CN104640382B - 复合基板和刚性基板 - Google Patents

复合基板和刚性基板 Download PDF

Info

Publication number: CN104640382B
Authority: CN; China
Prior art keywords: layer; composite substrate; rigid substrates; wiring layer; connection terminal
Prior art date: 2013-11-06
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

CN201410636928.9A

Other languages

English (en)

Chinese (zh)

Other versions

CN104640382A (zh

Inventor

宫崎政志

杉山裕

杉山裕一

秦丰

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Taiyo Yuden Co Ltd

Original Assignee

Taiyo Yuden Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-11-06

Filing date

2014-11-06

Publication date

2018-06-01

2014-11-06 Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd

2015-05-20 Publication of CN104640382A publication Critical patent/CN104640382A/zh

2018-06-01 Application granted granted Critical

2018-06-01 Publication of CN104640382B publication Critical patent/CN104640382B/zh

Status Expired - Fee Related legal-status Critical Current

2034-11-06 Anticipated expiration legal-status Critical

Links

239000000758 substrate Substances 0.000 title claims abstract description 227
239000002131 composite material Substances 0.000 title claims abstract description 97
239000010410 layer Substances 0.000 claims description 341
239000011810 insulating material Substances 0.000 claims description 22
238000009413 insulation Methods 0.000 claims description 14
239000002184 metal Substances 0.000 claims description 11
229910052751 metal Inorganic materials 0.000 claims description 11
239000004020 conductor Substances 0.000 claims description 10
239000012792 core layer Substances 0.000 claims 9
238000010276 construction Methods 0.000 abstract description 5
239000000463 material Substances 0.000 description 46
229910000679 solder Inorganic materials 0.000 description 37
230000004907 flux Effects 0.000 description 36
239000011247 coating layer Substances 0.000 description 24
238000004519 manufacturing process Methods 0.000 description 22
229920005989 resin Polymers 0.000 description 19
239000011347 resin Substances 0.000 description 19
239000010949 copper Substances 0.000 description 15
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
238000010586 diagram Methods 0.000 description 13
239000011248 coating agent Substances 0.000 description 10
238000000576 coating method Methods 0.000 description 10
229910052802 copper Inorganic materials 0.000 description 10
238000007747 plating Methods 0.000 description 10
239000000853 adhesive Substances 0.000 description 9
230000001070 adhesive effect Effects 0.000 description 9
239000004642 Polyimide Substances 0.000 description 8
239000003822 epoxy resin Substances 0.000 description 8
229920000647 polyepoxide Polymers 0.000 description 8
229920001721 polyimide Polymers 0.000 description 8
230000002708 enhancing effect Effects 0.000 description 7
239000002245 particle Substances 0.000 description 7
239000000377 silicon dioxide Substances 0.000 description 7
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
239000000945 filler Substances 0.000 description 6
238000000034 method Methods 0.000 description 6
239000000203 mixture Substances 0.000 description 6
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
239000003795 chemical substances by application Substances 0.000 description 4
238000001259 photo etching Methods 0.000 description 4
239000004925 Acrylic resin Substances 0.000 description 3
229920000178 Acrylic resin Polymers 0.000 description 3
229910000881 Cu alloy Inorganic materials 0.000 description 3
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
230000000052 comparative effect Effects 0.000 description 3
238000005530 etching Methods 0.000 description 3
229910052737 gold Inorganic materials 0.000 description 3
238000010438 heat treatment Methods 0.000 description 3
238000000059 patterning Methods 0.000 description 3
239000007787 solid Substances 0.000 description 3
239000002344 surface layer Substances 0.000 description 3
239000002253 acid Substances 0.000 description 2
238000005260 corrosion Methods 0.000 description 2
230000007797 corrosion Effects 0.000 description 2
238000005868 electrolysis reaction Methods 0.000 description 2
238000011049 filling Methods 0.000 description 2
-1 imide cyanate Chemical class 0.000 description 2
238000009434 installation Methods 0.000 description 2
RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
238000003475 lamination Methods 0.000 description 2
238000003754 machining Methods 0.000 description 2
239000007769 metal material Substances 0.000 description 2
238000002360 preparation method Methods 0.000 description 2
229920003002 synthetic resin Polymers 0.000 description 2
239000000057 synthetic resin Substances 0.000 description 2
XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
239000010426 asphalt Substances 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
238000000354 decomposition reaction Methods 0.000 description 1
238000010511 deprotection reaction Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000001125 extrusion Methods 0.000 description 1
239000003925 fat Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
239000011229 interlayer Substances 0.000 description 1
FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000011068 loading method Methods 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
239000007800 oxidant agent Substances 0.000 description 1
230000001590 oxidative effect Effects 0.000 description 1
229920003192 poly(bis maleimide) Polymers 0.000 description 1
239000011435 rock Substances 0.000 description 1
238000007788 roughening Methods 0.000 description 1
239000002699 waste material Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Combinations Of Printed Boards (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

CN201410636928.9A 2013-11-06 2014-11-06 复合基板和刚性基板 Expired - Fee Related CN104640382B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2013-230463		2013-11-06
JP2013230463A JP6387226B2 (ja)	2013-11-06	2013-11-06	複合基板

Publications (2)

Publication Number	Publication Date
CN104640382A CN104640382A (zh)	2015-05-20
CN104640382B true CN104640382B (zh)	2018-06-01

Family

ID=53194316

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201410636928.9A Expired - Fee Related CN104640382B (zh)	2013-11-06	2014-11-06	复合基板和刚性基板

Country Status (2)

Country	Link
JP (1)	JP6387226B2 (ja)
CN (1)	CN104640382B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN113261161A (zh) *	2019-03-21	2021-08-13	深圳市柔宇科技股份有限公司	电连接组件、电子设备及电连接组件的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1806474A (zh) *	2004-06-11	2006-07-19	揖斐电株式会社	刚挠性电路板及其制造方法
CN1939104A (zh) *	2004-04-09	2007-03-28	大日本印刷株式会社	刚性－柔性板及其制造方法
CN102448247A (zh) *	2010-10-07	2012-05-09	三星电机株式会社	其内嵌有电子组件的印刷电路板
CN102458056A (zh) *	2010-10-25	2012-05-16	矢崎总业株式会社	制造布线基板的方法
CN102771200A (zh) *	2010-02-22	2012-11-07	三洋电机株式会社	多层印刷电路板及其制造方法

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JPS59158823A (ja) *	1983-03-02	1984-09-08	Kunimitsu Yamada	地中プレストレストコンクリ−ト部材の構築工法
JP3107419B2 (ja) *	1991-07-23	2000-11-06	株式会社東海理化電機製作所	ドアロック解除装置
JPH05225965A (ja) *	1992-05-27	1993-09-03	Sony Corp	バッテリー装着装置
JP3956204B2 (ja) *	2002-06-27	2007-08-08	日本特殊陶業株式会社	積層樹脂配線基板及びその製造方法、積層樹脂配線基板用金属板
JP2005259860A (ja) *	2004-03-10	2005-09-22	Mitsubishi Electric Corp	電子回路装置
JP4574310B2 (ja) *	2004-09-30	2010-11-04	大日本印刷株式会社	リジッド−フレキシブル基板の製造方法
JP4792747B2 (ja) *	2004-11-29	2011-10-12	大日本印刷株式会社	配線基板ユニットの製造装置
JP3993211B2 (ja) *	2005-11-18	2007-10-17	シャープ株式会社	多層プリント配線板およびその製造方法
JP2008186843A (ja) *	2007-01-26	2008-08-14	Olympus Corp	フレキシブル基板の接合構造
US8648263B2 (en) *	2007-05-17	2014-02-11	Ibiden Co., Ltd.	Wiring board and method of manufacturing wiring board
CN102461350A (zh) *	2009-06-02	2012-05-16	索尼化学&信息部件株式会社	多层印刷布线板的制造方法
JP2011159855A (ja) *	2010-02-02	2011-08-18	Panasonic Corp	局所多層回路基板、および局所多層回路基板の製造方法
JP2012009478A (ja) *	2010-06-22	2012-01-12	Sumitomo Electric Printed Circuit Inc	接続構造、電子機器

2013
- 2013-11-06 JP JP2013230463A patent/JP6387226B2/ja not_active Expired - Fee Related
2014
- 2014-11-06 CN CN201410636928.9A patent/CN104640382B/zh not_active Expired - Fee Related

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1939104A (zh) *	2004-04-09	2007-03-28	大日本印刷株式会社	刚性－柔性板及其制造方法
CN1806474A (zh) *	2004-06-11	2006-07-19	揖斐电株式会社	刚挠性电路板及其制造方法
CN102771200A (zh) *	2010-02-22	2012-11-07	三洋电机株式会社	多层印刷电路板及其制造方法
CN102448247A (zh) *	2010-10-07	2012-05-09	三星电机株式会社	其内嵌有电子组件的印刷电路板
CN102458056A (zh) *	2010-10-25	2012-05-16	矢崎总业株式会社	制造布线基板的方法

Also Published As

Publication number	Publication date
JP6387226B2 (ja)	2018-09-05
CN104640382A (zh)	2015-05-20
JP2015090931A (ja)	2015-05-11

Legal Events

Date	Code	Title	Description
2015-05-20	C06	Publication
2015-05-20	PB01	Publication
2015-06-17	C10	Entry into substantive examination
2015-06-17	SE01	Entry into force of request for substantive examination
2018-06-01	GR01	Patent grant
2018-06-01	GR01	Patent grant
2023-11-17	CF01	Termination of patent right due to non-payment of annual fee	Granted publication date: 20180601
2023-11-17	CF01	Termination of patent right due to non-payment of annual fee

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US20120111616A1 (en)	2012-05-10	Electronic-component-mounted wiring substrate and method of manufacturing the same
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