CN104253063B - 一种用于防止晶片偏移掉落的装置 - Google Patents
一种用于防止晶片偏移掉落的装置 Download PDFInfo
- Publication number
- CN104253063B CN104253063B CN201310266339.1A CN201310266339A CN104253063B CN 104253063 B CN104253063 B CN 104253063B CN 201310266339 A CN201310266339 A CN 201310266339A CN 104253063 B CN104253063 B CN 104253063B
- Authority
- CN
- China
- Prior art keywords
- bolt
- dropping
- prevent
- chip
- knife
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本发明公开了一种用于防止晶片偏移掉落的装置,设置在半导体洗净台上,该装置包含:刀子,其由马达驱动并上、下摆动;基座,其通过V字机构与刀子相连,该V字机构包含轴承、穿设在轴承中的螺栓及摆动杆,摆动杆一端设置在螺栓上,其另一端顶住基座,螺栓向着刀子的外部延伸一段,该装置还包含锁紧部件,其套置在螺栓延伸段处。该装置结构简单、可以有效的防止轴承掉落,保证晶片在基座上的精确工位,从而防止晶片偏移掉落,提供晶片生产成功率。
Description
技术领域
本发明涉及半导体领域,特别涉及一种用于防止晶片偏移掉落的装置。
背景技术
半导体洗净台6’工作过程中,电机直接作用刀子1’,并通过V字机构带动基座2’,加载半导体洗净台6’,打开盖子,基座位于半导体洗净台6’内腔顶部,将晶片放置在基座2’上(参见图1);合上盖子,下降基座至处理腔中,晶片高溢流冲洗(参见图2);抬升基座,引进异丙醇或氮气并进行低溢流冲洗(参见图3);继续升高基座2’,排出清洗液,完成晶片的冲洗(参见图4)。
如图5所示,现有技术中由于轴承3’在螺栓4’上没有加上任何锁紧装置,当刀子1’上升到某一位置时,容易造成V字机构的轴承3’掉落,刀子1’与基座2’分离,使得晶片7’偏移掉落。
发明内容
本发明的目的是提供一种用于防止晶片偏移掉落的装置,该装置结构简单、可以有效的防止轴承掉落,保证晶片在基座上的精确工位,从而防止晶片偏移掉落,提供晶片生产成功率。
为了实现以上目的,本发明是通过以下技术方案实现的:
一种用于防止晶片偏移掉落的装置,设置在半导体洗净台上,该装置包含:刀子,其由马达驱动并上、下摆动;基座,其通过V字机构与刀子相连,该V字机构包含轴承、穿设在轴承中的螺栓及摆动杆,所述的摆动杆一端设置在螺栓上,其另一端顶住基座,其特点是,所述螺栓向着刀子的外部延伸一段,该装置还包含锁紧部件,其套置在螺栓延伸段处。
所述的螺栓延伸段外表面设为螺纹状。
所述的锁紧部件设为螺母,其与螺栓延伸段相适配。
所述的锁紧部件设为锁紧簧。
本发明与现有技术相比,具有以下优点:
本发明结构简单、可以有效的防止轴承掉落,保证晶片在基座上的精确工位,从而防止晶片偏移掉落,提供晶片生产成功率。
附图说明
图1为背景技术中半导体洗净台加载工作结构示意图;
图2为背景技术中半导体洗净台晶片高溢流冲洗工作结构示意图;
图3为背景技术中半导体洗净台晶片低溢流冲洗工作结构示意图;
图4为背景技术中半导体洗净台晶片低溢流冲洗完成晶片的冲洗的结构图;
图5为背景技术中轴承与螺栓的连接示意图;
图6为本发明一种用于防止晶片偏移掉落的装置结构示意图;
图7为本发明一种用于防止晶片偏移掉落的装置应用示意图。
具体实施方式
以下结合附图,通过详细说明一个较佳的具体实施例,对本发明做进一步阐述。
如图6、7所示,一种用于防止晶片偏移掉落的装置,设置在半导体洗净台6上,该装置包含:刀子1,其由马达驱动并上、下摆动;基座2,其通过V字机构与刀子1相连,并由刀子1带动基座2运动托住晶片7,该V字机构包含轴承3、穿设在轴承3中的螺栓4及摆动杆8,所述的摆动杆8一端设置在螺栓4上,其另一端顶住基座2,所述螺栓4向着刀子1的外部延伸一段,该装置还包含锁紧部件5,其套置在螺栓4延伸段处,所述的锁紧部件5设为螺母或锁紧簧(本实施例中锁紧部件为锁紧簧)。所述的螺栓4的延伸段外表面设为螺纹状,螺母与螺栓延伸段相适配,并可旋接在螺栓4延伸段处,通过螺母或锁紧簧可以有效的防止轴承3掉落,从而避免刀子1与基座2分离。
本发明结构简单、可以有效的防止轴承掉落,保证晶片7在基座2上的精确工位,从而防止晶片偏移掉落,提供晶片生产成功率。
尽管本发明的内容已经通过上述优选实施例作了详细介绍,但应当认识到上述的描述不应被认为是对本发明的限制。在本领域技术人员阅读了上述内容后,对于本发明的多种修改和替代都将是显而易见的。因此,本发明的保护范围应由所附的权利要求来限定。
Claims (4)
1.一种用于防止晶片偏移掉落的装置,设置在半导体洗净台上,该装置包含:刀子(1),其由马达驱动并上、下摆动;基座(2),其通过V字机构与刀子(1)相连,该V字机构包含轴承(3)、穿设在轴承(3)中的螺栓(4)及摆动杆(8),所述的摆动杆(8)一端设置在螺栓(4)上,其另一端顶住基座(2),其特征在于,所述螺栓(4)向着刀子(1)的外部延伸一段,该装置还包含锁紧部件(5),其套置在螺栓(4)的延伸段处。
2.如权利要求1所述的用于防止晶片偏移掉落的装置,其特征在于,所述的螺栓(4)的延伸段外表面设为螺纹状。
3.如权利要求2所述的用于防止晶片偏移掉落的装置,其特征在于,所述的锁紧部件(5)设为螺母,其与螺栓延伸段相适配。
4.如权利要求1所述的用于防止晶片偏移掉落的装置,其特征在于,所述的锁紧部件(5)设为锁紧簧。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310266339.1A CN104253063B (zh) | 2013-06-28 | 2013-06-28 | 一种用于防止晶片偏移掉落的装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310266339.1A CN104253063B (zh) | 2013-06-28 | 2013-06-28 | 一种用于防止晶片偏移掉落的装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104253063A CN104253063A (zh) | 2014-12-31 |
CN104253063B true CN104253063B (zh) | 2017-12-01 |
Family
ID=52187850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310266339.1A Active CN104253063B (zh) | 2013-06-28 | 2013-06-28 | 一种用于防止晶片偏移掉落的装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104253063B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1171858A (zh) * | 1995-01-05 | 1998-01-28 | 施蒂格微技术有限公司 | 用于化学湿处理的装置 |
US5887604A (en) * | 1991-05-08 | 1999-03-30 | Tokyo Electron Limited | Washing apparatus, and washing method |
CN1368755A (zh) * | 2001-02-02 | 2002-09-11 | 集贤实业有限公司 | 半导体晶圆干燥方法 |
CN102496590A (zh) * | 2011-12-22 | 2012-06-13 | 浙江金瑞泓科技股份有限公司 | 带超声或兆声振子的异丙醇干燥机 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3714763B2 (ja) * | 1997-03-31 | 2005-11-09 | 大日本スクリーン製造株式会社 | 基板保持部材およびこれを利用した基板処理装置 |
JP2004296552A (ja) * | 2003-03-25 | 2004-10-21 | Shimada Phys & Chem Ind Co Ltd | 基板乾燥装置 |
JP4999808B2 (ja) * | 2008-09-29 | 2012-08-15 | 東京エレクトロン株式会社 | 基板処理装置 |
KR101421752B1 (ko) * | 2008-10-21 | 2014-07-22 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 처리 방법 |
-
2013
- 2013-06-28 CN CN201310266339.1A patent/CN104253063B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5887604A (en) * | 1991-05-08 | 1999-03-30 | Tokyo Electron Limited | Washing apparatus, and washing method |
CN1171858A (zh) * | 1995-01-05 | 1998-01-28 | 施蒂格微技术有限公司 | 用于化学湿处理的装置 |
CN1368755A (zh) * | 2001-02-02 | 2002-09-11 | 集贤实业有限公司 | 半导体晶圆干燥方法 |
CN102496590A (zh) * | 2011-12-22 | 2012-06-13 | 浙江金瑞泓科技股份有限公司 | 带超声或兆声振子的异丙醇干燥机 |
Also Published As
Publication number | Publication date |
---|---|
CN104253063A (zh) | 2014-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200715521A (en) | Semiconductor stacked die/wafer configuration and packaging and method thereof | |
WO2007061558A3 (en) | Semiconductor die package using leadframe and clip and method of manufacturing | |
EP2775512A3 (en) | Semiconductor devices | |
WO2011044385A3 (en) | Vertically stackable dies having chip identifier structures | |
EP2779237A3 (en) | A chip arrangement and a method for manufacturing a chip arrangement | |
TWI317991B (en) | Semiconductor package with flip chip on leadframe | |
EP3070739A3 (en) | Semiconductor device and wafer level package including such semiconductor device | |
CN104253063B (zh) | 一种用于防止晶片偏移掉落的装置 | |
CN207747249U (zh) | 一种硅片切割用降温装置 | |
CN203991454U (zh) | 一种用于清洗液压油路块的多工位作业装置 | |
CN103387102B (zh) | 一种防阻塞减压锥及其使用方法 | |
CN201845753U (zh) | 一种晶圆夹 | |
CN203423157U (zh) | 一种石英真空吸笔 | |
CN103035546B (zh) | 一种小尺寸键合点双线键合方法 | |
CN206710553U (zh) | 一种集成电路检测平台 | |
CN205270186U (zh) | 一种清洗盘刷 | |
TW200717830A (en) | Package structure | |
CN204604052U (zh) | 材料切割升降器 | |
CN208111421U (zh) | 薄型qfp半导体芯片 | |
CN202633252U (zh) | 一种晶圆承载盒 | |
CN202494276U (zh) | 高效甩干花篮 | |
CN202796879U (zh) | 一种用于硅片清洗的喷淋*** | |
US10155214B2 (en) | Getter, MEMS device and method of forming the same | |
CN204011385U (zh) | 晶片承架 | |
CN206931595U (zh) | 半导体封装框架 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |