CN106535482A - Resin-filled back drilling hole processing method of PCB (Printed Circuit Board) - Google Patents
Resin-filled back drilling hole processing method of PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN106535482A CN106535482A CN201611179936.0A CN201611179936A CN106535482A CN 106535482 A CN106535482 A CN 106535482A CN 201611179936 A CN201611179936 A CN 201611179936A CN 106535482 A CN106535482 A CN 106535482A
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- Prior art keywords
- resin
- hole
- copper
- plating
- processing method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The invention relates to a resin-filled back drilling hole processing method of a PCB (Printed Circuit Board). The processing method comprises the steps of drilling through holes in a multi-layer PCB after previous procedure processing and lamination processing; plating copper to conduct the through holes, and electroplating a board surface; drilling a back drilling hole in the multi-layer PCB; filling the whole back drilling hole and the through holes which are needed to be filled with resin with the resin, grinding the board with an abrasive belt; fabricating an outer-layer pattern, covering the holes, reducing the copper, and grinding the board with the abrasive belt again; drilling a counter hole, depositing a copper plate, filling the holes with the resin for electroplating and filling; and entering a post procedure after fabricating the outer-layer pattern, electroplating the pattern, etching the outer layer, performing outer-layer AOI and performing soldering resist processing. By the processing method, the back drilling hole is an NPTH (Non Plating Through Hole) and is filled with the resin, the circuit quality is ensured, a PTH (Plating Through Hole) and the NPTH back drilling hole are both filled with the resin, and the signal reality is improved to a relatively high extent.
Description
Technical field
The present invention relates to the technical field of wiring board manufacture, more specifically refers to a kind of pcb board in resin plug back drill hole
Processing method.
Background technology
The useless hole copper part of plated-through-hole on wiring board can cause turning back, resonating for signal, cause signal transmission reflection,
Scattering, delay etc., bring distortion to signal.Therefore, in PCB manufacture processes, especially in the High-Speed PCB course of processing, it is anti-
Stop signal distortion or delay, need to bore to fall not playing the through hole section of any connection or transmitting effect to realize in through hole one end
To reduce the loss of signal, that is, carry on the back drilling design.
To increase welding density, it is ensured that can weld on back drill hole site, it is necessary to fill out electroplating after back drill stopple resin
It is flat, in the manufacturing process of the PCB for having NPTH back drills hole, after typically scheming electricity, bore back drill hole.Flow process is as follows：Front operation-pressure
Conjunction-drilling-sink copper plate electric-outer graphics-graphic plating-brill back drill hole-move back film-outer layer etching-rear operation.Normal resin plug
Hole flow process is：Front operation-filling holes with resin-abrasive belt grinding-rear operation, also, normal condition lower counterbore got out after shaping, and be
NPTH。
But, in above-mentioned flow process, after getting out back drill hole, because line quality can be affected, it is impossible to carry out filling in resin and abrasive band
The action of nog plate, is only capable of meeting back drill hole for NPTH, it is impossible to meet back drill stopple resin simultaneously, therefore the pcb board produced
The reduction loss of signal of higher degree is extremely difficult to, it is difficult to keep the higher validity of signal.
Chinese patent 201510868146.2 discloses a kind of manufacture method of back drill filling holes with resin wiring board, at preamble
Drilling through on laminated circuit plate after reason needs the hole of back drill and other all through holes, all heavy copper conducting, through full plate copper facing, figure
The step such as after shape plating imposite is tin plating, electrical testing back drill hole, the patch dry film sealing of hole on the copper foil surface of laminated circuit plate, exposure are aobvious
Shadow exposes the back drill hole for needing filling holes with resin, and resin plug back drill hole simultaneously polishes, and after taking off the dry film of sealing of hole, then carries out outer-layer circuit figure
The subsequent handlings such as shape transfer.The manufacture method is capable of achieving selectivity plug back drill hole by dry film sealing of hole, and whole flow process only has No. 1 brill
Through hole, 1 sink copper plate electric, 1 figure electric current journey, 1 back drill flow process are simplified and are removed between flow process, and reduction making sheet flow process back and forth
Fortune, reduces flow process carrying, the quality risk that upper and lower plates process is brought.Increase ET tests before consent, detected whether Lou to carry on the back
Bore and back drill is bad, it is ensured that quality.
Above-mentioned patent is to expose the back drill hole for needing filling holes with resin using exposure imaging, and resin plug back drill hole simultaneously polishes, this
Exposing imperfect and causing back drill hole be completely exposed phenomenon easily occur in sample, therefore easilys lead to Lou fill in showing for resin
As causing the effect for reducing the loss of signal weaker.
Therefore, it is necessary to design a kind of pcb board processing method in resin plug back drill hole, realization can meet back drill hole and be
NPTH and plug resin, can guarantee that line quality again, while realize that the effect of resin can be filled in PTH through holes and NPTH back drills hole,
Can higher degree raising signal validity.
The content of the invention
It is an object of the invention to overcome the defect of prior art, there is provided a kind of pcb board processing side in resin plug back drill hole
Method.
For achieving the above object, the present invention is employed the following technical solutions：A kind of pcb board processing side in resin plug back drill hole
Method, methods described include：
To the multi-layer PCB board holes drilled through after the process of front operation and pressing are processed；
Heavy copper turns on through hole, and carries out electroplating processes to plate face；
To multi-layer PCB twist drill back drill hole；
Whole back drill hole is filled up with resin and need to fill in the through hole of resin, and carry out abrasive belt grinding；
Outer graphics are made, cap bore subtracts copper, then carries out abrasive belt grinding；
Counterbore is bored, the plating of resin plug hole position is filled and led up by rear sink copper plate electric；
Carry out outer graphics making, graphic plating, outer layer etching, outer layer AOI, welding resistance process after, into rear operation.
Its further technical scheme is：The described pair of multi-layer PCB board after the process of front operation and pressing are processed is drilled through
In the step of hole, holes drilled through includes the through hole for being not required to fortress resin and the through hole for needing filling holes with resin.
Its further technical scheme is：The making outer graphics, cap bore subtract copper, then the step of carry out abrasive belt grinding, lid
Hole uses dry film.
Its further technical scheme is：The brill counterbore, rear sink copper plate electric, the step of the plating of resin plug hole position is filled and led up
In, the copper thickness in the counterbore can thicken copper when resin plug hole position is electroplated during the process and graphic plating filled and led up and enter
Row adjustment.
Its further technical scheme is：The brill counterbore, rear sink copper plate electric, the step of the plating of resin plug hole position is filled and led up
In, described filling and leading up in the plating of resin plug hole position specifically carry out heavy copper and panel plating process.
Its further technical scheme is：It is described to carry out outer graphics making, graphic plating, outer layer etching, outer layer AOI, resistance
After weldering is processed, the step of into rear operation, the rear operation includes surface treatment procedure, molding procedure, open-short circuit, FQC
Inspection operation and packaging shipment operation.
Compared with the prior art, the invention has the advantages that：A kind of pcb board processing in the resin plug back drill hole of the present invention
Method, by all through holes of subdrilling, carries out sink copper plate electric to through hole, gets out back drill hole, resin plug back drill hole and needs to fill in resin
Through hole, and carry out abrasive belt grinding, then make outer graphics, cap bore subtracts copper, then carries out abrasive belt grinding, bores counterbore, sinks copper coin afterwards
Electricity, the plating of resin plug hole position is filled and led up, and enters back into the step of follow-up routine, and realization can meet back drill hole for NPTH and fill in tree
Fat, can guarantee that line quality again, while realizing that the effect of resin can be filled in PTH through holes and NPTH back drills hole, it is also possible to compared with elevation
The validity of the raising signal of degree.
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings.
Description of the drawings
A kind of flow chart of the pcb board processing method in resin plug back drill hole that Fig. 1 is provided for the specific embodiment of the invention；
The view of the holes drilled through that Fig. 2 is provided for the specific embodiment of the invention；
Fig. 3 is the metallized view of the electroplates in hole that the specific embodiment of the invention is provided；
The view for boring back drill hole that Fig. 4 is provided for the specific embodiment of the invention；
The view of the filling holes with resin that Fig. 5 is provided for the specific embodiment of the invention；
Fig. 6 subtracts the view of copper for the cap bore that the specific embodiment of the invention is provided；
The view that Fig. 7 is filled and led up for the resin plug hole position plating that the specific embodiment of the invention is provided.
Specific embodiment
In order to more fully understand the technology contents of the present invention, technical scheme is entered with reference to specific embodiment
One step introduction and explanation, but it is not limited to this.
Specific embodiment as shown in Figures 1 to 7, a kind of pcb board processing in resin plug back drill hole that the present embodiment is provided
Method, during being used in manufacturing pcb board, realization can meet back drill hole for NPTH and fill in resin, and can protect
Card line quality, while realizing that the effect of resin can be filled in PTH through holes and NPTH back drills hole, it is also possible to the raising letter of higher degree
Number validity.
A kind of pcb board processing method in resin plug back drill hole, the method include：
S1, to through front operation process and pressing process after multi-layer PCB board holes drilled through；
S2, heavy copper conducting through hole, and electroplating processes are carried out to plate face；
S3, to multi-layer PCB twist drill back drill hole；
S4, whole back drill hole is filled up with resin and needs to fill in the through hole of resin, and carry out abrasive belt grinding；
S5, making outer graphics, cap bore subtracts copper, then carries out abrasive belt grinding；
S6, brill counterbore, rear sink copper plate electric will be filled and led up in the plating of resin plug hole position；
S7, carry out outer graphics making, graphic plating, outer layer etching, outer layer AOI, welding resistance process after, into rear operation.
As shown in Fig. 2 above-mentioned S1 steps, drill through to the multi-layer PCB board after the process of front operation and pressing are processed
In the step of hole, holes drilled through here includes the through hole for being not required to fortress resin and the through hole for needing filling holes with resin.
Above-mentioned front operation is processed includes sawing sheet and inner figure transfer, wherein, sawing sheet is big by MI desired sizes
Material is cut into small powder, and inner figure transfer includes patch dry film or applies wet film, and film inner layer erosion inspection is moved back in exposure imaging etching, by using phenanthrene
The media such as woods egative film, ink/dry film under the irradiation of ultraviolet high light are produced on required line pattern on internal substrate,
Again unwanted Copper Foil is etched away, the conducting wire of internal layer is finally made.
The nog plate processed before before inner figure transfer needing to carry out, inspection and roughening substrate in the etching of internal layer dry film internal layer
Copper face, is beneficial to cleaning plate face and increases the adhesion of plate face and dry and wet film, remove the covering of plate face debris, dry film and Copper Foil
Property ink.
Above-mentioned holes drilled through be in order to produce in the circuit board one allow rear operation complete connection line plate it is upper below
Or the passage of the electric conductivity between middle line layer.
In the present embodiment, above-mentioned S2 steps, sink copper conducting through hole, and the step of carry out electroplating processes to plate face, this
Process is the process of sink copper plate electric, and heavy copper is that one layer of conductive layers of copper is deposited on the hole wall insulated for assist side, facilitates plate
Electricity, conducting and the connection of internal layer circuit；As shown in figure 3, so just can guarantee that the signal transmission in back drill hole.
As shown in figure 4, S3 steps, the step of to multi-layer PCB twist drill back drill hole, it is for the back drill for generating NPTH here
Hole.
Above-mentioned S1 steps are to S3 steps, it is ensured that the integrated PTH through holes of same pcb board and NPTH back drills hole.
As shown in figure 5, for S4 steps, filling up whole back drill hole with resin and needing to fill in the through hole of resin, and carry out sand
The step of band nog plate, resin here can be PHP-900 resins ink or SKY-2000 resin ink, certainly, in other
Embodiment, above-mentioned resin can be the resin ink of other models.So, complete at the filling holes with resin to NPTH back drills hole
Reason, while line quality is ensure that, of course, it is possible to filling holes with resin process is carried out to PTH through holes according to practical situation, with compared with elevation
The validity of the raising signal of degree.
Above-mentioned PTH is plated-through-hole, hole wall metal lining and the hole of conductive pattern that is used for connecting intermediate layer or outer layer；
NPTH be non-plated-through-hole, hole wall not metal lining and be used for the hole of mechanical erection or mechanical fixing-assembly.
Further, as shown in fig. 6, S5 steps, make outer graphics, cap bore subtracts copper, then the step for carrying out abrasive belt grinding
Suddenly, cap bore here uses dry film, specifically needs to cover all through holes, while carry out subtracting Copper treatment, to ensure that copper is thick
Meet the requirements, while keeping back drill hole to be NPTH back drills hole.
In addition, as shown in fig. 7, S6 steps, counterbore is bored, rear sink copper plate electric, the step of the plating of resin plug hole position is filled and led up, this
In counterbore in copper it is thick can during the process and graphic plating that the plating of resin plug hole position is filled and led up when thicken copper and carry out
Adjustment, it is to avoid the copper in counterbore is thicker than thick or excessively thin and cause boring ratio adhesion and internal layer connection reliability to be affected.
In above-mentioned S6 steps, the process that the plating of resin plug hole position is filled and led up, mainly by heavy copper and panel plating
Reason, and the process of sink copper plate electric.
Further, in S7 steps, carry out outer graphics making, graphic plating, outer layer etching, at outer layer AOI, welding resistance
After reason, the step of into rear operation, outer graphics here make and include that patch dry film exposes and rush shadow；Graphic plating is to increase
The copper in circuit Ban Kong Xian faces is thick, the requirement for making up to；There is the operation for moving back film before outer layer etching, mainly using highly basic can make
Dry film dissolves or peel off property from plate face to be peeled off unwanted dry film or dissolve；Outer layer etching be using bivalence cuprammonium network and
The oxidisability of ion eating away from plate unwanted copper；Also carry out moving back stannum operation after outer layer etching, it is to utilize to move back to move back stannum
Nitric acid in stannum water can and stannum reaction dissolve away tin coating and reach and stannum be returned from plate；Outer layer AOI is by CCD scanning intake circuits
Plate image, itself and CAM test patterns are entered using computer compare and design specification logic process, by the bad point mark on wiring board
Note out and by bad point coordinate sends VRS to, final to confirm bad point position；Welding resistance is to prevent pcb board in inserting unit
When crossing wave-soldering after part, stannum extends through component side from via and causes short circuit, can efficiently solve scaling powder in welding process
The problem in via is remained in, product safety performance is improved, after the completion of element assembling, is formed negative pressure of vacuum shape on a testing machine
State, causes rosin joint in prevention surface tin cream ostium, affects attachment, prevent tin sweat(ing) is produced in via, it is to avoid PCB crosses backflow
During weldering, tin sweat(ing) ejects the short circuit for causing.
Above-mentioned rear operation includes：Surface treatment procedure, molding procedure, open-short circuit, FQC inspection operations and packaging
Shipment operation.
Specifically, surface treatment procedure is mainly as requested, and copper face is exposed to wiring board carries out the place of a figure layer
Reason processing；Main process has spray stannum:The stannum face of last layer weldability is sprayed on copper face using hot gas welding handling process；It is heavy
Stannum:Stannum is allowed to be deposited in plate face by chemical treatment using the principle of chemistry；Heavy silver:Silver is passed through using the principle of chemistry
The principles of chemistry are allowed to be deposited in plate face；Turmeric:Gold is allowed to be deposited in plate face by the principles of chemistry using the principle of chemistry；
It is gold-plated:Using the principle of plating, gold is allowed to by current/voltage control and is plated in plate face；Antioxidation:Will using the principle of chemistry
A kind of antioxidative chemical drugss are coated in plate face.
Molding procedure is mainly as requested, by shaped wiring board, the form factor required for being processed into；
Open-short circuit inspection is mainly into row line, the open circuit in hole and test for short-circuit；It is using sight or hardware check plate that FQC is checked
Face quality；Packaging shipment is to pack the plate of passed examination, final shipment.
A kind of pcb board processing method in above-mentioned resin plug back drill hole, by all through holes of subdrilling, carries out heavy copper to through hole
Plate electricity, gets out back drill hole, resin plug back drill hole and the through hole for needing plug resin, and carries out abrasive belt grinding, makes outer graphics again,
Cap bore subtracts copper, then carries out abrasive belt grinding, bores counterbore, and the plating of resin plug hole position is filled and led up, enters back into follow-up routine by rear sink copper plate electric
The step of, realization can meet back drill hole for NPTH and fill in resin, can guarantee that line quality again, at the same realize PTH through holes and
The effect of resin can be filled in NPTH back drills hole, it is also possible to the validity of the raising signal of higher degree.
It is above-mentioned only with embodiment further illustrating the technology contents of the present invention, be easier to understand in order to reader, but not
Represent embodiments of the present invention and be only limitted to this, it is any to extend or recreate according to the technology done by the present invention, by the present invention's
Protection.Protection scope of the present invention is defined by claims.
Claims (6)
1. a kind of pcb board processing method in resin plug back drill hole, it is characterised in that methods described includes：
To the multi-layer PCB board holes drilled through after the process of front operation and pressing are processed；
Heavy copper turns on through hole, and carries out electroplating processes to plate face；
To multi-layer PCB twist drill back drill hole；
Whole back drill hole is filled up with resin and need to fill in the through hole of resin, and carry out abrasive belt grinding；
Outer graphics are made, cap bore subtracts copper, then carries out abrasive belt grinding；
Counterbore is bored, the plating of resin plug hole position is filled and led up by rear sink copper plate electric；
Carry out outer graphics making, graphic plating, outer layer etching, outer layer AOI, welding resistance process after, into rear operation.
2. the pcb board processing method in a kind of resin plug back drill hole according to claim 1, it is characterised in that described to Jing
Cross front operation process and the step of multi-layer PCB board holes drilled through after pressing is processed in, holes drilled through includes being not required to fortress resin
Through hole and need the through hole of filling holes with resin.
3. a kind of pcb board processing method in resin plug back drill hole according to claim 2, it is characterised in that the making
Outer graphics, cap bore subtract copper, then the step of carry out abrasive belt grinding, cap bore uses dry film.
4. the pcb board processing method in a kind of resin plug back drill hole according to any one of claims 1 to 3, it is characterised in that
The brill counterbore, rear sink copper plate electric electroplate resin plug hole position in the step of filling and leading up, and the copper thickness in the counterbore can be in resin plug
Thicken copper when during the hole position process filled and led up of plating and graphic plating to be adjusted.
5. the pcb board processing method in a kind of resin plug back drill hole according to claim 4, it is characterised in that the brill sinks
Hole, rear sink copper plate electric electroplate resin plug hole position in the step of filling and leading up, and described filling and leading up in the plating of resin plug hole position is specifically carried out
Heavy copper and panel plating are processed.
6. the pcb board processing method in a kind of resin plug back drill hole according to claim 5, it is characterised in that described to carry out
Outer graphics making, graphic plating, outer layer etching, after the process of outer layer AOI, welding resistance, the step of into rear operation, the rear operation
Including surface treatment procedure, molding procedure, open-short circuit, FQC inspection operations and packaging shipment operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611179936.0A CN106535482A (en) | 2016-12-19 | 2016-12-19 | Resin-filled back drilling hole processing method of PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611179936.0A CN106535482A (en) | 2016-12-19 | 2016-12-19 | Resin-filled back drilling hole processing method of PCB (Printed Circuit Board) |
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| CN106535482A true CN106535482A (en) | 2017-03-22 |
Family
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| CN201611179936.0A Pending CN106535482A (en) | 2016-12-19 | 2016-12-19 | Resin-filled back drilling hole processing method of PCB (Printed Circuit Board) |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107817774A (en) * | 2017-11-21 | 2018-03-20 | 吉安市满坤科技有限公司 | A kind of printed circuit board intelligence manufacture technique |
| CN109246942A (en) * | 2018-10-19 | 2019-01-18 | 高德（江苏）电子科技有限公司 | A kind of processing technology of dry film cap bore removal printed wiring board surface layer copper thickness |
| CN109699122A (en) * | 2017-10-23 | 2019-04-30 | 健鼎（无锡）电子有限公司 | Circuit board and its manufacturing method |
| CN111712052A (en) * | 2020-07-13 | 2020-09-25 | 广东喜珍电路科技有限公司 | Back drilling hole sealing method for PCB outer shielding layer |
| CN112165770A (en) * | 2020-09-17 | 2021-01-01 | 胜宏科技（惠州）股份有限公司 | Method for improving large blind hole recess |
| CN112533383A (en) * | 2020-12-11 | 2021-03-19 | 胜宏科技（惠州）股份有限公司 | 22-layer low-loss PCB manufacturing method |
| CN113271716A (en) * | 2021-05-14 | 2021-08-17 | 惠州中京电子科技有限公司 | Process method for realizing shallow back drilling through etching |
| CN114040574A (en) * | 2021-10-15 | 2022-02-11 | 珠海杰赛科技有限公司 | Manufacturing method of PCB resin plug hole and printed circuit board |
| CN114286526A (en) * | 2021-12-02 | 2022-04-05 | 宜兴硅谷电子科技有限公司 | Copper reduction process of printed circuit board |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109699122A (en) * | 2017-10-23 | 2019-04-30 | 健鼎（无锡）电子有限公司 | Circuit board and its manufacturing method |
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| CN107817774A (en) * | 2017-11-21 | 2018-03-20 | 吉安市满坤科技有限公司 | A kind of printed circuit board intelligence manufacture technique |
| CN107817774B (en) * | 2017-11-21 | 2019-12-17 | 吉安市满坤科技有限公司 | intelligent manufacturing process of printed circuit board |
| CN109246942A (en) * | 2018-10-19 | 2019-01-18 | 高德（江苏）电子科技有限公司 | A kind of processing technology of dry film cap bore removal printed wiring board surface layer copper thickness |
| CN111712052A (en) * | 2020-07-13 | 2020-09-25 | 广东喜珍电路科技有限公司 | Back drilling hole sealing method for PCB outer shielding layer |
| CN112165770A (en) * | 2020-09-17 | 2021-01-01 | 胜宏科技（惠州）股份有限公司 | Method for improving large blind hole recess |
| CN112533383A (en) * | 2020-12-11 | 2021-03-19 | 胜宏科技（惠州）股份有限公司 | 22-layer low-loss PCB manufacturing method |
| CN113271716A (en) * | 2021-05-14 | 2021-08-17 | 惠州中京电子科技有限公司 | Process method for realizing shallow back drilling through etching |
| CN114040574A (en) * | 2021-10-15 | 2022-02-11 | 珠海杰赛科技有限公司 | Manufacturing method of PCB resin plug hole and printed circuit board |
| CN114286526A (en) * | 2021-12-02 | 2022-04-05 | 宜兴硅谷电子科技有限公司 | Copper reduction process of printed circuit board |
| CN114286526B (en) * | 2021-12-02 | 2023-08-25 | 宜兴硅谷电子科技有限公司 | Copper reduction process of printed circuit board |
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Application publication date: 20170322 |