耐摩耗性の乗り物用塗料の製造方法、乗り物用塗料、およびその使用 |
JP5449176B2 (ja) * | 2008-09-29 | 2014-03-19 | 三井化学株式会社 | 封止剤および封止部材、ならびに有機elデバイス |
JP5060648B1 (ja) * | 2011-09-30 | 2012-10-31 | 日本写真印刷株式会社 | 転写シート及び転写シートの製造方法 |
US9714191B2 (en) | 2012-04-17 | 2017-07-25 | Arkema Inc. | Process for coating a glass substrate with an aqueous fluoropolymer coating |
US10399892B2 (en) | 2012-04-17 | 2019-09-03 | Arkema Inc. | Aqueous fluoropolymer glass coating |
JP6070589B2 (ja) * | 2014-01-24 | 2017-02-01 | 信越化学工業株式会社 | シランカップリング剤及びその製造方法、プライマー組成物並びに塗料組成物 |
CN114016288B (zh) * | 2021-12-07 | 2024-03-15 | 中国第一汽车股份有限公司 | 一种纤维帘线浸渍液及其制备方法和应用 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59181036A (ja) | 1983-03-30 | 1984-10-15 | Nitto Electric Ind Co Ltd | 半導体装置 |
JPH0672220B2 (ja) * | 1985-03-12 | 1994-09-14 | エヌオーケー株式会社 | 加硫接着剤配合物およびそれを用いた接着方法 |
JPH0794533B2 (ja) * | 1989-09-29 | 1995-10-11 | 日東電工株式会社 | 半導体装置 |
JPH03122114A (ja) | 1989-10-06 | 1991-05-24 | Somar Corp | 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物 |
JPH03281618A (ja) * | 1990-03-30 | 1991-12-12 | Sekisui Chem Co Ltd | ポリアミド用プライマー組成物 |
JP2506220B2 (ja) * | 1990-06-19 | 1996-06-12 | 日東電工株式会社 | 半導体装置 |
JPH0768256B2 (ja) | 1991-08-01 | 1995-07-26 | 株式会社ジャパンエナジー | 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤 |
JPH0539295A (ja) | 1991-08-02 | 1993-02-19 | Nikko Kyodo Co Ltd | 金属表面処理剤 |
JPH0717739A (ja) | 1993-07-02 | 1995-01-20 | Furukawa Electric Co Ltd:The | 光ファイバの線引き方法 |
JPH0794534A (ja) | 1993-09-24 | 1995-04-07 | Sony Corp | ダイボンディング方法とダイボンディング装置 |
JP3479818B2 (ja) | 1995-08-31 | 2003-12-15 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP4007627B2 (ja) * | 1996-03-11 | 2007-11-14 | 日本パーカライジング株式会社 | 金属材料用表面処理剤組成物および処理方法 |
JP3555801B2 (ja) | 1996-04-30 | 2004-08-18 | 株式会社日鉱マテリアルズ | 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤 |
JP3555800B2 (ja) | 1996-04-30 | 2004-08-18 | 株式会社日鉱マテリアルズ | 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤 |
JP3436634B2 (ja) | 1996-04-30 | 2003-08-11 | 株式会社ジャパンエナジー | 表面処理剤および樹脂添加剤 |
JP3555802B2 (ja) | 1996-04-30 | 2004-08-18 | 株式会社日鉱マテリアルズ | 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤 |
JP3618182B2 (ja) * | 1996-10-29 | 2005-02-09 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物 |
JP3523804B2 (ja) | 1999-04-15 | 2004-04-26 | 株式会社日鉱マテリアルズ | 新規有機ケイ素化合物およびその製造方法並びにそれを用いる表面処理剤および樹脂添加剤 |
JP4273374B2 (ja) | 1999-07-21 | 2009-06-03 | 日立化成工業株式会社 | 電子部品封止用エポキシ樹脂組成物 |
JP2001279054A (ja) * | 2000-03-28 | 2001-10-10 | Sumitomo Bakelite Co Ltd | 熱硬化性樹脂組成物およびこれを用いた成形材料 |
US6350799B1 (en) * | 2000-05-23 | 2002-02-26 | Lord Corporation | Coolant resistant and thermally stable primer composition |
JP3708423B2 (ja) * | 2000-10-20 | 2005-10-19 | 株式会社日鉱マテリアルズ | エポキシ樹脂用フェノール系硬化剤及びそれを用いたエポキシ樹脂組成物 |
JP4260418B2 (ja) | 2001-12-07 | 2009-04-30 | 日鉱金属株式会社 | 塩基性シランカップリング剤有機カルボン酸塩組成物、その製造方法、並びにそれを含むエポキシ樹脂組成物 |
US6875807B2 (en) * | 2003-05-28 | 2005-04-05 | Indspec Chemical Corporation | Silane-modified phenolic resins and applications thereof |
-
2002
- 2002-10-28 JP JP2002312712A patent/JP2004143383A/ja active Pending
-
2003
- 2003-08-05 US US10/480,712 patent/US7109273B2/en active Active
- 2003-08-05 EP EP03762345A patent/EP1469022B1/en not_active Expired - Lifetime
- 2003-08-05 CN CNB038005751A patent/CN100357333C/zh not_active Expired - Fee Related
- 2003-08-05 KR KR1020037016956A patent/KR100575323B1/ko not_active IP Right Cessation
- 2003-08-05 WO PCT/JP2003/009967 patent/WO2004037880A1/ja active Application Filing
- 2003-08-05 CA CA002447858A patent/CA2447858C/en not_active Expired - Fee Related
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Cited By (7)
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CN101512421B (zh) * | 2006-09-07 | 2011-05-11 | 三井化学株式会社 | 液晶密封剂、使用其的液晶显示面板的制造方法、以及液晶显示面板 |
CN104812867A (zh) * | 2012-09-14 | 2015-07-29 | 东京应化工业株式会社 | 用于太阳热发电***的载热体组合物 |
US9644127B2 (en) | 2012-09-14 | 2017-05-09 | Tokyo Ohka Kogyo Co., Ltd. | Heating medium composition for solar thermal power generation system |
CN104812867B (zh) * | 2012-09-14 | 2017-07-14 | 东京应化工业株式会社 | 用于太阳热发电***的载热体组合物 |
CN105985711A (zh) * | 2015-03-18 | 2016-10-05 | 关西涂料株式会社 | 粉体涂料组合物和涂膜形成方法 |
CN108530591A (zh) * | 2018-04-20 | 2018-09-14 | 苏州兴业材料科技股份有限公司 | 3d砂型打印用碱酚醛树脂的制备方法 |
CN108530591B (zh) * | 2018-04-20 | 2020-10-02 | 苏州兴业材料科技股份有限公司 | 3d砂型打印用碱酚醛树脂的制备方法 |
Also Published As
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EP1469022A1 (en) | 2004-10-20 |
CN100357333C (zh) | 2007-12-26 |
KR20040060856A (ko) | 2004-07-06 |
KR100575323B1 (ko) | 2006-05-02 |
TW200406416A (en) | 2004-05-01 |
CA2447858C (en) | 2009-06-02 |
CA2447858A1 (en) | 2004-04-28 |
EP1469022A4 (en) | 2006-02-01 |
EP1469022B1 (en) | 2012-10-03 |
US7109273B2 (en) | 2006-09-19 |
US20050165195A1 (en) | 2005-07-28 |
TWI254049B (en) | 2006-05-01 |
WO2004037880A1 (ja) | 2004-05-06 |
JP2004143383A (ja) | 2004-05-20 |
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