CN103492289A - 覆盖膜 - Google Patents
覆盖膜 Download PDFInfo
- Publication number
- CN103492289A CN103492289A CN201180070280.8A CN201180070280A CN103492289A CN 103492289 A CN103492289 A CN 103492289A CN 201180070280 A CN201180070280 A CN 201180070280A CN 103492289 A CN103492289 A CN 103492289A
- Authority
- CN
- China
- Prior art keywords
- coverlay
- resin
- sealing layer
- hot sealing
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013039 cover film Substances 0.000 title abstract description 5
- 239000010410 layer Substances 0.000 claims description 71
- 229920005989 resin Polymers 0.000 claims description 59
- 239000011347 resin Substances 0.000 claims description 59
- 238000007789 sealing Methods 0.000 claims description 56
- 239000011229 interlayer Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 22
- 229920001577 copolymer Polymers 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 15
- YARNEMCKJLFQHG-UHFFFAOYSA-N prop-1-ene;styrene Chemical compound CC=C.C=CC1=CC=CC=C1 YARNEMCKJLFQHG-UHFFFAOYSA-N 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 11
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- 229910052799 carbon Inorganic materials 0.000 claims description 8
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- 239000011859 microparticle Substances 0.000 claims description 6
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- 238000012856 packing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 20
- 238000000926 separation method Methods 0.000 abstract 1
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- 239000010408 film Substances 0.000 description 21
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 18
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
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- 239000000126 substance Substances 0.000 description 9
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- 239000011256 inorganic filler Substances 0.000 description 7
- 229910003475 inorganic filler Inorganic materials 0.000 description 7
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- 229920000515 polycarbonate Polymers 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 7
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 7
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- 239000000853 adhesive Substances 0.000 description 3
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- 229920006267 polyester film Polymers 0.000 description 3
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- 229920005604 random copolymer Polymers 0.000 description 3
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- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
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- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
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- 238000010422 painting Methods 0.000 description 2
- 239000000088 plastic resin Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
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- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical group CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- XTVRLCUJHGUXCP-UHFFFAOYSA-N 3-methyleneheptane Chemical compound CCCCC(=C)CC XTVRLCUJHGUXCP-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- GHUXAYLZEGLXDA-UHFFFAOYSA-N 8-azido-5-ethyl-6-phenylphenanthridin-5-ium-3-amine;bromide Chemical compound [Br-].C12=CC(N=[N+]=[N-])=CC=C2C2=CC=C(N)C=C2[N+](CC)=C1C1=CC=CC=C1 GHUXAYLZEGLXDA-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 1
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- LCJHLOJKAAQLQW-UHFFFAOYSA-N acetic acid;ethane Chemical compound CC.CC(O)=O LCJHLOJKAAQLQW-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
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- 150000001336 alkenes Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
- WHLPIOPUASGRQN-UHFFFAOYSA-N butyl 2-methylprop-2-enoate;methyl 2-methylprop-2-enoate Chemical compound COC(=O)C(C)=C.CCCCOC(=O)C(C)=C WHLPIOPUASGRQN-UHFFFAOYSA-N 0.000 description 1
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- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
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- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- 239000000203 mixture Substances 0.000 description 1
- GQEZCXVZFLOKMC-UHFFFAOYSA-N n-alpha-hexadecene Natural products CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 1
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- 230000001902 propagating effect Effects 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
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- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
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- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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Abstract
本发明公开了一种覆盖膜,其至少包含基材层(A)、中间层(B)、剥离层(C)及可热封于载带的热封层(D),热封层(D)包含具有5000~20000的质均分子量的苯乙烯-丙烯酸类共聚物作为主成分而成。这样的覆盖膜从载带剥离时的剥离强度的偏差小,能够抑制覆盖膜的断裂等剥离时的电子器件的安装工序中的故障。
Description
技术领域
本发明涉及用于电子器件的包装体的覆盖膜。
背景技术
伴随电子设备的小型化,使用的电子器件也进行小型高性能化,并且在电子设备的组装工序中实施将器件自动地安装在印刷基板上。表面安装用电子器件被容纳于通过热成型连续形成有对应于电子器件的形状的袋部的载带。将电子器件容纳后,在载带的上表面叠置作为盖材的覆盖膜,以经加热的密封棒在长度方向上将覆盖膜的两端连续地进行热封,制成包装体。作为覆盖膜材料,使用在经双轴拉伸的聚酯膜基材上层叠热塑性树脂的热封层而得的材料等。作为前述载带,主要使用热塑性树脂的聚苯乙烯、聚碳酸酯制产品。
近年来,电容器、电阻器、IC、LED、连接器、开关元件等各种电子器件进行了显著微小化、轻质化、薄型化,为了从上述包装体取出容纳的电子器件而剥离覆盖膜时的要求性能比以往更严格。特别是从载带剥离覆盖膜时的剥离强度连续且固定在指定值的范围内,容纳的电子器件越是微小化、轻质化,则越容易因剥离时的振动导致该电子器件飞出,引发安装工序中的故障。
即,在电子设备等的制造工序的器件安装时,通过自动剥离装置从载带剥离覆盖膜,如果剥离强度过强,则有时覆盖膜断裂,相反如果过弱,则运送输送体时存在覆盖膜从载带剥落,作为内容物的电子器件脱落的可能。特别是随着安装速度的急剧高速化,覆盖膜的剥离速度也极度高速化达到0.1秒以下/tact,剥离时对覆盖膜施加大的冲击应力。其结果,有覆盖膜发生切断的、被称为“膜断裂”的问题产生。
作为这样的膜断裂的对策,提出了在双轴拉伸的聚酯膜等基材和密封层之间设置聚丙烯、尼龙、聚氨酯等耐冲击性、抗撕裂蔓延性优异的层的方法(参见专利文献1~3)。另外,提出了使用特定比重的茂金属线形低密度聚乙烯(LLDPE)作为中间层,使该中间层和基材层间的粘接层为低杨氏模量,由此防止向基材层传播应力的方法(参见专利文献4)。但是,即使利用这些方法也难以在每分钟100m这样的高速剥离中抑制膜断裂。
另外,容纳电子器件的包装体为了除去封装树脂所含的水分而需要进行烘烤处理。为了提高这样的电子器件的批量生产率,需要提高烘烤温度、缩短烘烤时间,最近,在将覆盖膜热封于载带的状态下,进行例如在60℃的环境下72小时或在80℃的环境下24小时左右的烘烤处理。这种情况下,存在电子器件附着于覆盖膜的热封面,在将器件安装到基板上时引发安装不良的情况。但是,以往对于这样的器件附着问题没有充分考虑。
现有技术文献
专利文献
专利文献1:日本特开平8-119373号公报
专利文献2:日本特开平10-250020号公报
专利文献3:日本特开2000-327024号公报
专利文献4:日本特开2006-327624号公报
发明内容
本发明是鉴于上述情况而提出的,主要课题在于提供至少部分消除了伴随以往的覆盖膜的不良情况的覆盖膜。
更具体而言,本发明的课题在于提供一种覆盖膜,其为聚苯乙烯及聚碳酸酯等的载带用覆盖膜,为了取出电子器件而剥离覆盖膜时的剥离强度连续且为规定范围内,并且即使在高速剥离时剥离强度的上升也少,不发生因剥离时的振动导致微小的电子器件飞出、高速剥离时的覆盖膜断裂、因烘烤处理导致器件附着之类的、在安装工序中的故障。
本发明人等针对前述课题努力研究,结果发现:通过设置由具有特定质均分子量的特定热塑性树脂形成的热封层,能获得克服了本发明的课题的覆盖膜,完成了本发明。
即,本发明的一个方案提供一种覆盖膜,其至少包含基材层(A)、中间层(B)、剥离层(C)及可热封于载带的热封层(D),热封层(D)包含具有5000~20000的质均分子量的苯乙烯-丙烯酸类共聚物作为主成分而成。
在上述方案的一个实施方式中,热封层(D)的苯乙烯-丙烯酸类共聚物是具有70~100℃的玻璃化温度的树脂。
其他实施方式中,剥离层(C)含有芳香族乙烯(aromatic vinyl)-共轭二烯共聚物的氢化树脂作为主成分而成,所述芳香族乙烯-共轭二烯共聚物的氢化树脂中芳香族乙烯基的含量为15~35质量%。另外,剥离层(C)和/或热封层(D)含有导电材料。这样的导电材料在一个实施方式中为导电性微粒,形状为针状、球状的微粒中的任一种或其组合。例如导电材料为碳纳米材料。
进而,本发明还包括将上述覆盖膜用作以热塑性树脂为主成分而形成的载带的盖材的电子器件包装体。
根据本发明,使用具有特定质均分子量的特定热塑性树脂作为热封层来形成聚苯乙烯及聚碳酸酯等的载带用覆盖膜,所以能够得到如下覆盖膜:该覆盖膜在为了取出电子器件而剥离覆盖膜时的剥离强度连续且为规定范围内,并且即使在高速剥离时剥离强度的上升也少,不发生因剥离时的振动导致微小的电子器件飞出、高速剥离时的覆盖膜断裂、因烘烤处理导致器件附着之类的、在安装工序中的故障。
附图说明
图1是表示本发明的覆盖膜的层结构的一例的剖面图。
具体实施方式
本发明的覆盖膜至少依次包含基材层(A)、中间层(B)、剥离层(C)以及热封层(D)而成。本发明的覆盖膜的结构的一例如图1所示。
基材层(A)是由双轴拉伸聚酯或双轴拉伸尼龙而形成的层,可以特别优选使用双轴拉伸聚对苯二甲酸乙二醇酯(PET)及双轴拉伸聚萘二甲酸乙二醇酯(PEN)、经双轴拉伸的6,6-尼龙、6-尼龙、经双轴拉伸的聚丙烯。作为双轴拉伸PET、双轴拉伸PEN、双轴拉伸6,6-尼龙、6-尼龙、双轴拉伸聚丙烯,除了常用材料以外,也可使用涂布或混入有用于抗静电处理的抗静电剂的材料、或实施了电晕处理、易粘接处理等的材料。基材层若过薄,则覆盖膜本身的拉伸强度降低,故剥离覆盖膜时容易发生“膜断裂”。另一方面,若过厚,则不仅导致对载带的热封性下降,而且也会导致成本升高,所以通常优选使用厚度为12~25μm的材料。
本发明中,在基材层(A)的单面,视需要通过粘接剂层而层叠设置中间层(B)。作为构成中间层(B)的树脂,可优选使用具有柔软性并且具有适度的刚性、常温时的撕裂强度优异的线形低密度聚乙烯(以下称为LLDPE),特别是通过使用密度为0.900~0.925(×103kg/m3)的范围的树脂,由于不易引起因热封时的热或压力导致的中间层树脂从覆盖膜端部露出,因此热封时不易产生烙铁污染,不仅如此,还缓和了覆盖膜热封时由于中间层软化而引起的热封烙铁的接触斑点,所以在将覆盖膜剥离时容易获得稳定的剥离强度。
LLDPE中,有利用齐格勒型催化剂聚合的物质和利用茂金属系催化剂聚合的物质(以下称为m-LLDPE)。因为m-LLDPE分子量分布被控制得窄,所以具有特别高的撕裂强度,可以优选用作本发明的中间层(B)。
上述m-LLDPE为作为共聚单体的碳数3以上的烯烃,优选为碳原子数3~18的直链状、支链状、由芳香核取代的α-烯烃与乙烯的共聚物。作为直链状的单烯烃,例如可以举出丙烯、1-丁烯、1-戊烯、1-己烯、1-辛烯、1-壬烯、1-癸烯、1-十二烯、1-十四烯、1-十六烯、1-十八烯等。另外,作为支链状单烯烃,例如可以举出3-甲基-1-丁烯、3-甲基-1-戊烯、4-甲基-1-戊烯、2-乙基-1-己烯等。另外,作为由芳香核取代的单烯烃,可以举出苯乙烯等。这些共聚单体可以单独或组合2种以上与乙烯共聚。该共聚中,也可以使丁二烯、异戊二烯、1,3-己二烯、二环戊二烯、5-乙叉基-2-降冰片烯等多烯类共聚。其中,使用了1-己烯、1-辛烯作为共聚单体的共聚物因拉伸强度强且成本方面亦优异,所以可优选使用。
上述中间层(B)的厚度一般为5~50μm,优选为10~40μm。中间层(B)的厚度不足5μm时,有基材层(A)与中间层(B)之间的粘接强度不足之虞,另外,将覆盖膜热封于载带时不易获得缓和热烙铁的接触斑点的效果。另一方面,若超过50μm,则因为覆盖膜的总厚度厚,所以将覆盖膜热封于载带时有时难以获得充分的剥离强度。
本发明的覆盖膜在前述中间层(B)与热封层(D)之间设置以热塑性树脂为主成分的剥离层(C)。该剥离层(C)中使用的热塑性树脂可以举出丙烯酸类树脂、聚酯类树脂、乙烯-乙酸乙烯酯共聚树脂(以下称为EVA)、乙烯-丙烯酸共聚树脂、乙烯-甲基丙烯酸共聚树脂、苯乙烯-异戊二烯二嵌段共聚树脂、苯乙烯-异戊二烯二嵌段共聚物的氢化树脂、苯乙烯-丁二烯二嵌段共聚树脂、苯乙烯-丁二烯二嵌段共聚物的氢化树脂、苯乙烯-异戊二烯-苯乙烯三嵌段共聚物的氢化树脂(以下称为SEPS)、苯乙烯-丁二烯-苯乙烯三嵌段共聚物的氢化树脂(以下称为SEBS)、苯乙烯-丁二烯无规共聚物的氢化树脂、苯乙烯-异戊二烯无规共聚物的氢化树脂等。其中,苯乙烯比率为15~35质量%的SEPS、SEBS在剥离覆盖膜时剥离强度的偏差小,可优选使用。
剥离层(C)的厚度通常为0.1~3μm、优选为0.1~1.5μm范围内。剥离层(C)的厚度小于0.1μm时,将覆盖膜热封于载带时有时不会呈现足够的剥离强度。另一方面,当剥离层(C)的厚度超过3μm时,有剥离覆盖膜时产生剥离强度的偏差之虞。需要说明的是,如后所述,该剥离层(C)及热封层(D)通常通过涂布而形成,通过涂布法形成时,此处所称厚度为干燥后的厚度。
剥离层(C)根据需要含有导电材料、优选为导电性微粒,并以使其表面电阻率优选达到1×104~1×1012Ω的方式构成。作为导电性微粒,可以举出导电性氧化锡颗粒、导电性氧化锌颗粒、导电性氧化钛颗粒等。其中,掺杂了锑、磷、镓的氧化锡显示高导电性,另外透明性降低得少,所以可更优选地使用。导电性氧化锡颗粒、导电性氧化锌颗粒、导电性氧化钛颗粒可以使用球状或针状的颗粒、或者它们的混合物。特别是使用针状锑掺杂氧化锡的情况下,能够得到具有特别良好的抗静电性能的覆盖膜。相对于构成剥离层(C)的热塑性树脂100质量份,导电性微粒的添加量通常为100~1000质量份,优选为200~800质量份。导电性微粒的添加量低于100质量份的情况下,有得不到覆盖膜的热封层(D)侧的表面电阻率为1012Ω以下的材料之虞,如果超过1000质量份,则因为相对的热塑性树脂的量减少,所以有难以由热封得到充分的剥离强度之虞。
剥离层(C)中,作为导电材料,还可以含有碳纳米管、碳纳米纤维中的至少一种碳纳米材料。其中,优选纵横尺寸比为10~10000的碳纳米管。相对于构成层的热塑性树脂100质量份,碳纳米材料在剥离层(C)中的添加量为0.5~15质量份,优选为3~10质量份。添加量低于0.5质量份时,无法充分获得由于添加碳纳米材料所产生的赋予导电性的效果,另一方面,超过15质量份时,不仅导致成本上升,还导致覆盖膜的透明性下降,所以难以透过覆盖膜检查容纳器件。
本发明的覆盖膜在剥离层(C)的表面上形成以热塑性树脂为主成分的热封层(D),作为该热塑性树脂,使用苯乙烯-丙烯酸类共聚物。苯乙烯-丙烯酸类共聚物是以苯乙烯类单体和(甲基)丙烯酸类单体为必需成分的共聚物,作为苯乙烯类单体,可以举出苯乙烯、α-甲基苯乙烯、邻甲基苯乙烯、间甲基苯乙烯、对甲基苯乙烯、对苯基苯乙烯等,特别优选苯乙烯。上述苯乙烯类单体可以单独或组合2种以上进行使用。作为(甲基)丙烯酸类单体,可以举出丙烯酸甲酯、丙烯酸乙酯、丙烯酸丙酯、丙烯酸丁酯等丙烯酸酯,甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯、甲基丙烯酸丁酯、甲基丙烯酸环己酯等甲基丙烯酸酯等。上述(甲基)丙烯酸类单体可以单独或组合2种以上进行使用。另外,也可以是在苯乙烯类单体和(甲基)丙烯酸类单体的基础上,还少量共聚有能与上述单体共聚的其他单体的物质。
上述以苯乙烯-丙烯酸类共聚物为主成分的树脂使用如下树脂:即相对作为构成载带材料的聚苯乙烯或聚碳酸酯等的热封性极优异,特别是以质均分子量为5000~20000、优选为10000~20000的苯乙烯-丙烯酸类共聚物为主成分的树脂。质均分子量低于5000时,因为产生粘性,所以容纳器件附着于热封层(D),成为安装故障的主要原因。另一方面,质均分子量超过20000时,在提高剥离速度时剥离强度上升显著,成为引起断裂的原因。另外,苯乙烯-丙烯酸类共聚物的玻璃化温度优选为70℃~100℃。低于70℃时,在海运等运输环境下,有容纳器件附着于覆盖膜的热封面之虞。
热封层(D)的厚度为0.1~5μm,优选为0.1~3μm,更优选为0.1~0.5μm的范围。热封层(D)的厚度小于0.1μm时,热封层(D)有时不显示足够的剥离强度。另一方面,热封层(D)的厚度超过5μm时,不仅导致成本升高,而且当剥离覆盖膜时容易发生剥离强度的偏差。
进而,本发明的优选实施方式的覆盖膜中,在热封层(D)中添加无机填料。本发明的覆盖膜如上所述那样,在被热封于已放入有电子器件的载带的表面的状态下,为了除去封装树脂所含的水分,有时以在60℃的环境下72小时或在80℃的环境下24小时左右的条件实施烘烤处理,这种情况下,如果作为内容物的电子器件粘接于覆盖膜,则在将覆盖膜剥离来安装电子器件的工序中发生故障。本发明的覆盖膜在将覆盖膜剥离时的剥离强度的偏差小,并且在60~80℃这样的高温下也能够控制热封层(D)对内容物即电子器件的粘合性,所以颇能消除这样的电子器件附着问题,但是如果在热封层(D)中添加无机填料,则更确实地实现该防附着效果。此处,所添加的无机填料只要能够有效地实现上述防附着效果,则可以为任何材料,例如可以举出球状或破碎形状的滑石颗粒、二氧化硅颗粒、氧化铝颗粒、云母颗粒、碳酸钙、碳酸镁等。另外,为了维持覆盖膜的透明性,使无机填料的中值粒径(D50)小于200nm,其含量例如为10~50质量份。
进而,本发明的覆盖膜中,在剥离层(C)中含有导电材料,但在一个实施方式中,在热封层(D)中也可以含有导电材料,并以使其表面电阻率优选达到1×104~1×1012Ω的方式构成。或者,其他实施方式中,还可以在剥离层(C)中不含导电材料,仅在热封层(D)中含有导电材料。此处,所含有的导电材料的种类、其量与上述其含有于剥离层(C)中时相同。
制作上述覆盖膜的方法没有特别限定,可使用一般的方法。例如:在基材层(A)例如双轴拉伸聚酯的膜表面,涂布聚氨酯、聚酯、聚烯烃、聚乙烯亚胺等粘接剂,从T模挤出成为中间层(B)的例如以m-LLDPE为主成分的树脂组合物,涂布在锚涂剂的涂布面上,从而制作包含基材层(A)和中间层(B)的双层膜。进而,可藉由例如凹版印刷涂布机、逆向涂布机、吻合涂布机、气刀涂布机、迈耶棒涂机、浸涂机等在中间层(B)的表面上涂布剥离层(C)。此时,在进行涂布之前,优选对中间层(B)的表面进行电晕放电处理或臭氧处理,尤其优选进行电晕放电处理。进而,藉由例如凹版印刷涂布机、逆向涂布机、吻合涂布机、气刀涂布机、迈耶棒涂机、浸涂机等在涂布于中间层(B)上的剥离层(C)之上涂布构成热封层(D)的树脂组合物,可获得作为目的的覆盖膜。
作为其他方法,也可以将中间层(B)预先通过T模流延法或者吹胀法等进行制膜,由将其与基材层(A)通过聚氨酯、聚酯、聚烯烃等粘接剂进行粘接的干式层压法,可以得到由基材层(A)和中间层(B)形成的膜,通过在其中间层(B)的表面涂布剥离层(C)和热封层(D),可获得目标覆盖膜。
进而,作为其他方法,通过夹层层压法也可以获得目标覆盖膜。即,将构成第一中间层的膜通过T模流延法或者吹胀法等进行制膜。接着,在该第一中间层的膜和基材层(A)的膜之间,供给溶融的以m-LLDPE为主成分的树脂组合物,形成第二中间层并层叠,获得由目标覆盖膜的基材层(A)与由第一中间层、第二中间层形成的中间层(B)所构成的膜,然后再在中间层(B)侧的表面涂布剥离层(C)和热封层(D),由此能够获得目标膜。该方法的情况下,也与上述方法相同,通常使用在基材层(A)的进行膜层叠的一侧的面涂布粘接剂的方法。
除了前述工序,视需要可以对覆盖膜的至少单面实施抗静电处理。作为抗静电剂,例如阴离子类、阳离子类、非离子类、甜菜碱类等表面活性剂型抗静电剂、高分子型抗静电剂以及分散于粘结剂的导电材料等,可以通过使用凹版印刷辊的辊涂机或唇涂机、喷雾等来进行涂布。另外,为了均匀涂布这些抗静电剂,优选在进行抗静电处理之前对膜表面进行电晕放电处理、臭氧处理,尤其优选进行电晕放电处理。
覆盖膜用作电子器件的容纳容器即载带的盖材。载带是指具有用于容纳电子器件的袋部的、宽度为8mm至100mm左右的带状物。以覆盖膜为盖材进行热封时,对构成载带的材质没有特别限定,可以使用市售品,例如可以使用聚苯乙烯、聚酯、聚碳酸酯、聚氯乙烯等。热封层中使用丙烯酸类树脂时,优选使用与聚苯乙烯及聚碳酸酯的载带的组合。载带可使用在树脂中混入炭黑或碳纳米管从而赋予了导电性的材料,混入有抗静电剂、导电材料的材料,或在表面涂布如下的涂布液从而赋予了抗静电性的材料,所述涂布液是将表面活性剂型的抗静电剂、聚吡咯、聚噻吩等导电物分散到丙烯酸类等有机粘结剂中而成的。
容纳电子器件的包装体例如可以由如下方法获得,即,将电子器件等容纳在载带的电子器件容纳部之后,以覆盖膜为盖材,将覆盖膜的长边方向的两边缘部进行连续热封来进行包装,并卷绕在卷盘上而获得。通过包装成该形态,来保存、运送电子器件等。容纳有电子器件等的包装体使用设置于载带的长边方向的边缘部的、载带运送用的被称为定位孔(sprocket hole)的孔进行运送,同时间歇性地剥离覆盖膜,并利用器件安装装置边确认电子器件等的存在、方向、位置边取出,进行向基板的安装。
进而,在剥离覆盖膜时,若剥离强度太小,则有从载带剥落,导致容纳器件脱落之虞,若剥离强度太大,则与载带的剥离变难并且有剥离覆盖膜时使覆盖膜断裂之虞,因此在120~220℃下进行热封的情况下,优选具有0.05~1.0N的剥离强度,并且优选剥离强度的偏差低于0.4N。
[实施例]
以下利用实施例详细说明本发明,但本发明不限于这些实施例。
<使用的原料>
在实施例及比较例中,基材层(A)、中间层(B)、剥离层(C)及热封层(D)使用以下原料。
(基材层(A))
双轴拉伸聚对苯二甲酸乙二醇酯膜(东洋纺株式会社制造),厚度12μm
(中间层(B))
m-LLDPE:LL-UL(FUTAMURA CHEMICAL CO.,LTD.制造的膜),厚度40μm
(剥离层(C)的树脂)
(c-1)树脂:Tuftec H1041(旭化成化学株式会社制造),苯乙烯-丁二烯-苯乙烯三嵌段共聚物的氢化树脂(SEBS),苯乙烯比率30质量%
(c-2)树脂:Septon2007(KURARAY Co.,Ltd制造),苯乙烯-异戊二烯-苯乙烯三嵌段共聚物的氢化树脂(SEPS),苯乙烯比率30质量%
(c-3)树脂:Tuftec H1051(旭化成化学株式会社制造),苯乙烯-丁二烯-苯乙烯三嵌段共聚物的氢化树脂(SEBS),苯乙烯比率42质量%
(剥离层(C)中配合的导电材料)
(c-4)导电材料:FSS-10T(石原产业株式会社制造),针状锑掺杂氧化锡,数均长径2μm,甲苯分散型
(c-5)导电材料:SNS-10T(石原产业株式会社制造),球状锑掺杂氧化锡,中值粒径(D50)100nm,甲苯分散型
(c-6)导电材料:DCNT-263D-1(大同涂料株式会社制造),碳纳米管,直径10~20nm,数均长径0.1~10μm
(热封层(D)的树脂)
(d-1)树脂:Daikalac S-7069A(大同化成工业株式会社制造),苯乙烯-丙烯酸类共聚物树脂,质均分子量9000,玻璃化温度80℃
(d-2)树脂:Daikalac S-7069B(大同化成工业株式会社制造),苯乙烯-丙烯酸类共聚物树脂,质均分子量12000,玻璃化温度80℃
(d-3)树脂:Daikalac S-7069C(大同化成工业株式会社制造),苯乙烯-丙烯酸类共聚物树脂,质均分子量16000,玻璃化温度80℃
(d-4)树脂:Daikalac8020(大同化成工业株式会社制造),苯乙烯-丙烯酸类共聚物树脂,质均分子量8000,玻璃化温度90℃
(d-5)树脂:Daikalac8000(大同化成工业株式会社制造),苯乙烯-丙烯酸类共聚物树脂,质均分子量9000,玻璃化温度66℃
(d-6)树脂:Daikalac S-7069D(大同化成工业株式会社制造),苯乙烯-丙烯酸类共聚物树脂,质均分子量22000,玻璃化温度80℃
(d-7)树脂:Daikalac8085(大同化成工业株式会社制造),丙烯酸类树脂,质均分子量4000,玻璃化温度90℃
(d-8)树脂:Dianal BR-113(MITSUBISHI RAYON Co.,Ltd.制造),丙烯酸类树脂,质均分子量30000,玻璃化温度75℃
(添加到热封层(D)中的无机填料)
(d-9)无机填料:MEK-ST-ZL(日产化学株式会社制造),二氧化硅填料,中值粒径(D50)100nm
(添加到热封层(D)中的导电材料)
(d-10)导电材料:FSS-10T(石原产业株式会社制造),针状锑掺杂氧化锡,数均长径2μm,甲苯分散型
<实施例1>
在厚度为12μm的双轴拉伸聚酯膜的表面通过凹版印刷法涂布聚酯类的锚涂剂后,通过干式层压法层叠由用茂金属催化剂聚合的[m-LLDPE]形成的厚度为40μm的膜,得到由双轴拉伸聚酯层(基材层)和m-LLDPE层(中间层)形成的层叠膜。然后,对该膜的m-LLDPE面实施电晕放电处理后,混合用环己烷溶解的[(c-1)树脂]和锑掺杂氧化锡分散液[(c-4)导电材料],使其固体成分比为(c-1):(c-4)=100:300质量份,在上述实施了电晕放电处理的面上,用凹版印刷法按使干燥厚度为0.4μm的厚度的方式进行涂布,制成剥离层。进而,在剥离层的涂布面上,作为热封层,混合苯乙烯树脂和甲基丙烯酸树脂的无规共聚物[(d-1)树脂]与[(d-9)无机填料],使其固体成分质量比为(d-1):(d-9)=100:50,并将其溶解于MEK,通过凹版印刷法涂布该溶液,使得干燥后的厚度为0.6μm,由此得到具有抗静电性能的载带用覆盖膜。
<实施例2~10、比较例4~6>
使用表1及表2中记载的树脂等原料来形成剥离层及热封层,除此之外,与实施例1同样地制作覆盖膜。
<比较例1>
不设置中间层,在厚度为50μm的基材层上依次形成剥离层及热封层,除此之外,与实施例1同样地制作覆盖膜。
<比较例2>
不设置剥离层,使用表2中记载的树脂等原料形成中间层及热封层,除此之外,与实施例1同样地制作覆盖膜。
<比较例3>
不设置热封层,使用表2中记载的树脂等原料形成中间层及剥离层,除此之外,与实施例1同样地制作覆盖膜。
<评价方法>
对各实施例及各比较例中制作的电子器件载带用覆盖膜进行下述评价。这些结果分别汇总示于表1及表2。
(1)雾度值
基于JIS K7105:1998的测定法A,使用积分球式测定装置测定雾度值。结果示于表1及表2的雾度值栏。
(2)密封性
使用贴带机(涩谷工业株式会社,ETM-480),以密封头宽0.5mm×2、密封头长32mm、密封压力0.1MPa、进料长度4mm、密封时间0.1秒×8次的条件,密封烙铁温度140℃到190℃以10℃间隔将宽5.5mm的覆盖膜热封于宽8mm的聚碳酸酯制载带(电气化学工业株式会社制造)及聚苯乙烯制载带(电气化学工业株式会社制造)。在温度23℃、相对湿度50%的气氛下放置24小时后,同样地在温度23℃、相对湿度50%的气氛下以每分钟300mm的速度、剥离角度170~180°剥离覆盖膜,将密封烙铁温度从140℃到190℃以10℃间隔热封时的平均剥离强度在0.3~0.9N的范围内的标记为“优”,将虽然存在平均剥离强度为0.3~0.9N的区域的烙铁温度范围、但密封烙铁温度从140℃到190℃以10℃间隔进行热封时,存在平均剥离强度偏离0.3~0.9N的范围的烙铁温度范围的标记为良,将在任一密封烙铁温度下平均剥离强度均不在0.3~0.9N的区域内的标记为“差”。结果示于表1及表2的密封性栏。
(3)剥离强度的偏差
进行热封,以使得相对于聚苯乙烯制载带(电气化学工业株式会社制造)的剥离强度达到0.4N。在与上述(2)密封性相同的条件下剥离覆盖膜。由在剥离方向剥离100mm覆盖膜时得到的图表推导出剥离强度的偏差。将剥离强度的偏差在0.2N以下的标记为“优”,0.2~0.4N的标记为“良”,大于0.4N的标记为“差”,剥离强度低于0.4N的标记为“未评价”。结果示于表1及表2的剥离强度的偏差栏。
(4)覆盖膜的剥离速度依赖性
进行热封,以使得相对聚苯乙烯制载带(电气化学工业株式会社制造)的剥离强度达到0.4N。在与上述(2)密封性相同的条件下剥离覆盖膜。将剥离速度变为每分钟2000mm,将剥离强度的平均值为0.4~0.5N的标记为“优”,0.5~0.6N的标记为“良”,大于0.6N的标记为“差”。结果示于表1及表2的剥离偏差栏。
(5)覆盖膜的断裂耐性
进行热封,以使得相对聚苯乙烯制载带(电气化学工业株式会社制造)的剥离强度达到1.0N。在与上述(2)密封性相同的条件下剥离覆盖膜。将密封有覆盖膜的载带切下550mm的长度,将载带的袋部底部粘贴到贴有双面胶带的垂直墙壁上。从粘贴的载带上部将覆盖膜剥离50mm,用夹子夹住覆盖膜,在该夹子上挂上质量1000g的砝码。然后,使砝码自然落下,将此时50个样品中没有1个样品发生覆盖膜断裂的标记为“优”,50个样品中有1~5个样品的覆盖膜发生断裂的标记为“良”,有5个样品以上断裂的标记为“差”。结果示于表1及表2的膜断裂耐性栏。
(6)剥离强度的经时稳定性
在与上述(3)密封性相同的条件下,进行热封以使得剥离强度达到0.4N。在温度60℃、相对湿度10%及温度60℃、相对湿度95%的环境下放置7天,取出后在温度23℃、相对湿度50%的气氛中放置24小时后,同样地在温度23℃、相对湿度50%的气氛中进行剥离强度的测定。在与上述(3)密封性相同的条件下实施剥离强度的测定。将平均剥离强度在0.4±0.1N的范围内的标记为“优”,在0.4±0.2N的范围内的标记为“良”,上述以外的平均剥离强度的标记为“差”。结果示于表1及表2的密封性栏。
(7)烘烤耐性
在水平铺开的覆盖膜的热封层面上搁置50个电子器件(斯坦利株式会社制造LED:1.6mm×0.8mm),在80℃环境中放置24小时。从80℃环境取出后,在温度23℃、相对湿度50%的环境气氛中放置1小时,同样地在温度23℃、相对湿度50%的环境气氛中将覆盖膜翻转,清点附着于覆盖膜的电子器件个数。将附着于覆盖膜的器件数在0~5个的范围内的标记为“优”,在6~10个的范围内的标记为“良”,超过10个的标记为“差”。结果示于表1及表2的烘烤耐性栏。
(8)表面电阻率
使用三菱化学株式会社的Hiresta UP MCP-HT450,按JIS K6911的方法,在环境气氛温度23℃、环境气氛湿度50%RH、施加电压10V的条件下测定热封层表面的表面电阻率。结果示于表1及表2的表面电阻率栏。
[表1]
[表2]
附图标记说明
1 覆盖膜
2 基材层(A)
3 锚涂层
4 中间层(B)
5 剥离层(C)
6 热封层(D)
Claims (7)
1.一种覆盖膜,其至少包含基材层(A)、中间层(B)、剥离层(C)、及可热封于载带的热封层(D),
热封层(D)包含具有5000~20000的质均分子量的苯乙烯-丙烯酸类共聚物作为主成分而成。
2.如权利要求1所述的覆盖膜,其中,热封层(D)的苯乙烯-丙烯酸类共聚物为具有70~100℃的玻璃化温度的树脂。
3.如权利要求1或2所述的覆盖膜,其中,剥离层(C)含有芳香族乙烯-共轭二烯共聚物的氢化树脂作为主成分而成,所述芳香族乙烯-共轭二烯共聚物的芳香族乙烯基的含量为15~35质量%。
4.如权利要求1~3中的任一项所述的覆盖膜,其中,剥离层(C)和/或热封层(D)含有导电材料。
5.如权利要求4所述的覆盖膜,其中,导电材料为导电性微粒,形状为针状、球状的微粒中的任一种或其组合。
6.如权利要求4或5所述的覆盖膜,其中,导电材料为碳纳米材料。
7.一种电子器件包装体,其将权利要求1~6中的任一项所述的覆盖膜用作以热塑性树脂作为主成分而成的载带的盖材。
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CN111319869A (zh) * | 2018-12-14 | 2020-06-23 | 科腾聚合物有限责任公司 | 用于半导体封装的热封层 |
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JP5814350B2 (ja) | 2015-11-17 |
SG194503A1 (en) | 2013-12-30 |
EP2700593B1 (en) | 2017-08-09 |
KR101689056B1 (ko) | 2016-12-22 |
EP2700593A1 (en) | 2014-02-26 |
EP2700593A4 (en) | 2014-10-01 |
US20140057064A1 (en) | 2014-02-27 |
KR20140031258A (ko) | 2014-03-12 |
JPWO2012143994A1 (ja) | 2014-07-28 |
WO2012143994A1 (ja) | 2012-10-26 |
US9338906B2 (en) | 2016-05-10 |
CN103492289B (zh) | 2015-09-23 |
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