WO2013039344A3 - 발광 다이오드 및 그것을 제조하는 방법 - Google Patents

발광 다이오드 및 그것을 제조하는 방법 Download PDF

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WO2013039344A3
WO2013039344A3 PCT/KR2012/007358 KR2012007358W WO2013039344A3 WO 2013039344 A3 WO2013039344 A3 WO 2013039344A3 KR 2012007358 W KR2012007358 W KR 2012007358W WO 2013039344 A3 WO2013039344 A3 WO 2013039344A3
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semiconductor layer
conductive semiconductor
light emitting
emitting diode
mesas
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PCT/KR2012/007358
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English (en)
French (fr)
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WO2013039344A2 (ko
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채종현
장종민
노원영
서대웅
갈대성
이준섭
이규호
인치현
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서울옵토디바이스(주)
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47883888&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2013039344(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from KR1020120015758A external-priority patent/KR20130094483A/ko
Priority claimed from KR1020120052722A external-priority patent/KR20130128747A/ko
Priority to JP2014530591A priority Critical patent/JP5869678B2/ja
Priority to EP18158047.3A priority patent/EP3361517B1/en
Priority to EP21185027.6A priority patent/EP3926698B1/en
Priority to EP12832213.8A priority patent/EP2757598B1/en
Priority to EP22184977.1A priority patent/EP4109570A1/en
Priority to US14/345,382 priority patent/US20140361327A1/en
Priority to EP18166240.4A priority patent/EP3364467B1/en
Application filed by 서울옵토디바이스(주) filed Critical 서울옵토디바이스(주)
Priority to CN201280045164.5A priority patent/CN103828073B/zh
Priority to EP17165501.2A priority patent/EP3223320B1/en
Priority to EP23183886.3A priority patent/EP4243094B1/en
Publication of WO2013039344A2 publication Critical patent/WO2013039344A2/ko
Publication of WO2013039344A3 publication Critical patent/WO2013039344A3/ko
Priority to US14/671,491 priority patent/US9634193B2/en
Priority to US14/920,790 priority patent/US10297720B2/en
Priority to US15/132,887 priority patent/US10319884B2/en
Priority to US15/226,304 priority patent/US10439105B2/en
Priority to US16/571,604 priority patent/US10756237B2/en

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  • Led Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
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Abstract

발광 다이오드 및 그것을 제조하는 방법이 개시된다. 이 발광 다이오드는, 제 1 도전형 반도체층과, 제 1 도전형 반도체층 상에 서로 이격되어 배치되고, 각각 활성층 및 제 2 도전형 반도체층을 포함하는 복수의 메사들과, 각각 복수의 메사들 상에 위치하여 제 2 도전형 반도체층에 오믹 콘택하는 반사 전극들과, 복수의 메사들 및 제 1 도전형 반도체층을 덮되, 메사들로부터 전기적으로 절연되고, 각각의 메사 상부 영역 내에 반사 전극들을 노출시키는 개구부들을 포함하고, 제 1 도전형 반도체층에 오믹콘택하는 전류 분산층을 포함한다. 이에 따라, 전류 분산 성능을 개선한 발광 다이오드가 제공될 수 있다.
PCT/KR2012/007358 2011-09-15 2012-09-14 발광 다이오드 및 그것을 제조하는 방법 WO2013039344A2 (ko)

Priority Applications (15)

Application Number Priority Date Filing Date Title
CN201280045164.5A CN103828073B (zh) 2011-09-16 2012-09-14 发光二极管及制造该发光二极管的方法
EP17165501.2A EP3223320B1 (en) 2011-09-16 2012-09-14 Light emitting diode
EP23183886.3A EP4243094B1 (en) 2011-09-16 2012-09-14 Light emitting diode and patterned substrate for the same
EP18158047.3A EP3361517B1 (en) 2011-09-16 2012-09-14 Light emitting diode
EP21185027.6A EP3926698B1 (en) 2011-09-16 2012-09-14 Light emitting diode
EP12832213.8A EP2757598B1 (en) 2011-09-16 2012-09-14 Light emitting diode
EP22184977.1A EP4109570A1 (en) 2011-09-16 2012-09-14 Light emitting diode
US14/345,382 US20140361327A1 (en) 2011-09-15 2012-09-14 Light emitting diode and method of manufacturing the same
EP18166240.4A EP3364467B1 (en) 2011-09-16 2012-09-14 Light emitting diode
JP2014530591A JP5869678B2 (ja) 2011-09-16 2012-09-14 発光ダイオード及びそれを製造する方法
US14/671,491 US9634193B2 (en) 2011-09-16 2015-03-27 Light emitting diode and method of manufacturing the same
US14/920,790 US10297720B2 (en) 2011-09-15 2015-10-22 Light emitting diode and method of manufacturing the same
US15/132,887 US10319884B2 (en) 2011-09-16 2016-04-19 Light emitting diode
US15/226,304 US10439105B2 (en) 2011-09-16 2016-08-02 Light emitting diode and light emitting diode package
US16/571,604 US10756237B2 (en) 2011-09-16 2019-09-16 Light emitting diode and light emitting diode package

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20110093396 2011-09-16
KR10-2011-0093396 2011-09-16
KR10-2012-0015758 2012-02-16
KR1020120015758A KR20130094483A (ko) 2012-02-16 2012-02-16 발광 다이오드 칩 및 그의 제조 방법
KR1020120052722A KR20130128747A (ko) 2012-05-17 2012-05-17 응력 완화층을 가지는 발광 다이오드 및 그 형성방법
KR10-2012-0052722 2012-05-17

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US14/345,382 A-371-Of-International US20140361327A1 (en) 2011-09-15 2012-09-14 Light emitting diode and method of manufacturing the same
US14/671,491 Continuation US9634193B2 (en) 2011-09-16 2015-03-27 Light emitting diode and method of manufacturing the same
US14/920,790 Continuation US10297720B2 (en) 2011-09-15 2015-10-22 Light emitting diode and method of manufacturing the same

Publications (2)

Publication Number Publication Date
WO2013039344A2 WO2013039344A2 (ko) 2013-03-21
WO2013039344A3 true WO2013039344A3 (ko) 2013-05-10

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ID=47883888

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Application Number Title Priority Date Filing Date
PCT/KR2012/007358 WO2013039344A2 (ko) 2011-09-15 2012-09-14 발광 다이오드 및 그것을 제조하는 방법

Country Status (6)

Country Link
US (6) US20140361327A1 (ko)
EP (7) EP3361517B1 (ko)
JP (3) JP5869678B2 (ko)
CN (5) CN106067499B (ko)
DE (1) DE202012013620U1 (ko)
WO (1) WO2013039344A2 (ko)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572068B (zh) * 2012-12-07 2017-02-21 晶元光電股份有限公司 發光元件
US9936579B2 (en) * 2013-02-01 2018-04-03 Apple Inc. Low profile packaging and assembly of a power conversion system in modular form
KR20140130618A (ko) 2013-05-01 2014-11-11 서울바이오시스 주식회사 솔더 페이스트를 통해 접착된 발광 다이오드를 갖는 발광 다이오드 모듈 및 발광 다이오드
DE202014011392U1 (de) * 2013-05-13 2020-02-21 Seoul Semiconductor Co., Ltd. LED-Gehäuse; Fahrzeuglampe sowie Hintergrundbeleuchtung mit diesem
US9847457B2 (en) 2013-07-29 2017-12-19 Seoul Viosys Co., Ltd. Light emitting diode, method of fabricating the same and LED module having the same
WO2015016561A1 (en) * 2013-07-29 2015-02-05 Seoul Viosys Co., Ltd. Light emitting diode, method of fabricating the same and led module having the same
US10283681B2 (en) * 2013-09-12 2019-05-07 Cree, Inc. Phosphor-converted light emitting device
KR101561198B1 (ko) * 2013-11-12 2015-10-19 주식회사 세미콘라이트 반도체 발광소자
CN103618035A (zh) * 2013-11-14 2014-03-05 南昌黄绿照明有限公司 一种具有应力调制层的氮化镓基led薄膜芯片及其制备方法
JP6248604B2 (ja) * 2013-12-18 2017-12-20 日亜化学工業株式会社 半導体発光素子及びその電極形成方法
DE102014102029A1 (de) * 2014-02-18 2015-08-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Halbleiterbauelementen und Halbleiterbauelement
JP6299336B2 (ja) * 2014-03-28 2018-03-28 日亜化学工業株式会社 発光素子及びそれを用いた発光装置
US9548419B2 (en) 2014-05-20 2017-01-17 Southern Taiwan University Of Science And Technology Light emitting diode chip having multi microstructure substrate surface
KR20150138977A (ko) * 2014-05-30 2015-12-11 한국전자통신연구원 발광 소자 및 그의 제조방법
KR102352661B1 (ko) * 2014-05-30 2022-01-18 루미리즈 홀딩 비.브이. 패터닝된 기판을 가지는 발광 디바이스
US9608168B2 (en) * 2014-06-13 2017-03-28 Seoul Viosys Co., Ltd. Light emitting diode
KR102357289B1 (ko) * 2014-07-01 2022-02-03 서울바이오시스 주식회사 발광 소자
CN110676367B (zh) * 2014-07-31 2023-03-24 首尔伟傲世有限公司 发光二极管
KR20160017849A (ko) * 2014-08-06 2016-02-17 서울바이오시스 주식회사 고출력 발광 장치 및 그 제조 방법
KR20160027875A (ko) 2014-08-28 2016-03-10 서울바이오시스 주식회사 발광소자
US20160181476A1 (en) * 2014-12-17 2016-06-23 Apple Inc. Micro led with dielectric side mirror
WO2016099061A1 (en) * 2014-12-19 2016-06-23 Seoul Viosys Co., Ltd. Semiconductor light emitting device and method of manufacturing the same
KR102647674B1 (ko) * 2014-12-31 2024-03-15 서울바이오시스 주식회사 고효율 발광 다이오드
TWI620349B (zh) * 2015-01-05 2018-04-01 隆達電子股份有限公司 覆晶式發光二極體晶片
WO2016122725A1 (en) * 2015-01-30 2016-08-04 Technologies Llc Sxaymiq Micro-light emitting diode with metal side mirror
US20160329461A1 (en) 2015-02-17 2016-11-10 Genesis Photonics Inc. Light emitting diode
US20180130926A1 (en) * 2015-02-17 2018-05-10 Genesis Photonics Inc. Light emitting diode
FR3038127B1 (fr) * 2015-06-24 2017-06-23 Commissariat Energie Atomique Procede de fabrication d'une pluralite de dipoles en forme d'ilots ayant des electrodes auto-alignees
CN104934514B (zh) * 2015-07-06 2018-06-22 天津宝坻紫荆科技有限公司 一种复合绝缘层及制备方法
DE102015114590B4 (de) 2015-09-01 2020-01-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils
CN105261691B (zh) * 2015-09-08 2018-02-13 圆融光电科技股份有限公司 发光二极管倒装芯片的制备方法及发光二极管倒装芯片
TWM542252U (zh) * 2015-10-16 2017-05-21 首爾偉傲世有限公司 小型發光二極體晶片
US9851056B2 (en) 2015-10-16 2017-12-26 Seoul Viosys Co., Ltd. Compact light emitting diode chip and light emitting device having a slim structure with secured durability
CN105633224A (zh) * 2016-01-04 2016-06-01 厦门市三安光电科技有限公司 一种led芯片电极与芯片结构及其制作方法
KR102624111B1 (ko) * 2016-01-13 2024-01-12 서울바이오시스 주식회사 자외선 발광소자
CN113948622A (zh) * 2016-01-13 2022-01-18 首尔伟傲世有限公司 紫外线发光元件
JP6601243B2 (ja) * 2016-01-29 2019-11-06 日亜化学工業株式会社 発光素子及びその製造方法
WO2017135763A1 (ko) 2016-02-05 2017-08-10 엘지이노텍 주식회사 발광소자 및 이를 포함하는 발광소자 패키지
KR102266960B1 (ko) * 2016-03-02 2021-06-18 한국전자통신연구원 쇼트키 다이오드 및 이의 제조 방법
DE102016106831A1 (de) * 2016-04-13 2017-10-19 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
EP3454372B1 (en) * 2016-05-03 2020-12-23 Seoul Viosys Co., Ltd. Light emitting diode
KR102550005B1 (ko) * 2016-07-15 2023-07-03 서울바이오시스 주식회사 자외선 발광 다이오드
CN107768495A (zh) * 2016-08-18 2018-03-06 新世纪光电股份有限公司 微型发光二极管及其制造方法
TWI742175B (zh) * 2016-10-07 2021-10-11 新世紀光電股份有限公司 發光二極體
US10340425B2 (en) * 2016-11-25 2019-07-02 Seoul Viosys Co., Ltd. Light emitting diode having light blocking layer
KR102550007B1 (ko) * 2016-11-30 2023-07-03 서울바이오시스 주식회사 복수의 발광셀들을 가지는 발광 다이오드
KR20180065342A (ko) 2016-12-07 2018-06-18 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치
US10985304B2 (en) * 2016-12-21 2021-04-20 Seoul Viosys Co., Ltd. Highly reliable light emitting diode
KR102601419B1 (ko) * 2016-12-28 2023-11-14 서울바이오시스 주식회사 고 신뢰성 발광 다이오드
KR20180081371A (ko) * 2017-01-06 2018-07-16 서울바이오시스 주식회사 전류 차단층을 가지는 발광 소자
CN110121782A (zh) 2017-03-23 2019-08-13 首尔半导体株式会社 显示装置及其制造方法
JP2018170333A (ja) * 2017-03-29 2018-11-01 株式会社東芝 半導体装置及びその製造方法
US10686158B2 (en) * 2017-03-31 2020-06-16 Innolux Corporation Display device
CN108735868B (zh) * 2017-04-25 2019-10-25 山东浪潮华光光电子股份有限公司 一种GaN基LED包覆式电极结构的制作方法
KR102381866B1 (ko) * 2017-05-02 2022-04-04 서울바이오시스 주식회사 자외선 발광 다이오드
DE102017111123A1 (de) * 2017-05-22 2018-11-22 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
CN109216513B (zh) * 2017-06-30 2023-05-23 日亚化学工业株式会社 发光装置及其制造方法
CN109256446B (zh) * 2017-07-13 2022-02-08 晶元光电股份有限公司 发光元件
CN107359223B (zh) * 2017-07-17 2019-02-05 天津三安光电有限公司 发光二极管及其制作方法
CN109326700B (zh) * 2017-07-31 2020-02-11 山东浪潮华光光电子股份有限公司 一种GaN基LED电极结构及其制作方法
KR102499308B1 (ko) * 2017-08-11 2023-02-14 서울바이오시스 주식회사 발광 다이오드
JP7255965B2 (ja) * 2017-08-24 2023-04-11 日機装株式会社 半導体発光素子の製造方法
US10707374B2 (en) 2017-09-15 2020-07-07 Glo Ab Etendue enhancement for light emitting diode subpixels
JP2019106406A (ja) * 2017-12-08 2019-06-27 Dowaエレクトロニクス株式会社 半導体発光素子およびそれを用いた表面実装デバイスならびにそれらの製造方法
TWD191816S (zh) 2017-12-12 2018-07-21 新世紀光電股份有限公司 發光二極體晶片
WO2019124843A1 (ko) * 2017-12-22 2019-06-27 서울바이오시스주식회사 칩 스케일 패키지 발광 다이오드
DE102018101393A1 (de) * 2018-01-23 2019-07-25 Osram Opto Semiconductors Gmbh Optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips
US11621380B2 (en) 2018-04-26 2023-04-04 Xiamen Changelight Co., Ltd. Flip-chip of light emitting diode and manufacturing method and illuminating method thereof
KR102565148B1 (ko) * 2018-06-27 2023-08-18 서울바이오시스 주식회사 플립칩형 발광 다이오드 칩 및 그것을 포함하는 발광 장치
US10886447B2 (en) * 2018-09-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting device
US11430929B2 (en) * 2018-09-14 2022-08-30 Seoul Viosys Co., Ltd. Light emitting device having a stacked structure
US11271136B2 (en) * 2018-11-07 2022-03-08 Seoul Viosys Co., Ltd Light emitting device
CN109659414B (zh) * 2018-11-22 2021-06-11 华灿光电(浙江)有限公司 一种倒装led芯片及其制作方法
US11271141B2 (en) * 2018-11-26 2022-03-08 Osram Opto Semiconductors Gmbh Light-emitting device with wavelenght conversion layer having quantum dots
CN111463329B (zh) * 2019-01-18 2021-09-17 北京北方华创微电子装备有限公司 一种led芯片及其制作方法
CA3127995A1 (en) * 2019-01-31 2020-08-06 Seoul Viosys Co., Ltd. Light-emitting diode
KR20200103925A (ko) 2019-02-25 2020-09-03 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP7480125B2 (ja) * 2019-04-08 2024-05-09 廈門三安光電有限公司 複合絶縁反射層
TWI699903B (zh) * 2019-05-17 2020-07-21 友達光電股份有限公司 顯示面板及其製造方法
DE102019122460A1 (de) * 2019-08-21 2021-02-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer halbleiterchip und verfahren zur herstellung eines solchen
DE102019122593A1 (de) * 2019-08-22 2021-02-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
US11848402B2 (en) * 2020-03-11 2023-12-19 Lumileds Llc Light emitting diode devices with multilayer composite film including current spreading layer
TWI832054B (zh) 2020-05-19 2024-02-11 美商谷歌有限責任公司 以側壁孔注入增強之基於量子井之led結構
GB2599065B (en) * 2020-05-22 2023-05-10 Plessey Semiconductors Ltd Light emitting device array
CN111596339B (zh) * 2020-05-29 2023-07-25 东华理工大学 一种半导体核辐射探测器及其制备方法和应用
CN111933765B (zh) * 2020-07-03 2022-04-26 厦门士兰明镓化合物半导体有限公司 微型发光二极管及制作方法,微型led显示模块及制作方法
CN111883624B (zh) * 2020-07-20 2021-11-05 华灿光电(苏州)有限公司 发光二极管芯片及其制备方法
WO2022031138A1 (ko) * 2020-08-07 2022-02-10 서울바이오시스주식회사 복수개의 발광셀들을 갖는 발광 다이오드
CN112242467A (zh) * 2020-10-20 2021-01-19 厦门乾照光电股份有限公司 一种led芯片的制作方法
WO2022094967A1 (zh) * 2020-11-06 2022-05-12 京东方科技集团股份有限公司 发光二极管芯片及其制备方法、显示装置
US20220173292A1 (en) * 2020-11-30 2022-06-02 Epistar Corporation Semiconductor Device
US20230238419A1 (en) * 2021-01-21 2023-07-27 Photon Wave Co., Ltd. Ultraviolet light-emitting device
JP7504054B2 (ja) 2021-04-20 2024-06-21 日機装株式会社 半導体発光素子
KR20220157120A (ko) * 2021-05-20 2022-11-29 삼성전자주식회사 발광 소자 및 이를 이용한 디스플레이 모듈
CN113540311B (zh) * 2021-07-15 2022-11-22 厦门三安光电有限公司 一种倒装发光二极管和发光装置
CN114038878B (zh) * 2021-08-17 2023-01-13 重庆康佳光电技术研究院有限公司 发光组件、显示屏及发光组件的制作方法
DE102021209250A1 (de) 2021-08-24 2023-03-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Schichtenstapel für einen Halbleiterchip, Halbleiterchip und Verfahren zur Herstellung eines Schichtenstapels für einen Halbleiterchip
CN113809210B (zh) * 2021-09-14 2024-01-09 泉州三安半导体科技有限公司 一种发光二极管芯片、发光装置、显示装置
CN113964249A (zh) * 2021-09-15 2022-01-21 厦门士兰明镓化合物半导体有限公司 发光二极管及其制造方法
CN117613165A (zh) * 2021-12-03 2024-02-27 泉州三安半导体科技有限公司 紫外发光二极管及发光装置
WO2023136991A1 (en) * 2022-01-13 2023-07-20 Nanosys, Inc. Light emitting diodes and method of making thereof by selectively growing active layers from trench separated areas
CN115579441B (zh) * 2022-12-09 2023-05-16 华灿光电(苏州)有限公司 一种发光二极管用电极及其制备方法
CN116936711B (zh) * 2023-09-19 2023-12-15 江西兆驰半导体有限公司 一种垂直发光二极管及其制备方法、led灯板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050095721A (ko) * 2004-03-27 2005-09-30 삼성전자주식회사 III - V 족 GaN 계 화합물 반도체 발광소자 및 그제조방법
KR20060134490A (ko) * 2005-06-22 2006-12-28 김성진 플립 칩 질화물반도체 발광 다이오드 및 그의 제조 방법
KR20100036617A (ko) * 2008-09-30 2010-04-08 서울옵토디바이스주식회사 발광 소자 및 그것을 제조하는 방법
WO2010132139A1 (en) * 2009-05-11 2010-11-18 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US20110084294A1 (en) * 2007-11-14 2011-04-14 Cree, Inc. High voltage wire bond free leds
WO2011050640A1 (en) * 2009-10-29 2011-05-05 Byd Company Limited Led, led chip and method of forming the same

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03250733A (ja) * 1990-02-28 1991-11-08 Sony Corp 半導体装置
US6784463B2 (en) * 1997-06-03 2004-08-31 Lumileds Lighting U.S., Llc III-Phospide and III-Arsenide flip chip light-emitting devices
JPH11220171A (ja) * 1998-02-02 1999-08-10 Toyoda Gosei Co Ltd 窒化ガリウム系化合物半導体素子
JPH11354541A (ja) 1998-06-11 1999-12-24 Fujitsu Quantum Devices Kk 半導体装置およびその製造方法
US6486499B1 (en) 1999-12-22 2002-11-26 Lumileds Lighting U.S., Llc III-nitride light-emitting device with increased light generating capability
US6828596B2 (en) 2002-06-13 2004-12-07 Lumileds Lighting U.S., Llc Contacting scheme for large and small area semiconductor light emitting flip chip devices
US7179670B2 (en) * 2004-03-05 2007-02-20 Gelcore, Llc Flip-chip light emitting diode device without sub-mount
KR100568297B1 (ko) * 2004-03-30 2006-04-05 삼성전기주식회사 질화물 반도체 발광 소자 및 그 제조 방법
JP4632697B2 (ja) * 2004-06-18 2011-02-16 スタンレー電気株式会社 半導体発光素子及びその製造方法
US20060001035A1 (en) * 2004-06-22 2006-01-05 Toyoda Gosei Co., Ltd. Light emitting element and method of making same
US7274040B2 (en) * 2004-10-06 2007-09-25 Philips Lumileds Lighting Company, Llc Contact and omnidirectional reflective mirror for flip chipped light emitting devices
US8318519B2 (en) * 2005-01-11 2012-11-27 SemiLEDs Optoelectronics Co., Ltd. Method for handling a semiconductor wafer assembly
JP2007027540A (ja) * 2005-07-20 2007-02-01 Matsushita Electric Ind Co Ltd 半導体発光素子およびこれを用いた照明装置
JP4819453B2 (ja) 2005-09-12 2011-11-24 昭和電工株式会社 窒化ガリウム系半導体発光素子およびその製造方法
SG130975A1 (en) * 2005-09-29 2007-04-26 Tinggi Tech Private Ltd Fabrication of semiconductor devices for light emission
WO2007072967A1 (en) * 2005-12-19 2007-06-28 Showa Denko K.K. Flip-chip type semiconductor light-emitting device, method for manufacturing flip-chip type semiconductor light-emitting device, printed circuit board for flip-chip type semiconductor light-emitting device, mounting structure for flip-chip type semiconductor light-emitting device-and light-emitting diode lamp
JP2007184411A (ja) * 2006-01-06 2007-07-19 Sony Corp 発光ダイオードおよびその製造方法ならびに集積型発光ダイオードおよびその製造方法ならびに発光ダイオードバックライトならびに発光ダイオード照明装置ならびに発光ダイオードディスプレイならびに電子機器ならびに電子装置およびその製造方法
WO2007081092A1 (en) * 2006-01-09 2007-07-19 Seoul Opto Device Co., Ltd. Del à couche d'ito et son procédé de fabrication
JP2008192782A (ja) * 2007-02-05 2008-08-21 Toyota Central R&D Labs Inc 電極及びそれを有するiii族窒化物系化合物半導体発光素子
DE102007019776A1 (de) * 2007-04-26 2008-10-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente
JP4367531B2 (ja) * 2007-06-06 2009-11-18 ソニー株式会社 発光素子における電極構造の形成方法、及び、積層構造体の形成方法
KR100838197B1 (ko) 2007-08-10 2008-06-16 서울옵토디바이스주식회사 개선된 전류분산 성능을 갖는 발광 다이오드
TWI464921B (zh) * 2009-02-25 2014-12-11 Epistar Corp 主波長分佈收斂之發光元件及其製造方法
US9117944B2 (en) * 2008-09-24 2015-08-25 Koninklijke Philips N.V. Semiconductor light emitting devices grown on composite substrates
JP5123269B2 (ja) * 2008-09-30 2013-01-23 ソウル オプト デバイス カンパニー リミテッド 発光素子及びその製造方法
JP5530087B2 (ja) * 2008-10-17 2014-06-25 ユー・ディー・シー アイルランド リミテッド 発光素子
CN101740674B (zh) * 2008-11-26 2011-08-31 晶元光电股份有限公司 发光元件结构及其制造方法
JP4702442B2 (ja) * 2008-12-12 2011-06-15 ソニー株式会社 半導体発光素子及びその製造方法
KR20100076083A (ko) * 2008-12-17 2010-07-06 서울반도체 주식회사 복수개의 발광셀들을 갖는 발광 다이오드 및 그것을 제조하는 방법
JP5311408B2 (ja) 2008-12-26 2013-10-09 シャープ株式会社 窒化物半導体発光素子
CN102130286B (zh) * 2009-02-19 2013-03-20 光宝电子(广州)有限公司 发光二极管的封装结构及封装方法
US7977132B2 (en) * 2009-05-06 2011-07-12 Koninklijke Philips Electronics N.V. Extension of contact pads to the die edge via electrical isolation
CN101924116B (zh) * 2009-06-12 2014-04-23 刘胜 可扩展的超大尺寸发光二极管芯片及制造方法
KR101106151B1 (ko) * 2009-12-31 2012-01-20 서울옵토디바이스주식회사 발광 소자 및 그것을 제조하는 방법
KR100999779B1 (ko) * 2010-02-01 2010-12-08 엘지이노텍 주식회사 발광소자, 발광소자의 제조방법 및 발광소자 패키지
JP5148647B2 (ja) 2010-03-05 2013-02-20 株式会社東芝 半導体発光素子、半導体発光装置及び半導体発光素子の製造方法
CN101872824A (zh) * 2010-06-07 2010-10-27 厦门市三安光电科技有限公司 侧面具有双反射层的氮化镓基倒装发光二极管及其制备方法
CN103238223B (zh) * 2010-12-08 2017-03-01 日亚化学工业株式会社 氮化物系半导体发光元件
US10074778B2 (en) * 2011-03-22 2018-09-11 Seoul Viosys Co., Ltd. Light emitting diode package and method for manufacturing the same
KR20130035658A (ko) * 2011-09-30 2013-04-09 서울옵토디바이스주식회사 발광 다이오드 소자용 기판 제조 방법
TW201347141A (zh) * 2012-05-04 2013-11-16 Chi Mei Lighting Tech Corp 發光二極體結構及其製造方法
US10290773B2 (en) * 2012-09-13 2019-05-14 Epistar Corporation Light-emitting device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050095721A (ko) * 2004-03-27 2005-09-30 삼성전자주식회사 III - V 족 GaN 계 화합물 반도체 발광소자 및 그제조방법
KR20060134490A (ko) * 2005-06-22 2006-12-28 김성진 플립 칩 질화물반도체 발광 다이오드 및 그의 제조 방법
US20110084294A1 (en) * 2007-11-14 2011-04-14 Cree, Inc. High voltage wire bond free leds
KR20100036617A (ko) * 2008-09-30 2010-04-08 서울옵토디바이스주식회사 발광 소자 및 그것을 제조하는 방법
WO2010132139A1 (en) * 2009-05-11 2010-11-18 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
WO2011050640A1 (en) * 2009-10-29 2011-05-05 Byd Company Limited Led, led chip and method of forming the same

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DE202012013620U1 (de) 2018-08-06
WO2013039344A2 (ko) 2013-03-21
CN106098889A (zh) 2016-11-09
US20160043282A1 (en) 2016-02-11
JP6858112B2 (ja) 2021-04-14
EP3361517A1 (en) 2018-08-15
EP2757598B1 (en) 2017-04-26
US20140361327A1 (en) 2014-12-11
EP3223320A1 (en) 2017-09-27
EP2757598A2 (en) 2014-07-23
CN106067499B (zh) 2019-04-05
US20150200334A1 (en) 2015-07-16
US20160233386A1 (en) 2016-08-11
CN106129195A (zh) 2016-11-16
EP2757598A4 (en) 2015-05-27
EP3364467A1 (en) 2018-08-22
US10297720B2 (en) 2019-05-21
CN106058000A (zh) 2016-10-26
US20160343911A1 (en) 2016-11-24

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