WO2003028111A1 - Memoire a semi-conducteur permanente et procede de fabrication - Google Patents
Memoire a semi-conducteur permanente et procede de fabrication Download PDFInfo
- Publication number
- WO2003028111A1 WO2003028111A1 PCT/JP2002/009857 JP0209857W WO03028111A1 WO 2003028111 A1 WO2003028111 A1 WO 2003028111A1 JP 0209857 W JP0209857 W JP 0209857W WO 03028111 A1 WO03028111 A1 WO 03028111A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- source
- drain regions
- voltage
- sbl
- charge accumulation
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002784 hot electron Substances 0.000 abstract 4
- 238000009825 accumulation Methods 0.000 abstract 3
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0491—Virtual ground arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
- H01L29/42332—Gate electrodes for transistors with a floating gate with the floating gate formed by two or more non connected parts, e.g. multi-particles flating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/40—EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/432,158 US6903977B2 (en) | 2001-09-25 | 2002-09-25 | Nonvolatile semiconductor memory device and method of producing the same |
DE10295303.1T DE10295303B4 (de) | 2001-09-25 | 2002-09-25 | Nichtflüchtige Halbleiterspeichervorrichtung mit Ladungsspeicherfilm und Speicherperipherieschaltungen, Verfahren zu deren Betrieb und Verfahren zu deren Herstellung |
JP2003531535A JP4114607B2 (ja) | 2001-09-25 | 2002-09-25 | 不揮発性半導体メモリ装置及びその動作方法 |
US11/079,300 US7102931B2 (en) | 2001-09-25 | 2005-03-15 | Nonvolatile semiconductor memory apparatus and method of producing the same |
US11/096,017 US7142451B2 (en) | 2001-09-25 | 2005-04-01 | Nonvolatile semiconductor memory apparatus and method of producing the same |
US11/095,798 US7088622B2 (en) | 2001-09-25 | 2005-04-01 | Nonvolatile semiconductor memory apparatus and method of producing the same |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-291759 | 2001-09-25 | ||
JP2001291759 | 2001-09-25 | ||
JP2002044309 | 2002-02-21 | ||
JP2002-44309 | 2002-02-21 | ||
JP2002046998 | 2002-02-22 | ||
JP2002-46998 | 2002-02-22 | ||
JP2002-188809 | 2002-06-27 | ||
JP2002188809 | 2002-06-27 |
Related Child Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10432158 A-371-Of-International | 2002-09-25 | ||
US11/079,300 Continuation US7102931B2 (en) | 2001-09-25 | 2005-03-15 | Nonvolatile semiconductor memory apparatus and method of producing the same |
US11/095,798 Continuation US7088622B2 (en) | 2001-09-25 | 2005-04-01 | Nonvolatile semiconductor memory apparatus and method of producing the same |
US11/096,017 Continuation US7142451B2 (en) | 2001-09-25 | 2005-04-01 | Nonvolatile semiconductor memory apparatus and method of producing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003028111A1 true WO2003028111A1 (fr) | 2003-04-03 |
Family
ID=27482578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/009857 WO2003028111A1 (fr) | 2001-09-25 | 2002-09-25 | Memoire a semi-conducteur permanente et procede de fabrication |
Country Status (5)
Country | Link |
---|---|
US (5) | US6903977B2 (ja) |
JP (1) | JP4114607B2 (ja) |
DE (1) | DE10295303B4 (ja) |
TW (1) | TW561617B (ja) |
WO (1) | WO2003028111A1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004343014A (ja) * | 2003-05-19 | 2004-12-02 | Sharp Corp | 半導体記憶装置、半導体装置、及びそれらの製造方法、並びに携帯電子機器、並びにicカード |
JP2004349308A (ja) * | 2003-05-20 | 2004-12-09 | Sharp Corp | 半導体記憶装置 |
JP2004349311A (ja) * | 2003-05-20 | 2004-12-09 | Sharp Corp | 半導体記憶装置 |
JP2005317117A (ja) * | 2004-04-28 | 2005-11-10 | Sony Corp | 不揮発性半導体メモリ装置の動作方法、および、不揮発性半導体メモリ装置 |
JP2007142398A (ja) * | 2005-11-17 | 2007-06-07 | Ememory Technology Inc | 単層ポリシリコン不揮発性メモリーセルの駆動方法 |
JP2007534157A (ja) * | 2003-11-04 | 2007-11-22 | マイクロン テクノロジー、インコーポレイテッド | 自己整合型電荷分離構造nromフラッシュメモリ |
JP2009146497A (ja) * | 2007-12-13 | 2009-07-02 | Renesas Technology Corp | 半導体装置 |
JP2009157975A (ja) * | 2007-12-25 | 2009-07-16 | Spansion Llc | 半導体装置およびその制御方法 |
JP2010016067A (ja) * | 2008-07-01 | 2010-01-21 | Sony Corp | 不揮発性半導体メモリデバイス、その製造方法および動作方法 |
JP2011100533A (ja) * | 2009-11-05 | 2011-05-19 | Fs Semiconductor Corp Ltd | フラッシュepromの閾値電圧降下方法及びその構造 |
JP2013191885A (ja) * | 2013-06-18 | 2013-09-26 | Renesas Electronics Corp | 不揮発性半導体記憶装置 |
WO2023105763A1 (ja) * | 2021-12-10 | 2023-06-15 | キオクシア株式会社 | メモリデバイス |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
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US6774278B1 (en) * | 1995-06-07 | 2004-08-10 | Cook Incorporated | Coated implantable medical device |
ITMI20010521A1 (it) * | 2001-03-12 | 2002-09-12 | Snoline Spa | Transizione tra barriere di sicurezza per la chiusura facilmente amovibile |
US6903977B2 (en) * | 2001-09-25 | 2005-06-07 | Sony Corporation | Nonvolatile semiconductor memory device and method of producing the same |
US7382659B2 (en) * | 2002-10-15 | 2008-06-03 | Halo Lsi, Inc. | Twin insulator charge storage device operation and its fabrication method |
JP2004348817A (ja) * | 2003-05-20 | 2004-12-09 | Sharp Corp | 半導体記憶装置、そのページバッファリソース割当方法及び回路、コンピュータシステム並びに携帯電子機器 |
US7202523B2 (en) * | 2003-11-17 | 2007-04-10 | Micron Technology, Inc. | NROM flash memory devices on ultrathin silicon |
US7158411B2 (en) * | 2004-04-01 | 2007-01-02 | Macronix International Co., Ltd. | Integrated code and data flash memory |
JP4419699B2 (ja) * | 2004-06-16 | 2010-02-24 | ソニー株式会社 | 不揮発性半導体メモリ装置およびその動作方法 |
US20080203464A1 (en) * | 2004-07-01 | 2008-08-28 | Chih-Hsin Wang | Electrically alterable non-volatile memory and array |
US7881123B2 (en) * | 2005-09-23 | 2011-02-01 | Macronix International Co., Ltd. | Multi-operation mode nonvolatile memory |
JP2007193867A (ja) * | 2006-01-17 | 2007-08-02 | Matsushita Electric Ind Co Ltd | 不揮発性半導体記憶装置及びその書き換え方法 |
US20070177428A1 (en) * | 2006-01-30 | 2007-08-02 | Zeev Cohen | Memory circuit arrangement and method for reading and/or verifying the status of memory cells of a memory cell array |
US7440335B2 (en) * | 2006-05-23 | 2008-10-21 | Freescale Semiconductor, Inc. | Contention-free hierarchical bit line in embedded memory and method thereof |
JP5088465B2 (ja) | 2006-07-12 | 2012-12-05 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 不揮発性半導体メモリ |
US7369446B2 (en) * | 2006-07-13 | 2008-05-06 | Atmel Corporation | Method and apparatus to prevent high voltage supply degradation for high-voltage latches of a non-volatile memory |
JP4241780B2 (ja) * | 2006-08-09 | 2009-03-18 | シャープ株式会社 | 半導体記憶装置及び電子機器 |
US7453725B2 (en) * | 2006-10-06 | 2008-11-18 | Atmel Corporation | Apparatus for eliminating leakage current of a low Vt device in a column latch |
EP2084613A4 (en) * | 2006-11-01 | 2009-10-21 | Gumbo Logic Inc | NON-VOLATILE FALL-LOAD SWITCHES FOR PROGRAMMABLE LOGIC |
US20080150000A1 (en) * | 2006-12-21 | 2008-06-26 | Spansion Llc | Memory system with select gate erase |
US8072023B1 (en) | 2007-11-12 | 2011-12-06 | Marvell International Ltd. | Isolation for non-volatile memory cell array |
JP5166095B2 (ja) * | 2008-03-31 | 2013-03-21 | 株式会社東芝 | 不揮発性半導体記憶装置の駆動方法及び不揮発性半導体記憶装置 |
JP5300773B2 (ja) * | 2010-03-29 | 2013-09-25 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
JP5702109B2 (ja) * | 2010-10-20 | 2015-04-15 | ラピスセミコンダクタ株式会社 | 半導体メモリ |
JP5667893B2 (ja) * | 2011-01-20 | 2015-02-12 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
CN104183490B (zh) * | 2013-05-21 | 2017-11-28 | 中芯国际集成电路制造(上海)有限公司 | Mos晶体管的形成方法 |
TWI566249B (zh) * | 2014-11-21 | 2017-01-11 | 慧榮科技股份有限公司 | 快閃記憶體的資料寫入方法與其控制裝置 |
US9698147B2 (en) | 2015-02-25 | 2017-07-04 | Sii Semiconductor Corporation | Semiconductor integrated circuit device having low and high withstanding-voltage MOS transistors |
US11416416B2 (en) * | 2019-01-13 | 2022-08-16 | Ememory Technology Inc. | Random code generator with non-volatile memory |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001102553A (ja) * | 1999-09-29 | 2001-04-13 | Sony Corp | 半導体装置、その駆動方法および製造方法 |
JP2001168219A (ja) * | 1999-09-29 | 2001-06-22 | Sony Corp | 不揮発性半導体記憶装置およびその駆動方法 |
JP2001237330A (ja) * | 1999-12-17 | 2001-08-31 | Sony Corp | 不揮発性半導体記憶装置およびその動作方法 |
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-
2002
- 2002-09-25 US US10/432,158 patent/US6903977B2/en not_active Expired - Lifetime
- 2002-09-25 JP JP2003531535A patent/JP4114607B2/ja not_active Expired - Fee Related
- 2002-09-25 WO PCT/JP2002/009857 patent/WO2003028111A1/ja active Application Filing
- 2002-09-25 DE DE10295303.1T patent/DE10295303B4/de not_active Expired - Fee Related
- 2002-09-25 TW TW091122024A patent/TW561617B/zh not_active IP Right Cessation
-
2005
- 2005-03-15 US US11/079,299 patent/US7145808B2/en not_active Expired - Fee Related
- 2005-03-15 US US11/079,300 patent/US7102931B2/en not_active Expired - Fee Related
- 2005-04-01 US US11/096,017 patent/US7142451B2/en not_active Expired - Fee Related
- 2005-04-01 US US11/095,798 patent/US7088622B2/en not_active Expired - Fee Related
Patent Citations (3)
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JP2001102553A (ja) * | 1999-09-29 | 2001-04-13 | Sony Corp | 半導体装置、その駆動方法および製造方法 |
JP2001168219A (ja) * | 1999-09-29 | 2001-06-22 | Sony Corp | 不揮発性半導体記憶装置およびその駆動方法 |
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Non-Patent Citations (1)
Title |
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J. D. Bude, et al., "EEPROM/FLASH sub 3.OV drain-source bias hot carrier writing", Technical Digest International Electron Devices Meeting, December 1995, pages 989 to 991 * |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004343014A (ja) * | 2003-05-19 | 2004-12-02 | Sharp Corp | 半導体記憶装置、半導体装置、及びそれらの製造方法、並びに携帯電子機器、並びにicカード |
JP2004349308A (ja) * | 2003-05-20 | 2004-12-09 | Sharp Corp | 半導体記憶装置 |
JP2004349311A (ja) * | 2003-05-20 | 2004-12-09 | Sharp Corp | 半導体記憶装置 |
JP4480955B2 (ja) * | 2003-05-20 | 2010-06-16 | シャープ株式会社 | 半導体記憶装置 |
JP2007534157A (ja) * | 2003-11-04 | 2007-11-22 | マイクロン テクノロジー、インコーポレイテッド | 自己整合型電荷分離構造nromフラッシュメモリ |
JP2005317117A (ja) * | 2004-04-28 | 2005-11-10 | Sony Corp | 不揮発性半導体メモリ装置の動作方法、および、不揮発性半導体メモリ装置 |
JP2007142398A (ja) * | 2005-11-17 | 2007-06-07 | Ememory Technology Inc | 単層ポリシリコン不揮発性メモリーセルの駆動方法 |
JP2009146497A (ja) * | 2007-12-13 | 2009-07-02 | Renesas Technology Corp | 半導体装置 |
JP2009157975A (ja) * | 2007-12-25 | 2009-07-16 | Spansion Llc | 半導体装置およびその制御方法 |
JP2010016067A (ja) * | 2008-07-01 | 2010-01-21 | Sony Corp | 不揮発性半導体メモリデバイス、その製造方法および動作方法 |
JP2011100533A (ja) * | 2009-11-05 | 2011-05-19 | Fs Semiconductor Corp Ltd | フラッシュepromの閾値電圧降下方法及びその構造 |
JP2013191885A (ja) * | 2013-06-18 | 2013-09-26 | Renesas Electronics Corp | 不揮発性半導体記憶装置 |
WO2023105763A1 (ja) * | 2021-12-10 | 2023-06-15 | キオクシア株式会社 | メモリデバイス |
Also Published As
Publication number | Publication date |
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US7088622B2 (en) | 2006-08-08 |
US20050201189A1 (en) | 2005-09-15 |
JP4114607B2 (ja) | 2008-07-09 |
DE10295303T5 (de) | 2004-09-23 |
US7102931B2 (en) | 2006-09-05 |
DE10295303B4 (de) | 2017-07-13 |
JPWO2003028111A1 (ja) | 2005-01-13 |
US20050152187A1 (en) | 2005-07-14 |
US20050185499A1 (en) | 2005-08-25 |
US20040042295A1 (en) | 2004-03-04 |
US6903977B2 (en) | 2005-06-07 |
US7142451B2 (en) | 2006-11-28 |
US7145808B2 (en) | 2006-12-05 |
TW561617B (en) | 2003-11-11 |
US20050169085A1 (en) | 2005-08-04 |
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