CN110324978A - The electroplating processing method of 28G antenna printed circuit board - Google Patents
The electroplating processing method of 28G antenna printed circuit board Download PDFInfo
- Publication number
- CN110324978A CN110324978A CN201910356508.8A CN201910356508A CN110324978A CN 110324978 A CN110324978 A CN 110324978A CN 201910356508 A CN201910356508 A CN 201910356508A CN 110324978 A CN110324978 A CN 110324978A
- Authority
- CN
- China
- Prior art keywords
- time
- dry film
- plate
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 31
- 238000003672 processing method Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 91
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 83
- 239000010949 copper Substances 0.000 claims abstract description 50
- 229910052802 copper Inorganic materials 0.000 claims abstract description 50
- 238000003825 pressing Methods 0.000 claims abstract description 41
- 238000007747 plating Methods 0.000 claims abstract description 27
- 238000005553 drilling Methods 0.000 claims abstract description 26
- 238000007689 inspection Methods 0.000 claims abstract description 15
- 238000005530 etching Methods 0.000 claims abstract description 14
- 239000011889 copper foil Substances 0.000 claims description 33
- 238000002203 pretreatment Methods 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 16
- 238000007788 roughening Methods 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 18
- 238000005516 engineering process Methods 0.000 abstract description 9
- 239000007795 chemical reaction product Substances 0.000 abstract description 4
- 239000002253 acid Substances 0.000 description 10
- 239000000428 dust Substances 0.000 description 10
- 238000005498 polishing Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000006467 substitution reaction Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009172 bursting Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Abstract
The present invention provides a kind of electroplating processing method of 28G antenna printed circuit board, characterized by comprising the following steps: sawing sheet → internal layer → first time pressing → first time drilling → first time black holes → first time dry film → whole plate is electroplated →, which takes off dry film → nog plate → second of dry film → first time etching → inspection → second of pressing → second of drilling → second black holes → third time dry film → whole plate is electroplated →, takes off dry film → nog plate → four time dry film → second of etching → inspection → lower process.The printed circuit board that the present invention produces on traditional Common platings line realizes the hole copper that the pulse plating of high cost is just able to achieve: face copper=2:0.5, effectively save the cost of production, it can satisfy the production requirement of high-end product, make outstanding contributions for the progress of industry technology.
Description
Technical field
The invention belongs to printed circuit board processing technique fields, and in particular to a kind of 28G antenna tradition used for printed circuit board
Pulse plating processing method is realized in plating.
Background technique
The ratio of electroplating hole copper thickness required by 28G high-transmission high-frequency printed circuit and surface copper thickness is hole copper:
Face copper=2:0.5, cannot achieve at all on existing conventional plating techniques, and traditional electroplating technology is hole copper: face copper=
0.9:1, the technical field of tradition plating must be face copper thickness it is absolute be greater than hole copper, if if realizing hole copper: face copper=2:
0.5 must just put into fairly expensive pulse plating production line.
In the prior art, pulse plating is typically used, realizes forward and reverse plating, final to realize hole copper: face copper=2:
0.5.And traditional electroplating technology, generally comprise following steps: sawing sheet → internal layer → pressing → drilling → whole plate plating → dry film
→ graphic plating → etches → moves back tin → inspection → lower process；There was only positive plating by this processing method, limit production is
Hole copper: face copper=0.9:1 cannot achieve hole copper: face copper=2:0.5.Existing tradition electroplating processing method is unable to satisfy high-end product
Production requirement.
Summary of the invention
In view of this, the present invention provides a kind of 28G antenna tradition plating realization pulse plating processing side used for printed circuit board
Method, the processing method that the present invention is electroplated by changing existing tradition, the printed circuit board produced on traditional Common platings line are real
The hole copper that the pulse plating of existing high cost is just able to achieve: face copper=2:0.5 equally can satisfy the production requirement of high-end product.
The technical solution of the present invention is as follows: the electroplating processing method of 28G antenna printed circuit board, which is characterized in that including with
Lower step: sawing sheet → internal layer → first time pressing → first time drilling → first time black holes → first time dry film → whole plate plating →
It is black to take off dry film → nog plate → second of dry film → first time etching → inspection → second of pressing → second of drilling → second
Hole → third time dry film → whole plate is electroplated → takes off dry film → nog plate → four time dry film → second of etching → inspection → lower process.
After sawing sheet, toasted 2-4 hours at 150-200 DEG C.
Further, in interior layer process, pre-treatment microetch amount is controlled in 17-35 microinch；Inner layer exposure level: L1 layers with
One core plate of L2 layers of exposure, L3 layers and one core plate of L4 layers of exposure；Wherein L1 and L4 layers of empty exposure.On fully automatic exposure machine
Operation confirms film harmomegathus and very poor before upper machine, and every production 20PNL plate must all clean a film, glass platform, dust sticky paper
Replacement frequency is that every 20PNL is changed once.
Further, in first time process for pressing, brownification microetch amount is controlled in 55-75 microinch；Walkthrough heats+4 rivetings
Nail；Copper foil uses normal copper foil, and copper foil is inverted, i.e., smooth surface places 20 completely new brown paper close to core plate up and down.It is needed before plate-laying clear
Clean plate-laying work top, when plate-laying, need to use dust-binding cloth clean wiping plate face；Polishing: plate face residue glue of polishing after pressing.
Further, in first time bore process, thick copper sheet parameter is 2/it is folded；Baking sheet again, 150- are first cleaned after drilling
Baking sheet 1-2 hours at 200 DEG C；The hole d is thick≤1000 microinch, ailhead≤2 times.Nozzle is bored, 500 hole of nozzle service life is bored.
Further, in first time black holes technique, plasma removes glue 0.3-0.6mg/cm3, heavy using black holes substitution tradition
Copper.
Further, in first time dry film process, dry film uses the plated hole copper film；Plated hole film shading region and printed circuit
Panel aperture is equal.
Further, in first time whole plate electroplating technology, hole copper plates 15 microns.Dry film process is taken off, film is normally moved back, after moving back film
Turning dry film pre-treatment polish-brush adds drying primary.First time nog plate technique is polished the part layers of copper of aperture protrusion with ceramic nog plate
It is smooth.
Further, second of dry film process, pre-treatment are forbidden to walk super roughening line, use needle brush as pre-treatment, use negative film
Film production.
Further, first time etch process is etched using acid negative film.
Further, second of process for pressing, the control of microetch amount is after 55-75 microinch, brownification at 80-120 DEG C of insert rack
Baking sheet 0.8-1.5 hours, into press in 12 hours after brownification.
Further, walkthrough technique, using filling holes with resin, the big 0.1mm of boring aperture is pressed in consent aluminium flake aperture, is filled in from the face L1
Hole；First pressure testing is confirmed whether to fill up using PP pressing filler；Plate-laying technique needs cleaning plate-laying work top, copper foil before plate-laying
Using normal copper foil, copper foil is inverted, i.e., smooth surface opens completely new brown paper close to core plate, mounted on top 20.Technique for grinding is beaten after pressing
Nog plate face residue glue.
Further, second of bore process parameter and drilling for the first time are consistent；Second of black holes technological parameter and first
Secondary black holes is consistent；Second of whole plate electroplating technological parameter and the plating of first time whole plate are consistent；Second of nog plate technological parameter and
One time nog plate is consistent；Third time dry film, the technological parameter of the 4th dry film are consistent with second of dry film.
Further, it etches for second: being etched using acid negative film.
The present invention may be implemented to complete to need in the past on traditional ordinary gantry formula plating line by the change of processing flow
It will just fertile high-end product, the printed circuit board produced on traditional Common platings line be real on expensive pulse plating line
The hole copper that the pulse plating of existing high cost is just able to achieve: face copper=2:0.5 effectively saves the cost of production, can satisfy high-end
The production requirement of product makes outstanding contributions for the progress of industry technology.
Specific implementation and mode
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with specific embodiment, to the present invention
It is described in further detail.It should be understood that the specific embodiments described herein are only to explain the present invention, and
The scope of protection of the present invention is not limited.
Embodiment 1
The electroplating processing method of 28G antenna printed circuit board, which comprises the following steps: sawing sheet → internal layer → the first
It is dry that secondary pressing → first time drilling → first time black holes → first time dry film → whole plate is electroplated → takes off dry film → nog plate → second
Film → first time etching → inspection → second of pressing → second of drilling → second black holes → third time dry film → whole plate electricity
Plate → take off dry film → nog plate → four time dry film → second of etching → inspection → lower process.
After sawing sheet, toasted 4 hours at 150 DEG C.
Further, in interior layer process, pre-treatment microetch amount is controlled in 17 microinch；Inner layer exposure level: L1 layers and L2
Layer one core plate of exposure, L3 layers and one core plate of L4 layers of exposure；Wherein L1 and L4 layers of empty exposure.Make on fully automatic exposure machine
Industry confirms film harmomegathus and very poor before upper machine, and every production 20PNL plate must all clean a film, glass platform, and dust sticky paper is more
Changing frequency is that every 20PNL is changed once.
Further, in first time process for pressing, brownification microetch amount is controlled in 55 microinch；Walkthrough heats+4 rivets；
Copper foil uses normal copper foil, and copper foil is inverted, i.e., smooth surface places 20 completely new brown paper close to core plate up and down.It needs to clean before plate-laying
Plate-laying work top, when plate-laying, need to use dust-binding cloth clean wiping plate face；Polishing: plate face residue glue of polishing after pressing.
Further, in first time bore process, thick copper sheet parameter is 2/it is folded；First clean baking sheet again after drilling, 150 DEG C
Lower baking sheet 2 hours；The hole d is thick≤1000 microinch, ailhead≤2 times.Nozzle is bored, 500 hole of nozzle service life is bored.
Further, in first time black holes technique, plasma removes glue 0.3mg/cm3, using the heavy copper of black holes substitution tradition.
Further, in first time dry film process, dry film uses the plated hole copper film；Plated hole film shading region and printed circuit
Panel aperture is equal.
Further, in first time whole plate electroplating technology, hole copper plates 15 microns.Dry film process is taken off, film is normally moved back, after moving back film
Turning dry film pre-treatment polish-brush adds drying primary.First time nog plate technique is polished the part layers of copper of aperture protrusion with ceramic nog plate
It is smooth.
Further, second of dry film process, pre-treatment are forbidden to walk super roughening line, use needle brush as pre-treatment, use negative film
Film production.
Further, first time etch process is etched using acid negative film.
Further, second of process for pressing, microetch amount control baking sheet 1.5 at 80 DEG C of insert rack after 55 microinch, brownification
Hour, into press in 12 hours after brownification.
Further, walkthrough technique, using filling holes with resin, the big 0.1mm of boring aperture is pressed in consent aluminium flake aperture, is filled in from the face L1
Hole；First pressure testing is confirmed whether to fill up using PP pressing filler；Plate-laying technique needs cleaning plate-laying work top, copper foil before plate-laying
Using normal copper foil, copper foil is inverted, i.e., smooth surface opens completely new brown paper close to core plate, mounted on top 20.Technique for grinding is beaten after pressing
Nog plate face residue glue.
Further, second of bore process parameter and drilling for the first time are consistent；Second of black holes technological parameter and first
Secondary black holes is consistent；Second of whole plate electroplating technological parameter and the plating of first time whole plate are consistent；Second of nog plate technological parameter and
One time nog plate is consistent；Third time dry film, the technological parameter of the 4th dry film are consistent with second of dry film.
Further, it etches for second: being etched using acid negative film.
Embodiment 2
The electroplating processing method of 28G antenna printed circuit board, which comprises the following steps: sawing sheet → internal layer → the first
It is dry that secondary pressing → first time drilling → first time black holes → first time dry film → whole plate is electroplated → takes off dry film → nog plate → second
Film → first time etching → inspection → second of pressing → second of drilling → second black holes → third time dry film → whole plate electricity
Plate → take off dry film → nog plate → four time dry film → second of etching → inspection → lower process.
After sawing sheet, toasted 2 hours at 200 DEG C.
Further, in interior layer process, pre-treatment microetch amount is controlled in 35 microinch；Inner layer exposure level: L1 layers and L2
Layer one core plate of exposure, L3 layers and one core plate of L4 layers of exposure；Wherein L1 and L4 layers of empty exposure.Make on fully automatic exposure machine
Industry confirms film harmomegathus and very poor before upper machine, and every production 20PNL plate must all clean a film, glass platform, and dust sticky paper is more
Changing frequency is that every 20PNL is changed once.
Further, in first time process for pressing, brownification microetch amount is controlled in 75 microinch；Walkthrough heats+4 rivets；
Copper foil uses normal copper foil, and copper foil is inverted, i.e., smooth surface places 20 completely new brown paper close to core plate up and down.It needs to clean before plate-laying
Plate-laying work top, when plate-laying, need to use dust-binding cloth clean wiping plate face；Polishing: plate face residue glue of polishing after pressing.
Further, in first time bore process, thick copper sheet parameter is 2/it is folded；First clean baking sheet again after drilling, 200 DEG C
Lower baking sheet 1 hour；The hole d is thick≤1000 microinch, ailhead≤2 times.Nozzle is bored, 500 hole of nozzle service life is bored.
Further, in first time black holes technique, plasma removes glue 0.6mg/cm3, using the heavy copper of black holes substitution tradition.
Further, in first time dry film process, dry film uses the plated hole copper film；Plated hole film shading region and printed circuit
Panel aperture is equal.
Further, in first time whole plate electroplating technology, hole copper plates 15 microns.Dry film process is taken off, film is normally moved back, after moving back film
Turning dry film pre-treatment polish-brush adds drying primary.First time nog plate technique is polished the part layers of copper of aperture protrusion with ceramic nog plate
It is smooth.
Further, second of dry film process, pre-treatment are forbidden to walk super roughening line, use needle brush as pre-treatment, use negative film
Film production.
Further, first time etch process is etched using acid negative film.
Further, second of process for pressing, microetch amount control baking sheet 0.8 at 120 DEG C of insert rack after 75 microinch, brownification
Hour, into press in 12 hours after brownification.
Further, walkthrough technique, using filling holes with resin, the big 0.1mm of boring aperture is pressed in consent aluminium flake aperture, is filled in from the face L1
Hole；First pressure testing is confirmed whether to fill up using PP pressing filler；Plate-laying technique needs cleaning plate-laying work top, copper foil before plate-laying
Using normal copper foil, copper foil is inverted, i.e., smooth surface opens completely new brown paper close to core plate, mounted on top 20.Technique for grinding is beaten after pressing
Nog plate face residue glue.
Further, second of bore process parameter and drilling for the first time are consistent；Second of black holes technological parameter and first
Secondary black holes is consistent；Second of whole plate electroplating technological parameter and the plating of first time whole plate are consistent；Second of nog plate technological parameter and
One time nog plate is consistent；Third time dry film, the technological parameter of the 4th dry film are consistent with second of dry film.
Further, it etches for second: being etched using acid negative film.
Embodiment 3
The electroplating processing method of 28G antenna printed circuit board, which comprises the following steps: sawing sheet → internal layer → the first
It is dry that secondary pressing → first time drilling → first time black holes → first time dry film → whole plate is electroplated → takes off dry film → nog plate → second
Film → first time etching → inspection → second of pressing → second of drilling → second black holes → third time dry film → whole plate electricity
Plate → take off dry film → nog plate → four time dry film → second of etching → inspection → lower process.
After sawing sheet, toasted 2-4 hours at 180 DEG C.
Further, in interior layer process, pre-treatment microetch amount is controlled in 26 microinch；Inner layer exposure level: L1 layers and L2
Layer one core plate of exposure, L3 layers and one core plate of L4 layers of exposure；Wherein L1 and L4 layers of empty exposure.Make on fully automatic exposure machine
Industry confirms film harmomegathus and very poor before upper machine, and every production 20PNL plate must all clean a film, glass platform, and dust sticky paper is more
Changing frequency is that every 20PNL is changed once.
Further, in first time process for pressing, brownification microetch amount is controlled in 65 microinch；Walkthrough heats+4 rivets；
Copper foil uses normal copper foil, and copper foil is inverted, i.e., smooth surface places 20 completely new brown paper close to core plate up and down.It needs to clean before plate-laying
Plate-laying work top, when plate-laying, need to use dust-binding cloth clean wiping plate face；Polishing: plate face residue glue of polishing after pressing.
Further, in first time bore process, thick copper sheet parameter is 2/it is folded；First clean baking sheet again after drilling, 180 DEG C
Lower baking sheet 1.5 hours；The hole d is thick≤1000 microinch, ailhead≤2 times.Nozzle is bored, 500 hole of nozzle service life is bored.
Further, in first time black holes technique, plasma removes glue 0.45mg/cm3, using the heavy copper of black holes substitution tradition.
Further, in first time dry film process, dry film uses the plated hole copper film；Plated hole film shading region and printed circuit
Panel aperture is equal.
Further, in first time whole plate electroplating technology, hole copper plates 15 microns.Dry film process is taken off, film is normally moved back, after moving back film
Turning dry film pre-treatment polish-brush adds drying primary.First time nog plate technique is polished the part layers of copper of aperture protrusion with ceramic nog plate
It is smooth.
Further, second of dry film process, pre-treatment are forbidden to walk super roughening line, use needle brush as pre-treatment, use negative film
Film production.
Further, first time etch process is etched using acid negative film.
Further, second of process for pressing, baking sheet 1 is small at 100 DEG C of insert rack after 65 microinch, brownification for the control of microetch amount
When, into press in 12 hours after brownification.
Further, walkthrough technique, using filling holes with resin, the big 0.1mm of boring aperture is pressed in consent aluminium flake aperture, is filled in from the face L1
Hole；First pressure testing is confirmed whether to fill up using PP pressing filler；Plate-laying technique needs cleaning plate-laying work top, copper foil before plate-laying
Using normal copper foil, copper foil is inverted, i.e., smooth surface opens completely new brown paper close to core plate, mounted on top 20.Technique for grinding is beaten after pressing
Nog plate face residue glue.
Further, second of bore process parameter and drilling for the first time are consistent；Second of black holes technological parameter and first
Secondary black holes is consistent；Second of whole plate electroplating technological parameter and the plating of first time whole plate are consistent；Second of nog plate technological parameter and
One time nog plate is consistent；Third time dry film, the technological parameter of the 4th dry film are consistent with second of dry film.
Further, it etches for second: being etched using acid negative film.
Embodiment 4
The electroplating processing method of 28G antenna printed circuit board, which comprises the following steps: sawing sheet → internal layer → the first
It is dry that secondary pressing → first time drilling → first time black holes → first time dry film → whole plate is electroplated → takes off dry film → nog plate → second
Film → first time etching → inspection → second of pressing → second of drilling → second black holes → third time dry film → whole plate electricity
Plate → take off dry film → nog plate → four time dry film → second of etching → inspection → lower process.
After sawing sheet, toasted 2-4 hours at 150-200 DEG C.
Further, in interior layer process, pre-treatment microetch amount is controlled in 17-35 microinch；Inner layer exposure level: L1 layers with
One core plate of L2 layers of exposure, L3 layers and one core plate of L4 layers of exposure；Wherein L1 and L4 layers of empty exposure.On fully automatic exposure machine
Operation confirms film harmomegathus and very poor before upper machine, and every production 20PNL plate must all clean a film, glass platform, dust sticky paper
Replacement frequency is that every 20PNL is changed once.
Further, in first time process for pressing, brownification microetch amount is controlled in 55-75 microinch；Walkthrough heats+4 rivetings
Nail；Copper foil uses normal copper foil, and copper foil is inverted, i.e., smooth surface places 20 completely new brown paper close to core plate up and down.It is needed before plate-laying clear
Clean plate-laying work top, when plate-laying, need to use dust-binding cloth clean wiping plate face；Polishing: plate face residue glue of polishing after pressing.
Further, in first time bore process, thick copper sheet parameter is 2/it is folded；Baking sheet again, 150- are first cleaned after drilling
Baking sheet 1-2 hours at 200 DEG C；The hole d is thick≤1000 microinch, ailhead≤2 times.Nozzle is bored, 500 hole of nozzle service life is bored.
Further, in first time black holes technique, plasma removes glue 0.3-0.6mg/cm3, heavy using black holes substitution tradition
Copper.
Further, in first time dry film process, dry film uses the plated hole copper film；Plated hole film shading region and printed circuit
Panel aperture is equal.
Further, in first time whole plate electroplating technology, hole copper plates 15 microns.Dry film process is taken off, film is normally moved back, after moving back film
Turning dry film pre-treatment polish-brush adds drying primary.First time nog plate technique is polished the part layers of copper of aperture protrusion with ceramic nog plate
It is smooth.
Further, second of dry film process, pre-treatment are forbidden to walk super roughening line, use needle brush as pre-treatment, use negative film
Film production.
Further, first time etch process is etched using acid negative film.
Further, second of process for pressing, the control of microetch amount is after 55-75 microinch, brownification at 80-120 DEG C of insert rack
Baking sheet 0.8-1.5 hours, into press in 12 hours after brownification.
Further, walkthrough technique, using filling holes with resin, the big 0.1mm of boring aperture is pressed in consent aluminium flake aperture, is filled in from the face L1
Hole；First pressure testing is confirmed whether to fill up using PP pressing filler；Plate-laying technique needs cleaning plate-laying work top, copper foil before plate-laying
Using normal copper foil, copper foil is inverted, i.e., smooth surface opens completely new brown paper close to core plate, mounted on top 20.Technique for grinding is beaten after pressing
Nog plate face residue glue.
Further, second of bore process parameter and drilling for the first time are consistent；Second of black holes technological parameter and first
Secondary black holes is consistent；Second of whole plate electroplating technological parameter and the plating of first time whole plate are consistent；Second of nog plate technological parameter and
One time nog plate is consistent；Third time dry film, the technological parameter of the 4th dry film are consistent with second of dry film.
Further, it etches for second: being etched using acid negative film.
Experimental test: it is produced by the first time pressing of the printed circuit board respectively to embodiment 1-4, second of process for pressing
Product are tested, and in thermal shock test, are put into 288 DEG C of tin furnaces, 10 seconds/time, 6 times without there is white point, without plate bursting；Medium laminate
Thickness also complies with MI requirement.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (9)
- The electroplating processing method of 1.28G antenna printed circuit board, which comprises the following steps: sawing sheet → internal layer → the One step press → first time drilling → first time black holes → first time dry film → whole plate is electroplated → takes off dry film → nog plate → second Dry film → first time etching → inspection → second of pressing → second of drilling → second black holes → third time dry film → whole plate It is electroplated → takes off dry film → nog plate → four time dry film → second of etching → inspection → lower process.
- 2. the electroplating processing method of 28G antenna printed circuit board according to claim 1, which is characterized in that after sawing sheet, It is toasted 2-4 hours at 150-200 DEG C.
- 3. the electroplating processing method of 28G antenna printed circuit board according to claim 1, which is characterized in that interior layer process In, pre-treatment microetch amount is controlled in 17-35 microinch；Inner layer exposure level: L1 layers and one core plate of L2 layers of exposure, L3 layers and L4 Layer one core plate of exposure；Wherein L1 and L4 layers of empty exposure.
- 4. the electroplating processing method of 28G antenna printed circuit board according to claim 1, which is characterized in that press for the first time It closes in technique, brownification microetch amount is controlled in 55-75 microinch；Walkthrough heats+4 rivets；Copper foil uses normal copper foil, and copper foil falls It sets, i.e., smooth surface places 20 completely new brown paper close to core plate up and down.
- 5. the electroplating processing method of 28G antenna printed circuit board according to claim 1, which is characterized in that bore for the first time In the technique of hole, thick copper sheet parameter is 2/it is folded；Baking sheet again is first cleaned after drilling, baking sheet 1-2 hours at 150-200 DEG C；The hole d is thick≤ 1000 microinch, ailhead≤2 times.
- 6. the electroplating processing method of 28G antenna printed circuit board according to claim 1, which is characterized in that black for the first time In the technique of hole, plasma removes glue 0.3-0.6mg/cm3.
- 7. the electroplating processing method of 28G antenna printed circuit board according to claim 1, which is characterized in that dry for the first time In membrane process, dry film uses the plated hole copper film；Plated hole film shading region is equal with printed circuit panel aperture；The plating of first time whole plate In technique, hole copper plates 15 microns.
- 8. the electroplating processing method of 28G antenna printed circuit board according to claim 1, which is characterized in that second dry Membrane process, pre-treatment are forbidden to walk super roughening line, use needle brush as pre-treatment, are produced with the negative film film.
- 9. the electroplating processing method of 28G antenna printed circuit board according to claim 1, which is characterized in that second of pressure Technique is closed, the control of microetch amount is after 55-75 microinch, brownification baking sheet 0.8-1.5 hours at 80-120 DEG C of insert rack, and 12 is small after brownification When it is interior into press.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910356508.8A CN110324978A (en) | 2019-04-29 | 2019-04-29 | The electroplating processing method of 28G antenna printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910356508.8A CN110324978A (en) | 2019-04-29 | 2019-04-29 | The electroplating processing method of 28G antenna printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110324978A true CN110324978A (en) | 2019-10-11 |
Family
ID=68113048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910356508.8A Pending CN110324978A (en) | 2019-04-29 | 2019-04-29 | The electroplating processing method of 28G antenna printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110324978A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739068A (en) * | 2020-11-12 | 2021-04-30 | 福莱盈电子股份有限公司 | Hole filling method for through hole of circuit board |
| CN113056116A (en) * | 2019-12-28 | 2021-06-29 | 深南电路股份有限公司 | Method for plating hole copper and processing method of circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102316677A (en) * | 2010-06-30 | 2012-01-11 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
| CN105208778A (en) * | 2015-09-23 | 2015-12-30 | 安捷利电子科技（苏州）有限公司 | Manufacturing mode for producing high-density flexible printed circuit board in sheet mode |
| CN107493659A (en) * | 2017-08-22 | 2017-12-19 | 景旺电子科技(龙川)有限公司 | A kind of FPC fine-lines preparation method |
-
2019
- 2019-04-29 CN CN201910356508.8A patent/CN110324978A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102316677A (en) * | 2010-06-30 | 2012-01-11 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
| CN105208778A (en) * | 2015-09-23 | 2015-12-30 | 安捷利电子科技（苏州）有限公司 | Manufacturing mode for producing high-density flexible printed circuit board in sheet mode |
| CN107493659A (en) * | 2017-08-22 | 2017-12-19 | 景旺电子科技(龙川)有限公司 | A kind of FPC fine-lines preparation method |
Non-Patent Citations (3)
| Title |
|---|
| 宋建远等: "微波天线印制电路板制作技术研究", 《印制电路信息》 * |
| 朱民: "非化学镀孔金属化-黑孔化技术应用", 《中外技术情报》 * |
| 程婕: "《电子产品制造工程实践技术》", 31 August 2015 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056116A (en) * | 2019-12-28 | 2021-06-29 | 深南电路股份有限公司 | Method for plating hole copper and processing method of circuit board |
| CN112739068A (en) * | 2020-11-12 | 2021-04-30 | 福莱盈电子股份有限公司 | Hole filling method for through hole of circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104754885B (en) | The manufacture method of circuit board | |
| CN102523692B (en) | Stepped circuit board manufacturing process | |
| CN110324978A (en) | The electroplating processing method of 28G antenna printed circuit board | |
| CN101702869B (en) | Method for directly producing circuit boards from insulated substrate without cladding copper | |
| CN107960019A (en) | A kind of PCB production methods for realizing zero stub and PCB | |
| CN102883558A (en) | Manufacturing method of single plating hole copper | |
| WO2017156678A1 (en) | Method for manufacturing stacked holes of circuit board | |
| WO2020220681A1 (en) | Method for manufacturing printed circuit board for power source of civil high-speed transmission unmanned aerial vehicle | |
| CN109068491B (en) | Aluminum substrate machining process | |
| CN111107717A (en) | Processing method of PCB capable of preventing finger from scratching | |
| CN105792519A (en) | Method for preventing blistering of electroplating copper of resin-filled board | |
| CN111741615B (en) | Method for pressing and filling glue of blind hole with high thickness-diameter ratio | |
| CN105075411A (en) | Method for manufacturing multilayer wiring substrate | |
| CN106231801A (en) | For the technique making pottery plate HDI plate | |
| CN101626663B (en) | Method for preparing second-order laser blind hole by UV, acid etching and CO2 | |
| CN104661450A (en) | Direct hole metallization method based on laser drilling | |
| WO2019134207A1 (en) | Process for improving slip resistance performance of 5g communication high-frequency signal board | |
| CN102427673A (en) | Machining method of blind hole PCB (Printed Circuit Board) | |
| CN111836484A (en) | Processing method for PCB (printed circuit board) backrest design | |
| CN105873368A (en) | Method for manufacturing outer layer graph of thick copper plate | |
| CN110831333A (en) | Method for removing burrs of drilling hole | |
| CN104105354A (en) | Method of manufacturing high-aperture ratio fine printed circuit board | |
| CN115955786A (en) | Production process of three-side wrapped Jin Dujin finger | |
| CN201432459Y (en) | Mesh structure of SMT glue printed halftone | |
| CN102638948B (en) | Manufacturing method of printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191011 |