CN112739068A - Hole filling method for through hole of circuit board - Google Patents
Hole filling method for through hole of circuit board Download PDFInfo
- Publication number
- CN112739068A CN112739068A CN202011262595.XA CN202011262595A CN112739068A CN 112739068 A CN112739068 A CN 112739068A CN 202011262595 A CN202011262595 A CN 202011262595A CN 112739068 A CN112739068 A CN 112739068A
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- Prior art keywords
- hole
- circuit board
- cleaning
- wall
- filling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Abstract
The invention discloses a hole filling method of a circuit board through hole, which comprises the following steps: forming a through hole on the circuit board; removing glue from the through hole and cleaning for the first time; after the first cleaning is finished, carrying out copper deposition treatment on the circuit board so as to form a first conductive layer on the wall of the through hole and carrying out second cleaning; after the second cleaning is finished, detecting whether residual glue exists on the hole wall of the through hole; and if no residual glue exists on the hole wall of the through hole, carrying out copper plating on the through hole in a pulse hole filling mode so as to form a second conductive layer on the first conductive layer until the through hole is filled. The invention has at least the following advantages: the through hole is filled through the pulse, the through hole is filled, the surface copper thickness of the circuit board can be reduced when the hole copper thickness of the through hole reaches the standard, the arrangement of precise circuits on the surface of the circuit board is facilitated, the circuit processing capacity of the circuit board is greatly improved, the problem of circuit short circuit caused by the excessive thickness of the surface copper is avoided, the qualified rate of the circuit is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a hole filling method for a through hole of a circuit board.
Background
With the rapid development of the electronic industry, the application of the circuit board is more extensive, and the requirements for the functions of the circuit board are more abundant, especially the requirements for via holes and circuits on the circuit board are higher. At present, the circuit board is processed by adopting a conventional hole filling mode on the basis of the existing through hole and the blind hole, when the through hole meets the requirement of the thickness of hole copper, the thickness of the circuit board surface copper is thicker, the line width and the line distance on the circuit board are influenced, the circuit process capability on the circuit board is greatly reduced, the yield of the circuit is influenced due to the thicker circuit board surface copper, the circuit board is easy to cause the short circuit phenomenon, the reject ratio of the circuit board is increased, and the production cost of the circuit board is improved.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the invention provides a hole filling method for a through hole of a circuit board, which is used for solving the problems that the copper thickness of the through hole reaches the standard and the copper thickness of the surface of the circuit board is thicker.
The embodiment of the application discloses a hole filling method for a circuit board through hole, the processing method is characterized in that the through hole of the circuit board is subjected to pulse hole filling copper plating, when the hole copper thickness of the through hole reaches the standard, the surface copper thickness of the circuit board can be reduced, the circuit processing capacity of the circuit board is greatly improved, the qualification rate of circuits is improved, and the short circuit phenomenon of the circuit board is avoided, and the hole filling method for the circuit board through hole comprises the following steps:
forming a through hole on the circuit board;
removing glue from the through hole and cleaning for the first time;
after the first cleaning is finished, carrying out copper deposition treatment on the circuit board so as to form a first conductive layer on the hole wall of the through hole and carrying out second cleaning;
after the second cleaning is finished, detecting whether residual glue exists on the hole wall of the through hole or not;
and if no residual glue exists on the hole wall of the through hole, carrying out copper plating on the through hole in a pulse hole filling mode so as to form a second conducting layer on the first conducting layer until the through hole is filled.
Further, the step of removing glue from the through hole and performing the first cleaning is plasma glue removal.
Further, the first cleaning in the step of removing the glue from the through hole and performing the first cleaning is plasma cleaning.
Further, the step of performing copper deposition on the circuit board after the first cleaning is completed to form the first conductive layer on the hole wall of the through hole and perform the second cleaning includes performing physical adsorption on the hole wall of the through hole, and includes: and soaking the circuit board into the medicinal liquid to enable the whole circuit board to be attached with carbon ions, and attaching the carbon ions to the hole wall of the through hole to form a first conducting layer.
Further, the second cleaning in the step of "performing a copper deposition treatment on the circuit board after the first cleaning is completed to form the first conductive layer on the hole wall of the through hole and performing the second cleaning" is to clean the circuit board by using a dilute sulfuric acid solution, and includes: and immersing the circuit board into the dilute sulfuric acid solution, wherein the dilute sulfuric acid solution flows along a certain direction to wash away carbon ions of the circuit board except the through hole.
Further, the volume of the through hole is larger than that of the first conducting layer.
Further, in the step of detecting whether residual glue exists on the hole wall of the through hole after the second cleaning is completed, the hole wall of the through hole is qualified if no residual glue exists on the hole wall, and is unqualified if residual glue exists on the hole wall.
Further, in the step "if no residual glue exists on the hole wall of the through hole, copper plating is performed on the through hole in a pulse hole filling mode so as to form a second conductive layer on the first conductive layer until the through hole is filled up", copper plating is performed on the through hole in the pulse hole filling mode, and the ratio of the thickness of surface copper to the thickness of hole copper is about 1: 1.4.
Further, the pulse hole filling time is 40 minutes.
The invention has the following beneficial effects:
1. according to the processing method of the through hole, on the basis of the through hole of the circuit board, a first conducting layer is formed on the wall of the through hole of an original insulating layer through physical adsorption, then pulse hole filling copper plating is carried out on the through hole, when the thickness of the hole copper of the through hole reaches the standard, the thickness of surface copper of the circuit board is reduced, the thickness ratio of the surface copper to the thickness of the hole copper is increased from 1:0.75 to 1:1.4, arrangement of precise circuits on the surface of the circuit board is facilitated, the circuit processing capacity of the circuit board is greatly improved, the problem of short circuit caused by over-thick surface copper is avoided, the qualification rate of the circuits is improved, and the production cost is reduced.
2. The through hole can be filled in about 40 minutes by filling the through hole through pulse filling, and the filling of the through hole in a common hole filling mode takes about 1 hour.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for filling through holes in a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a circuit board via in an embodiment of the invention;
reference numerals of the above figures: 1. a through hole; 2. an outer substrate; 3. an inner layer substrate; 4. a first conductive layer; 5. a second conductive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
According to the hole filling method for the circuit board through hole, the through hole is subjected to pulse hole filling copper plating on the basis that the circuit board is provided with the through hole and the blind hole, when the hole copper thickness of the through hole reaches the standard, the surface copper thickness of the circuit board is also reduced, the circuit processing capacity of the circuit board is greatly improved, and the qualification rate of the circuit is improved, wherein the hole filling method for the circuit board through hole comprises the following steps:
forming a through hole 1 on the circuit board;
removing glue from the through hole 1 and cleaning for the first time;
after the first cleaning is finished, carrying out copper deposition treatment on the circuit board to form a first conductive layer 4 on the hole wall of the through hole 1 and carrying out second cleaning;
after the second cleaning is finished, detecting whether residual glue exists on the hole wall of the through hole 1 or not;
if no residual glue exists on the hole wall of the through hole 1, copper plating is carried out on the through hole 1 in a pulse hole filling mode, so that a second conducting layer 5 is formed on the first conducting layer 4 until the through hole 1 is filled.
With reference to fig. 1 and 2, by adopting the above scheme, the circuit board is cut into a required size according to design requirements, and a through hole 1 is mechanically drilled in the cut circuit board, wherein the through hole 1 is communicated with an outer layer substrate 2 and an inner layer substrate 3 of the circuit board and penetrates through the circuit board. And inspecting the quality of the through hole 1, wherein the through hole cannot have defects such as burrs, flashes and the like. After the through hole 1 is processed, releasing O under vacuum by a pulp grinder2、N2And (3) carrying out plasma glue removing cleaning on the circuit board and the through hole 1, and slicing to confirm the color of the hole wall of the through hole so as to remove the residual glue on the circuit board and the hole wall of the through hole 1. After the residual glue on the hole walls of the circuit board and the through hole 1 is removed, the circuit board and the hole walls of the through hole 1 are cleaned through plasma cleaning, so that the circuit board and the residual glue residues on the hole walls of the through hole 1 are cleaned. And then carrying out copper plating pretreatment on the cleaned through hole 1, placing the circuit board in a liquid medicine, and soaking for a long time, wherein a layer of carbon ions can be attached to the surface of the circuit board and the wall of the through hole 1 through physical adsorption, so that a first conductive layer 4 is formed on the wall of the through hole 1. Then placing the circuit board in dilute sulfuric acid, wherein the dilute sulfuric acid flows on the circuit board from front to back so as to separate the redundant carbon on the outer surface of the through hole 1 of the circuit boardThe seeds are rinsed off. The through-hole 1 is subjected to a copper plating process within 48h of the formation of the first conductive layer 4 in the through-hole 1. Detecting the hole wall of the through hole 1 by a detector, confirming whether the hole wall of the through hole 1 has residual glue, and if the hole wall of the through hole 1 has residual glue, determining that the circuit board is a defective product; if the hole wall of the through hole 1 has no residual glue, the circuit board is a qualified product. And finally, carrying out copper plating on the circuit board without residual glue on the hole wall of the through hole, and carrying out copper plating on the through hole 1 through pulse hole filling to form a second conducting layer 5 until the through hole 1 is completely filled, so that no gap is formed in the through hole 1. And (3) carrying out copper plating on the through hole 1 by a pulse hole filling method, wherein when the thickness of the hole copper reaches the standard, the thickness of the circuit board surface copper is also reduced. According to a large amount of experimental data, the pulse hole filling enables the thickness of the surface copper and the hole copper to be improved from the original 1:0.75 to 1:1.4, the processing capacity of the circuit board is greatly improved, and the qualification rate of the circuit board is improved.
Specifically, in this embodiment, the method for filling the through hole 1 of the circuit board includes the following steps:
and cutting the circuit board into required sizes according to design requirements, and chamfering and edging the circuit board after cutting. And through holes 1 are formed in the wiring board by mechanical drilling. The through hole 1 is communicated with the outer layer base material 2 and the inner layer base material 3 of the circuit board and penetrates through the circuit board. And inspecting the quality of the through hole 1, wherein the defects such as burrs, flashes and the like cannot occur.
O release under vacuum by means of a pulper2、N2And (3) carrying out plasma glue removing and cleaning on the circuit board and the through hole 1, and slicing to confirm the color and the smoothness degree of the hole wall of the through hole so as to remove the residual glue on the circuit board and the hole wall of the through hole 1. And cleaning the circuit board and the hole wall of the through hole 1 by plasma cleaning, so that the residual glue residues on the circuit board and the hole wall of the through hole 1 are cleaned. And the plasma cleaning is used for cleaning the glue residues on the wall of the through hole, and coarsening the surface of the circuit board and the wall surface of the through hole so as to improve the binding force of the through hole.
After the first cleaning is finished, carrying out copper deposition treatment on the circuit board, and immersing the circuit board into liquid medicine, wherein the concentration of the liquid medicine is 2.2% -2.7%, the optimal concentration value is 2.45%, the pH value of the liquid medicine is 9.8-10.6, the optimal pH value is 10.2, and the copper content in the liquid medicine is less than 30 g/L. Make whole circuit board all adhere to carbon ion through physical adsorption, the speed that liquid medicine flows is 1.5 meters/minute, according to the size of different circuit boards in the pore wall of through-hole 1 adheres to carbon ion and forms first conducting layer 4 and need different time to make the insulating through-hole pore wall of itself have the electric conductivity. And then placing the circuit board in dilute sulfuric acid, wherein the concentration of the dilute sulfuric acid solution is 0.5-1.5%, and the optimal concentration value is 1.0%. The dilute sulfuric acid flows from front to back on the circuit board so as to wash away redundant carbon ions on the outer surface of the circuit board except the through hole 1.
After the cleaning for the second time is finished, the detection personnel slice the through hole 1, and the slice is detected through a high power microscope to confirm whether the residual glue exists on the hole wall of the through hole 1. If the hole wall of the through hole 1 has residual glue, the circuit board is a defective product; if the hole wall of the through hole 1 has no residual glue, the circuit board is a qualified product.
The through-hole 1 is subjected to a copper plating process within 48h of the formation of the first conductive layer 4 in the through-hole 1. If no residual glue exists on the hole wall of the through hole 1, copper plating is carried out on the through hole 1 of the qualified circuit board by using a pulse hole filling method so as to form a second conducting layer 5 on the first conducting layer 4 until the through hole 1 is filled up, and no gap exists in the through hole 1. The pulse hole filling enables the thickness of the surface copper and the hole copper to be improved from 1:0.75 to 1:1.4, and the processing capacity of the circuit board is greatly improved.
Specifically, in this embodiment, the step of removing the glue from the through hole 1 and performing the first cleaning is plasma glue removal. O release under vacuum by means of a pulper2、N2And (3) carrying out plasma glue removing and cleaning on the circuit board and the through hole 1 so as to remove the residual glue residues in the circuit board and the through hole 1.
In a preferred embodiment, the first cleaning in the step of "removing the glue from the through-hole 1 and performing the first cleaning" is a plasma cleaning. The plasma cleaning does not need to consume water resources, does not need to add any chemical solvent, does not pollute the environment, does not damage the surface of the circuit board, and achieves the purpose of removing the residual impurities on the circuit board.
Specifically, in this embodiment, the step of processing the hole wall of the through hole 1 by physical adsorption in "after the first cleaning is completed, performing a copper deposition process on the circuit board to form the first conductive layer 4 on the hole wall of the through hole 1 and performing the second cleaning" includes: and soaking the circuit board into the liquid medicine to enable the whole circuit board to be attached with carbon ions. The surface of the through hole 1 is an insulating layer at first, and carbon ions are attached to the hole wall of the through hole 1 to form a first conductive layer 4, so that the insulated hole wall generates conductivity, and the subsequent copper plating process can be smoothly carried out.
In a preferred embodiment, the second cleaning in the step of "performing a copper deposition process on the circuit board after the first cleaning is completed to form the first conductive layer 4 on the wall of the through hole 1 and performing the second cleaning" is to clean the circuit board by a dilute sulfuric acid solution, and includes: and immersing the circuit board into the dilute sulfuric acid solution, wherein the dilute sulfuric acid solution flows along a certain direction to wash away carbon ions of the circuit board except the through hole 1.
Specifically, in the present embodiment, the volume of the through hole 1 is larger than the volume of the first conductive layer 4. The first conducting layer 4 is formed on the hole wall of the through hole 1 without conducting capacity through physical adsorption, so that the subsequent copper plating process on the hole wall of the through hole 1 can be smoothly carried out.
Specifically, in this embodiment, in the step "after the second cleaning, detect whether there is residual glue on the hole wall of the through hole 1", if there is no residual glue on the hole wall of the through hole 1, the hole wall is a qualified product, and if there is residual glue, the hole wall is an unqualified product.
Specifically, in the step "if there is no residual glue on the hole wall of the through hole 1, copper plating is performed on the through hole 1 in a pulse hole filling manner to form the second conductive layer 5 on the first conductive layer 4 until the through hole 1 is filled up", copper plating is performed on the through hole 1 in the pulse hole filling manner to form the second conductive layer 5 on the first conductive layer 4 until the through hole 1 is filled up, and there is no gap in the through hole 1. And after pulse hole filling, the ratio of the thickness of the circuit board surface copper to the thickness of the through hole 1 hole copper is increased to 1:1.4 from 1:0.75 of the original common hole filling mode. The thickness of the surface copper is reduced, so that the circuit board is convenient to arrange, and the processing capacity of the circuit board is greatly improved.
In a preferred embodiment, the pulse fills the hole for 40 minutes. The through holes 1 are plated with copper in a common hole filling mode, and the hole filling time is about 1 h. The working efficiency of copper plating of the through holes 1 is greatly improved through a pulse hole filling mode.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the technical scheme and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (9)
1. A method for filling a through hole of a circuit board is characterized by comprising the following steps:
forming a through hole on the circuit board;
removing glue from the through hole and cleaning for the first time;
after the first cleaning is finished, carrying out copper deposition treatment on the circuit board so as to form a first conductive layer on the hole wall of the through hole and carrying out second cleaning;
after the second cleaning is finished, detecting whether residual glue exists on the hole wall of the through hole or not;
and if no residual glue exists on the hole wall of the through hole, carrying out copper plating on the through hole in a pulse hole filling mode so as to form a second conducting layer on the first conducting layer until the through hole is filled.
2. The method of claim 1, wherein the step of removing the glue from the through hole and performing the first cleaning is a plasma glue removal.
3. The method for filling a via hole of a circuit board according to claim 2, wherein the first cleaning in the step of removing the glue from the via hole and performing the first cleaning is a plasma cleaning.
4. The method for filling a via hole in a circuit board according to claim 1, wherein the step of "performing a copper deposition process on the circuit board after the first cleaning to form a first conductive layer on the wall of the via hole and performing a second cleaning" is a step of performing a physical adsorption process on the wall of the via hole, and includes: and soaking the circuit board into the medicinal liquid to enable the whole circuit board to be attached with carbon ions, and attaching the carbon ions to the hole wall of the through hole to form a first conducting layer.
5. The method for filling a via hole in a circuit board according to claim 4, wherein the second cleaning in the step of "after the first cleaning, performing copper deposition on the circuit board to form the first conductive layer on the wall of the via hole and performing the second cleaning" is to clean the circuit board with a dilute sulfuric acid solution, and includes: and immersing the circuit board into the dilute sulfuric acid solution, wherein the dilute sulfuric acid solution flows along a certain direction to wash away carbon ions of the circuit board except the through hole.
6. A method for filling a via hole of a wiring board according to claim 1, wherein a volume of the via hole is larger than a volume of the first conductive layer.
7. The method for filling a via hole in a circuit board according to claim 1, wherein in the step of detecting whether residual glue exists on the wall of the via hole after the second cleaning, the wall of the via hole is qualified if no residual glue exists on the wall of the via hole, and is unqualified if residual glue exists on the wall of the via hole.
8. The method for filling a through hole of a circuit board according to claim 1, wherein in the step of "if no adhesive residue exists on the wall of the through hole, copper plating is performed on the through hole by using a pulse hole filling manner so as to form a second conductive layer on the first conductive layer until the through hole is filled", and the through hole is plated with copper by using the pulse hole filling manner, wherein the ratio of the thickness of surface copper to the thickness of hole copper is about 1: 1.4.
9. A method for filling a via hole in a circuit board according to claim 8, wherein the pulse filling time is 40 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011262595.XA CN112739068A (en) | 2020-11-12 | 2020-11-12 | Hole filling method for through hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011262595.XA CN112739068A (en) | 2020-11-12 | 2020-11-12 | Hole filling method for through hole of circuit board |
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| Publication Number | Publication Date |
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| CN112739068A true CN112739068A (en) | 2021-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011262595.XA Pending CN112739068A (en) | 2020-11-12 | 2020-11-12 | Hole filling method for through hole of circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114173492A (en) * | 2021-10-19 | 2022-03-11 | 安捷利美维电子(厦门)有限责任公司 | Through blind hole design method for detecting hole filling capacity of circuit board |
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