CN114173492A - Through blind hole design method for detecting hole filling capacity of circuit board - Google Patents
Through blind hole design method for detecting hole filling capacity of circuit board Download PDFInfo
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- CN114173492A CN114173492A CN202111215222.1A CN202111215222A CN114173492A CN 114173492 A CN114173492 A CN 114173492A CN 202111215222 A CN202111215222 A CN 202111215222A CN 114173492 A CN114173492 A CN 114173492A
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000013461 design Methods 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052802 copper Inorganic materials 0.000 claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 47
- 238000007747 plating Methods 0.000 claims abstract description 28
- 238000005553 drilling Methods 0.000 claims abstract description 25
- 238000009713 electroplating Methods 0.000 claims abstract description 21
- 238000000151 deposition Methods 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 17
- 238000012360 testing method Methods 0.000 claims abstract description 14
- 230000002950 deficient Effects 0.000 claims abstract description 10
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000001465 metallisation Methods 0.000 claims abstract description 8
- 230000007547 defect Effects 0.000 claims abstract description 7
- 238000003754 machining Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 34
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 239000011159 matrix material Substances 0.000 claims description 17
- 238000000227 grinding Methods 0.000 claims description 13
- 238000003475 lamination Methods 0.000 claims description 7
- 239000012792 core layer Substances 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009658 destructive testing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/10—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
- G01N1/06—Devices for withdrawing samples in the solid state, e.g. by cutting providing a thin slice, e.g. microtome
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2873—Cutting or cleaving
Abstract
The invention discloses a through blind hole design method for detecting hole filling capacity of a circuit board, which comprises the steps of selecting a core board layer, making a next layer of target without drawing a pattern in a unit; laminating by using prepregs, and drilling target holes; using a target hole for alignment, processing a laser hole, and drilling a mechanical drilling alignment target; machining a mechanical through hole corresponding to the alignment target; removing glue and depositing copper on the plate, carrying out flash plating, and plating a copper layer as a bottom layer for hole metallization; electroplating under the same conditions each time by using a fixed current density; making hole data, scanning the blind holes after hole filling, finding out holes with poor hole filling and calculating the reject ratio; slicing the defective blind hole, and counting the defect degree of the defective blind hole; and respectively slicing the through holes with different specifications, calculating the copper thickness in the through holes and comparing the copper thickness with different apertures. When the hole filling capacity is evaluated, the hole filling capacity of different blind hole sizes and the through blind hole plating capacity can be evaluated at one time, and the problem of low test identification degree is solved.
Description
Technical Field
The invention relates to the field of circuit board detection, in particular to a through blind hole design method for detecting hole filling capacity of a circuit board.
Background
At present, circuit boards are classified into three major categories, i.e., single-sided boards, double-sided boards, and multilayer circuit boards, depending on the number of layers. First, a single panel, on the most basic PCB, the components are concentrated on one side and the wires are concentrated on the other side. Such PCBs are called single-sided circuit boards because the conductors are present on only one side thereof. The single panel is generally simple to manufacture and low in cost, but has the disadvantage that the single panel cannot be applied to a complex product. The double-sided board is an extension of a single-sided board, and is used when a single-layer wiring cannot meet the requirements of an electronic product. Copper is coated on both sides of the circuit board, so that wires are arranged between the two layers, and the wires can be connected through the through holes to form required network connection. The multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multifunction, large capacity, small volume, thinning and light weight. Circuit board testing is becoming more and more appreciated by manufacturers as an important step in evaluating the performance of circuit boards.
However, the existing test for the hole-filling electroplating capability of the circuit board has the following defects:
in the prior art, a production line product is generally sliced by destructive testing after being electroplated, and the blind hole diameter and the through hole copper thickness are checked to determine whether the blind hole diameter and the through hole copper thickness are within a required range. Although whether the manufacturing process meets the requirements can be detected through product monitoring, the specification of the product is stable, the change of potential manufacturing process capability cannot be identified, and the test identification degree is low.
Disclosure of Invention
In order to overcome the defects of the prior art, an object of the present invention is to provide a method for designing a through blind via for detecting a hole filling capability of a circuit board, which can solve the problem of low test recognition degree.
One of the purposes of the invention is realized by adopting the following technical scheme:
a through blind hole design method for detecting the hole filling capability of a circuit board comprises the following steps,
the core layer manufacturing step: selecting a core plate layer, wherein no graph is made in the unit and only a laser hole provided for the outer layer is used as a base plate, and a target of the next layer is made on the plate by adopting a dry film exposure, development and etching mode;
and (3) laminating: laminating by using prepregs, and processing after lamination to drill target holes;
laser drilling: using a target hole for alignment, processing a laser hole, and drilling a mechanical drilling alignment target;
mechanical drilling: machining a mechanical through hole corresponding to the alignment target;
a plate grinding step: grinding the plate to level the surface;
removing glue and depositing copper and flash plating: removing glue and depositing copper on the plate, carrying out flash plating, and plating a copper layer as a bottom layer for hole metallization;
and (3) hole filling electroplating: electroplating under the same conditions each time by using a fixed current density;
AOI scanning step: making hole data, scanning the blind holes after hole filling, finding out holes with poor hole filling and calculating the reject ratio;
a micro-section manufacturing step: slicing the defective blind hole, and counting the defect degree of the defective blind hole; and respectively slicing the through holes with different specifications, calculating the copper thickness in the through holes and comparing the copper thickness with different apertures.
Further, machining a through hole in a rectangular area at the first position by using a mechanical drill, and paving 75um blind holes in the rectangular area according to the rule that the distance between the blind holes and the hole edge of the through hole is 0.2mm, and the distance between the blind holes and the hole edge of the blind hole is 0.2 mm;
forming a second position below the first position at a distance of more than 5mm, and arranging a plurality of blind hole BGA matrixes;
and forming a third position 1.5mm below the second position, arranging a through hole matrix, wherein the matrix interval is at least 6mm, the distance between the hole edges of the through holes is 0.45mm, arranging a circle of outer through holes on the periphery of the matrix, the distance between the hole edges of the outer through holes is 3mm, and the distance between the hole edges of the outer through holes and the matrix is at least 3mm so as to form a complete through hole testing unit, and by analogy, discharging the matrix with the drill tip and cutter diameters of 0.2mm,0.25mm,0.3mm,0.35mm and 4 mm.
Further, forming a complete unit by the first position, the second position and the third position, and repeating the steps to manufacture units of blind holes of other specifications and form a complete set.
Further, in the core layer manufacturing step, a plate with the thickness of 50mil and the bottom copper of 10Z is selected as the core layer.
Further, in the press-fitting step, lamination was performed using 1080 prepreg having a resin content of 63%.
Further, in the mechanical drilling step, whether the smoothness of the mechanical through hole meets the requirement or not is detected, if yes, the plate grinding step is executed, and if not, the reworking treatment is carried out.
Further, in the plate grinding step, whether the ground surface meets the requirements or not is detected, if yes, the step of removing glue, depositing copper and flash plating is executed, and if not, reworking is carried out.
And further, in the step of removing the glue and depositing the copper and carrying out flash plating, detecting whether the removal of the drilling dirt in the hole meets the requirement, if so, carrying out flash plating, and if not, carrying out rework treatment.
Further, in the step of removing the glue and depositing the copper and performing flash plating, a 5um copper layer is plated to be used as a bottom layer of the hole metallization.
Further, in the via-filling electroplating step, before electroplating, it is checked whether the conditions of each electroplating are the same.
Further, in the AOI scanning step, when the blind hole after hole filling is scanned, a scanned image is stored.
Further, in the micro-slicing manufacturing step, when the copper thickness in the hole is calculated and different hole diameters are compared, a copper thickness and hole diameter data table is established.
Compared with the prior art, the invention has the beneficial effects that:
manufacturing a target of a next layer on the plate by adopting a dry film exposure, development and etching mode; laminating by using prepregs, and processing after lamination to drill target holes; using a target hole for alignment, processing a laser hole, and drilling a mechanical drilling alignment target; machining a mechanical through hole corresponding to the alignment target; grinding the plate to level the surface; removing glue and depositing copper on the plate, carrying out flash plating, and plating a copper layer as a bottom layer for hole metallization; electroplating under the same conditions each time by using a fixed current density; making hole data, scanning the blind holes after hole filling, finding out holes with poor hole filling and calculating the reject ratio; slicing the defective blind hole, and counting the defect degree of the defective blind hole; and respectively slicing the through holes with different specifications, calculating the copper thickness in the through holes and comparing the copper thickness with different apertures. By the method, the hole filling capacity and the through blind hole plating capacity of different blind hole sizes under different arrangement densities can be evaluated at one time when the hole filling capacity is evaluated, the electroplating capacity changes of blind holes with different specifications and through holes in different periods can be mastered through periodic tests, and the problem of low test recognition degree is solved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a flow chart of a blind via design method for detecting the hole-filling capability of a circuit board according to a preferred embodiment of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a method for designing a through blind via for testing the hole-filling capability of a circuit board includes the following steps,
the core layer manufacturing step: selecting a core plate layer, wherein no graph is made in the unit and only a laser hole provided for the outer layer is used as a base plate, and a target of the next layer is made on the plate by adopting a dry film exposure, development and etching mode; in the core board layer manufacturing step, a board with the thickness of 50mil and the bottom copper of 10Z is selected as a core board layer.
And (3) laminating: laminating by using prepregs, and processing after lamination to drill target holes; in the laminating step, a prepreg of 1080 content, 63% resin content was used for lamination.
Laser drilling: using a target hole for alignment, processing a laser hole, and drilling a mechanical drilling alignment target;
mechanical drilling: machining a mechanical through hole corresponding to the alignment target; in the mechanical drilling step, whether the smoothness of the mechanical through hole meets the requirement or not is detected, if yes, the plate grinding step is executed, and if not, the reworking treatment is carried out.
A plate grinding step: grinding the plate to level the surface; in the plate grinding step, whether the ground surface meets the requirements or not is detected, if yes, the step of removing glue and depositing copper and flash plating is executed, and if not, the step of reworking is carried out.
Removing glue and depositing copper and flash plating: removing glue and depositing copper on the plate, carrying out flash plating, and plating a copper layer as a bottom layer for hole metallization; and in the step of removing the glue and depositing the copper and carrying out flash plating, detecting whether the removal of the drilling dirt in the hole meets the requirement, if so, carrying out flash plating, and if not, carrying out rework treatment.
Preferably, in the step of removing the glue and depositing the copper and flashing, a 5um copper layer is plated as a bottom layer of the hole metallization.
And (3) hole filling electroplating: electroplating under the same conditions each time by using a fixed current density; in the step of hole-filling electroplating, before electroplating, whether the conditions of each electroplating are the same or not is checked.
AOI scanning step: making hole data, scanning the blind holes after hole filling, finding out holes with poor hole filling and calculating the reject ratio; and in the AOI scanning step, storing a scanning image when scanning the blind hole after hole filling.
A micro-section manufacturing step: slicing the defective blind hole, and counting the defect degree of the defective blind hole; and respectively slicing the through holes with different specifications, calculating the copper thickness in the through holes and comparing the copper thickness with different apertures. In the micro-slice manufacturing step, when the copper thickness in the hole is calculated and different apertures are compared, a copper thickness and aperture data table is established. By the method, the hole filling capacity and the through blind hole plating capacity of different blind hole sizes under different arrangement densities can be evaluated at one time when the hole filling capacity is evaluated, the electroplating capacity changes of blind holes with different specifications and through holes in different periods can be mastered through periodic tests, and the problem of low test recognition degree is solved.
Specifically, the following are exemplified: different blind hole structures and through hole structures are designed on the outer layer of a 4L circuit board, during electroplating, the blind holes and the through holes are filled simultaneously, and after filling is completed, the current filling capacity and the through blind hole plating capacity are confirmed by evaluating the double values of the blind holes with different designs and the copper thickness in the through holes. The periodic test can completely evaluate the current state of the production line by comparing results of different periods. The specific design is as follows:
the core plate layer is spread copper entirely and is provided the blind hole chassis for the outer, adopts 1080 PP to carry out the pressfitting, forms the thickness about 65um, carries out laser drilling and mechanical drilling in the outer layer. Take a 75um blind via as an example:
position 1: through holes were drilled at the four corners in a rectangular area of 65mmx30MM using a mechanical drill with a tool diameter of 2.1 MM. Two through holes are drilled in the middle, and the specific positions of the 8 through holes are not limited. Wherein the hole edge distance of the two through holes in the middle is 0.5 mm. In this rectangle region, according to blind hole apart from the blind hole limit 0.2mm, the blind hole of 75um is paved with blind hole and blind hole limit 0.2 mm's rule. Wherein, the blind holes are laid between the two through holes in the middle according to the same rule.
Position 2: under position 1, the interval is more than 5mm, arrange 5 blind hole BGA matrixes according to 15X15, blind hole tool path 75um, 5 blind hole matrix hole limit to the hole limit be 0.1mm respectively, 0.15mm,0.2mm,0.25mm,0.3 mm.
Position 3: at a position 1.5mm above the position 2, a matrix of 5x10 through holes is arranged, the diameter of the drill tip is 0.2mm, the matrix is arranged according to 3x3, and the matrix interval is at least 6 mm; the hole edge of the through hole is 0.45mm to the hole edge. And a circle of through holes are arranged on the periphery of the 3X3 matrix, the cutter diameter of each through hole is still 0.2mm, the cutter diameter of each through hole is 3mm from the edge of each through hole to the edge of each through hole, and the cutter diameter of each through hole is at least 3mm from the edge of each through hole to the matrix, so that a complete through hole testing unit is formed. And by analogy, discharging a matrix of drill tip diameters of 0.2mm,0.25mm,0.3mm,0.35mm and 0.4 mm.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. A through blind hole design method for detecting hole filling capacity of a circuit board is characterized by comprising the following steps:
the core layer manufacturing step: selecting a core plate layer, wherein no graph is made in the unit and only a laser hole provided for the outer layer is used as a base plate, and a target of the next layer is made on the plate by adopting a dry film exposure, development and etching mode;
and (3) laminating: laminating by using prepregs, and processing after lamination to drill target holes;
laser drilling: using a target hole for alignment, processing a laser hole, and drilling a mechanical drilling alignment target;
mechanical drilling: machining a mechanical through hole corresponding to the alignment target;
a plate grinding step: grinding the plate to level the surface;
removing glue and depositing copper and flash plating: removing glue and depositing copper on the plate, carrying out flash plating, and plating a copper layer as a bottom layer for hole metallization;
and (3) hole filling electroplating: electroplating under the same conditions each time by using a fixed current density;
AOI scanning step: making hole data, scanning the blind holes after hole filling, finding out holes with poor hole filling and calculating the reject ratio;
a micro-section manufacturing step: slicing the defective blind hole, and counting the defect degree of the defective blind hole; and respectively slicing the through holes with different specifications, calculating the copper thickness in the through holes and comparing the copper thickness with different apertures.
2. The method of claim 1, wherein the method comprises the steps of: processing a through hole in a rectangular area by using a mechanical drill at the first position, and paving 75um blind holes in the rectangular area according to the rule that the distance between the blind holes and the hole edge of the through hole is 0.2mm and the distance between the blind holes and the hole edge of the blind hole is 0.2 mm;
forming a second position below the first position at a distance of more than 5mm, and arranging a plurality of blind hole BGA matrixes;
and forming a third position 1.5mm below the second position, arranging a through hole matrix, wherein the matrix interval is at least 6mm, the distance between the hole edges of the through holes is 0.45mm, arranging a circle of outer through holes on the periphery of the matrix, the distance between the hole edges of the outer through holes is 3mm, and the distance between the hole edges of the outer through holes and the matrix is at least 3mm so as to form a complete through hole testing unit, and by analogy, discharging the matrix with the drill tip and cutter diameters of 0.2mm,0.25mm,0.3mm,0.35mm and 4 mm.
3. The method of claim 2, wherein the method comprises the steps of: and forming a complete unit by the first position, the second position and the third position, and manufacturing units of blind holes of other specifications by analogy, and forming a complete set.
4. The method of claim 1, wherein the method comprises the steps of: in the core board layer manufacturing step, a board with the thickness of 50mil and the bottom copper of 10Z is selected as a core board layer.
5. The method of claim 1, wherein the method comprises the steps of: in the laminating step, a prepreg of 1080 content, 63% resin content was used for lamination.
6. The method of claim 1, wherein the method comprises the steps of: in the mechanical drilling step, whether the smoothness of the mechanical through hole meets the requirement or not is detected, if yes, the plate grinding step is executed, and if not, the reworking treatment is carried out.
7. The method of claim 1, wherein the method comprises the steps of: in the plate grinding step, whether the ground surface meets the requirements or not is detected, if yes, the step of removing glue and depositing copper and flash plating is executed, and if not, the step of reworking is carried out.
8. The method of claim 1, wherein the method comprises the steps of: and in the step of removing the glue and depositing the copper and carrying out flash plating, detecting whether the removal of the drilling dirt in the hole meets the requirement, if so, carrying out flash plating, and if not, carrying out rework treatment.
9. The method of claim 1, wherein the method comprises the steps of: in the step of removing the glue and depositing the copper and performing flash plating, a 5um copper layer is plated to be used as a bottom layer of hole metallization.
10. The method of claim 1, wherein the method comprises the steps of: in the step of hole-filling electroplating, before electroplating, whether the conditions of each electroplating are the same or not is checked.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111215222.1A CN114173492B (en) | 2021-10-19 | 2021-10-19 | Through blind hole design method for detecting hole filling capability of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111215222.1A CN114173492B (en) | 2021-10-19 | 2021-10-19 | Through blind hole design method for detecting hole filling capability of circuit board |
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| CN114173492A true CN114173492A (en) | 2022-03-11 |
| CN114173492B CN114173492B (en) | 2024-03-08 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN114173492B (en) | 2024-03-08 |
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