TW200717830A - Package structure - Google Patents
Package structureInfo
- Publication number
- TW200717830A TW200717830A TW094136399A TW94136399A TW200717830A TW 200717830 A TW200717830 A TW 200717830A TW 094136399 A TW094136399 A TW 094136399A TW 94136399 A TW94136399 A TW 94136399A TW 200717830 A TW200717830 A TW 200717830A
- Authority
- TW
- Taiwan
- Prior art keywords
- package structure
- substrate
- diversion
- bumps
- die
- Prior art date
Links
Landscapes
- Wire Bonding (AREA)
Abstract
A package structure has a substrate, a die mounted on the central region of the substrate, and a plurality of diversion bumps. The diversion bumps are used to diverse the direction of water during the washing process. Thus, the diversion bumps is able to prevent tin residual or solder chippings from retaining under the die.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94136399A TWI261367B (en) | 2005-10-18 | 2005-10-18 | Package structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94136399A TWI261367B (en) | 2005-10-18 | 2005-10-18 | Package structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI261367B TWI261367B (en) | 2006-09-01 |
TW200717830A true TW200717830A (en) | 2007-05-01 |
Family
ID=37876165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94136399A TWI261367B (en) | 2005-10-18 | 2005-10-18 | Package structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI261367B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI604537B (en) * | 2016-09-30 | 2017-11-01 | 南亞科技股份有限公司 | Semiconductor package and method for forming the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109276953A (en) * | 2017-07-21 | 2019-01-29 | 德梅斯特(上海)环保科技有限公司 | A kind of dedusting demister and dedusting demister system |
-
2005
- 2005-10-18 TW TW94136399A patent/TWI261367B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI604537B (en) * | 2016-09-30 | 2017-11-01 | 南亞科技股份有限公司 | Semiconductor package and method for forming the same |
Also Published As
Publication number | Publication date |
---|---|
TWI261367B (en) | 2006-09-01 |
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