CN102523702A - Electroplating manufacturing process of circuit board with back-drilled blind hole - Google Patents
Electroplating manufacturing process of circuit board with back-drilled blind hole Download PDFInfo
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- CN102523702A CN102523702A CN2011104262758A CN201110426275A CN102523702A CN 102523702 A CN102523702 A CN 102523702A CN 2011104262758 A CN2011104262758 A CN 2011104262758A CN 201110426275 A CN201110426275 A CN 201110426275A CN 102523702 A CN102523702 A CN 102523702A
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- blind hole
- copper
- wiring board
- back drill
- drill blind
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Abstract
The invention discloses an electroplating manufacturing process, comprising the following steps of: A, utilizing a plasma degumming machine to carry out degumming treatment on residual resin in a back-drilled blind hole of a circuit board; B, carrying out primary copper deposition treatment on the back-drilled blind hole of the circuit board and then carrying out secondary copper deposition treatment to form a copper layer with the thickness of 0.3-0.5 microns in the back-drilled blind hole; and C, carrying out hole-filling electroplating on the circuit board to lead the thickness of the copper layer in the back-drilled blind hole to be more than 18 microns. According to the invention, by utilizing a plasma degumming way to treat the residual resin in the back-drilled blind hole of the circuit board, the problem that a chemical degumming speed is lower is solved, and the plasma degumming way has a good degumming effect and no residues; two times of copper deposition solve the problems that the thickness of deposited copper generated by the primary copper deposition is thin, and hollow copper depositing layers, broken copper or an open circuit is easy to generate in a process of storing or electrically pre-treating a board; and the thickness of the copper layer in the blind hole can reach to be more than 18 microns through the hole-filling electroplating, so that the thickness requirement of the back-drilled blind hole is met. Compared with the prior art, the electroplating manufacturing process provided by the invention effectively overcomes the quality defects that: the back-drilled blind hole cannot be completely degummed, the binding force is poor, and the copper in the hole is thinner and the like.
Description
Technical field:
The invention belongs to the PCB manufacture technology field, what be specifically related to is that a kind of wiring board back drill blind hole is electroplated manufacture craft.
Background technology:
Along with the continuous promotion of information-based industry, the speed of digital data transmission is more and more faster, and frequency is increasingly high, and high-power confession puts the utilization of device, and the pcb board of traditional design can not satisfy the needs of this high-frequency circuit.For the Transmission Research of signal integrity, proved that useless hole, PTH hole copper partly has significant impact at present, can satisfy high frequency, performance at a high speed cheaply so use the back drill technology to remove this part hole.
Manufacturing process at PCB adopts the back drill blind hole can effectively satisfy the needs of high-frequency circuit, and the back drill blind hole is by big nose end 3 on the wiring board, is positioned at constituting than small bore end 4 of big nose end 3 bottoms; As shown in Figure 1; Electroplating processes process to this back drill blind hole is following: at first on internal layer Copper Foil 1, cover one deck prepreg, be covered with outer copper foil 2 at prepreg then, carry out lamination afterwards; It is pressed together; Then use bigger brill to chew and get out big nose end 3 in the circuit board, adopt less brill to chew afterwards and get out, then can form the back drill blind hole than small bore end 4 in the bottom of big nose end 3.
In boring procedure; Chew when high speed rotating owing to bore, can produce high temperature, the prepreg that covers on the internal layer Copper Foil 1 is produced melt; Thereby cause internal layer Copper Foil 1 and back drill blind hole contact position to be melted the resin covering that the back produces by prepreg; Make in the hole of internal layer Copper Foil 1 and back drill blind hole inwall the copper electroplating layer 6 can't conducting, cause opening circuit between internal layer Copper Foil 1 and panel plating copper layer 5, the outer copper foil 2, influence the electric property of product.
For being very difficult for this to happen; The resin that produces after need melting prepreg is removed; The mode of removing glue at present is to carry out through liquor potassic permanganate; But because the back drill blind hole depth is darker, it is relatively poor with exchangeability that potassium permanganate removes sol solution liquid medicine circulation in blind hole, so can produce following problem:
1, removes that glue liquid medicine is stung the erosion resin degree of depth and roughness has satisfied not quality requirements in the back drill blind hole, be easy to generate resin and heavy copper layer adhesion is poor, internal layer copper has cull quality defect.
2, heavy copper thickness is thin, can not satisfy the basic demand of the copper layer thickness of the 0.3-0.6UM hole in, deposit or plate electricity pre-treatment process in can cause heavy copper layer cavity, empty in electroplating formation hole, back, the defectives such as copper or open circuit of breaking.
3, blind hole bottom and sidewall copper are thick thin partially, and aperture copper is thick thick partially, and common electrical copper facing liquid medicine blind hole covering power only 40% can't guarantee that the interior copper layer thickness of blind hole is finally greater than the requirement of 18UM.
Summary of the invention:
For this reason; The object of the present invention is to provide a kind of wiring board back drill blind hole to electroplate manufacture craft; Do not have to solve; Copper thickness is thin in the interior resin poor removal effect of blind hole that exists in the present wiring board back drill blind hole plating manufacture craft, the hole, defectives such as cavity, disconnected copper or open circuit in the easy formation hole after electroplating, and the interior copper layer thickness of blind hole finally can not satisfy the requirement of 18UM.
For realizing above-mentioned purpose, the present invention mainly adopts following technical scheme:
A kind of plating manufacture craft comprises step:
A, utilize plasma to remove the glue machine cull in the wiring board back drill blind hole is removed glue to handle;
B, above-mentioned wiring board back drill blind hole is carried out once heavy copper handle, and then carry out the heavy copper of secondary and handle, making and forming thickness in the back drill blind hole is the copper layer of 0.3～0.5um;
C, wiring board is carried out filling perforation electroplate, make that copper layer thickness reaches more than the 18um in the back drill blind hole.
Comprise before the wherein said steps A:
On the internal layer Copper Foil, cover one deck prepreg, and cover outer copper foil, carry out lamination treatment then, more above-mentioned wiring board is bored the back drill blind hole afterwards at prepreg.
Wherein above-mentioned wiring board is bored the back drill blind hole and at first adopt the large scale brill to chew boring, form blind hole; And then use small size to bore and chew the bottom hole in above-mentioned blind hole, form the back drill blind hole.
Comprise step after the wherein said step C:
D, the wiring board after electroplating through filling perforation put in order the plate plating, the panel plating copper layer of wiring board is increased to more than the 35um.
Comprise step after the wherein said step D:
E, the wiring board after whole plate electroplated carry out negative graphic making.
The present invention adopts plasma to remove the glue mode cull in the wiring board back drill blind hole is handled; Utilize plasma circulation in the back drill blind hole far to be better than the characteristics of the liquid flow general character; Solved chemistry and removed glue speed problem of lower, and it is effective to remove glue, noresidue; Through the heavy copper of secondary, the heavy copper thickness of having avoided once heavy copper to produce is thin, deposit or plate electricity pre-treatment process in can be easy to generate the problem of heavy copper layer cavity, disconnected copper or open circuit; Electroplate through filling perforation, the interior copper layer thickness of blind hole is reached more than the 18um, guaranteed the thickness requirement of back drill blind hole.Compared with prior art, the present invention efficiently solve the back drill blind hole remove glue not to the utmost, quality defect such as adhesion is poor, hole copper approaches partially.
Description of drawings:
Fig. 1 is the piece cutting structure sketch map of wiring board back drill blind hole.
Fig. 2 electroplates the manufacture craft flow chart for wiring board back drill blind hole of the present invention.
Identifier declaration among the figure: internal layer Copper Foil 1, outer copper foil 2, big nose end 3, than copper electroplating layer 6 in small bore end 4, panel plating copper layer 5, the hole.
Embodiment:
For setting forth thought of the present invention and purpose, will combine accompanying drawing and specific embodiment that the present invention is done further explanation below.
The present invention is to provide a kind of wiring board back drill blind hole and electroplate manufacture craft; Be mainly used in and adopt chemistry thin in the present wiring board back drill blind hole plating of the solution manufacture craft except that copper thickness in the interior resin poor removal effect of the blind hole of glue existence, the hole; Form defectives such as cavity in the hole, disconnected copper or open circuit after electroplating easily, and the interior copper layer thickness of blind hole finally can not satisfy the requirement of 18UM.
See also Fig. 1, shown in Figure 2, Fig. 1 is the piece cutting structure sketch map of wiring board back drill blind hole; Fig. 2 electroplates the manufacture craft flow chart for wiring board back drill blind hole of the present invention.A kind of wiring board back drill blind hole of the present invention is electroplated manufacture craft, specifically comprises step:
At first carrying out internal layer makes; On the internal layer Copper Foil, cover one deck prepreg (PP sheet) then, and cover outer copper foil, above-mentioned internal layer Copper Foil, prepreg and outer copper foil are carried out lamination treatment at this prepreg; The three is combined closely, more above-mentioned wiring board is bored the back drill blind hole afterwards.
When wherein boring the back drill blind hole, at first to adopt large-sized brill to chew and hole, form blind hole; The degree of depth of this blind hole will arrive internal layer Copper Foil place; But can not penetrate whole wiring board, and then use undersized brill to chew and hole again, form the back drill blind hole in the bottom of above-mentioned blind hole.
After above-mentioned operation is accomplished, then get into step:
A, utilize plasma to remove the glue machine cull in the wiring board back drill blind hole is removed glue to handle;
It is to utilize radio frequency electrode that gas is excited into plasma that plasma removes glue, reaches except that the glue effect with plasma and resin reaction, and plasma circulation in the back drill blind hole far is better than the liquid flow general character, removes the glue effect and can access effective assurance.And through evidence, plasma removes glue and replaces liquor potassic permanganate to remove glue speed problem of lower except that glue can effectively solve chemistry.
B, above-mentioned wiring board back drill blind hole is carried out once heavy copper handle, and then carry out the heavy copper of secondary and handle, making and forming thickness in the back drill blind hole is the copper layer of 0.3～0.5um;
For guaranteeing heavy copper thickness, need to increase the heavy copper flow process of secondary, the heavy copper of secondary begins from the preimpregnation cylinder, makes blind inner hole deposition copper layer thickness reach 0.3-0.5un.
C, wiring board is carried out filling perforation electroplate, make that copper layer thickness reaches more than the 18um in the back drill blind hole.
The thick requirement of back drill blind hole copper is greater than 18um, but because the interior liquid medicine circulation of back drill blind hole is poor, blind hole bottom and sidewall copper are thick thin partially; And aperture copper is thick thick partially, and common electrical copper facing liquid medicine blind hole covering power is merely 40%, has both influenced the blind hole aperture; Copper is thick can not to meet the demands; Therefore need to increase filling perforation and electroplate flow process, liquid medicine is electroplated in filling perforation can be in the blind hole bottom and the sidewall fast deposition of electronegative potential, and its blind hole covering power can reach 90-120%; Can guarantee effectively that blind hole copper is thick, making originally, the hole copper thickness of 0.3-0.5un reaches 18um fast.
D, the wiring board after electroplating through filling perforation put in order the plate plating, the panel plating copper layer of wiring board is increased to more than the 35um.
E, the wiring board after whole plate electroplated carry out negative graphic making.
In sum, the present invention is through changing process conditions, efficiently solve the back drill blind hole remove glue not to the utmost, quality problem such as adhesion is poor, hole copper approaches partially.
More than be a kind of wiring board back drill blind hole provided by the present invention to be electroplated manufacture craft carried out detailed introduction; Used concrete example among this paper structural principle of the present invention and execution mode are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (5)
1. electroplate manufacture craft for one kind, it is characterized in that comprising step:
A, utilize plasma to remove the glue machine cull in the wiring board back drill blind hole is removed glue to handle;
B, above-mentioned wiring board back drill blind hole is carried out once heavy copper handle, and then carry out the heavy copper of secondary and handle, making and forming thickness in the back drill blind hole is the copper layer of 0.3～0.5um;
C, wiring board is carried out filling perforation electroplate, make that copper layer thickness reaches more than the 18um in the back drill blind hole.
2. wiring board back drill blind hole according to claim 1 is electroplated manufacture craft, it is characterized in that comprising before the said steps A:
On the internal layer Copper Foil, cover one deck prepreg, and cover outer copper foil, carry out lamination treatment then, more above-mentioned wiring board is bored the back drill blind hole afterwards at prepreg.
3. wiring board back drill blind hole according to claim 2 is electroplated manufacture craft, it is characterized in that above-mentioned wiring board is bored the back drill blind hole at first adopts the large scale brill to chew boring, forms blind hole; And then use small size to bore and chew the bottom hole in above-mentioned blind hole, form the back drill blind hole.
4. wiring board back drill blind hole according to claim 1 is electroplated manufacture craft, it is characterized in that said step C comprises step afterwards:
D, the wiring board after electroplating through filling perforation put in order the plate plating, the panel plating copper layer of wiring board is increased to more than the 35um.
5. wiring board back drill blind hole according to claim 4 is electroplated manufacture craft, it is characterized in that said step D comprises step afterwards:
E, the wiring board after whole plate electroplated carry out negative graphic making.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110426275.8A CN102523702B (en) | 2011-12-19 | 2011-12-19 | Electroplating manufacturing process of circuit board with back-drilled blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110426275.8A CN102523702B (en) | 2011-12-19 | 2011-12-19 | Electroplating manufacturing process of circuit board with back-drilled blind hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102523702A true CN102523702A (en) | 2012-06-27 |
| CN102523702B CN102523702B (en) | 2014-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110426275.8A Expired - Fee Related CN102523702B (en) | 2011-12-19 | 2011-12-19 | Electroplating manufacturing process of circuit board with back-drilled blind hole |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103429012A (en) * | 2013-08-02 | 2013-12-04 | 北大方正集团有限公司 | PCB (Printed Circuit Board) and production method of back drilling hole in PCB |
| CN103874332A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
| CN105282977A (en) * | 2015-10-15 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Method for improving copper missing of metalized back drilling hole of circuit board with high thickness-to-diameter ratio |
| CN106304641A (en) * | 2016-08-26 | 2017-01-04 | 广东冠锋科技股份有限公司 | A kind of manufacture method of super thick Teflon circuit board |
| CN109831875A (en) * | 2019-02-25 | 2019-05-31 | 深圳冠锋航天科技有限公司 | Radar antenna module and preparation method thereof |
| CN110831350A (en) * | 2019-11-14 | 2020-02-21 | 四会富仕电子科技股份有限公司 | Method for manufacturing bottomless copper circuit board |
| CN112739068A (en) * | 2020-11-12 | 2021-04-30 | 福莱盈电子股份有限公司 | Hole filling method for through hole of circuit board |
| WO2021143102A1 (en) * | 2020-01-15 | 2021-07-22 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high density interconnect hdi board |
| CN113279034A (en) * | 2021-05-14 | 2021-08-20 | 惠州中京电子科技有限公司 | Filling hole electroplating processing method for Mini LED micro blind hole |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101137270A (en) * | 2006-08-31 | 2008-03-05 | 比亚迪股份有限公司 | Flexible multi-layer circuit board and its producing method |
| CN101873770A (en) * | 2009-04-21 | 2010-10-27 | 中山市兴达电路板有限公司 | Electroplating copper plughole process of circuit board |
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2011
- 2011-12-19 CN CN201110426275.8A patent/CN102523702B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101137270A (en) * | 2006-08-31 | 2008-03-05 | 比亚迪股份有限公司 | Flexible multi-layer circuit board and its producing method |
| CN101873770A (en) * | 2009-04-21 | 2010-10-27 | 中山市兴达电路板有限公司 | Electroplating copper plughole process of circuit board |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103429012A (en) * | 2013-08-02 | 2013-12-04 | 北大方正集团有限公司 | PCB (Printed Circuit Board) and production method of back drilling hole in PCB |
| WO2015014051A1 (en) * | 2013-08-02 | 2015-02-05 | 北大方正集团有限公司 | Manufacturing method for back drilling hole in pcb and pcb |
| CN103429012B (en) * | 2013-08-02 | 2016-01-13 | 北大方正集团有限公司 | The preparation method in the back drill hole on a kind of pcb board and pcb board |
| US9756734B2 (en) | 2013-08-02 | 2017-09-05 | Peking University Founder Group Co., Ltd. | Manufacturing method for back drilling hole in PCB and PCB |
| CN103874332A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
| CN105282977A (en) * | 2015-10-15 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Method for improving copper missing of metalized back drilling hole of circuit board with high thickness-to-diameter ratio |
| CN106304641A (en) * | 2016-08-26 | 2017-01-04 | 广东冠锋科技股份有限公司 | A kind of manufacture method of super thick Teflon circuit board |
| CN109831875A (en) * | 2019-02-25 | 2019-05-31 | 深圳冠锋航天科技有限公司 | Radar antenna module and preparation method thereof |
| CN110831350A (en) * | 2019-11-14 | 2020-02-21 | 四会富仕电子科技股份有限公司 | Method for manufacturing bottomless copper circuit board |
| WO2021143102A1 (en) * | 2020-01-15 | 2021-07-22 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high density interconnect hdi board |
| CN112739068A (en) * | 2020-11-12 | 2021-04-30 | 福莱盈电子股份有限公司 | Hole filling method for through hole of circuit board |
| CN113279034A (en) * | 2021-05-14 | 2021-08-20 | 惠州中京电子科技有限公司 | Filling hole electroplating processing method for Mini LED micro blind hole |
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|---|---|
| CN102523702B (en) | 2014-11-26 |
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Inventor after: Song Xiuquan Inventor after: Peng Tao Inventor after: Chang Wenzhi Inventor after: Chen Hongsheng Inventor after: Tian Weifeng Inventor after: Liu Chen Inventor before: Song Xiujin Inventor before: Peng Tao Inventor before: Chang Wenzhi Inventor before: Chen Hongsheng Inventor before: Tian Weifeng Inventor before: Liu Chen |
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Owner name: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO., LTD. Effective date: 20141014 |
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Inventor after: Song Jianyuan Inventor after: Chang Wenzhi Inventor after: Wei Hao Inventor after: Wang Shuyi Inventor before: Song Xiuquan Inventor before: Peng Tao Inventor before: Chang Wenzhi Inventor before: Chen Hongsheng Inventor before: Tian Weifeng Inventor before: Liu Chen |
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Free format text: CORRECT: INVENTOR; FROM: SONG XIUQUAN PENG TAO CHANG WENZHI CHEN HONGSHENG TIAN WEIFENG LIU CHEN TO: SONG JIANYUAN CHANG WENZHI WEI HAO WANG SHUYI |
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Effective date of registration: 20141014 Address after: The new industrial zone of Baoan District Jade Road Shenzhen City manhole street 518000 Guangdong province Henggang Xinqiao building 3 Applicant after: Shenzhen Suntak Multilayer PCB Co., Ltd. Applicant after: JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO., LTD. Address before: The new industrial zone of Baoan District Jade Road Shenzhen City manhole street 518000 Guangdong province Henggang Xinqiao building 3 Applicant before: Shenzhen Suntak Multilayer PCB Co., Ltd. |
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