CN103874332A - Manufacturing method of teflon high-frequency circuit board - Google Patents
Manufacturing method of teflon high-frequency circuit board Download PDFInfo
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- CN103874332A CN103874332A CN201410114329.0A CN201410114329A CN103874332A CN 103874332 A CN103874332 A CN 103874332A CN 201410114329 A CN201410114329 A CN 201410114329A CN 103874332 A CN103874332 A CN 103874332A
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Abstract
The invention discloses a manufacturing method of a teflon high-frequency circuit board. The method is characterized in that because traditional adhesive removing processes are replaced by the plasma cleaning process after the drilling process, the defects that holes are not provided with copper and the circuit board is disconnected can be effectively overcome, and the product yield is improved; after the full-board electroplating process is completed, a negative-film developing and etching process is carried out, a circuit part is directly etched, the picture electroplating process is omitted, manufacturing time is shortened, production cost is effectively reduced, and a finer circuit can be manufactured.
Description
[technical field]
The present invention relates to wiring board and make field, particularly relate to a kind of manufacture method of Teflon high-frequency circuit board.
[background technology]
At present, when wiring board is in the time making circuit, need porose interior copper and circuit copper, the electroplating liquid medicine in graphic plating may cause etching short circuit to the impact of dry film, and existing positive is due to higher to the thick uniformity requirement of copper, is difficult for for doing fine-line; The heavy copper cash of tradition, except in adhesive process, can use the harmful liquid such as organic solvent, volatility liquid medicine, the glass fibre of copper-clad plate material is stung to erosion property stronger, is prone to resin cavity hole in, sinks after copper and occurs Kong Wutong, will cause the quality defects such as wiring board open circuit.
[summary of the invention]
The present invention seeks to have overcome the deficiencies in the prior art, the manufacture method of the Teflon high-frequency circuit board that a kind of production method is simple, conforming product rate is high is provided.
The present invention is achieved by the following technical solutions:
A manufacture method for Teflon high-frequency circuit board, its feature comprises that step is as follows:
(1) sawing sheet: to qualified on inspection wiring board according to designing requirement sawing sheet, surface clean and oven dry;
(2) boring: the wiring board after step (1) sawing sheet is got out to all kinds of holes that client needs according to making instruction;
(3) plasma cleaning: impurity or greasy dirt on PCB surface and the hole inwall of the plasma removal step (2) producing with the high frequency voltage within the scope of radio wave;
(4) heavy copper: deposit one deck conducting thin copper layer between layers at the wiring board hole wall of step (3);
(5) electric plating of whole board: the thickness of copper in thickening step (4) PCB surface and hole;
(6) negative film dry film develops: in the copper-clad plate obtaining after step (5) is processed, paste blue layer dry film, then paste exposure in the circuit board with the negative film film, after exposure, on the negative film film, the part of colourless printing opacity is circuit, the part that black is in the light is unnecessary copper sheet, through developing apparatus, the dry film on unnecessary copper sheet is removed, after developing, exposed copper sheet is out copper sheet unnecessary on wiring board, and what under blue dry film, cover is circuit pack;
(7) acid etching: exposed copper sheet after etching away step (6) dry film and develop with acidic etching liquid, the circuit that remaining blue dry film covers;
(8) move back film: the blue dry film in step (7) is all returned, copper face and circuit are exposed;
(9) figure inspection: adopt scanner to open short circuit phenomenon inspection to circuit;
(10) anti-welding: the uniform welding resistance ink of local silk-screen one deck that does not need in the circuit board soldering of electronic components;
(11) wiring board divides plate: cut apart the connection between each production board in large plate with miniature carving cutter;
(12) moulding gong plate: go out finished product profile by customer requirement gong with milling cutter;
(13) subsequent handling: electric property and outward appearance that the described production board of detecting step (12) is each layer, on the solder side of described production board, plate under one deck normal temperature stable, can prevent copper surface oxidisation and not affect the organic film of welding function, finally production board is packed to shipment.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: the step of described plasma cleaning is as follows:
1) wiring board being cleaned is sent into vacuum chamber fixing, the air in discharge vacuum chamber is to 0.1-0.2torr;
2) gas of using to vacuum chamber introducing plasma cleaning makes its pressure remain on 0.15-0.25torr;
3) in vacuum chamber, apply high frequency voltage within the scope of radio wave and produce plasma wiring board is cleaned, scavenging period be tens seconds to a few minutes;
4) clean completely, cut off high frequency voltage, the dirt of Exhaust Gas and vaporization simultaneously blasts air in vacuum chamber, makes its air pressure rise to an atmospheric pressure.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: the gas of described cleaning use is oxygen, hydrogen, argon gas or nitrogen.
Compared with prior art, the present invention has the following advantages:
1, the present invention adopts negative film development etch process, directly loses circuit pack, has reduced graphic plating technique, has saved Production Time, has also effectively saved production cost, can make meticulousr circuit simultaneously.
2, the present invention adopts plasma cleaning to replace tradition except adhesive process, and except compared with adhesive process, plasma cleaning has the advantage of the following aspects with the heavy copper cash of tradition:
A. after plasma cleaning, wiring board plate face is very dry, and drying processing can be sent to next procedure again.
B. plasma cleaning technique not with an organic solvent, the harmful liquid such as volatility liquid medicine, after cleaning, can not produce noxious pollutant yet, belong to environmentally friendly green cleaning method.
C. the plasma that adopts the high-frequency discharge within the scope of radio wave to produce cleans, its directivity is not strong, can go deep into the fine eyelet of wiring board and the inside of depression and complete cleaning task, not be subject to the impact of cleaned material shape, can be better to those difficult cleaning performances that clean position.
D. the vacuum degree that plasma cleaning need to be controlled is 0.15-0.25torr, and this vacuum degree is easy to realize in plant produced.Equipment cost is not high, and cleaning process does not need to use expensive organic solvent or other liquid medicine yet, therefore plasma cleaning operating cost is far below traditional adhesive process that removes.
E. due to plasma cleaning do not need to cleaning fluid transport, store, the treatment measures such as discharge, so production site easily keeps hygienically clean.
F. plasma cleaning is under vacuum condition, PCB surface to be cleaned, and can not contact any organic solvent or liquid medicine, can effectively avoid the generation of the defect such as Kong Wutong, wiring board open circuit, improving product acceptance rate, thereby the company of saving production cost.
[brief description of the drawings]
Fig. 1 is process chart of the present invention;
Fig. 2 is negative film process chart of the present invention;
Fig. 3 is plasma cleaning flow chart of the present invention.
[embodiment]
Below in conjunction with accompanying drawing, the invention will be further described:
A manufacture method for Teflon high-frequency circuit board, comprises that step is as follows:
(1) sawing sheet: to qualified on inspection wiring board according to designing requirement sawing sheet, surface clean and oven dry;
(2) boring: the wiring board after step (1) sawing sheet is got out to all kinds of holes that client needs according to making instruction, as the edges of boards tooling hole of wiring board, tooling hole, insert hole etc.;
(3) plasma cleaning: impurity or greasy dirt etc. on PCB surface and the hole inwall of the plasma removal step (2) producing by the high-frequency discharge within the scope of radio wave;
(4) heavy copper: deposit one deck conducting thin copper layer between layers at the wiring board hole wall of step (3);
(5) electric plating of whole board: the thickness of copper in thickening step (4) PCB surface and hole, reaches customer requirement;
(6) negative film dry film develops: in the copper-clad plate obtaining, stick blue layer dry film after step (5) is processed, expose by negative film film aligning, after developing, exposed copper sheet is out copper unnecessary on wiring board, and what under blue dry film, cover is circuit pack;
(7) acid etching: exposed copper after etching away step (6) dry film and develop with acidic etching liquid, the circuit that remaining blue dry film covers;
(8) move back film: the blue dry film in step (7) is all returned, copper face and circuit are exposed;
(9) figure inspection: adopt scanner to circuit open short circuit phenomenon inspection, in industry, claim " AOI ";
(10) anti-welding: not need in the circuit board the uniform welding resistance ink of local silk-screen one deck of soldering of electronic components, mainly in the time of client's welding component, play and prevent that scolding tin from connecting the effect of short circuit, obtains production board;
(11) wiring board divides plate: cut apart the connection between each production board in large plate with V-CUT cutter (miniature carving cutter);
(12) moulding gong plate: go out finished product profile by customer requirement gong with milling cutter;
(13) open-short circuit: the electric property that the described production board of detecting step (12) is each layer;
(14) finished product inspection: be mainly function and the outward appearance that checks production board;
(15) there is organizational security weldering film: stabilization energy prevents copper surface oxidisation and do not affect the organic film of welding function, title " OSP " in industry under solder side plating one deck normal temperature of production board;
(16) finished product packing: by the qualified production board packaging shipment of inspection eventually.
Described negative film technique concrete steps as shown in Figure 2, first paste in the circuit board blue layer dry film, then paste exposure in the circuit board with the negative film film, after exposure, on the negative film film, the part of colourless printing opacity is circuit, the part that black is in the light is unnecessary copper sheet, through developing apparatus, the dry film on unnecessary copper sheet is removed, after developing, exposed copper sheet is out copper sheet (copper sheet not using) unnecessary on wiring board, what under blue dry film, cover is circuit pack, the copper thickness of this circuit pack has thickeied in heavy copper coin electrician order the required thickness that enough clients specify, therefore no longer do graphic plating technique, but directly etch away exposed copper sheet through acidic etching liquid, the circuit that remaining blue dry film covers, again through moving back film, dry to wait and make circuit.
The step of described step (3) plasma cleaning is as follows:
1) wiring board being cleaned is sent into vacuum chamber fixing, the air of discharging in vacuum chamber is pressure unit to 0.1-0.2torr(torr, and Chinese is translated into holder, and 1 holder is decided to be 1/760 times of normal atmospheric pressure);
2) gas of using to vacuum chamber introducing plasma cleaning makes its pressure remain on 0.15-0.25torr, according to the difference of cleaning material, can select respectively the gases such as oxygen, hydrogen, argon gas or nitrogen;
3) in vacuum chamber, apply high frequency voltage within the scope of radio wave and produce plasma wiring board is cleaned, scavenging period be tens seconds to a few minutes;
4) clean completely, cut off high frequency voltage, the dirt of Exhaust Gas and vaporization simultaneously blasts air in vacuum chamber, makes its air pressure rise to an atmospheric pressure.
Claims (3)
1. a manufacture method for Teflon high-frequency circuit board, its feature comprises that step is as follows:
(1) sawing sheet: to qualified on inspection wiring board according to designing requirement sawing sheet, surface clean and oven dry;
(2) boring: the wiring board after step (1) sawing sheet is got out to all kinds of holes that client needs according to making instruction;
(3) plasma cleaning: impurity or greasy dirt on PCB surface and the hole inwall of the plasma removal step (2) producing with the high frequency voltage within the scope of radio wave;
(4) heavy copper: deposit one deck conducting thin copper layer between layers at the wiring board hole wall of step (3);
(5) electric plating of whole board: the thickness of copper in thickening step (4) PCB surface and hole;
(6) negative film dry film develops: in the copper-clad plate obtaining after step (5) is processed, paste blue layer dry film, then paste exposure in the circuit board with the negative film film, after exposure, on the negative film film, the part of colourless printing opacity is circuit, the part that black is in the light is unnecessary copper sheet, through developing apparatus, the dry film on unnecessary copper sheet is removed, after developing, exposed copper sheet is out copper sheet unnecessary on wiring board, and what under blue dry film, cover is circuit pack;
(7) acid etching: exposed copper sheet after etching away step (6) dry film and develop with acidic etching liquid, the circuit that remaining blue dry film covers;
(8) move back film: the blue dry film in step (7) is all returned, copper face and circuit are exposed;
(9) figure inspection: adopt scanner to open short circuit phenomenon inspection to circuit;
(10) anti-welding: the uniform welding resistance ink of local silk-screen one deck that does not need in the circuit board soldering of electronic components;
(11) wiring board divides plate: cut apart the connection between each production board in large plate with miniature carving cutter;
(12) moulding gong plate: go out production board by customer requirement gong with milling cutter;
(13) subsequent handling: electric property and outward appearance that the described production board of detecting step (12) is each layer, on the solder side of described production board, plate under one deck normal temperature stable, can prevent copper surface oxidisation and not affect the organic film of welding function, finally production board is packed to shipment.
2. the manufacture method of Teflon high-frequency circuit board according to claim 1, is characterized in that: the step of described plasma cleaning is as follows:
1) wiring board being cleaned is sent into vacuum chamber fixing, the air in discharge vacuum chamber is to 0.1-0.2torr;
2) gas of using to vacuum chamber introducing plasma cleaning makes its pressure remain on 0.15-0.25torr;
3) in vacuum chamber, apply high frequency voltage within the scope of radio wave and produce plasma wiring board is cleaned, scavenging period be tens seconds to a few minutes;
4) clean completely, cut off high frequency voltage, the dirt of Exhaust Gas and vaporization simultaneously blasts air in vacuum chamber, makes its air pressure rise to an atmospheric pressure.
3. the manufacture method of Teflon high-frequency circuit board according to claim 2, is characterized in that: the gas of described cleaning use is oxygen, hydrogen, argon gas or nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410114329.0A CN103874332A (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of teflon high-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410114329.0A CN103874332A (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of teflon high-frequency circuit board |
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| CN103874332A true CN103874332A (en) | 2014-06-18 |
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| CN201410114329.0A Pending CN103874332A (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of teflon high-frequency circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902699A (en) * | 2015-05-04 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Electroplating method of backboard comprising high thickness-diameter ratio through hole |
| CN105916312A (en) * | 2016-05-27 | 2016-08-31 | 建业科技电子（惠州）有限公司 | Blue glue production process for printed circuit boards |
| CN113950203A (en) * | 2021-12-20 | 2022-01-18 | 广东科翔电子科技股份有限公司 | Method for manufacturing hole-in-hole disc of high-precision Mini-LED PCB |
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| CN102006728A (en) * | 2010-11-09 | 2011-04-06 | 深圳崇达多层线路板有限公司 | Novel production method of board deep-recess line |
| CN102523702A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing process of circuit board with back-drilled blind hole |
| US20120256722A1 (en) * | 2011-04-08 | 2012-10-11 | Endicott Interconnect Technologies, Inc. | Method of cavity forming on a buried resistor layer using a fusion bonding process |
| CN102917546A (en) * | 2012-10-21 | 2013-02-06 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
| CN103209546A (en) * | 2013-04-03 | 2013-07-17 | 遂宁市广天电子有限公司 | Method for making line in direct negative etching way |
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2014
- 2014-03-25 CN CN201410114329.0A patent/CN103874332A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102006728A (en) * | 2010-11-09 | 2011-04-06 | 深圳崇达多层线路板有限公司 | Novel production method of board deep-recess line |
| US20120256722A1 (en) * | 2011-04-08 | 2012-10-11 | Endicott Interconnect Technologies, Inc. | Method of cavity forming on a buried resistor layer using a fusion bonding process |
| CN102523702A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing process of circuit board with back-drilled blind hole |
| CN102917546A (en) * | 2012-10-21 | 2013-02-06 | 蔡新民 | Method for manufacturing polytetrafluoroethylene high-frequency circuit board |
| CN103209546A (en) * | 2013-04-03 | 2013-07-17 | 遂宁市广天电子有限公司 | Method for making line in direct negative etching way |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902699A (en) * | 2015-05-04 | 2015-09-09 | 深圳崇达多层线路板有限公司 | Electroplating method of backboard comprising high thickness-diameter ratio through hole |
| CN104902699B (en) * | 2015-05-04 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of backboard electro-plating method of the through-hole containing high thickness to diameter ratio |
| CN105916312A (en) * | 2016-05-27 | 2016-08-31 | 建业科技电子（惠州）有限公司 | Blue glue production process for printed circuit boards |
| CN113950203A (en) * | 2021-12-20 | 2022-01-18 | 广东科翔电子科技股份有限公司 | Method for manufacturing hole-in-hole disc of high-precision Mini-LED PCB |
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Application publication date: 20140618 |
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