JPS5578545A - Manufacture of semiconductor - Google Patents
Manufacture of semiconductorInfo
- Publication number
- JPS5578545A JPS5578545A JP15327178A JP15327178A JPS5578545A JP S5578545 A JPS5578545 A JP S5578545A JP 15327178 A JP15327178 A JP 15327178A JP 15327178 A JP15327178 A JP 15327178A JP S5578545 A JPS5578545 A JP S5578545A
- Authority
- JP
- Japan
- Prior art keywords
- film
- container
- substrate
- vacuum
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To place plastic film between the openings of a vacuum container and a vacuum cover, and proceed the adhesion of the film toward the edges of a substrate by using the difference between the air pressures generated on container and cover sides for preventing the mutual bite of adjacent chips.
CONSTITUTION: A semiconductor substrate 4 having a scribing-cut groove on the right side and metallic deposit film on the reverse side is placed on the substrate fastening table 3 at the center of a vacuum container 2 having a gas discharge port 1. Stretched polyvinyl chloride film 6 is placed over the opening of the container 2 and fastened with a band 7 having spring characteristic. A vacuum cover 9 having an air supply port 8 is put on the film 6 on the container 2, and the container 2 is evacuated with the port 1. The film 6 is adhered to the reverse side of the substrate 4 when air is gradually fed through the port 8, and this adhesion gradually expands toward the edge of the substrate 4 when air is fed to cover 9 side. The whole ranges of the substrate 4 and film 6 are thus adhered in vacuum.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15327178A JPS5578545A (en) | 1978-12-11 | 1978-12-11 | Manufacture of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15327178A JPS5578545A (en) | 1978-12-11 | 1978-12-11 | Manufacture of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5578545A true JPS5578545A (en) | 1980-06-13 |
Family
ID=15558803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15327178A Pending JPS5578545A (en) | 1978-12-11 | 1978-12-11 | Manufacture of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5578545A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61263136A (en) * | 1985-05-15 | 1986-11-21 | Nitto Electric Ind Co Ltd | Support table for thin plate article |
| JPS6393130A (en) * | 1986-10-08 | 1988-04-23 | Hitachi Ltd | Jig for sticking wafer |
| JPH0254564A (en) * | 1988-08-18 | 1990-02-23 | Nec Corp | Device for application of adhesive tape to semiconductor wafer |
| JP2010118584A (en) * | 2008-11-14 | 2010-05-27 | Takatori Corp | Mounting device for wafer |
| EP2631938A1 (en) * | 2010-10-19 | 2013-08-28 | LINTEC Corporation | Sheet adhesion device and adhesion method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495570A (en) * | 1972-05-02 | 1974-01-18 |
-
1978
- 1978-12-11 JP JP15327178A patent/JPS5578545A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495570A (en) * | 1972-05-02 | 1974-01-18 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61263136A (en) * | 1985-05-15 | 1986-11-21 | Nitto Electric Ind Co Ltd | Support table for thin plate article |
| JPS6393130A (en) * | 1986-10-08 | 1988-04-23 | Hitachi Ltd | Jig for sticking wafer |
| JPH0254564A (en) * | 1988-08-18 | 1990-02-23 | Nec Corp | Device for application of adhesive tape to semiconductor wafer |
| JP2010118584A (en) * | 2008-11-14 | 2010-05-27 | Takatori Corp | Mounting device for wafer |
| EP2631938A1 (en) * | 2010-10-19 | 2013-08-28 | LINTEC Corporation | Sheet adhesion device and adhesion method |
| EP2631938A4 (en) * | 2010-10-19 | 2014-08-13 | Lintec Corp | Sheet adhesion device and adhesion method |
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