WO2011125975A1 - Boîte de filtre, dispositif d'exposition, et procédé de production de dispositif - Google Patents

Boîte de filtre, dispositif d'exposition, et procédé de production de dispositif Download PDF

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Publication number
WO2011125975A1
WO2011125975A1 PCT/JP2011/058513 JP2011058513W WO2011125975A1 WO 2011125975 A1 WO2011125975 A1 WO 2011125975A1 JP 2011058513 W JP2011058513 W JP 2011058513W WO 2011125975 A1 WO2011125975 A1 WO 2011125975A1
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WIPO (PCT)
Prior art keywords
filter box
filter
frame
box according
handle
Prior art date
Application number
PCT/JP2011/058513
Other languages
English (en)
Japanese (ja)
Inventor
公一 桂
恵二 松浦
佳成 堀田
孝志 増川
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to CN2011800168721A priority Critical patent/CN102821829A/zh
Priority to JP2012509651A priority patent/JPWO2011125975A1/ja
Priority to KR1020127028906A priority patent/KR20130032305A/ko
Publication of WO2011125975A1 publication Critical patent/WO2011125975A1/fr

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/0407Constructional details of adsorbing systems
    • B01D53/0415Beds in cartridges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D46/00Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/42Auxiliary equipment or operation thereof
    • B01D46/4227Manipulating filters or filter elements, e.g. handles or extracting tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/0407Constructional details of adsorbing systems
    • B01D53/0446Means for feeding or distributing gases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2258/00Sources of waste gases
    • B01D2258/02Other waste gases
    • B01D2258/0216Other waste gases from CVD treatment or semi-conductor manufacturing

Definitions

  • the exposure apparatus EX includes a box-like highly airtight chamber 10 installed on the floor FL1, and the inside of the chamber 10 is formed by a partition member 10d having two openings opened and closed by shutters 24R and 24W, for example.
  • the chamber is divided into an exposure chamber 10a and a loader chamber 10b.
  • An exposure body 4 including an illumination optical system ILS, a reticle stage RST, a projection optical system PL, and a wafer stage WST is installed in the exposure chamber 10a, and the reticle library 9 and the wafer cassette 7 are placed in the loader chamber 10b.
  • a reticle loader system and a wafer loader system are installed.
  • the image of the pattern in the illumination area is imaged on the surface of the wafer W via the projection optical system PL that is telecentric on both sides and the projection magnification ⁇ is reduced (for example, 1/4).
  • a lower frame 12 is installed on the floor FL 1 in the exposure chamber 10 a of the chamber 10 via a plurality of pedestals 11.
  • a flat base member 13 is fixed to the center of the lower frame 12.
  • a flat wafer base WB is supported via three anti-vibration tables 14, and the wafer stage WST can be moved in the X and Y directions via an air bearing on the upper surface parallel to the XY plane of the wafer base WB. And is rotatable in the ⁇ z direction.
  • the stage control system in the main control device is configured such that the speed and position of the reticle stage RST in the Y direction via a drive mechanism (not shown) including a linear motor based on the measurement value of the reticle interferometer, etc.
  • the position in the X direction and the rotation angle in the ⁇ z direction are controlled.
  • a local liquid immersion mechanism including, for example, a ring-shaped nozzle head disposed on the lower surface of the optical member at the lower end of the projection optical system PL.
  • the blowing units 19R and 19W blow out the temperature-controlled air on the optical path of the measurement beam with a substantially uniform wind speed distribution by a down flow method (or a side flow method). Similarly, temperature-controlled air is locally supplied to the optical path of the measurement beam of the X-axis laser interferometer. Accordingly, the positions of reticle stage RST and wafer stage WST can be measured with high accuracy by reticle interferometer 21R, wafer interferometer 21W, and the like.
  • the first type filter box 38 is also referred to as a first filter box 38
  • the second type filter box 40 is also referred to as a second filter box 40.
  • the filter box is installed in a direction in which the filter plane intersects the horizontal direction, for example, the filter plane of the filter box is in the XZ plane.
  • the filter surface of the filter box may be installed inclined with respect to the XZ plane.
  • a taper may be formed on the installation surface of the filter box frame, or a taper member may be provided on the bottom plate 28 h of the casing 28.
  • the installation state of the filter box will be described as follows.
  • FIG. 2 shows the filter device 26 in a state where the door 29 of the casing 28 in FIG. 1 is opened.
  • the casing 28, the door 29, and the partition plates 42A to 42C are indicated by two-dot chain lines.
  • the door 29 has a gasket for sealing the periphery of the window 28b and the ends of the partition plates 42A to 42C and the door 29 when the window 28b of the casing 28 is closed by the door 29. 46 is fixed.
  • the gasket 46 can be formed of a material having excellent corrosion resistance and low degassing, such as a sheet of Teflon (registered trademark of DuPont) or a sheet of silicon rubber.
  • the transmittance of the exposure light EL is improved in the exposure chamber 10a of the chamber 10, and the optical element is formed on the surface by the interaction between the organic gas and the exposure light EL.
  • Generation of cloudy material is suppressed.
  • the alkaline gas and the acid gas changes in the photoresist characteristics of the wafer W and the like are suppressed.
  • the photoresist is a chemically amplified photoresist
  • the generated acid may react to form a slightly soluble layer on the photoresist surface. . Therefore, removal of alkaline gases such as ammonia and amines is particularly effective.
  • the fourth space 28f communicates with the first duct 32 of FIG. 1 through the opening 28g.
  • the taper angles ⁇ of the taper portions 48Aa to 48Ca of the positioning blocks 48A to 48C are equal to each other, and the taper angle ⁇ is, for example, 20 ° to 40 °. As an example, the taper angle ⁇ is 30 °.
  • the first taper portion 50b is inclined at a taper angle ⁇ clockwise with respect to the ZY plane
  • the second taper portion 50c is inclined at a taper angle ⁇ counterclockwise with respect to the ZY plane.
  • the taper angle ⁇ is equal to the taper angle of the taper portions 48Aa to 48Ca of the positioning blocks 48A to 48C in FIG. Therefore, in FIG. 3, when the angle formed by the first tapered portion 50b with respect to the end surface 50a of the frame 50 is ⁇ , the sum of the angle ⁇ and the taper angle ⁇ is 90 °.
  • the mounting surface 50d of the frame 50 of the filter box 38 is placed on the upper surface of the bottom plate 28h of the third space 28e of the casing 28, and as shown in FIG. 3, the first tapered portion 50b of the frame 50 is the tapered portion of the positioning block 48A.
  • the state where the end face 50a of the frame 50 is brought into close contact with the partition plate 42A via the gasket 54 while being in contact with 48Aa is the installation position Q1 of the filter box 38 in the third space 28e.
  • the filter box 38 is placed horizontally and is stably stationary by its own weight.
  • the position of the concave portion 48Cb of the positioning block 48C is at a low position in accordance with the handle portion 70A (the same applies to the concave portion 48Ab of the positioning block 48A), and the position of the concave portion 48Bb of the positioning block 48B is the handle portion. It is at a high position to match 70B. Accordingly, when the second filter box 40 is to be installed at the installation position Q3 or Q1 in the space 28c or 28e, the handle portion 70B of the filter box 40 mechanically interferes with the tapered portion 48Ca or 48Aa of the positioning block 48C or 48A. Therefore, it is possible to prevent the filter box 40 from being erroneously installed at the installation positions Q3 and Q1.
  • the handle portion 70A of the filter box 38 mechanically interferes with the taper portion 48Ba of the positioning block 48B. It is possible to prevent the filter box 38 from being installed by mistake.
  • the position of the handle portion 70A of the filter box 38 and the position of the handle portion 70B of the filter box 40 are different, and the corresponding recesses 48Aa, 48Ca of the positioning blocks 48A, 48C in the casing 28 are provided. And the position of the recess 48Bb of the positioning block 48B are different.
  • the gas in the first space 28c sandwiched between the upper plate in which the opening 28a of the casing 28 is formed and the partition plate 42C always passes through the chemical filter 51 of the filter box 38 and then passes through the opening 42Ca. Then, it flows into the second space 28d sandwiched between the partition plates 42B and 42C. Similarly, the gas in the space 28d always passes through the chemical filter 56 of the filter box 40 and then flows into the third space 28e sandwiched between the partition plates 42A and 42B through the opening 42Ba.
  • the gas in the space 28e always passes through the chemical filter 51 of the filter box 38, and then passes through the opening 42Aa, the fourth space 28f on the back surface of the partition plate 42A, and the opening 28g on the side wall of the casing 28. 2 flows into the first duct 32.
  • the air AR flowing from the upper opening 28a in the + Y direction of the casing 28 always has two (two-stage) filter boxes 38 for organic gas removal and one (one-stage) alkaline gas and acid gas. Since the air passes through the filter box 40 for removal and is supplied to the air conditioner 30 in FIG. 1, air from which impurities are highly removed is supplied into the chamber 10.
  • the operator holds the handle 70A of the first filter box 38, and places the installation surface 50d of the filter box 38 (frame 50) on the bottom plate 28h (see FIG. 2) in the third space 28e of the casing 28. Put. Then, the operator pushes the filter box 38 into the third space 28e as indicated by the arrow B2. Next, as indicated by an arrow B3 in FIG. 5B, the operator engages (contacts) the first tapered portion 50b of the filter box 38 with the tapered portion 48Aa of the positioning block 48A. One handle 70A of the filter box 38 fits in the recess 48Ab of the positioning block 48A. Then, as indicated by the arrow B4, the moving lever 58A is pressed against the second tapered portion 50c of the filter box 38.
  • the operator further rotates the moving lever 58A as indicated by an arrow B5 in FIG. 6A to urge the filter box 38 in the ⁇ X direction and the ⁇ Y direction.
  • the filter box 38 moves to the installation position Q1 in the casing 28, and the end surface 50a of the filter box 38 comes into close contact with the partition plate 42A via the gasket 54.
  • the movement lever 58A may be further rotated after the movement lever 58A is pressed against the second tapered portion 50c of the filter box 38. .
  • the operator holds the handle 70B of the second filter box 40, and places the installation surface 55d of the filter box 40 (frame 55) on the bottom plate 28h in the second space 28d of the casing 28. Then, the operator pushes the filter box 40 into the second space 28d of the casing 28 as indicated by an arrow B7.
  • the operator engages (contacts) the first taper portion 55b of the filter box 40 with the taper portion 48Ba of the positioning block 48B, and makes the second taper portion 55c of the filter box 40 contact the second taper portion 55c.
  • the moving lever 58B is pressed.
  • One handle 70B of the filter box 40 fits in the recess 48Bb of the positioning block 48B.
  • the operator further rotates the moving lever 58B as indicated by the arrow B8, and moves the filter box 40 to the installation position Q2 in the casing 28 as indicated by the arrow B9.
  • the end surface 55a of the filter box 40 is in close contact with the partition plate 42B via the gasket 54.
  • the movement lever 58B may be further rotated after the movement lever 58B is pressed against the second tapered portion 55c of the filter box 40.
  • the third filter box 38 is moved in the first space 28c of the casing 28, the moving lever 58C is rotated, and the filter box 38 is moved to the installation position in the first space 28c. Install.
  • the door 29 of the casing 28 is closed and locked to complete the installation of the filter boxes 38 and 40.
  • the first taper portion 50b (55b) of the filter box 38 (40) is pressed against the taper portion 48Aa (48Ba) of the positioning block 48A (48B) to urge the filter box 38 (40).
  • the filter box 38 (40) is installed in a short time at the installation position Q1 (Q2) on the front surface of the partition plate 42A (42B). Therefore, the filter box 38 (40), and thus the internal chemical filter 51 (56) can be efficiently and easily positioned at the target position.
  • the operator when exchanging the filter boxes 38 and 40 in the casing 28, the operator first releases the lock of the casing 28 and opens the door 29, and moves as shown by an arrow D1 in FIG. 6B.
  • the lever 58C is removed from the filter box 38.
  • the operator holds the handle 70A of the filter box 38 in the first space 28c, and carries out the filter box 38 as indicated by an arrow D2.
  • the operator after removing the moving lever 58B from the filter box 40 as indicated by an arrow D3 in FIG. 6A, the operator holds the handle 70B of the filter box 40 in the second space 28d, and the filter box
  • the 40 first taper portions 55b are moved forward along the taper portion 42Ba of the positioning block 48B.
  • the operator pulls out the filter box 40 from the second space 28d of the casing 28 as indicated by an arrow D4.
  • the operator installs new filter boxes 38 and 40 at target positions in the casing 28 by the same process as the installation operation of the filter boxes 38 and 40 described above.
  • the exchange of the filter boxes 38 and 40 is completed.
  • the filter boxes 38 and 40 can be easily pulled out from the installation position, the filter boxes 38 and 40 in the casing 28 can be easily and efficiently replaced.
  • the exposure apparatus EX of the present embodiment includes an entire air conditioning system including a filter device 26 and an air conditioner 30.
  • the filter device 26 includes two first filter boxes 38 and one second filter box 40. ing.
  • the first filter box 38 that holds the chemical filter 51 includes at least one of a frame 50 that holds the chemical filter 51, a handle portion 70 ⁇ / b> A (first handle portion) provided on the frame 50, and a side surface of the frame 50.
  • a first tapered portion 50b (a first inclined portion as a shape changing portion) that is formed in a portion and gradually inclines toward the first end surface 50a side from the second end surface 50g of the frame 50;
  • the second filter box 40 is similarly configured, and the frame 55 of the filter box 40 is provided with a first tapered portion 55b.
  • a gasket 54 (seal member) is provided on the first end surface 50 a of the two end surfaces of the frame 50.
  • the positioning block 48A in which the taper portions 48Aa and 48Ba having the same inclination angle as the first taper portions 50b and 55b are provided in the vicinity of the installation position in the casing 28 that houses the filter boxes 38 and 40. 48B is provided. Then, by energizing (moving) the frames 50, 55 so that the first tapered portions 50b, 55b of the frames 50, 55 move along the tapered portions 48Aa, 48Ba of the casing 28, the filter box 38, Installation of the 40 (chemical filters 51, 56) with respect to the target position in the casing 28 can be performed efficiently and easily. In other words, the first taper portions 50b and 55b of the filter boxes 38 and 40 can perform two functions of movement and positioning.
  • the first filter box 38 is formed on the second side surface opposite to the first side surface of the frame 50 with respect to the chemical filter 51, and from the second end surface 50g toward the first end surface 50a side, A second taper portion 50c that is gradually inclined to the outside of the frame 50 is provided symmetrically with the first taper portion 50b.
  • the second filter box 40 also has a second tapered portion 55c formed on the frame 55 symmetrically with the first tapered portion 55b.
  • the second taper portions 50c and 55c of the frames 50 and 55 are moved along the taper portions 48Aa and 48Ba of the casing 28, so that the filter boxes 38 and 40 ( The chemical filter 51, 56) can be efficiently installed at the target position in the casing 28.
  • the first taper portion 50b and the second taper portion 50c of the frame 50 are formed on the entire first side surface and second side surface of the frame 50, and the first taper portion 55b and the second taper portion 55c of the frame 55 are formed. Is formed on the entire first side surface and second side surface of the frame 55. Therefore, it is easy to process the tapered portions 50b and 50c.
  • the tapered portions 50b and 50c may be formed only on a part of the first side surface and the second side surface of the frame 50.
  • the corresponding positioning blocks 48A and 48C on the casing 28 side may be formed with a tapered portion only in a portion corresponding to the tapered portion 50b.
  • the tapered portions 55b and 55c are each formed in a plane, that is, in a straight line shape, and positioning corresponding to these. Since the tapered portions 48Aa and 48Ba of the blocks 48A and 48B are also formed in a plane, the tapered portions 50b and 50c and the like can be easily formed.
  • the tapered portions 50b and 50c and the tapered portions 55b and 55c may be formed in a convex or concave spherical shape, that is, a curved shape.
  • the taper portions 48Aa and 48Ba of the positioning blocks 48A and 48B corresponding to these are formed in a concave or convex spherical shape, and the filter box using the positioning blocks 48A and 48B is used in the same manner as in the above embodiment. 38 and 40 can be moved and positioned.
  • the convex handle portion 70A (first handle portion) provided on the first side surface in the ⁇ X direction of the frame 50 of the filter box 38 in FIG. 4A is provided on the first taper portion 50b.
  • a concave portion 48Ab through which the handle portion 70A can pass is provided in the tapered portion 48Aa of the positioning block 48A in the casing 28 corresponding thereto. Therefore, even if there is the handle portion 70A, the first taper portion 50b of the frame 50 can be moved in close contact with the taper portion 48Aa of the positioning block 48A. The same applies to the handle portion 70B of the first tapered portion 55b of the filter box 40.
  • the convex handle portion 70A (second handle portion) provided on the second side surface in the + X direction of the frame 50 of the filter box 38 in FIG. 4A is provided in the second tapered portion 50c.
  • the second taper portion 50c of the frame 50 is moved to the taper portion 48Aa of the positioning block 48A. It can move in close contact with.
  • the handle portion 70B of the second tapered portion 55c of the filter box 40 is provided in the convex handle portion 70A (second handle portion) provided on the second side surface in the + X direction of the frame 50 of the filter box 38 in FIG. 4A.
  • a handle 70A is provided near the center of the second tapered portion 50c of the frame 50 of the first filter box 38 at a position F2 close to the end face 50a, and a position F2 of the first tapered portion 50b. 70A may be provided in a symmetrical position.
  • a recess 48Ab is formed at a position corresponding to the tapered portion 48Aa of the positioning block 48A of FIG. Further, in FIG.
  • a handle portion 70B is provided near the center of the second taper portion 55c of the frame 55 of the second filter box 40 at a position F4 away from the end face 50a, and the position of the first taper portion 55b.
  • a handle portion 70B is provided at a position symmetrical to F4.
  • a recess 48Bb is formed at a position corresponding to the tapered portion 48Ba of the positioning block 48B of FIG.
  • the positional relationship between the handle portions 70A and 70B with respect to the frames 50 and 55 is different from the distance between the end surfaces 50a and 55a. Therefore, the operator can identify the filter boxes 38 and 40 from the positions of the handle portions 70A and 70B with respect to the frames 50 and 55.
  • a label or the like that can identify the type may be attached to the frames 50 and 55 so that the positional relationship of the handle portion 70A with respect to the frame 50 and the positional relationship of the handle portion 70B with respect to the frame 55 may be the same.
  • the filter device 26 includes the movement levers 58A to 58C for urging the filter boxes 38 and 40 toward the positioning blocks 48A to 48C in the casing 28, the filter boxes 38 and 40 are moved. It can be done smoothly.
  • the movement levers 58A to 58C are not necessarily provided.
  • the partition plates 42A to 42C are substantially parallel to the plane including the vertical line (substantially perpendicular to the horizontal plane).
  • the positioning blocks 48A to 48C are provided, the movement and positioning of the filter boxes 38 and 40 are performed. Can be performed smoothly.
  • the partition plates 42A to 42C may be inclined obliquely with respect to the plane including the vertical line, for example.
  • the chemical filter 51 (filter medium) of the filter box 38 removes organic gas (organic matter) in the gas passing through the filter box 38
  • the chemical filter 56 (filter medium) of the filter box 40 contains the inside thereof. Since the alkaline gas and the acidic gas in the passing gas are removed, air in which impurities are highly removed can be supplied into the chamber 10 in which the exposure main body 4 is accommodated.
  • the filter in the filter box 40 may be, for example, a filter that removes at least one of an alkaline substance and an acidic substance in a gas passing through the filter box 40.
  • the impurity which a chemical filter removes is arbitrary, For example, you may make it absorb organic gas, alkaline gas, and acidic gas with one chemical filter.
  • any filter (filter medium) other than a chemical filter can be used for the filters in the filter boxes 38 and 40.
  • a dustproof filter for removing minute particles (particles) such as a HEPA filter or a ULPA filter may be used.
  • filter boxes 38 and one filter box 40 are installed in the filter device 26 of the present embodiment, the number of filter boxes 38 and 40 provided in the filter device 26 is arbitrary. In addition, one or a plurality of filter boxes 38 or one or a plurality of filter boxes 40 may be installed in the filter device 26.
  • the casing 28 of the filter device 26 is partitioned into a plurality of spaces by partition plates 42A to 42C.
  • the filter boxes 38 and 40 are simply stacked alternately, for example, without partitioning the casing 28 by the partition plates 42A to 42C. It is also possible.
  • the exposure apparatus EX of the present embodiment is an exposure main body that exposes the wafer W in the exposure apparatus that exposes the wafer W (substrate) through the pattern of the reticle R and the projection optical system PL with the exposure light EL. 4, a filter box 38, 40 of the present embodiment, and an air conditioner 30 that blows air taken in from the outside of the chamber 10 into the chamber 10 through the filter box 38, 40. ing.
  • the filter boxes 38 and 40 can be exchanged efficiently, and positioning between the filter boxes 38 and 40 can be performed with high accuracy, so that the exposure apparatus can be efficiently maintained. And impurities in the air in the chamber 10 can be removed with high accuracy.
  • a frame having a tapered portion similar to the frames 50 and 55 of the filter boxes 38 and 40 is used as the frame of the filter boxes 63 and 64 of the local air conditioner 60 in the loader chamber 10b.
  • the filter boxes 63 and 64 may be housed in a casing having a positioning block formed with a tapered portion similar to the positioning blocks 48A to 48C.
  • FIG. 7 (A) is a perspective view showing a first filter box 38A and a positioning block 48A corresponding to the first filter box 38A of the first modification of the above embodiment
  • FIG. 7 (B) is a first modification thereof. It is a perspective view which shows the 2nd filter box 40A of an example, and the positioning block 48B corresponding to this.
  • the filter of the first modification example is obtained by installing the positioning block 48A of FIG. 7A and the positioning block 48B of FIG. 7B in the casing 28 instead of the positioning blocks 48A, 48C and 48B of FIG.
  • the boxes 38A, 40A can be installed in the casing 28.
  • the first filter box 38A includes an annular frame 50 that holds the chemical filter 51, and a gasket 54A (a part of the gasket 54 is cut away) provided on the first end surface 50a of the frame 50. And a handle portion 50b1 (first handle portion) formed of a recess provided on the first side surface of the frame 50, and a handle portion 50b1 formed on the first side surface of the frame 50 so as to sandwich the handle portion 50b1 in the Z direction.
  • Two first taper portions 50b2 and 50b3 two portions of the first inclined portion that gradually incline toward the outside of the frame 50 from the second end surface 50g of the 50 toward the first end surface 50a side.
  • the filter box 38 ⁇ / b> A is formed so as to sandwich the handle portion 50 c 1 (second handle portion) formed of a concave portion provided on the second side surface of the frame 50 and the handle portion 50 c 1 on the second side surface of the frame 50 in the Z direction.
  • grip portions 49A are provided on the handle portions 50b1 and 50c1 so that the operator can easily hold them.
  • the position of the handle portion 50b1 in the Z direction with respect to the installation surface of the frame 50 is lower than the position of the handle portion 50c1 in the Z direction, and the handle portions 50b1 and 50c1 have a rotationally symmetrical positional relationship with respect to the center of the frame 50. Is provided. In other words, the distance in the Z direction from the installation surface below the frame 50 of one handle portion 50b1 is equal to the distance in the Z direction from the installation surface above the frame 50 of the other handle portion 50c1. Furthermore, a convex portion 49C is provided at a position corresponding to the handle portion 50b1 (and 50c1) of the tapered portion 48Aa of the positioning block 48A.
  • the height of the convex portion 49C is set lower than the depth from the tapered portions 50b2 and 50b3 to the grip portion 49A. Therefore, the taper portions 50b2 and 50b3 (or 50c2 and 50c3) of the frame 50 can be brought into close contact with the taper portion 48Aa of the positioning block 48A.
  • the second filter box 40A includes an annular frame 55 that holds the chemical filter 56 and a gasket 54B (a part of the gasket 54 provided on the first end surface 55a of the frame 55).
  • a notched shape a pair of handle portions 55b1 and 55c1 (first handle portion and second handle portion) formed of recesses provided on the first side surface and the second side surface of the frame 55, and the first of the frame 55
  • First taper portions 55b2 and 55b3 two portions of the first inclined portion
  • second taper portions 55c2 and 55c3 first portions formed so as to sandwich the handle portions 55b1 and 55c1 in the Z direction on the side surface and the second side surface, respectively.
  • the grip portions 49B are provided on the handle portions 55b1 and 55c1.
  • the positional relationship in the Z direction of the handle portions 55b1 and 55c1 with respect to the frame 55 is opposite to the positional relationship in the Z direction of the handle portions 50b1 and 50c1 with respect to the frame 50.
  • the distance in the Z direction from the installation surface below the frame 55 of one handle portion 55b1 is equal to the distance in the Z direction from the installation surface above the frame 55 of the other handle portion 55c1.
  • the distance in the Z direction from the installation surface below the frame 55 of the one handle portion 55b1 of the filter box 40A and the distance in the Z direction from the installation surface below the frame 50 of the one handle portion 50b1 of the filter box 38A. are different from each other.
  • a convex portion 49D is provided at a position corresponding to the handle portion 55b1 (and 55c1) of the tapered portion 48Ba of the positioning block 48B. Therefore, if the frame 50 of the first filter box 38A is erroneously brought into contact with the positioning block 48B, the convex portion 49D and the first taper portion 50b2 (or 50c2) of the frame 50 mechanically interfere with each other. On the other hand, the taper portions 55b2 and 55b3 (or 55c2 and 55c3) of the frame 55 can be brought into close contact with the taper portion 48Ba of the positioning block 48B. Conversely, if the frame 55 of the second filter box 40A is accidentally brought into contact with the positioning block 48A of FIG.
  • FIG. 8A is a perspective view showing a first filter box 38B and a positioning block 48A1 corresponding to the first filter box 38B of the second modification of the above embodiment, and FIG. It is a perspective view showing the 2nd filter box 40B of the 1st modification, and positioning block 48A2 corresponding to this.
  • the positioning block 48A1 of FIG. 8A and the positioning block 48A1 of FIG. 8B are installed in the casing 28 instead of the positioning blocks 48A, 48C and 48B of FIG.
  • the boxes 38B and 40B can be installed in the casing 28.
  • the first filter box 38B includes an annular frame 50A for holding the chemical filter 51, a gasket 54 provided on the first end surface in the ⁇ Y direction of the frame 50A, and + Z of the frame 50. Formed on the + Z direction side of the first side surface 50Ab of the frame 50A, and formed on the outer side of the frame 50A toward the gasket 54 side. A first tapered portion 50Abt (first inclined portion) inclined at a taper angle ⁇ .
  • the second side surface 50Ac in the + X direction of the frame 50A is parallel to the ZY plane and is not inclined.
  • the taper portion 48A1a having the taper angle ⁇ of the positioning block 48A1 is formed only in a portion corresponding to the first taper portion 50bt of the frame 50A. Therefore, the first taper portion 50Abt of the frame 50A can be brought into close contact with the taper portion 48A1a of the positioning block 48A1.
  • the second filter box 40B includes an annular frame 55A for holding the chemical filter 56, a gasket 54 provided on the first end face of the frame 55A, and the +55 direction of the frame 55.
  • a handle portion 70D (first handle portion) formed of a convex portion provided on the fourth side surface and formed on the ⁇ Z direction side of the first side surface 55Ab of the frame 55A, taper toward the outer side of the frame 55A toward the gasket 54 side. And a first tapered portion 55Abt (first inclined portion) inclined at an angle ⁇ .
  • the second side surface 55Ac in the + X direction of the frame 55A is parallel to the ZY plane and is not inclined.
  • the taper portion 48A2a having the taper angle ⁇ of the positioning block 48A2 is formed only in a portion corresponding to the first taper portion 55Abt of the frame 55A.
  • the positional relationship in the Z direction of the first tapered portion 55Abt relative to the frame 55A is opposite to the positional relationship in the Z direction of the first tapered portion 50Abt relative to the frame 50A.
  • the taper portion 48A1a of the positioning block 48A1 and the taper portion 48A2a of the positioning block 48A2 have different positions in the Z direction. Accordingly, it is possible to prevent the first filter box 38B from being erroneously installed in the space where the positioning block 48A2 is located, and conversely, the second filter box 40B is erroneously installed in the space where the positioning block 48A1 in FIG. Installation can be prevented.
  • the distance from the second side surface 50Ac may be different.
  • the distance from the end surface 50Aa of the handle portion 70C may be different from the distance from the end surface 55Ac of the handle portion 70D.
  • FIG. 9A is a plan view showing a first filter box 38C and a positioning block 48A corresponding to the first filter box 38C of the third modified example of the above embodiment.
  • the filter box 38C has a chemical filter 51 housed in an annular frame 50C and a gasket 54 fixed to the end surface of the frame 50C. Further, the opposing first side surface 50Cb and second side surface 50Cc of the frame 50C are inclined symmetrically on average, and stepped step portions are formed respectively, and a handle portion 70A is attached to the side surfaces 50Cb and 50Cc.
  • the filter box 38C By moving the filter box 38C by bringing the first side surface 50Cb or the second side surface 50Cc into contact with the tapered portion of the positioning block 48A, the filter box 38C can be easily positioned in the casing 28 so as to contact the partition plate 42A.
  • FIG. 9B is a plan view showing a first filter box 38D of the fourth modified example and a positioning block 48A corresponding to the first filter box 38D.
  • the filter box 38D has a chemical filter 51 housed in an annular frame 50D and a gasket 54 fixed to the end surface of the frame 50D. Further, the first side surface 50Db and the second side surface 50Dc facing each other of the frame 50D are inclined symmetrically on average, and a plurality of convex arcs are formed on the outer sides, respectively, and a handle portion 70A is attached to the side surfaces 50Db and 50Dc. ing.
  • the filter box 38D can be easily positioned so as to contact the partition plate 42A by moving the filter box 38D by bringing the first side surface 50Db or the second side surface 50Dc into contact with the tapered portion of the positioning block 48A.
  • FIG. 9C is a plan view showing the first filter box 38E of the fifth modified example and the positioning block 48A corresponding thereto.
  • the filter box 38E has a chemical filter 51 housed in an annular frame 50E and a gasket 54 fixed to the end surface of the frame 50E. Further, the first side surface 50Eb and the second side surface 50Ec facing each other of the frame 50E are inclined symmetrically on average, and convex arc portions are formed on the outer sides, respectively, and a handle portion 70A is attached to the side surfaces 50Eb and 50Ec. .
  • the filter box 38E By moving the filter box 38E by bringing the first side surface 50Eb or the second side surface 50Ec into contact with the tapered portion of the positioning block 48A, the filter box 38E can be easily positioned so as to contact the partition plate 42A.
  • FIG. 10 (A) shows another example of the filter device 26B of the above embodiment
  • FIG. 10 (B) shows the first filter box 38F in FIG. 10 (A).
  • the surface of the partition plate 42A in the casing 28 facing the filter boxes 38F and 40F can be easily separated from the gasket 54 and easily slipped.
  • a flat cover member TF5 having an opening through which is passed is attached.
  • the cover member TF5 is made of, for example, a synthetic resin, and specifically made of, for example, Teflon (registered trademark of DuPont).
  • first filter box 38F is positioned so as to be in close contact with the cover member TF5 attached to the partition plate 42A, and the second filter box 40F and the first filter box are sequentially provided so as to be in close contact with the filter box 38F.
  • 38F and the second filter box 40F are positioned.
  • the row of filter boxes 38F, 40F, 38F, 40F are positioned by positioning blocks 48A3, 48B3, 48A4, 48B4 fixed to the inner surface of the casing 28, respectively.
  • the length in the Y direction of the positioning blocks 48A3, 48B3, etc. is set to be smaller than the height in the Y direction of the filter boxes 38F, 40F.
  • the filter boxes 38F and 40F are obtained by housing the chemical filters 51 and 56 in the annular frames 50F and 55F, respectively, and fixing the gasket 54 to the end faces of the frames 50F and 55F.
  • the first side surface and the second side surface of the frames 50F and 55F that face each other are tapered in a symmetrical manner, and face the first side surface and the second side surface of the frames 50F and 55F and the end surface to which the gasket 54 is fixed.
  • Cover members TF1 and TF2 which can be easily separated from the gasket 54 and are slippery, are attached along the end face.
  • the handle portions 70A and 70B are fixed to the first and second side surfaces of the frames 50F and 55F through the cover members TF3 and TF4.
  • Cover members TF3 and TF4 each having a flat plate shape and partially formed with a groove are also fixed to the tapered portions of the positioning blocks 48A3, 48A4 and 48B3 and 48B4.
  • the material of the cover members TF1, TF2, TF3, and TF4 is the same as the material of the cover member TF5, for example.
  • a rectangular opening TF1c that allows gas to pass is formed in a portion of the cover member TF1 of the filter box 38F that faces the chemical filter 51.
  • the portions of the cover member TF1 that cover the first side surface and the second side surface of the frame 50F are tapered portions TF1a and TF1b that are symmetrically inclined.
  • the configuration of the filter box 40F is the same, but the position of the handle portion 70B is different from the position of the handle portion 70A.
  • a moving lever portion 58G is provided inside a door 29 that closes the casing 28.
  • the moving lever 58G includes a pedestal portion 58G3, a guide portion 58G4 extending along the Y direction, a lever portion 58G1 having an inclined surface movable in the Y direction along the guide portion 58G4, and the lever portion 58G1 from the pedestal portion 58G3.
  • the cover members TF3 and TF4 covering the positioning blocks 48A3, 48B3, 48A4 and 48B4 are covered with the filter boxes 38F and 40F, respectively.
  • the taper portions of the members TF1 and TF2 are brought into contact with each other, and the filter boxes 38F and 40F are sequentially moved substantially in the ⁇ Y direction.
  • the cover members TF1 to TF4 are slippery, the filter boxes 38F and 40F can be easily moved.
  • the gasket 54 of the filter box 38F at the end in the ⁇ Y direction comes into contact with the cover member TF5 that covers the partition plate 42A, and the filter box 38F (40F)
  • the gasket 54 of the filter box 40F (38F) adjacent thereto is in contact with the cover member TF1 (TF2).
  • the filter box 40F at the end in the + Y direction is urged in the ⁇ Y direction by the moving lever portion 58G, so that the partition plate 42A (cover member TF5) and the filter box 38F , 40F can be adhered while maintaining airtightness. Accordingly, clean gas can be supplied to the air blowing unit (not shown) of the air conditioner through the four-stage filter boxes 38F and 40F.
  • the door 29 is opened, and the filter boxes 40F and 38F are sequentially carried out of the casing 28.
  • the gasket 54 of the filter box 40F can be easily separated from the cover member TF1 of the filter box 38F, and the gasket 54 of the filter box 38F can also be easily separated from the cover member TF5.
  • the filter boxes 38F and 40F can be easily replaced.
  • the number of stages of the filter boxes 38F and 40F is arbitrary. Further, the cover members TF3 and TF4 such as the positioning blocks 48A3 and 48B3 can be omitted. Further, when the cover members TF3 and TF4 such as the positioning blocks 48A3 and 48B3 are provided, the taper portions of the cover members TF1 and TF2 on the filter box 38F and 40F side can be omitted. Further, instead of the cover members TF1 to TF4, for example, slippery resin adhesive tape may be attached.
  • the outer shapes of the frames 50, 50A to 50F and 55, 55A to 55F of the filter boxes 38 to 38F and 40 to 40F are substantially square (substantially square ring (frame shape)). It is.
  • the outer shapes of the frames 50, 50A and 55, 55A for example, are substantially rectangular (such as a rectangle) (substantially rectangular ring (frame)), or substantially square or rectangular, and the corners are chamfered. Also good.
  • the electronic device performs a function / performance design of the electronic device as shown in FIG. 221, manufacturing a mask (reticle) based on this design step 222, manufacturing a substrate (wafer) as a base material of the device and applying a resist 223, mask pattern by the exposure apparatus of the above-described embodiment
  • a substrate (sensitive substrate), a process for developing the exposed substrate, a substrate processing step 224 including heating (curing) and etching process of the developed substrate, a device assembly step (dicing process, bonding process, package process) 225) as well as inspection step 2 It is produced through a 6 or the like.
  • this device manufacturing method includes forming the pattern of the photosensitive layer on the substrate using the exposure apparatus of the above embodiment, and processing the substrate on which the pattern is formed (step 224). Yes.
  • the exposure apparatus the maintenance cost can be reduced and the exposure accuracy can be improved, so that the electronic device can be manufactured at a low cost with high accuracy.
  • air is used as the air conditioning gas. Instead, nitrogen gas or a rare gas (such as helium or neon), or a mixed gas of these gases may be used. .
  • the present invention can be applied not only to a scanning exposure type projection exposure apparatus but also to exposure using a batch exposure type (stepper type) projection exposure apparatus.
  • the present invention can also be applied when exposure is performed using a proximity type or contact type exposure apparatus that does not use a projection optical system.
  • the present invention is not limited to application to a semiconductor device manufacturing process.
  • a manufacturing process of a display device such as a liquid crystal display element or a plasma display formed on a square glass plate, or an imaging element (CCD, etc.), micromachines, MEMS (Microelectromechanical Systems), thin film magnetic heads, and various devices such as DNA chips can be widely applied to the manufacturing process.
  • the present invention can also be applied to a manufacturing process when manufacturing a mask (photomask, reticle, etc.) on which mask patterns of various devices are formed using a photolithography process.
  • the present invention is not limited to the above-described embodiment, and it is needless to say that various configurations can be taken without departing from the gist of the present invention.
  • the disclosures in the above-mentioned publications, international publication pamphlets, US patents, or US patent application publication specifications described in the present application are incorporated into the description of this specification.
  • the entire disclosure of US Patent Application No. 61 / 320,832, filed April 5, 2010, including the description, claims, drawings, and abstract, is incorporated herein by reference in its entirety. It is.
  • EX ... exposure device, R ... reticle, PL ... projection optical system, W ... wafer, 4 ... exposure body, 10 ... chamber, 26 ... filter device, 28 ... casing, 30 ... main air conditioner, 38, 40 ... filter box 42A to 42C ... partition plate, 48A to 48C ... positioning block, 50, 55 ... frame, 50b, 55b ... first taper part, 51, 56 ... chemical filter, 60 ... local air conditioner, 70A, 70B ... handle part

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Separation Of Gases By Adsorption (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

La présente invention concerne une boîte de filtre qui contient un filtre qui est équipée d'un cadre qui soutient le filtre, et une poignée qui est disposée sur le cadre ; et a des parties à forme modifiée qui sont formées sur au moins des parties des côtés du cadre, qui sont orientées depuis un côté de surface d'extrémité vers l'autre côté de surface d'extrémité des deux surfaces d'extrémité du cadre, et qui sont modifiées à l'extérieur du cadre. Le filtre peut être configuré de telle manière que le positionnement puisse être efficacement ou aisément effectué.
PCT/JP2011/058513 2010-04-05 2011-04-04 Boîte de filtre, dispositif d'exposition, et procédé de production de dispositif WO2011125975A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011800168721A CN102821829A (zh) 2010-04-05 2011-04-04 过滤器箱、曝光装置、及元件制造方法
JP2012509651A JPWO2011125975A1 (ja) 2010-04-05 2011-04-04 フィルタボックス、露光装置、及びデバイス製造方法
KR1020127028906A KR20130032305A (ko) 2010-04-05 2011-04-04 필터 박스, 노광 장치, 및 디바이스 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32083210P 2010-04-05 2010-04-05
US61/320,832 2010-04-05

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WO2011125975A1 true WO2011125975A1 (fr) 2011-10-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016042499A (ja) * 2014-08-13 2016-03-31 株式会社ニコン フィルタボックス及びその製造方法、フィルタ装置、並びに露光装置

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Publication number Priority date Publication date Assignee Title
TWD195394S (zh) 2018-08-17 2019-01-11 明光電機有限公司 Part of a double-conducting special filter

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JPS5013971A (fr) * 1973-06-08 1975-02-13
JPS5790724U (fr) * 1980-11-19 1982-06-04
JPH09113028A (ja) * 1995-10-17 1997-05-02 Matsushita Electric Ind Co Ltd 空気清浄フィルタ用収納ケース
JPH1147531A (ja) * 1997-07-31 1999-02-23 Tennex:Kk 室内空気処理用のフィルタ部材
JP2002158170A (ja) * 2000-09-08 2002-05-31 Nikon Corp 露光装置及びデバイス製造方法

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KR101037057B1 (ko) * 2002-12-10 2011-05-26 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
CN201291102Y (zh) * 2008-10-31 2009-08-19 中国北车集团大同电力机车有限责任公司 空气过滤器

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Publication number Priority date Publication date Assignee Title
JPS5013971A (fr) * 1973-06-08 1975-02-13
JPS5790724U (fr) * 1980-11-19 1982-06-04
JPH09113028A (ja) * 1995-10-17 1997-05-02 Matsushita Electric Ind Co Ltd 空気清浄フィルタ用収納ケース
JPH1147531A (ja) * 1997-07-31 1999-02-23 Tennex:Kk 室内空気処理用のフィルタ部材
JP2002158170A (ja) * 2000-09-08 2002-05-31 Nikon Corp 露光装置及びデバイス製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016042499A (ja) * 2014-08-13 2016-03-31 株式会社ニコン フィルタボックス及びその製造方法、フィルタ装置、並びに露光装置

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KR20130032305A (ko) 2013-04-01
TW201206549A (en) 2012-02-16
CN102821829A (zh) 2012-12-12

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