JP4999808B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP4999808B2 JP4999808B2 JP2008250343A JP2008250343A JP4999808B2 JP 4999808 B2 JP4999808 B2 JP 4999808B2 JP 2008250343 A JP2008250343 A JP 2008250343A JP 2008250343 A JP2008250343 A JP 2008250343A JP 4999808 B2 JP4999808 B2 JP 4999808B2
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- 238000012545 processing Methods 0.000 title claims description 95
- 239000000758 substrate Substances 0.000 title claims description 88
- 230000002265 prevention Effects 0.000 claims description 71
- 239000007788 liquid Substances 0.000 claims description 57
- 230000005660 hydrophilic surface Effects 0.000 claims description 5
- 230000005661 hydrophobic surface Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 99
- 238000001035 drying Methods 0.000 description 28
- 239000007789 gas Substances 0.000 description 19
- 239000000126 substance Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 8
- 230000032258 transport Effects 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 4
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 4
- -1 polychlorotrifluoroethylene Polymers 0.000 description 4
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920001774 Perfluoroether Polymers 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 2
- 230000001846 repelling effect Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
上記洗浄・乾燥処理装置は、図1に示すように、被処理用の基板である半導体ウエハW(以下にウエハWという)を収容する処理室である処理槽1と、この処理槽1の上方に位置するウエハWを収容する乾燥室2と、処理槽1内のウエハWに処理液である酸化膜除去用の薬液例えば希フッ酸水(DHF)を供給する薬液供給手段3と、処理槽1内のウエハWに別の処理液である洗浄用のリンス液を供給するリンス液供給手段4と、乾燥室2内に例えば窒素ガス(N2ガス)や清浄空気等の乾燥気体を供給する乾燥気体供給手段6と、薬液供給手段3、リンス液供給手段4及び乾燥気体供給手段6やこの発明における後述する搬送手段であるウエハボート5、容器カバー昇降機構8、シャッタ9等に制御(作動)信号を伝達する制御手段例えば中央演算処理装置10(以下にCPU10という)とを具備している。
上記第1実施形態では、下側保持体20が2本の場合について説明したが、下側保持体20Aを1本にしてもよい。すなわち、第2実施形態のウエハボート5Aは、図9及び図10に示すように、ガイド部7と、このガイド部7に水平状態に固着された互いに平行な、ウエハWの周縁の下端部を支持する1本の下側保持体20Aと、ウエハWの転倒時に該ウエハWの周縁の下部側端部を保持する左右一対の上側保持体30とで主に構成されている。
上記実施形態では、ウエハWの下端部を支持する下側保持体20,20Aと、ウエハWの転倒時に該ウエハWの下部側端部を保持する左右一対の上側保持体30とを具備する場合について説明したが、逆の構成としてもよい。すなわち、ウエハWの下部側端部を支持する左右一対の上側保持体と、ウエハWの転倒時に該ウエハWの下端部を保持する下側保持体とを具備する構成としてもよい。
1 処理槽
2 乾燥室
3 薬液供給手段
4 リンス液供給手段
5,5A ウエハボート(搬送手段)
6 乾燥気体供給手段
9 シャッタ
10 CPU(制御手段)
20,20A 下側保持体
21,21A 保持溝
22,22A 保持溝部
23,23A 転倒防止溝
24,24A 転倒防止溝部
25 保持溝の開口端
26 転倒防止溝の開口端
27 保持溝の溝底
28 転倒防止溝の溝底
29 頂部
30 上側保持体
31 保持溝
Claims (11)
- 基板を複数の保持体で垂直に保持した状態で搬送する搬送手段と、処理液を貯留する処理槽と、を具備し、基板を上記搬送手段の上記保持体によって保持した状態で上記処理槽内の処理液に浸漬させて基板に処理を施す基板処理装置であって、
上記保持体の少なくとも一つの保持体が基板の端部を直接支持する保持溝を有する保持溝部と、該保持溝部に隣接して設けられ、基板を上記保持溝で保持している際には基板と非接触であって上記保持溝による基板の支持が解かれた際に基板を保持する転倒防止溝を有する転倒防止溝部と、を一体に形成してなる、
ことを特徴とする基板処理装置。 - 請求項1記載の基板処理装置において、
上記搬送手段は、基板の下端部を直接支持する上記保持溝と上記転倒防止溝とを一体に形成する下側保持体と、基板の転倒時に該基板の下部側端部を保持する左右一対の上側保持体とを具備してなる、ことを特徴とする基板処理装置。 - 請求項1記載の基板処理装置において、
上記搬送手段は、基板の下部側端部を直接支持する上記保持溝と上記転倒防止溝とを一体に形成する左右一対の上側保持体と、基板の転倒時に該基板の下端部を保持する下側保持体とを具備してなる、ことを特徴とする基板処理装置。 - 請求項2記載の基板処理装置において、
上記下側保持体は、複数枚の基板を互いに平行に保持すべく保持溝と転倒防止溝を複数並設してなる、ことを特徴とする基板処理装置。 - 請求項3記載の基板処理装置において、
上記上側保持体は、複数枚の基板を互いに平行に保持すべく保持溝と転倒防止溝を複数並設してなる、ことを特徴とする基板処理装置。 - 請求項1ないし5のいずれかに記載の基板処理装置において、
上記転倒防止溝は、上記保持溝の開口端より高い開口端と、上記保持溝の溝底より深い溝底を有する、ことを特徴とする基板処理装置。 - 請求項1ないし5のいずれかに記載の基板処理装置において、
上記保持溝は略V字状に形成されていることを特徴とする基板処理装置。 - 請求項1ないし7のいずれかに記載の基板処理装置において、
上記転倒防止溝は保持溝の開き角度より小さい開き角度を有する略V字状に形成されていることを特徴とする基板処理装置。 - 請求項1ないし7のいずれかに記載の基板処理装置において、
上記転倒防止溝は保持溝の開き角度より小さい開き角度を有する略Y字状に形成されていることを特徴とする基板処理装置。 - 請求項1ないし9のいずれかに記載の基板処理装置において、
上記保持溝及び保持溝部は、上記転倒防止溝及び転倒防止溝部側に向かって下り傾斜状に形成されている、ことを特徴とする基板処理装置。 - 請求項1ないし10のいずれかに記載の基板処理装置において、
上記保持溝を有する保持溝部は少なくともその表面が親水性を有する部材にて形成され、上記転倒防止溝を有する転倒防止溝部は少なくともその表面が疎水性を有する部材にて形成される、ことを特徴とする基板処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008250343A JP4999808B2 (ja) | 2008-09-29 | 2008-09-29 | 基板処理装置 |
KR1020090087588A KR101290936B1 (ko) | 2008-09-29 | 2009-09-16 | 기판 처리 장치 |
TW098131617A TWI401764B (zh) | 2008-09-29 | 2009-09-18 | Substrate processing device |
US12/562,818 US8585030B2 (en) | 2008-09-29 | 2009-09-18 | Substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008250343A JP4999808B2 (ja) | 2008-09-29 | 2008-09-29 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010080859A JP2010080859A (ja) | 2010-04-08 |
JP4999808B2 true JP4999808B2 (ja) | 2012-08-15 |
Family
ID=42056551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008250343A Active JP4999808B2 (ja) | 2008-09-29 | 2008-09-29 | 基板処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8585030B2 (ja) |
JP (1) | JP4999808B2 (ja) |
KR (1) | KR101290936B1 (ja) |
TW (1) | TWI401764B (ja) |
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US6092981A (en) * | 1999-03-11 | 2000-07-25 | Applied Materials, Inc. | Modular substrate cassette |
US6176377B1 (en) * | 1999-08-18 | 2001-01-23 | Ali Industries, Inc. | Rack for supporting abrasive discs or the like |
US6318389B1 (en) * | 1999-10-29 | 2001-11-20 | Memc Electronic Materials, Inc. | Apparatus for cleaning semiconductor wafers |
US6669253B2 (en) * | 2000-12-18 | 2003-12-30 | David W. Benzing | Wafer boat and boat holder |
TW522448B (en) * | 2001-10-22 | 2003-03-01 | Advanced Semiconductor Eng | Semiconductor wafer carrying apparatus |
US7175026B2 (en) * | 2002-05-03 | 2007-02-13 | Maxtor Corporation | Memory disk shipping container with improved contaminant control |
US6814808B1 (en) * | 2002-10-08 | 2004-11-09 | Sci-Tech Glassblowing, Inc. | Carrier for semiconductor wafers |
TWM309572U (en) * | 2006-08-07 | 2007-04-11 | Yau-Gung Li | Carrier rack for substrates |
-
2008
- 2008-09-29 JP JP2008250343A patent/JP4999808B2/ja active Active
-
2009
- 2009-09-16 KR KR1020090087588A patent/KR101290936B1/ko active IP Right Grant
- 2009-09-18 TW TW098131617A patent/TWI401764B/zh active
- 2009-09-18 US US12/562,818 patent/US8585030B2/en active Active
Also Published As
Publication number | Publication date |
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JP2010080859A (ja) | 2010-04-08 |
KR20100036178A (ko) | 2010-04-07 |
US20100078867A1 (en) | 2010-04-01 |
TWI401764B (zh) | 2013-07-11 |
KR101290936B1 (ko) | 2013-07-29 |
US8585030B2 (en) | 2013-11-19 |
TW201027657A (en) | 2010-07-16 |
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