TW200717830A - Package structure - Google Patents

Package structure

Info

Publication number
TW200717830A
TW200717830A TW094136399A TW94136399A TW200717830A TW 200717830 A TW200717830 A TW 200717830A TW 094136399 A TW094136399 A TW 094136399A TW 94136399 A TW94136399 A TW 94136399A TW 200717830 A TW200717830 A TW 200717830A
Authority
TW
Taiwan
Prior art keywords
package structure
substrate
diversion
bumps
die
Prior art date
Application number
TW094136399A
Other languages
Chinese (zh)
Other versions
TWI261367B (en
Inventor
Chun-Yang Lee
Sung-Fei Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94136399A priority Critical patent/TWI261367B/en
Application granted granted Critical
Publication of TWI261367B publication Critical patent/TWI261367B/en
Publication of TW200717830A publication Critical patent/TW200717830A/en

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  • Wire Bonding (AREA)

Abstract

A package structure has a substrate, a die mounted on the central region of the substrate, and a plurality of diversion bumps. The diversion bumps are used to diverse the direction of water during the washing process. Thus, the diversion bumps is able to prevent tin residual or solder chippings from retaining under the die.
TW94136399A 2005-10-18 2005-10-18 Package structure TWI261367B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94136399A TWI261367B (en) 2005-10-18 2005-10-18 Package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94136399A TWI261367B (en) 2005-10-18 2005-10-18 Package structure

Publications (2)

Publication Number Publication Date
TWI261367B TWI261367B (en) 2006-09-01
TW200717830A true TW200717830A (en) 2007-05-01

Family

ID=37876165

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94136399A TWI261367B (en) 2005-10-18 2005-10-18 Package structure

Country Status (1)

Country Link
TW (1) TWI261367B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI604537B (en) * 2016-09-30 2017-11-01 南亞科技股份有限公司 Semiconductor package and method for forming the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109276953A (en) * 2017-07-21 2019-01-29 德梅斯特(上海)环保科技有限公司 A kind of dedusting demister and dedusting demister system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI604537B (en) * 2016-09-30 2017-11-01 南亞科技股份有限公司 Semiconductor package and method for forming the same

Also Published As

Publication number Publication date
TWI261367B (en) 2006-09-01

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