CN108366489B - A kind of undesirable method of optimization back drill aperture turmeric - Google Patents
A kind of undesirable method of optimization back drill aperture turmeric Download PDFInfo
- Publication number
- CN108366489B CN108366489B CN201810060131.7A CN201810060131A CN108366489B CN 108366489 B CN108366489 B CN 108366489B CN 201810060131 A CN201810060131 A CN 201810060131A CN 108366489 B CN108366489 B CN 108366489B
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- CN
- China
- Prior art keywords
- hole
- back drill
- aperture
- production
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Abstract
The invention discloses a kind of undesirable methods of optimization back drill aperture turmeric, comprising the following steps: drills on production plate on production plate, the hole bored includes the through-hole for needing back drill, and makes via metal by heavy copper and electric plating of whole board；Outer-layer circuit and production solder mask are successively made on production plate；To the welding resistance windowing position on production plate and the through-hole of back drill is needed to carry out heavy nickel gold processing；Back drill is carried out on the through-hole for needing to carry out back drill, drills out back drill hole as required, and the aperture in the back drill hole is greater than the aperture of the through-hole；Then molding and electric performance test process successively are carried out to production plate, detection is qualified, finished product.The method of the present invention is by optimized production process process, under the premise of not increasing process and cost, can solve the defect of the heavy nickel gold plating leakage of aperture back drill.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of undesirable side of optimization back drill aperture turmeric
Method.
Background technique
In order to increase the signal integrity of impedance transmission lines, copper extra in back drill removal telltale hole is generallyd use；It is existing
Back drill hole production method be after plate graphic plating etch before carry out back drill, to drill out back drill hole, but for small
The telltale hole in aperture is easy to cause tin and copper by aperture clogs if aperture is less than the hole of 0.35mm after back drill, etching is moved back difficult when tin
It is clean in removal, cause rear process to will appear plating leakage defect when being surface-treated heavy nickel gold；There are also one is by such telltale hole more
It is changed to filling holes with resin, but will increase process and cost in this way, production efficiency is reduced, can also bring quality risk, as abrasive band flattens
Shi Rongyi grinds away plate, will increase the difficulty of production outer-layer circuit at the same time, and not necessarily meets the requirement of client.
Summary of the invention
There is drawbacks described above existing line plate in the present invention, it is undesirable to provide a kind of optimization back drill aperture turmeric
Method, this method is by optimized production process process, under the premise of not increasing process and cost, can solve the heavy nickel of aperture back drill
The defect of golden plating leakage.
In order to solve the above-mentioned technical problems, the present invention provides a kind of undesirable methods of optimization back drill aperture turmeric, including
Following steps:
S1, it drills on production plate, the hole bored includes the through-hole for needing back drill, and makes through-hole by heavy copper and electric plating of whole board
Metallization；
S2, outer-layer circuit and production solder mask are successively made on production plate；
S3, heavy nickel gold processing is carried out to the welding resistance windowing position produced on plate and the through-hole for needing back drill；
S4, back drill being carried out on the through-hole for needing to carry out back drill, drilling out back drill hole as required, the aperture in the back drill hole is big
In the aperture of the through-hole；
S5, molding and electric performance test process successively then are carried out to production plate, detection is qualified, finished product.
Preferably, in step S4, the big 0.15-0.25mm in aperture of through-hole described in the aperture ratio in the back drill hole.
Preferably, the method is suitable for the through-hole aperture less than 0.35mm, and radius-thickness ratio is greater than the plate of 6:1.
Preferably, the production plate is to have been subjected to the plate being pressed together.
Compared with prior art, the invention has the following beneficial effects:
Back drill process is put and is carried out after the surface treatment by optimized production process process by the present invention, in this way will not volume
Outer increase process and cost, when surface treatment is also not present causes heavy nickel gold the problem of plating leakage occur because of plug-hole, and it is heavy to solve
The defect of nickel gold plating leakage；It the back drill hole made by the method for the invention will not even if forming copper/ni au plug-hole in aperture
Influence that client is subsequent to install and use and the reliability of product.
Specific embodiment
In order to more fully understand technology contents of the invention, below in conjunction with specific embodiment to technical side of the invention
Case is described further and illustrates.
Embodiment 1
A kind of undesirable method of optimization back drill aperture turmeric, is less than in particular for aperture shown in the present embodiment
0.35mm, radius-thickness ratio are greater than the undesirable method of aperture turmeric of 6:1, successively include following treatment process:
(1), sawing sheet: core plate is outputed by jigsaw size 320mm × 420mm, core plate plate thickness is 1mm, the outer layer copper face of core plate
Thickness is 1OZ.
(2), internal layer circuit (negative film technique) is made: according to figure location hole, with the coating sense of vertical application machine on core plate
Light film, 8 μm of the film thickness monitoring of light-sensitive surface complete interior layer line using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Road exposure forms inner line figure after developed；Internal layer etching, etches internal layer circuit for the core plate after exposure development, interior
Wide measure of layer line is 3mil；Then internal layer AOI checks the defects of opening short circuit, route notch, route pin hole of internal layer circuit, has
Defect scraps processing, and flawless product goes out to downstream.
(3), press: brownification speed carries out brownification according to bottom copper copper thickness, by outer copper foil, prepreg, core plate, semi-solid preparation
Piece, outer copper foil successively overlap as required, then select lamination appropriate to be pressed according to plate Tg, form production
Plate.
(4) outer layer drills: carrying out drilling processing to production plate using borehole data, the hole bored includes needing leading to for back drill
Hole, the aperture of the through-hole are 0.25mm.
(5), heavy copper: making to produce the hole metallization on plate, and backlight tests 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), electric plating of whole board: according to the prior art and by design requirement to production plate carry out electric plating of whole board, thicken plate face and
Layers of copper in hole.
(7), outer-layer circuit production (positive blade technolgy): outer graphics transfer, it is luxuriant and rich with fragrance using Full-automatic exposure machine and positive route
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, forms outer-layer circuit figure on production plate
Shape；Outer graphics plating, the then copper facing and tin plating respectively on production plate, copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is that 10min, 3-5 μm of tin thickness is electroplated with the current density of 1.2ASD；Then film is successively moved back again, etches and move back tin,
Outer-layer circuit is etched on production plate；Outer layer AOI, then check outer-layer circuit opens short circuit, route notch, route pin hole etc.
Defect, defective to scrap processing, flawless product goes out to downstream.
(8), solder mask and silk-screen welding resistance, silk-screen character: are made on production plate according to the prior art and by design requirement
Character.
(9), it surface treatment (heavy nickel gold): is surface-treated, hinders on production plate according to the prior art and by design requirement
The copper face of weldering windowing position and the logical principles of chemistry of through-hole for needing back drill, uniform deposition centainly requires the nickel layer and gold of thickness in layers of copper
Layer.
(10), back drill hole: carrying out back drill on the through-hole for needing to carry out back drill, depth and hole by required production back drill hole
Diameter requires to drill out back drill hole, and the big 0.15-0.25mm in aperture of the aperture ratio through-hole in back drill hole, such as the aperture in back drill hole is
0.5mm；After making back drill hole by the above method, even if copper/ni au plug-hole is formed in through-holes, after client will not being influenced
Continuous to install and use and the reliability of product, the problem of heavy nickel gold plating leakage, is also resolved, and will not increase additional process
And cost.
(11), it forms: according to the prior art and pressing design requirement gong shape, route is made in the +/- 0.05mm of external form tolerance
Plate.
(12), electric performance test: detecting the electric property of wiring board, detects qualified wiring board and enters next processing
Link；
(13), final inspection: taking a sample test appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of finished product etc. respectively,
Qualified product can shipment.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (3)
1. a kind of undesirable method of optimization back drill aperture turmeric, which comprises the following steps:
S1, it drills on production plate, the hole bored includes the through-hole for needing back drill, and makes via metal by heavy copper and electric plating of whole board
Change；
S2, outer-layer circuit and production solder mask are successively made on production plate；
S3, heavy nickel gold processing is carried out to the welding resistance windowing position produced on plate and the through-hole for needing back drill；
S4, back drill being carried out on the through-hole for needing to carry out back drill, drilling out back drill hole as required, the aperture in the back drill hole is greater than institute
State the aperture of through-hole；
S5, molding and electric performance test process successively then are carried out to production plate, detection is qualified, finished product.
2. the undesirable method of optimization back drill aperture turmeric according to claim 1, which is characterized in that described in step S4
The big 0.15-0.25mm in the aperture of through-hole described in the aperture ratio in back drill hole.
3. the undesirable method of optimization back drill aperture turmeric according to claim 1, which is characterized in that the production plate is
By the plate being pressed together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810060131.7A CN108366489B (en) | 2018-01-22 | 2018-01-22 | A kind of undesirable method of optimization back drill aperture turmeric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810060131.7A CN108366489B (en) | 2018-01-22 | 2018-01-22 | A kind of undesirable method of optimization back drill aperture turmeric |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108366489A CN108366489A (en) | 2018-08-03 |
| CN108366489B true CN108366489B (en) | 2019-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810060131.7A Active CN108366489B (en) | 2018-01-22 | 2018-01-22 | A kind of undesirable method of optimization back drill aperture turmeric |
Country Status (1)
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| CN (1) | CN108366489B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195313A (en) * | 2018-09-25 | 2019-01-11 | 深圳崇达多层线路板有限公司 | A kind of Novel back drilling testing hole production method |
| CN111065207B (en) * | 2019-12-31 | 2021-10-08 | 广州广合科技股份有限公司 | Method for processing poor back-drilled board of PCB |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861058B (en) * | 2010-06-04 | 2012-05-09 | 深南电路有限公司 | Method of PCB board processing technology |
| JP2016152256A (en) * | 2015-02-16 | 2016-08-22 | 日本電気株式会社 | Electronic component mounting method |
| US9763327B2 (en) * | 2015-03-19 | 2017-09-12 | Multek Technologies Limited | Selective segment via plating process and structure |
| CN105578801B (en) * | 2015-12-15 | 2018-04-03 | 深圳崇达多层线路板有限公司 | A kind of preparation method in the back drill hole of the consent of solder mask half |
| CN105491800A (en) * | 2015-12-23 | 2016-04-13 | 江门崇达电路技术有限公司 | Fabrication method of PCB with back-drill hole |
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| Publication number | Publication date |
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| CN108366489A (en) | 2018-08-03 |
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