CN105764270A - Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing - Google Patents
Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing Download PDFInfo
- Publication number
- CN105764270A CN105764270A CN201610258116.4A CN201610258116A CN105764270A CN 105764270 A CN105764270 A CN 105764270A CN 201610258116 A CN201610258116 A CN 201610258116A CN 105764270 A CN105764270 A CN 105764270A
- Authority
- CN
- China
- Prior art keywords
- golden finger
- layer
- electricity gold
- gold wire
- electricity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Abstract
The invention relates to the circuit board production technology field and especially relates to a manufacturing method of a PCB possessing entire board electrolytic gold and golden finger surface processing. In the invention, an electrolytic gold lead is made when an external layer line is made, and simultaneously, orders of a manufacturing flow are adjusted so that the entire board electrolytic gold surface processing and the golden finger surface processing are performed after the external layer line is made. Therefore, a severe lateral erosion problem is solved. A problem that a line side surface and a golden finger side surface have suspended gold is avoided. Through the method in the invention, quality of the PCB possessing the entire board electrolytic gold surface processing and the golden finger surface processing can be guaranteed.
Description
Technical field
The present invention relates to board production technical field, particularly relate to the manufacture method of a kind of PCB with imposite electricity gold and golden finger surface treatment.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed circuit board, also known as printed substrate.Part PCB, in order to meet certain electrical performance demands, need to do imposite electricity gold surface and process and golden finger surface treatment.Prior art is generally not added with lead-in wire when making the PCB with imposite electricity gold and golden finger surface treatment, the mode using alkali etching makes, and Making programme is generally as follows: sawing sheet → internal layer circuit → pressing → boring → heavy copper → electric plating of whole board → outer graphics → graphic plating (copper facing is not tin plating) → electronickelling gold (imposite electricity gold) → outer graphics 2 (windowing at golden finger position place) → local electric gold (golden finger position thickening) → take off film → outer layer etching → silk-screen welding resistance, character → molding.Existing manufacture method due to be imposite electricity gold and local electric gold after do again outer layer etching, serious lateral erosion problem easily occurs, the outstanding gold in circuit side and golden finger side occurs after causing outer layer etching, the golden finger cross sectional representation of the outstanding gold in side as shown in Figure 1,11 is the plating layer gold at golden finger top, 12 is the layers of copper bottom golden finger, and 13 is base material.If the outstanding gold in circuit side and/or golden finger side is excessive, there will be and subside, seriously can become breach if collapsing, having a strong impact on the quality of finished product.
Summary of the invention
The present invention is directed to prior art and make the PCB with imposite electricity gold and golden finger surface treatment, the problem that outstanding gold easily occur in circuit side and golden finger side, it is provided that the manufacture method of a kind of PCB avoiding the outstanding gold in circuit side and golden finger side.
For achieving the above object, the present invention is by the following technical solutions.
The manufacture method of a kind of PCB with imposite electricity gold and golden finger surface treatment, comprises the following steps:
S1 makes electricity gold wire: first passing sequentially through pad pasting, exposure and development treatment and make outer-layer circuit figure and electricity gold wire figure on multilayer boards, described outer-layer circuit figure includes golden finger figure and line pattern；Then passing sequentially through graphic plating and outer layer etch processes, make outer-layer circuit figure and electricity gold wire figure be changed into outer-layer circuit and electricity gold wire respectively, described outer-layer circuit includes circuit and golden finger position.
Described multi-layer sheet is after being integrated by core material, prepreg and outer copper foil pressing and sequentially passes through the plate that boring, heavy copper and electric plating of whole board process.
S2 makes electricity gold wire protective layer: first make solder mask on multilayer boards according to prior art, and then silk-screen anti-electricity bronze ink on electricity gold wire, forms electricity gold wire protective layer.
S3 imposite electricity gold surface processes: according to prior art electronickelling and electrogilding successively on multilayer boards.
S4 golden finger surface treatment: first passing sequentially through pad pasting, exposure and development treatment and make the first dry film protective layer on multilayer boards, described first dry film protective layer is windowed at golden finger position place；Then thick metal plated on golden finger position, form golden finger.
S5 is except electricity gold wire: first take off the first dry film protective layer according to prior art, then passes through outer layer etch processes and removes electricity gold wire.
Operation after S6: be shaped multi-layer sheet successively according to prior art processing, prepare PCB finished product.
Compared with prior art, the invention has the beneficial effects as follows: the present invention by making electricity gold wire in the lump when making outer-layer circuit, adjust the order of Making programme simultaneously, make can to carry out imposite electricity gold surface after making outer-layer circuit again to process and golden finger surface treatment, thus solving the problem that lateral erosion is serious, thus avoid circuit side and golden finger side and outstanding gold problem occurs, can be ensured that by the inventive method having imposite electricity gold surface concurrently processes the quality of the PCB with golden finger surface treatment.
Accompanying drawing explanation
Fig. 1 is the golden finger cross sectional representation of the outstanding gold in side；
Fig. 2 is the multiple-plate structural representation having made outer-layer circuit and electricity gold wire in embodiment.
Detailed description of the invention
In order to understand the technology contents of the present invention more fully, below in conjunction with specific embodiment technical scheme it is described further and illustrates.
Embodiment 1
The present embodiment provides the manufacture method of a kind of PCB with imposite electricity gold and golden finger surface treatment.Concrete making step is as follows:
(1) front operation
According to prior art by pre-set dimension by base material sawing sheet, do not made the core material of internal layer circuit.Then pass through negative film technique on core material, make internal layer circuit.
Core material then carries out internal layer AOI (automated optical inspection), and whether the internal layer circuit on detection core material exists out the defects such as short circuit, in order to be modified.
Core material is carried out brown process, then by predetermined lamination order, core material, prepreg, outer copper foil is stacked together and forms pre-stack structure, then pre-stack structure pressing is integrated, forms multi-layer sheet.
Hole on multilayer boards according to drilling data, and pass sequentially through heavy copper and electric plating of whole board and process and make hole metallization.
(2) electricity gold wire is made
Outer graphics processing mode according to prior art, passes sequentially through pad pasting, exposure and development treatment and makes outer-layer circuit figure and electricity gold wire figure on multilayer boards, and described outer-layer circuit figure includes golden finger figure and line pattern.
Then passing sequentially through graphic plating and outer layer etch processes, make outer-layer circuit figure and electricity gold wire figure be changed into outer-layer circuit and electricity gold wire respectively, outer-layer circuit then correspondence includes circuit and golden finger position, as shown in Figure 2,21 is golden finger position, and 22 is circuit, and 23 is electricity gold wire.
Outer layer central layer then carries out outer layer AOI (automated optical inspection), and whether the outer-layer circuit on detection outer layer central layer exists out the defects such as short circuit, in order to be modified.
(3) solder mask is made
According to prior art silk-screen solder mask on multilayer boards, make solder mask.
(4) electricity gold wire protective layer is made
Silk-screen anti-electricity bronze ink on electric gold wire on multilayer boards, forms electricity gold wire protective layer.
(5) imposite electricity gold surface processes
According to prior art electronickelling on multilayer boards, form nickel dam, then electrogilding on nickel dam again, form layer gold.
(6) golden finger surface treatment
Outer graphics processing mode according to prior art, passes sequentially through pad pasting, exposure and development treatment and makes the first dry film protective layer on multilayer boards, and the first dry film protective layer is windowed at golden finger position place, makes golden finger position exposed out.Then according to existing thick metal plated mode on golden finger position thick metal plated, prepare golden finger finished product.
(7) except electricity gold wire
After first taking off the first dry film protection according to prior art, using the layer gold on multi-layer sheet as resistant layer (electricity gold wire covers without layer gold), remove electricity gold wire by outer layer etch processes.
(8) operation afterwards
Successively multi-layer sheet is sequentially carried out according to prior art forming processes, electrical testing, eventually inspection, FQA etc., prepares PCB finished product.
The above only further illustrates the technology contents of the present invention with embodiment, in order to reader is easier to understand, but does not represent embodiments of the present invention and be only limitted to this, and any technology done according to the present invention extends or recreation, all by the protection of the present invention.
Claims (2)
1. the manufacture method of a PCB with imposite electricity gold and golden finger surface treatment, it is characterised in that comprise the following steps:
S1 makes electricity gold wire: first passing sequentially through pad pasting, exposure and development treatment and make outer-layer circuit figure and electricity gold wire figure on multilayer boards, described outer-layer circuit figure includes golden finger figure and line pattern；Then passing sequentially through graphic plating and outer layer etch processes, make outer-layer circuit figure and electricity gold wire figure be changed into outer-layer circuit and electricity gold wire respectively, described outer-layer circuit includes circuit and golden finger position；
S2 makes electricity gold wire protective layer: first make solder mask on multilayer boards according to prior art, and then silk-screen anti-electricity bronze ink on electricity gold wire, forms electricity gold wire protective layer；
S3 imposite electricity gold surface processes: according to prior art electronickelling and electrogilding successively on multilayer boards；
S4 golden finger surface treatment: first passing sequentially through pad pasting, exposure and development treatment and make the first dry film protective layer on multilayer boards, described first dry film protective layer is windowed at golden finger position place；Then thick metal plated on golden finger position, form golden finger；
S5 is except electricity gold wire: first take off the first dry film protective layer according to prior art, then passes through outer layer etch processes and removes electricity gold wire；
Operation after S6: be shaped multi-layer sheet successively according to prior art processing, prepare PCB finished product.
2. a kind of manufacture method of PCB with imposite electricity gold and golden finger surface treatment according to claim 1, it is characterized in that, in step S1, described multi-layer sheet is after being integrated by core material, prepreg and outer copper foil pressing and sequentially passes through the plate that boring, heavy copper and electric plating of whole board process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610258116.4A CN105764270A (en) | 2016-04-22 | 2016-04-22 | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610258116.4A CN105764270A (en) | 2016-04-22 | 2016-04-22 | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105764270A true CN105764270A (en) | 2016-07-13 |
Family
ID=56325703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610258116.4A Pending CN105764270A (en) | 2016-04-22 | 2016-04-22 | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105764270A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231804A (en) * | 2016-08-09 | 2016-12-14 | 安徽广德威正光电科技有限公司 | A kind of processing technology of pcb board |
| CN106937491A (en) * | 2017-04-05 | 2017-07-07 | 广东浪潮大数据研究有限公司 | One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
| CN115696764A (en) * | 2022-07-29 | 2023-02-03 | 欣强电子（清远）有限公司 | Method for manufacturing electric gold lead of rigid-flex board and rigid-flex board |
| CN115884525A (en) * | 2023-02-10 | 2023-03-31 | 圆周率半导体(南通)有限公司 | Novel gold electroplating process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN101378635A (en) * | 2008-09-19 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for producing circuit board with local electric thick gold |
| CN103037626A (en) * | 2012-06-11 | 2013-04-10 | 北京凯迪思电路板有限公司 | Circuit board surface treatment method by electroplating process |
| CN103648241A (en) * | 2013-12-09 | 2014-03-19 | 深圳市深联电路有限公司 | Internal-arranged lead manufacturing technology of long and short printed plug circuit board |
| WO2015085933A1 (en) * | 2013-12-11 | 2015-06-18 | 广州兴森快捷电路科技有限公司 | Method for manufacturing leadless printed circuit board locally plated with hard gold |
| CN105282983A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Lead wire etching technology with gold fingers with three surfaces wrapped by gold |
-
2016
- 2016-04-22 CN CN201610258116.4A patent/CN105764270A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN101378635A (en) * | 2008-09-19 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for producing circuit board with local electric thick gold |
| CN103037626A (en) * | 2012-06-11 | 2013-04-10 | 北京凯迪思电路板有限公司 | Circuit board surface treatment method by electroplating process |
| CN103648241A (en) * | 2013-12-09 | 2014-03-19 | 深圳市深联电路有限公司 | Internal-arranged lead manufacturing technology of long and short printed plug circuit board |
| WO2015085933A1 (en) * | 2013-12-11 | 2015-06-18 | 广州兴森快捷电路科技有限公司 | Method for manufacturing leadless printed circuit board locally plated with hard gold |
| CN105282983A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Lead wire etching technology with gold fingers with three surfaces wrapped by gold |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231804A (en) * | 2016-08-09 | 2016-12-14 | 安徽广德威正光电科技有限公司 | A kind of processing technology of pcb board |
| CN106231804B (en) * | 2016-08-09 | 2019-01-18 | 安徽广德威正光电科技有限公司 | A kind of manufacture craft of pcb board |
| CN106937491A (en) * | 2017-04-05 | 2017-07-07 | 广东浪潮大数据研究有限公司 | One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
| CN115696764A (en) * | 2022-07-29 | 2023-02-03 | 欣强电子（清远）有限公司 | Method for manufacturing electric gold lead of rigid-flex board and rigid-flex board |
| CN115884525A (en) * | 2023-02-10 | 2023-03-31 | 圆周率半导体(南通)有限公司 | Novel gold electroplating process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN105517374B (en) | A kind of production method of thin core plate HDI plate | |
| CN104363720B (en) | A kind of method for making deep blind slot in the pcb | |
| CN104717846B (en) | The preparation method of metallization slotted eye in a kind of PCB | |
| CN104284520B (en) | A kind of PCB surface processing method | |
| CN105578778A (en) | Manufacturing method of single-face local thick-gold plated PCB | |
| CN102364999A (en) | Manufacturing method of mechanical conduction hole circuit board without holes on surface | |
| CN104918421A (en) | Manufacturing method for PCB golden finger | |
| CN105208790B (en) | A method of making solder mask on PCB | |
| CN105848423B (en) | A kind of production method of the PCB with electroplating gold and chemical two kinds of surface treatments of turmeric | |
| CN104363704A (en) | Manufacturing method of thick hole copper PCB | |
| CN107708316A (en) | A kind of preparation method of superfinishing fine rule road | |
| CN105704948A (en) | Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN110430677A (en) | It is a kind of to improve back drill hole burr and crimp hole PCB preparation method less than normal | |
| CN109874232A (en) | A kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed | |
| CN105392288A (en) | Method for manufacturing metalized blind holes on PCB | |
| CN106714453A (en) | Pseudo rigid-flex board and preparation method thereof | |
| CN108289388A (en) | The undesirable PCB production methods of tin in a kind of prevention | |
| CN106793578A (en) | A kind of PCB preparation methods in electric thick gold hole | |
| CN105357893B (en) | A kind of production method of carbon oil plate | |
| CN105120600B (en) | A kind of nickel surface processing method | |
| CN110708873A (en) | Manufacturing method for realizing positioning of embedded copper block | |
| CN108401381A (en) | A kind of production method of disconnecting golden finger class printed circuit board | |
| CN105517373B (en) | A kind of production method of PCB backboards outer-layer circuit figure | |
| CN110944454A (en) | Circuit board production process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160713 |