CN105657976A - Manufacturing method of entire-board nickel gold plating stepped board - Google Patents
Manufacturing method of entire-board nickel gold plating stepped board Download PDFInfo
- Publication number
- CN105657976A CN105657976A CN201610034011.0A CN201610034011A CN105657976A CN 105657976 A CN105657976 A CN 105657976A CN 201610034011 A CN201610034011 A CN 201610034011A CN 105657976 A CN105657976 A CN 105657976A
- Authority
- CN
- China
- Prior art keywords
- nickel gold
- daughter board
- board
- imposite
- stepped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
Abstract
The invention relates to the technical field of printed wiring boards, and discloses a manufacturing method of an entire-board nickel gold plating stepped board. The method comprises the following steps of: manufacturing an inlayer graph, browning a graph copper surface, forming a stepped slotted hole with non-gummosis pp, stitching, drilling an outer layer, plating copper, metallizing holes, electroplating the entire board, manufacturing an outer layer graph, electroplating the graph, etching the outer layer, froming a stepped groove, eliminating gummosis, and plating nickel gold. According to the invention, the problem in the manufacturing process of the entire-board nickel gold plating board free from resistance welding that it is unable to adopt a high temperature adhesive tape to close the windowing completely during stitching, and gold cannot be plated in subsequent surface processing process due to the pp glue existing on the board surface is solved, the production is convenient, and the production yield rate of stepped boards is improved.
Description
Technical field
The invention belongs to pcb board manufacturing technology field, particularly relate to the manufacture method of the heavy nickel gold stepped plate of a kind of imposite.
Background technology
Make stepped plate, prior art is to adopt pp to window, in stitching operation process, adopting high temperature gummed tape to cover copper face, it is prevented that pp powder drops on copper face, then some is to adopt direct pressing, but during due to direct pressing, high temperature gummed tape does not have pressing properties of materials, after being pressed in plate, easily causes the defects such as plate bursting; Some is after molding gong goes out step trough, is burnt by high temperature gummed tape laser.
But, the heavy nickel gold stepped plate of imposite for welding resistance need not be done, in manufacturing process, because stepped locations is too little, laminating high temperature gummed tape difficulty is relatively big, even and if laminating, it is also difficult to remove high temperature gummed tape, it is possible to the problem causing plate bursting; Do not fit high temperature gummed tape, operating process can cause pp powder drop on copper face so that sequent surface processing procedure cannot sink the defects such as gold.
Summary of the invention
It is an object of the invention to provide the manufacture method of the heavy nickel gold stepped plate of a kind of imposite not doing welding resistance. Aim to solve the problem that the heavy nickel gold stepped plate of the imposite not doing welding resistance is in making bonding processes, do not adopt high temperature gummed tape position of will windowing to paste and extremely cause plate face pp glue stain, and cause the problem of gold of cannot sinking in surface treatment process.
The technical scheme is that the manufacture method of the heavy nickel gold stepped plate of a kind of imposite, comprise the following steps:
First daughter board makes inner figure;
The brown of inner figure copper face;
Gummosis pp and the first daughter board will not fit, and ladder slotted eye will do not gone out by gummosis pp gong, and window out;
First daughter board and the second daughter board are carried out pressing;
Second daughter board outer layer away from described first daughter board is holed;
Outer layer boring on second daughter board is carried out heavy copper, described boring of metallizing;
The outer layer of described second daughter board is carried out electric plating of whole board;
Described second daughter board makes outer graphics;
Described outer graphics is electroplated, hole and table copper are electroplated;
The outer layer of described second daughter board is etched, controls etched figure live width;
Described step trough is fallen corresponding to the position gong of described second daughter board, forms ladder position;
Except gummosis, remove because stitching operation process pp glue falls the colloid on copper face;
Heavy nickel gold.
Further, described include except the method for gummosis:
Bulk: the bulking agent solution containing ether and phosphoric acid, make glue stain soften;
First time washing: wash away plate face liquid medicine;
Second time washing: clean plate face further;
Remove glue stain: chemistry, except gummosis, removes plate face glue stain;
Preneutralization: remove plate face oxidant, neutralizes basicity;
Third time washing: clean plate face residual preneutralization liquid medicine;
Neutralize: thoroughly remove plate face oxidant further, neutralize basicity;
4th washing: wash away plate face liquid medicine;
5th washing: clean plate face further;
Sandblasting: process plate face glue stain further, removes copper face oxidation simultaneously.
Further, in described fermentation steps, the concentration of bulking agent solution is 30%-34%, and temperature is 75-85 DEG C, and action time is 8min.
Further, in described removing glue stain step, the oxidant total amount of solution used is 65-75g/L, and basicity is 1.0-1.4N, and the concentration of potassium manganate is less than 25g/L, and solution temperature is 75-85 DEG C, and action time is 10-12min.
Further, in described preneutralization step, the concentration of the sulphuric acid of preneutralization agent used is 2%-4%, and the concentration of hydrogen peroxide is 1%-3%, and solution temperature is room temperature, and time action time is 1-2min.
Further, in described neutralization procedure, in solution, sulfuric acid concentration is 2%-4%, and nertralizer concentration is 3%-5%, and solution temperature is room temperature, and time action time is 3-4min; The speed of described sandblasting is 2.0-2.5m/min.
Further, described making on the first daughter board between inner figure and the brown of inner figure copper face further comprises the steps of: internal layer automatic optics inspection.
Further, the described outer layer at the second daughter board etches, and controls etched figure live width and falls corresponding to the position gong of described second daughter board with by described step trough, is formed and further comprises the steps of: the first time detection of outer layer automated optical between ladder position.
Further, described removing is because stitching operation process pp glue falls the colloid on copper face and further comprises the steps of: the second time detection of outer layer automated optical between heavy nickel gold.
Further, described inner figure makes the exposure completing internal layer circuit with 6 lattice exposure guide rules or 21 lattice exposure guide rules.
Beneficial effect: solve in the heavy nickel gold stepped plate manufacturing process of the imposite not doing welding resistance, high temperature gummed tape cannot be pasted because stepped locations is too little, in operating process, pp powder can drop on copper face, cause the problem of gold of cannot sinking in back side surface processing procedure, convenient production, improves stepped plate and produces yield.
Accompanying drawing explanation
The manufacture method process chart of the heavy nickel gold stepped plate of a kind of imposite that Fig. 1 provides for the embodiment of the present invention 1.
Except gummosis process chart in the manufacture method of the heavy nickel gold stepped plate of a kind of imposite that Fig. 2 provides for the embodiment of the present invention 1.
Detailed description of the invention
For setting forth thought and the purpose of the present invention, below in conjunction with the drawings and specific embodiments, the present invention is described further.
In conjunction with the manufacture method process chart of the heavy nickel gold stepped plate of the imposite shown in Fig. 1, it comprises the following steps:
S01: sawing sheet, outputs two pieces of daughter boards by jigsaw size;
S02: the first daughter board makes inner figure, completes internal layer circuit exposure with 6 lattice exposure guide rules or 21 lattice exposure guide rules, and after development, the different-thickness adjustment according to internal layer copper etches, and etches line pattern;
S03: internal layer automatic optics inspection (AOI), checks the defect such as the opening of internal layer, short circuit and makes correction;
S04: the brown of inner figure copper face, the speed of brown carries out brown according to the copper thickness of end copper;
S05: not gummosis pp and the laminating of the first daughter board, will not go out ladder slotted eye by gummosis pp gong, and be fallen by the pp glue gong on stepped locations, window out, facilitate the making of follow-up step trough;
S06: the first daughter board and the second daughter board are carried out pressing, selects suitable lamination to carry out pressing according to plate Tg, and the table copper thickness of outer copper foil finished product as requested selects Copper Foil;
S07: outer layer is holed, and according to thickness of slab, carries out Drilling operation;
S08: outer layer sinks copper, plated through-hole, backlight tests 9.5 grades;
S09: electric plating of whole board, hole copper is required to meet IPC standard, to copper-clad (wrapcopper) general control in 7-12um scope;
S10: outer graphics, completes outer-layer circuit exposure with 6 lattice exposure guide rules (21 lattice exposure guide rule), and develops;
S11: graphic plating, electroplates hole, table copper, meets copper thickness requirement;
S12: outer layer etches, and is etched under alkaline environment, and the speed of etching is etched by end copper, controls etching live width;
S13: outer layer automatic optics inspection (AOI), checks opening the defects such as short circuit and making correction of outer layer;
S14: before the forming, gong goes out step trough, is fallen by the core layer gong on step trough position, exposes ladder position;
S15: except gummosis, removes because stitching operation process pp glue falls the colloid on copper face;
S16: outer layer automatic optics inspection (AOI), checks whether pp glue is removed clean;
S17: heavy nickel gold, produces with taping machine, improves production efficiency;
S18: external form, on request gong external form;
S19: electrical testing, the electric property of test-based examination production board;
S20: inspection eventually, checks that whether the aesthetic appearance of production board is bad;
S21: shipment.
As in figure 2 it is shown, except gummosis process chart in the manufacture method of the heavy nickel gold stepped plate of a kind of imposite of embodiment of the present invention offer, it comprises the following steps:
S1501 is bulk: adopts the bulking agent containing ether and phosphoric acid solution, is immersed in bulking agent by the plate having glue stain, and concentration controls 30%-34%, and solution temperature controls at 75-85 DEG C, and action time is the time control 8min, makes glue stain soften.
S1502 first time washing: being carried out with clear water, scavenging period is 1-1.5min, it is therefore an objective to wash away the liquid medicine in plate face.
S1503 second time washing: being carried out with clear water, scavenging period is 1.5-2.0min, further clean plate face.
S1504 removes gummosis: be 65-75g/L in oxidant total amount, and basicity is 1.0-1.4N, and potassium manganate concentration is less than in the solution of 25g/L, and solution temperature is 75-85 DEG C, and action time is 10-12min. Remove plate face glue stain.
S1505 preneutralization: be 2%-4% by sulfuric acid concentration, hydrogen peroxide concentration is the preneutralization agent solution of 1%-3% composition, and in the solution that preneutralization agent temperature is 19-23 DEG C, action time is 1-2min. Purpose is in that to remove plate face oxidant, neutralizes basicity, plays protection nertralizer and uses duration.
S1506 third time washing: be carried out with clear water, wash away the product after preneutralization and preneutralization agent.
S1507 neutralizes: be 2%-4% by sulfuric acid concentration, and nertralizer concentration is 3%-5%, and temperature is in the solution of room temperature, by plate effect 3-4min, it is therefore intended that thoroughly removes plate face oxidant further, neutralizes basicity.
The 4th washing of S1508: being carried out with clear water, scavenging period is 1-1.5min, washes away plate face liquid medicine.
The 5th washing of S1509: being carried out with clear water, scavenging period is 1.5-2.0min, and the space of a whole page is thoroughly cleaned in further clean plate face.
S1510 sandblasting: sandblasting speed is 2.0-2.5m/min, but frosted, it is prevented that by circuit mill open circuit, it is therefore intended that process plate face glue stain further, remove copper face oxidation, it is simple to rear process inspection plate face simultaneously.
It is above provided by the present invention, the invention have the benefit that and solve in the heavy nickel gold stepped plate manufacturing process of the imposite not doing welding resistance, do not fit because stepped locations is too little high temperature gummed tape, cause pp powder in operating process can drop on copper face, make cannot sink golden problem in follow-up surface treatment process, after improved method, improve stepped plate and produce yield.
Having done detailed introduction herein for specific embodiment, step and principle to the present invention are set forth, and above example is only intended to help to understand method and the core concept thereof of the present invention; Simultaneously for one of ordinary skill in the art, according to the thought of the present invention, all will change in specific embodiments and applications, in sum, this specification content should not be construed as limitation of the present invention.
Claims (10)
1. a manufacture method for the heavy nickel gold stepped plate of imposite, comprises the following steps:
First daughter board makes inner figure;
The brown of inner figure copper face;
Gummosis pp and the first daughter board will not fit, and ladder slotted eye will do not gone out by gummosis pp gong, and window out;
First daughter board and the second daughter board are carried out pressing;
Second daughter board outer layer away from described first daughter board is holed;
Outer layer boring on second daughter board is carried out heavy copper, described boring of metallizing;
The outer layer of described second daughter board is carried out electric plating of whole board;
Described second daughter board makes outer graphics;
Described outer graphics is electroplated, hole and table copper are electroplated;
The outer layer of described second daughter board is etched, controls etched figure live width;
Described step trough is fallen corresponding to the position gong of described second daughter board, forms ladder position;
Except gummosis, remove because stitching operation process pp glue falls the colloid on copper face;
Heavy nickel gold.
2. the manufacture method of the heavy nickel gold stepped plate of imposite according to claim 1, it is characterised in that described include except the method for gummosis:
Bulk: the bulking agent solution containing ether and phosphoric acid, make glue stain soften;
First time washing: wash away plate face liquid medicine;
Second time washing: clean plate face further;
Remove glue stain: chemistry, except gummosis, removes plate face glue stain;
Preneutralization: remove plate face oxidant, neutralizes basicity;
Third time washing: wash away plate face residual preneutralization liquid medicine;
Neutralize: thoroughly remove plate face oxidant further, neutralize basicity;
4th washing: wash away plate face liquid medicine;
5th washing: clean plate face further;
Sandblasting: process plate face glue stain further, removes copper face oxidation simultaneously.
3. the manufacture method of the heavy nickel gold stepped plate of imposite according to claim 2, it is characterised in that: in described fermentation steps, the concentration of bulking agent solution is 30%-34%, and temperature is 75-85 DEG C, and action time is 8min.
4. the manufacture method of the heavy nickel gold stepped plate of imposite according to claim 2, it is characterized in that: in described removing glue stain step, the oxidant total amount of solution used is 65-75g/L, basicity is 1.0-1.4N, the concentration of potassium manganate is less than 25g/L, solution temperature is 75-85 DEG C, and action time is 10-12min.
5. the manufacture method of the heavy nickel gold stepped plate of imposite according to claim 2, it is characterized in that: in described preneutralization step, the sulfuric acid concentration of preneutralization agent used is 2%-4%, and the concentration of hydrogen peroxide is 1%-3%, solution temperature is room temperature, and time action time is 1-2min.
6. the manufacture method of the heavy nickel gold stepped plate of imposite according to claim 2, it is characterised in that: in described neutralization procedure, in solution, sulfuric acid concentration is 2%-4%, and nertralizer concentration is 3%-5%, and solution temperature is room temperature, and time action time is 3-4min; The speed of described sandblasting is 2.0-2.5m/min.
7. the manufacture method of the heavy nickel gold stepped plate of imposite according to claim 1, it is characterised in that: described making on the first daughter board between inner figure and the brown of inner figure copper face further comprises the steps of: internal layer automatic optics inspection.
8. the manufacture method of the heavy nickel gold stepped plate of imposite according to claim 1, it is characterized in that: the described outer layer at the second daughter board etches, control etched figure live width to fall corresponding to the position gong of described second daughter board with by described step trough, formed and between ladder position, further comprise the steps of: the first time detection of outer layer automated optical.
9. the manufacture method of the heavy nickel gold stepped plate of imposite according to claim 1, it is characterised in that: described removing is because stitching operation process pp glue falls the colloid on copper face and further comprises the steps of: the second time detection of outer layer automated optical between heavy nickel gold.
10. the manufacture method of the heavy nickel gold stepped plate of imposite according to claim 1, it is characterised in that: described inner figure makes the exposure completing internal layer circuit with 6 lattice exposure guide rules or 21 lattice exposure guide rules.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610034011.0A CN105657976A (en) | 2016-01-19 | 2016-01-19 | Manufacturing method of entire-board nickel gold plating stepped board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610034011.0A CN105657976A (en) | 2016-01-19 | 2016-01-19 | Manufacturing method of entire-board nickel gold plating stepped board |
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| CN105657976A true CN105657976A (en) | 2016-06-08 |
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| CN201610034011.0A Pending CN105657976A (en) | 2016-01-19 | 2016-01-19 | Manufacturing method of entire-board nickel gold plating stepped board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106559958A (en) * | 2016-11-22 | 2017-04-05 | 奥士康精密电路（惠州）有限公司 | A kind of method for lifting heavy copper cash production capacity |
| CN109068504A (en) * | 2018-10-30 | 2018-12-21 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove that side wall is non-metallic |
| CN109275276A (en) * | 2018-10-24 | 2019-01-25 | 江门崇达电路技术有限公司 | A kind of minimizing technology of gold face oxide |
| CN111356298A (en) * | 2020-03-17 | 2020-06-30 | 景旺电子科技(龙川)有限公司 | Method for solving carbon powder residue in multilayer FPC (flexible printed circuit) manufacturing process based on front opening window process |
| CN111741618A (en) * | 2020-08-14 | 2020-10-02 | 博敏电子股份有限公司 | Processing method for depositing nickel and gold on bottom of PCB step groove |
| CN111757603A (en) * | 2020-06-08 | 2020-10-09 | 大连崇达电路有限公司 | Processing method for improving oxidation of metal surface of small PCS plate |
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| CN106559958A (en) * | 2016-11-22 | 2017-04-05 | 奥士康精密电路（惠州）有限公司 | A kind of method for lifting heavy copper cash production capacity |
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| CN109275276A (en) * | 2018-10-24 | 2019-01-25 | 江门崇达电路技术有限公司 | A kind of minimizing technology of gold face oxide |
| CN109068504A (en) * | 2018-10-30 | 2018-12-21 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove that side wall is non-metallic |
| CN109068504B (en) * | 2018-10-30 | 2020-01-17 | 生益电子股份有限公司 | Manufacturing method of stepped groove with non-metalized side wall and PCB |
| CN111356298A (en) * | 2020-03-17 | 2020-06-30 | 景旺电子科技(龙川)有限公司 | Method for solving carbon powder residue in multilayer FPC (flexible printed circuit) manufacturing process based on front opening window process |
| CN111757603A (en) * | 2020-06-08 | 2020-10-09 | 大连崇达电路有限公司 | Processing method for improving oxidation of metal surface of small PCS plate |
| CN111757603B (en) * | 2020-06-08 | 2023-09-12 | 大连崇达电路有限公司 | Processing method for improving oxidation of small PCS (process control System) plate metal surface |
| CN111741618A (en) * | 2020-08-14 | 2020-10-02 | 博敏电子股份有限公司 | Processing method for depositing nickel and gold on bottom of PCB step groove |
| WO2022033256A1 (en) * | 2020-08-14 | 2022-02-17 | 博敏电子股份有限公司 | Processing method for electroless nickel immersion gold at bottom of step slot of pcb |
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