WO2012053268A1 - シート貼付装置および貼付方法 - Google Patents
シート貼付装置および貼付方法 Download PDFInfo
- Publication number
- WO2012053268A1 WO2012053268A1 PCT/JP2011/067197 JP2011067197W WO2012053268A1 WO 2012053268 A1 WO2012053268 A1 WO 2012053268A1 JP 2011067197 W JP2011067197 W JP 2011067197W WO 2012053268 A1 WO2012053268 A1 WO 2012053268A1
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- WIPO (PCT)
- Prior art keywords
- sheet
- adherend
- wafer
- space
- adhesive sheet
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Definitions
- the present invention relates to a sheet sticking apparatus and a sticking method for sticking an adhesive sheet to an adherend.
- a sheet affixing apparatus that affixes an adhesive sheet such as a protective sheet, a mounting sheet, a dicing tape, or a die bonding tape to the surface of a semiconductor wafer as an adherend (hereinafter sometimes simply referred to as a wafer).
- an adhesive sheet such as a protective sheet, a mounting sheet, a dicing tape, or a die bonding tape to the surface of a semiconductor wafer as an adherend (hereinafter sometimes simply referred to as a wafer).
- Patent Document 1 the ring frame to which the adhesive sheet is stuck is supported by the frame holding part in the chamber, the wafer is disposed above the surface of the adhesive sheet, and the wafer is attached to the adhesive sheet in a vacuum atmosphere. By adhering to the surface of the wafer, the adhesive sheet is attached to the wafer surface.
- the back surface of the wafer is ground to reduce the thickness of the semiconductor chip.
- the inside of the wafer is ground deeper than the outer edge.
- a wafer is known in which the inner side is formed thinner than the outer edge, that is, the outer edge has an annular convex part protruding in the thickness direction, and the inner part surrounded by the convex part has a concave part (for example, , See Patent Document 2).
- An object of the present invention is to provide a sheet sticking apparatus and a sheet sticking method capable of sticking an adhesive sheet to an adherend having a convex portion at an outer edge portion without generating a gap as much as possible.
- the sheet sticking device of the present invention includes a sheet support means for supporting an adhesive sheet disposed to face an adherend, and the supporting adhesive sheet is bent toward the adherend side.
- the adherend and an adhesive sheet disposed so as to face the adherend are provided with a decompression unit that maintains a decompressed atmosphere.
- the decompression unit forms a first space and a second space that are independent from each other with the adhesive sheet as a boundary, and the sheet deforming unit includes the first space and the second space. It is preferable that the adhesive sheet is bent and attached to the adherend side due to a pressure difference.
- the adhesive sheet arranged to face the adherend is supported, and when the sticking adhesive sheet is bent to the adherend side and stuck to the adherend, The adhesive sheet region positioned outside the outer edge of the adherend when the adherend is viewed in plan is restricted from being deformed toward the adherend.
- the adhesive sheet region located outside the outer edge of the adherend is bent toward the adherend side.
- the adhesive sheet can be attached to the adherend in a reduced pressure state. And it can prevent that a space
- the pressure difference between the first space and the second space Since the adhesive sheet can be bent to the adherend side and applied to the outer edge direction from the center area of the adherend, the adhesive sheet is prevented from being applied to the outer edge portion of the adherend first. can do.
- the sheet sticking apparatus 1 of the present embodiment has a mounting sheet MS as an adhesive sheet, which is stuck in advance so as to close the opening RF1 of the ring frame RF, on a wafer W as an adherend.
- the wafer W and the ring frame RF are integrated with the mounting sheet MS.
- the wafer W is ground so that the outer edge portion is thicker than the other portions, so that an annular protrusion W1 protruding in the thickness direction (back surface side) is formed on the outer edge portion, and the protrusion A semiconductor wafer in which a recess W2 is formed on the inner side surrounded by W1, and a circuit is formed on a circuit surface W3 on the surface side (opposite side of the grinding surface, lower surface side in FIG. 1). .
- a protective sheet (not shown) is affixed to the circuit surface W3.
- the mounting sheet MS has a configuration in which an adhesive layer is laminated on one surface of a base sheet (not shown).
- the sheet sticking apparatus 1 is configured to be able to stick a mounting sheet MS to a plurality of wafers W of a plurality of sizes by exchanging a table 21A described later with a different size. Therefore, for example, the sheet sticking apparatus 1 for an 8-inch frame can stick the mounting sheet MS to the 6-inch and 8-inch wafers W, and the sheet sticking apparatus 1 for the 12-inch frame is an 8-inch and 12-inch wafer. A mounting sheet MS can be attached to W.
- the sheet sticking apparatus 1 includes an adherend support means 2 that supports the wafer W, a mounting sheet MS that faces the wafer W, and a decompression means 3 that maintains the wafer W and the mounting sheet MS in a reduced pressure atmosphere. And a deformation restricting member 4A as a deformation restricting means for restricting deformation of the mounting sheet MS region located outside the outer edge of the wafer W toward the wafer W when the wafer W is viewed in plan view.
- the adherend support means 2 includes a disk-shaped table 21A having an outer shape larger than the outer edge of the wafer W, and a linear motion motor 22 as a drive device having an output shaft 22A fixed to the lower surface of the table 21A. .
- the upper surface 24 of the table 21A is provided with an annular convex portion 23 whose outer edge portion projects in the thickness direction (upward in FIG. 1).
- the adherend support means 2 is configured to be able to replace the table 21A with a table 21B (see FIG. 6) having a size different from that of the table 21A so as to support a plurality of size wafers W.
- FIG. 1 is for a 12-inch wafer W
- FIG. 6 is for an 8-inch wafer W.
- the decompression means 3 is formed by a cover member 6 and a lower chamber 7 as sheet support means for supporting the mounting sheet MS affixed to the ring frame RF so as to face the wafer W, and the lid member 6 and the mounting sheet MS.
- the pressure adjusting means 8A as a sheet deforming means capable of reducing the pressure in the first space V1 (see FIG. 2), and the pressure in the second space V2 (see FIG. 2) formed by the mounting sheet MS and the lower chamber 7 are reduced.
- Pressure adjusting means 8B as possible sheet deforming means.
- the lid member 6 is provided so as to be movable up and down by a driving device (not shown).
- the lower surface 61 side of the lid member 6 has a frame holding portion 63 having a concave cross section having the same shape as the outer shape of the ring frame RF, and annular elastic members 64A and 64B embedded in a state where the surface is exposed to the frame holding portion 63. It has.
- the portion of the frame holding portion 63 where the ring frame RF is located is provided with a plurality of suction ports 65 and is made of an elastic member so as to follow the step portion of the mounting sheet MS and seal the first space V1. Can be secured.
- the frame holding portion 63 is provided with a pressure adjustment passage 66 connected to the pressure adjustment means 8A, and the pressure adjustment passage 66 is provided with a pressure detection means 9A for detecting the pressure in the first space V1.
- the lower chamber 7 is formed in a box shape having an upper surface 74 opened. That is, the lower chamber 7 includes a bottom surface portion 71 provided with the adherend support means 2 and a side surface portion 72 extending upward from the outer edge of the bottom surface portion 71.
- the bottom surface portion 71 is provided with a pressure adjustment passage 73 connected to the pressure adjustment means 8B, and the pressure adjustment passage 73 is provided with a pressure detection means 9B for detecting the pressure in the second space V2.
- an annular frame support portion 75 formed one step down on the inner peripheral side, and an annular restriction formed one step further down on the inner peripheral side of the frame support portion 75.
- a member support portion 76 is provided.
- the ring frame RF to which the mounting sheet MS is affixed is supported by the frame support 75, and the deformation restricting member 4A is supported by the restricting member support 76.
- the first space V1 and the second space V2 that are independent from each other with the mounting sheet MS as a boundary are formed. Further, the pressure adjusting means 8A and 8B adjust the pressure in the first and second spaces V1 and V2, thereby pressing the mounting sheet MS by the pressure difference between the first space V1 and the second space V2, thereby changing the wafer. Affix to W.
- the deformation restricting member 4A is an annular member having a L-shaped cross section. That is, the deformation restricting member 4A has an annular convex portion 41A protruding in the thickness direction on the inner edge side and a concave portion 42A on the outer edge side of the convex portion 41A.
- the deformation regulating member 4A is supported by the regulating member support portion 76 of the lower chamber 7 with the convex portion 41A facing the mounting sheet MS, and the lower surface 61 of the lid member 6 abuts on the upper surface 74 of the lower chamber 7.
- the convex portion 41A comes into contact with the mounting sheet MS
- the concave portion 42A comes into contact with the ring frame RF.
- the contact surface of the convex portion 41A with the mounting sheet MS is subjected to a non-adhesion process in which a fluororesin or the like is laminated so that the attached mounting sheet MS can be peeled off.
- a 12-inch ring frame RF in which an opening RF1 is closed by a mounting sheet MS is held by a lid member 6 as shown in FIG. Is placed on a 12-inch table 21A.
- the decompression unit 3 lowers the lid member 6 by a driving device (not shown), and brings the lower surface 61 of the lid member 6 into contact with the upper surface 74 of the lower chamber 7.
- the pressure adjusting means 8A and 8B reduce the first and second spaces V1 and V2 by the same pressure.
- the first and second spaces V1, V2 are brought into a vacuum state or a reduced pressure state so as to be the same pressure while reducing the pressure at a rate.
- the pressure reducing means 3 sets the pressure of the first space V1 higher than the pressure of the second space V2 by the pressure adjusting means 8A and 8B while maintaining the pressure reduced state of the first and second spaces V1 and V2.
- the mounting sheet MS is pushed toward the second space V ⁇ b> 2 by the pressure difference between the first and second spaces V ⁇ b> 1 and V ⁇ b> 2, and bends so that the center portion is closest to the wafer W.
- the linear motion motor 22 is driven to raise the table 21A, the mounting sheet MS is gradually attached from the center portion of the wafer W toward the outer edge side as shown in FIG. As shown in FIG.
- the mounting sheet MS is pasted to the opening RF1 of the ring frame RF in a size that protrudes from the outer edge of the wafer W, and is supported by the lid member 6 and the lower chamber 7 via the ring frame RF. That is, the mounting sheet MS is supported by the lid member 6 and the lower chamber 7 at a position outside the outer edge of the wafer W and away from the outer edge of the wafer W in a state of being disposed facing the wafer W. For this reason, when the deformation restricting member 4A is not provided, the mounting sheet MS starts to bend from the ring frame RF portion outside the outer edge of the wafer W as shown by a two-point difference line in FIG.
- the mounting sheet MS is attached to the top surface W11 of the convex portion W1 of the wafer W before being attached to the wide area of the bottom surface W21 from the central portion of the concave portion W2 of the wafer W. Even if gas is introduced into the first space V1 in this state and atmospheric pressure acts on the mounting sheet MS, the fourth space V4 is extinguished as shown by a two-dot chain line in FIG. The fourth space V4 remains. If the first and second spaces V1, V2 are depressurized and are in a complete vacuum state (no pressure), the fourth space V4 will not remain, but it will be in a complete vacuum state.
- the deformation restricting member 4A when the wafer W is viewed in plan, the mounting sheet MS region located outside the outer edge of the wafer W comes into contact with the convex portion 41A of the deformation restricting member 4A, and the convex portion 41A. However, the deformation of the region of the mounting sheet MS toward the wafer W is restricted. For this reason, the displacement of the mounting sheet MS region located outside the outer edge of the wafer W is restricted, and the region of the mounting sheet MS can be prevented from being bent toward the wafer W side.
- the area where the mounting sheet MS is affixed to the bottom surface W21 of the concave portion W2 before being affixed to the top surface W11 of the convex portion W1 can be widened.
- the fourth space V4 can be made as small as possible.
- the pressure in the second space V2 is set equal to the pressure in the first space V1 by the pressure adjusting means 8B.
- the pressure reducing means 3 gradually increases the pressure in the third and second spaces V3, V2 at the same pressure increasing rate by the pressure adjusting means 8A, 8B and gradually returns to the atmospheric pressure, so that the fourth space V4 is mounted.
- the mounting sheet MS is pressed by the pressure of the third space V3 through the mounting sheet MS and gradually becomes smaller, so that the mounting sheet MS is in close contact with the corner corner W23 of the wafer W. Affixed to Strictly speaking, the mounting sheet MS is not in close contact with the corner corner W23 of the wafer W, but the fourth space V4 in the decompressed state is formed as small as possible. In this state, the mounting sheet MS is in close contact with the corner portion W23 of the wafer W.
- the lid member 6 opens the suction port 65 as shown in FIG.
- the lid member 6 is raised to a predetermined position by a driving device (not shown) in a state where the ring frame RF is sucked and held therethrough. Thereafter, the wafer W and the ring frame RF are transported to the next process, for example, a protective sheet peeling process, by a transport means (not shown).
- a 12-inch table 21A is mounted as shown in FIG. While changing to the 8-inch table 21B, the deformation restricting member 4A is replaced with a deformation restricting member 4B having a size corresponding to the size of the table 21A. That is, when the table 21B is smaller than the table 21A, the outer diameter and the concave portion 42B are the same and the inner diameter is smaller than the deformation regulating member 4A, and the radial length of the convex portion 41B is smaller. A longer deformation restricting member 4B is used.
- the mounting sheet MS is attached to the wafer W in the same manner as described above. As described above, even when the size of the wafer W is small, the mounting sheet MS can be attached to the wafer W without causing the fourth space V4 to appear between the mounting sheet MS and the wafer W.
- the following effects are obtained. That is, when the sheet sticking apparatus 1 bends the mounting sheet MS to the wafer W side and sticks it to the wafer W, the region outside the outer edge of the wafer W of the mounting sheet MS is deformed to the wafer W side. In order to regulate, it can regulate that the field of mount sheet MS bends to the wafer W side. Therefore, before the mounting sheet MS is attached to the top surface W11 of the convex portion W1 on the outer edge of the wafer W, the mounting sheet MS can be applied over a wide area of the bottom surface W21 of the concave portion W2 of the wafer W. Generation of the fourth space V4 between the sheet MS and the wafer W can be prevented.
- the adherend is the wafer W
- the ring frame RF may be omitted, and glass other than the wafer W may be used.
- Other plate-like members such as a plate, a steel plate, or a resin plate, and other than the plate-like member can also be targeted.
- the wafer W can illustrate a silicon semiconductor wafer, a compound semiconductor wafer, etc.
- the adhesive sheet to be attached to such an adherend is not limited to the mounting sheet MS, but any other adhesive sheet having an arbitrary use and shape to be applied to a plate-like member such as any other sheet, film, tape or the like is applied. it can.
- the wafer W with which the protective sheet was affixed on the circuit surface was employ
- the mounting sheet MS to which the ring frame RF is attached is supported by the lid member 6 and the lower chamber 7 of the decompression means 3, but the sheet support means is limited to the lid member 6 and the lower chamber 7.
- the lid member 6 is formed in a box shape like the lower chamber 7, and a table for supporting the ring frame RF and the mounting sheet MS is provided on the lower surface 61 of the lid member 6, or the bottom surface portion 71 of the lower chamber 7 is covered.
- An outer peripheral table may be provided so as to surround the body support means 2, and the mounting sheet MS to which the ring frame RF is attached may be supported by these tables.
- the lid member 6 and the lower chamber 7 hold the wafer W and the mounting sheet MS by holding the ring frame RF portion.
- the lid member 6 and the lower chamber 7 hold the mounting sheet MS. Also good.
- the mounting sheet is set by setting the pressure of the first space V1 in which the wafer W is not arranged higher than the pressure of the second space V2 in which the wafer W is arranged by the pressure adjusting means 8A.
- the sheet deformation means for bending the mounting sheet MS toward the wafer W is not limited to this.
- the pressure adjusting means 8B sets the pressure of the second space V2 to be lower than the pressure of the first space V1, or is provided with a sticking roller, and the sticking roller rolls on the mounting sheet MS for mounting.
- the sheet MS may be bent toward the wafer W and attached to the wafer W.
- the annular deformation restricting member 4A is provided, but the deformation restricting means is not limited to this. In short, it is only necessary to be able to regulate the deformation of the region outside the outer edge of the wafer W of the mounting sheet MS toward the wafer W.
- a plurality of suction ports are provided in the portion outside the outer edge of the wafer W of the lid member 6. The mounting sheet MS is sucked in the direction opposite to the direction of the wafer W through the suction port, so that the region outside the outer edge of the wafer W of the mounting sheet MS is prevented from being deformed to the wafer W side. You may make it do.
- the drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder.
- an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot
- an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder.
- a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
一方、半導体製造工程におけるダイシングの前工程において、半導体チップを薄型化するためにウェハの裏面を研削することが行われており、この研削工程において、ウェハの内側を外縁部よりも深く研削することで、外縁部よりも内側が薄く形成され、つまり厚さ方向に突出した環状の凸部を外縁部に有するとともに、当該凸部で囲まれた内側に凹部を有するウェハが知られている(例えば、特許文献2参照)。
また、本発明のシート貼付装置において、前記減圧手段は、前記接着シートを境に独立した第1空間および第2空間を形成し、前記シート変形手段は、前記第1空間および前記第2空間の圧力差により前記接着シートを前記被着体側に撓ませて貼付することが好ましい。
また、接着シートを境に独立した第1空間および第2空間に対し、第1空間の圧力を第2空間の圧力に対して高く設定することで、第1空間および第2空間の圧力差により接着シートを被着体側に撓ませて、当該接着シートを被着体の中心領域から外縁方向に貼付することができるので、接着シートが被着体の外縁部に先に貼付されることを防止することができる。
図1に示すように、本実施形態のシート貼付装置1は、予めリングフレームRFの開口部RF1を閉塞するように貼付された接着シートとしてのマウント用シートMSを被着体としてのウェハWに貼付し、マウント用シートMSでウェハWとリングフレームRFとを一体化するものである。ここで、ウェハWは、外縁部がそれ以外の部分よりも厚くなるように研削されることで、厚さ方向(裏面側)に突出した環状の凸部W1が外縁部に形成され、凸部W1で囲まれた内側に凹部W2が形成されるとともに、その表面側(研削面の反対側であり、図1の下側の面側)の回路面W3に回路が形成された半導体ウェハである。回路面W3には、図示しない保護シートが貼付されている。また、マウント用シートMSは、図示しない基材シートの一方の面に接着剤層が積層された構成を有している。
先ず、図示しない搬送手段がマウント用シートMSによって開口部RF1が閉塞された12インチ用のリングフレームRFを図1に示すように蓋部材6に吸着保持させるとともに、12インチのウェハWを図1に示すように12インチ用のテーブル21A上に載置する。この後、減圧手段3は、図示しない駆動機器により蓋部材6を下降させて、蓋部材6の下面61を下チャンバ7の上面74に当接させる。蓋部材6および下チャンバ7が第1および第2空間V1,V2(図2から図4参照)を形成した後、圧力調整手段8A,8Bは、第1および第2空間V1,V2を同じ減圧率で減圧しつつ、同じ圧力となるように、第1および第2空間V1,V2を真空状態または減圧状態にする。
すなわち、シート貼付装置1は、マウント用シートMSをウェハW側に撓ませてウェハWに貼付する際に、マウント用シートMSのウェハW外縁よりも外側の領域がウェハW側に変形することを規制するため、マウント用シートMSの当該領域がウェハW側に撓むことを規制することができる。従って、マウント用シートMSがウェハW外縁の凸部W1の頂面W11に貼付される前に、マウント用シートMSをウェハWの凹部W2の底面W21の広範囲に貼付することができるので、マウント用シートMSおよびウェハW間に第4空間V4が生じることを防止することができる。
また、前記実施形態では、蓋部材6や下チャンバ7は、リングフレームRF部分を保持することで、ウェハWやマウント用シートMSを保持していたが、マウント用シートMSを保持するようにしてもよい。
3 減圧手段
4A,4B 変形規制部材(変形規制手段)
6 蓋部材(シート支持手段)
7 下チャンバ(シート支持手段)
8A,8B 圧力調整手段(シート変形手段)
MS マウント用シート(接着シート)
V1 第1空間
V2 第2空間
W ウェハ(被着体)
Claims (4)
- 被着体に対向して配置した接着シートを支持するシート支持手段と、
支持している接着シートを前記被着体側に撓ませて当該被着体に貼付するシート変形手段と、
前記被着体を平面視したときに被着体外縁よりも外側に位置する接着シート領域が前記被着体側へ変形することを規制する変形規制手段とを備えていることを特徴とするシート貼付装置。 - 前記被着体および当該被着体に対向して配置した接着シートを減圧雰囲気に保つ減圧手段を備えていることを特徴とする請求項1に記載のシート貼付装置。
- 前記減圧手段は、前記接着シートを境に独立した第1空間および第2空間を形成し、
前記シート変形手段は、前記第1空間および前記第2空間の圧力差により前記接着シートを前記被着体側に撓ませて貼付することを特徴とする請求項2に記載のシート貼付装置。 - 被着体に対向して配置した接着シートを支持し、
支持している接着シートを前記被着体側に撓ませて当該被着体に貼付する際、前記被着体を平面視したときに被着体外縁よりも外側に位置する接着シート領域が前記被着体側へ変形することを規制することを特徴とするシート貼付方法。
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CN201180050526.5A CN103180937B (zh) | 2010-10-19 | 2011-07-28 | 片材粘附装置及粘附方法 |
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