US6768061B2 - Multilayer circuit board - Google Patents

Multilayer circuit board Download PDF

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Publication number
US6768061B2
US6768061B2 US10/179,203 US17920302A US6768061B2 US 6768061 B2 US6768061 B2 US 6768061B2 US 17920302 A US17920302 A US 17920302A US 6768061 B2 US6768061 B2 US 6768061B2
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Prior art keywords
circuit board
resin
layer
integrated
heat sink
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Expired - Lifetime
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US10/179,203
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US20030007330A1 (en
Inventor
Koji Kondo
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Murata Manufacturing Co Ltd
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Denso Corp
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Publication of US20030007330A1 publication Critical patent/US20030007330A1/en
Priority to US10/842,526 priority Critical patent/US7328505B2/en
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Assigned to MURATA MANUFACTURING CO., LTD. reassignment MURATA MANUFACTURING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DENSO CORPORATION
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/1147—Manufacturing methods using a lift-off mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Definitions

  • the present invention relates to a multilayer circuit board and a method for manufacturing the multilayer circuit board, especially relates to a multilayer circuit board that has electrodes, which are used for the connection with a chip component, only on one surface of the board and to a method for manufacturing the multilayer circuit board.
  • a conventionally known multilayer circuit board of the same type is manufactured using a plurality of so-called double-sided boards as follows.
  • Each double-sided board includes a thermosetting resin film and a plurality of conductor layers, which are located on two surfaces of the thermosetting resin film.
  • the conductor layers on one surface are electrically connected to the conductor layers on the other surface.
  • the plurality of double-sided boards are piled with a plurality of interconnecting boards, which include unset thermosetting resin films in B stage and are ready for electrically connecting the conductor layers, such that the interconnecting boards are interleaved with the double-sided boards.
  • an unset thermosetting resin film is piled to cover one surface, to which the chip component is not connected, of the piled body, which includes the interconnecting boards and the double-sided boards. Then, the piled body, which includes the interconnecting boards, the double-sided boards, and the unset thermosetting resin film, is pressed and heated to complete the conventionally known multilayer circuit board.
  • Another conventionally known multilayer circuit board is manufactured as follows. An interconnecting board and a conductive foil are piled in this order on each surface of a double-sided board. After the piled body, which includes the double-sided board, the interconnecting boards, and the conductive foils, is pressed and heated, the conductive foils formed on both surfaces of the double-sided board are shaped by etching. An intermediate multilayer circuit board having the predetermined number of layers is formed by repeating a series of the piling, pressing, heating, and etching steps.
  • the piled body which includes the intermediate multilayer circuit board and the unset thermosetting resin film, is pressed and heated to complete the another conventionally known multilayer circuit board.
  • the present invention has been made in view of the above aspects with an object to provide a multilayer circuit board, the manufacturing process of which can be simplified even if the multilayer circuit board has electrodes used for connection with a chip component only on one surface of the board, and to provide a method for manufacturing the multilayer circuit board.
  • a plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a single-sided conductor layer film. Then, a plurality of via-holes, which are bottomed by the conductor layers, are formed in the single-sided conductor layer film. Then an interlayer connecting material is packed in the via-holes to form a single-sided conductor layer film having the interlayer connecting material.
  • a plurality of single-sided conductor layer films are formed and stacked such that surfaces having the conductor layers face in the same direction. Then, the single-sided conductor layer films are pressed and heated to complete the multilayer circuit board, which has electrodes only on one surface.
  • the multilayer circuit board is formed by using only the single-sided conductor layer films and pressing once, so the manufacturing process is simplified.
  • FIGS. 1A to 1 F are step-by-step cross-sectional views showing the summarized production process of a multilayer circuit board according to the first embodiment of the present invention.
  • FIGS. 2A to 2 F are step-by-step cross-sectional views showing the summarized production process of a multilayer circuit board according to the second embodiment of the present invention.
  • a single-sided conductor layer film 21 has conductor layers 22 , which are shaped by etching a conductive foil (a copper foil with a nominal thickness of 18 micrometers in this embodiment) adhered onto one side of a resin film 23 .
  • a thermoplastic film with a thickness of 25-75 micrometers which is made of a mixture of 65-35 weight % polyetheretherketone resin and 35-65 weight % polyetherimide resin, is used as the resin film 23 .
  • a single-sided conductor layer film 21 is immersed in plating solutions for so-called nickel-gold plating.
  • Surfaces of the conductor layers 22 are plated with nickel and gold, and as shown in FIG. 1B, processed surface layers 32 are formed on the surfaces of the conductor layers 22 .
  • the processed surface layers 32 are formed for the purpose of improving the adhesion with a bonding material such as solder when a chip component is connected to the electrodes 33 by the bonding material.
  • via-holes 24 which are bottomed by the conductor layers 22 , are formed in the single-sided conductor layer film 21 by irradiating with carbon dioxide laser from the side of the resin film 23 , as shown in FIG. 1 C.
  • the conductor layers 22 escape being dug by adjusting the power and the exposure time period of the carbon dioxide laser.
  • excimer laser and so on may be used for forming the via-holes 24 .
  • via-hole formation means such as drilling is applicable. However, if holes are machined by laser beam, it is possible to form holes with a fine diameter and the conductor layers 22 incur less damage, so laser beam is preferred.
  • conductive paste 50 (interlayer connecting material), which is a material for electric connection, is packed in the via-holes 24 , as shown in FIG. 1 D.
  • the conductive paste 50 is prepared as follows. An organic solvent and binder resin are added to metal particles made of copper, silver, tin, and so on. The mixture is compounded by a mixer to make it pasty. The conductive paste 50 is printed and packed in the via-holes 24 by a screen-printing machine. Instead of the method using the screen-printing machine, other methods using a dispenser and so on may be used as long as the conductive paste 50 is surely packed in the via-holes 24 .
  • the via-holes 24 are formed and the conductive paste 50 is packed by the same steps as in FIGS. 1C and 1D.
  • a plurality of single-sided conductor layer films 21 are stacked such that the surfaces having the conductor layers 22 face upward.
  • the single-sided conductor layer film 31 which includes the electrodes 33 , is stacked such that the surface having the electrodes 33 faces upward. No via-holes are formed in the single-sided conductor layer film 21 that is located at the lowest position in FIG. 1 E.
  • the stacked body in FIG. 1E is pressed and heated from the top and the bottom surfaces of the stacked body by a vacuum hot-press machine. Specifically, the stacked body in FIG. 1E is pressed under a pressure of 1-10 MPa while being heated at a temperature of 250-350° C. to bond the single-sided conductor layer films 21 , 31 and to form an integrated body, as shown in FIG. 1 F.
  • All the resin films 23 are made of the same thermoplastic resin and the modulus of elasticity of the resin films 23 is reduced to about 5-40 MPa when being pressed and heated by the vacuum hot-press machine, so the resin films 23 are readily heat-sealed and integrated, as shown in FIG. 1 F. Moreover, the surface activities of the conductor layers 22 and the conductive paste 50 in the via-holes 24 are increased by being heated above 250° C., so the conductor layers 22 and the conductive paste 50 are connected and a plurality of pairs of conductor layers 22 , which are separated by the resin films 23 , are electrically connected by the conductive paste 50 . With above steps, a multilayer circuit board 100 , which includes the electrodes 33 only on one surface of the board 100 , is manufactured.
  • the modulus of elasticity of the resin films 23 while being pressed and heated is preferably 1-1000 MPa. If the modulus of elasticity is greater than 1000 MPa, it is difficult to heat-seal the resin films 23 and the conductor layers 22 are readily broken by excessive stress that the conductor layers 22 incur while being pressed and heated. On the other hand, if the modulus of elasticity is smaller than 1 MPa, the resin films 23 flow readily and the conductor layers 22 are drifted too readily to form the multilayer circuit board 100 .
  • the multilayer circuit board 100 is manufactured using only the single-sided conductor layer films 21 , 31 , so the manufacturing process can be simplified. Moreover, the single-sided conductor layer films 21 , 31 are bonded together at one time by being pressed and heated once. Therefore, it is possible to shorten the lead time in the manufacturing process and simplify further the manufacturing process. In addition, the surface, to which the chip component is not connected, of the multilayer circuit board 100 is insulated by the resin film 23 of the single-sided conductor layer film 21 that is located at the lowest position as viewed in FIG. 1 E. Therefore, no dedicated insulating layer made of a film and so on is needed.
  • the conductor layers 22 are formed on the resin films 23 , the processed surface layers 32 and the via-holes 24 are formed in the resin films 23 , and the conductive paste 50 is packed in the via-holes 24 .
  • a plurality of single-sided conductor layer films 21 a are formed using the same steps as for the single-sided conductor layer films 21 .
  • Each single-sided conductor layer film 21 a includes a plurality of thermal vias 44 , which are made of via-holes 24 a and the conductive paste 50 , which is packed in the via-holes 24 a.
  • a plurality of single-sided conductor layer films 21 , 21 a are stacked such that the surfaces having the conductor layers 22 face upward.
  • the single-sided conductor layer film 31 which includes the electrodes 33 , is stacked such that the surface having the electrodes 33 faces upward.
  • a heat sink 46 made of aluminum alloy is placed under the stacked body that includes single-sided conductor layer films 21 , 21 a , 31 .
  • the heat sink 46 is a heat releasing member and has a roughened surface at the upper side of the heat sink 46 in FIG. 2E for the purpose of improving the adhesion, which is described later, when being bonded to the single-sided conductor layer film 21 a .
  • a method for forming the roughened surface buffing, shot blasting, anodic oxide coating, and so on may be employed.
  • the stacked body and the heat sink 46 are stacked as shown in FIG. 2E, the stacked body and the heat sink 46 are pressed and heated by the vacuum hot-press machine. By being pressed and heated, the single-sided conductor layer films 21 , 21 a , 31 and the heat sink 46 are bonded together, and an integrated body is formed, as shown in FIG. 2 F.
  • the resin films 23 are heat-sealed and integrated, and at the same time a plurality of pairs of conductor layers 22 , which are separated by the resin films 23 , are electrically connected by the conductive paste 50 in the via-holes 24 , 24 a , and a multilayer circuit board 100 , which includes the electrodes 33 only on one surface of the board 100 , is manufactured.
  • the heat sink 46 is located on the bottom surface of the board 100 , and the bottom surface faces in the direction opposite to the one in which the top surface having the electrodes 33 faces.
  • the via-holes 24 a are located at the central areas of two single-sided conductor layer films 21 a .
  • the conductive paste 50 packed in the via-holes 24 a of the two single-sided conductor layer films 21 a are directly or indirectly connected to the heat sink 46 , as shown in FIG. 2 F.
  • the conductive paste 50 of one single-sided conductor layer film 21 a to which the heat sink 46 is connected is directly connected to the heat sink 46 and connects the heat sink 46 and the conductor layers 22 of the one single-sided conductor layer film 21 a is connected.
  • the conductive paste 50 of the other single-sided conductor layer film 21 a connects the conductor layers 22 of the one single-sided conductor layer film 21 a and the conductor layers 22 of the other single-sided conductor layer film 21 a.
  • thermal vias 44 make up thermal vias 44 .
  • a plurality of thermal vias 44 are formed for releasing heat from the integrated single-sided conductor layer films 21 , 21 a , 31 to the heat sink 46 .
  • the thermal vias 44 and the conductor layers 22 connected to the thermal vias 44 in FIG. 2F are electrically insulated from other conductor layers 22 that make up an electric circuit in the multilayer circuit board 100 .
  • the conductive paste 50 of the thermal vias 44 is formed only for the thermal conduction to the heat sink 46 .
  • the electric circuit of the multilayer circuit board 100 is insulated at the surface having the heat sink 46 .
  • the via-holes 24 a of the thermal vias 44 are formed to have the same diameter (nominally 100 micrometers in FIGS. 2E and 2F) as other via-holes 24 .
  • the thermal conductivity of the thermal vias 44 can be improved by increasing the diameter of the via-holes 24 a of the thermal vias 44 and the connecting material 50 packed in the via-holes 24 a .
  • the adhesion between the multilayer circuit board 100 and the heat sink 46 extremely decreases at the positions where the thermal vias 44 are formed.
  • the number of the thermal vias 44 is increased without increasing the diameter to improve the thermal conductivity, the adhesion between the multilayer circuit board 100 and the heat sink 46 can be prevented from decreasing.
  • the resin films 23 are made of the same thermoplastic resin, and the modulus of elasticity of the resin films 23 is reduced to about 5-40 MPa when being pressed and heated by the vacuum hot-press machine.
  • the surface activities of the conductor layers 22 , the conductive paste 50 , and the heat sink 46 are increased by being heated above 250° C. Therefore, the resin films 23 can be surely bonded to each other, and the conductor layers 22 , the conductive paste 50 , and the heat sink 46 can be surely connected to each other.
  • the modulus of elasticity of the resin films 23 while being pressed and heated is preferably 1-1000 MPa because of the same reasons as described in the first embodiment.
  • the multilayer circuit board 100 is formed using only the single-sided conductor layer films 21 , 21 a , 31 , so the manufacturing process can be simplified. Moreover, the single-sided conductor layer films 21 , 21 a , 31 are bonded together at one time by being pressed and heated once, at the same time, the heat sink 46 is connected to the multilayer circuit board 100 , and the thermal vias 44 are connected to the heat sink 46 . Therefore, it is possible to shorten the lead time in the manufacturing process and simplify further the manufacturing process
  • the heat sink 46 is vulnerable to damage from the plating solutions for plating nickel and gold on the conductor layers 22 to form the electrodes 33 . Therefore, the heat sink 46 needs to be protected by coating resin and so on if the heat sink 46 has to be immersed in the plating solutions to form the processed surface layers 32 on the conductive layers 22 .
  • the processed surface layers 32 are formed before the single-sided conductor layer film 21 , 21 a , 31 , and the heat sink 46 are stacked. Therefore, there is no need to protect the heat sink 46 .
  • the resin films made of a mixture of 65-35 weight % polyetheretherketone resin and 35-65 weight % polyetherimide resin are used for the resin films 23 .
  • the resin films it is possible to use other resin films made by adding nonconductive filler to polyetheretherketone resin and polyetherimide resin. It is also possible to use separately polyetheretherketone or polyetherimide.
  • thermoplastic resins such as thermoplastic polyimide or what is called liquid crystal polymer are usable as well.
  • the resin film is preferably used.
  • the processed surface layers 32 are located only on the conductor layers 22 of one single-sided conductor layer film 31 , as shown in FIGS. 1F and 2F. However, they may be located on the conductor layers 22 of other single-sided conductor layer films 21 , 21 a .
  • nickel-gold plating which is applied to the conductor layers 22 to form the electrodes 33 and improve the adhesion of the bonding material that is used when the chip component is connected, heat-stable prefluxing, palladium plating and soon may be applied. If sufficient adhesion is provided without the processed surface layers 32 , there is no need to from the processed surface layers 32 .
  • the heat sink 46 is made of aluminum alloy. However, it may be made of other metals or ceramics.
  • the thermal vias 44 are formed only in two single-sided conductor layer films 21 a in FIG. 2E, there are other variations.
  • the thermal vias 44 may be formed in four single-sided conductor layer films 21 a such that the thermal vias 44 are connected together to reach the top surface on which the electrodes 33 are formed to relatively efficiently release heat in the chip component connected to the electrodes 33 to the heat sink 46 .
  • the thermal vias 44 may function as a part of the electric circuit.
  • the thermal vias 44 may function as a wiring that electrically connects the electric circuit to the heat sink 46 to earth the electric circuit.
  • the heat sink 46 is an insulator made of a material such as ceramics, even if the thermal vias 46 are electrically connected to the electric circuit, the electric circuit can be insulated by the heat sink 46 while desired heat releasing characteristics are assured.
  • a so-called bonding sheet such as a polyetherimide sheet, a thermosetting resin sheet containing heat conductive filler, or a thermoplastic resin sheet containing heat conductive filler may be formed on the surface of the heat sink 46 , at which the heat sink 46 is adhered to the single-sided conductor layer films 21 a , in order to improve adhesion or heat conductivity.
  • the bonding sheet needs to be removed at the positions where the thermal vias 44 contact the heat sink 46 .
  • the multilayer circuit boards 100 according to the first and second embodiments include four single-sided conductor layer films 21 , 21 a , 31 .
  • the total number of the single-sided conductor layer films 21 , 21 a , 31 is not limited.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
US10/179,203 2001-07-06 2002-06-26 Multilayer circuit board Expired - Lifetime US6768061B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/842,526 US7328505B2 (en) 2001-07-06 2004-05-11 Method for manufacturing multilayer circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-206889 2001-07-06
JP2001206889A JP2003023250A (ja) 2001-07-06 2001-07-06 多層基板のおよびその製造方法

Related Child Applications (1)

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US10/842,526 Division US7328505B2 (en) 2001-07-06 2004-05-11 Method for manufacturing multilayer circuit board

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US20030007330A1 US20030007330A1 (en) 2003-01-09
US6768061B2 true US6768061B2 (en) 2004-07-27

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US20070277999A1 (en) * 2006-05-30 2007-12-06 Yazaki Corporation Circuit board and electrical connection box having the same
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US20040020046A1 (en) * 2001-08-09 2004-02-05 Takeshi Suzuki Production method for conductive paste and production method for printed circuit
US20080296052A1 (en) * 2002-08-09 2008-12-04 Ibiden Co., Ltd. Multilayer printed wiring board
US8592688B2 (en) * 2002-08-09 2013-11-26 Ibiden Co., Ltd. Multilayer printed wiring board
US20100101838A1 (en) * 2002-08-09 2010-04-29 Ibiden Co., Ltd. Multilayer printed wiring board
US9226397B2 (en) 2002-08-09 2015-12-29 Ibiden Co., Ltd. Multilayer printed wiring board having multilayer core substrate
US20060023990A1 (en) * 2004-07-30 2006-02-02 General Electric Company Interconnect device
US7316512B2 (en) * 2004-07-30 2008-01-08 General Electric Company Interconnect device
US20060274510A1 (en) * 2004-11-09 2006-12-07 Masakazu Nakada Multilayer wiring board and fabricating method of the same
US7642468B2 (en) * 2004-11-09 2010-01-05 Sony Corporation Multilayer wiring board and fabricating method of the same
US7143509B2 (en) 2004-11-26 2006-12-05 Via Technologies, Inc. Circuit board and processing method thereof
US20060112548A1 (en) * 2004-11-26 2006-06-01 I-Tseng Lee Circuit board and processing method thereof
US20080190659A1 (en) * 2004-12-23 2008-08-14 Advantech Global, Ltd System For And Method Of Planarizing The Contact Region Of A Via By Use Of A Continuous Inline Vacuum Deposition Process
US20090024345A1 (en) * 2005-03-22 2009-01-22 Harald Prautzsch Device and Method for Determining the Temperature of a Heat Sink
US9967966B2 (en) 2005-03-22 2018-05-08 Sew-Eurodrive Gmbh & Co. Kg Device and method for determining the temperature of a heat sink
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US8890000B2 (en) 2006-02-22 2014-11-18 Ibiden Co., Ltd. Printed wiring board having through-hole and a method of production thereof
US20110030207A1 (en) * 2006-04-03 2011-02-10 Panasonic Corporation Multilayer printed wiring board and manufacturing method thereof
US20070277999A1 (en) * 2006-05-30 2007-12-06 Yazaki Corporation Circuit board and electrical connection box having the same
US7888600B2 (en) * 2006-05-30 2011-02-15 Yazaki Corporation Circuit board and electrical connection box having the same
US9564346B2 (en) 2009-10-14 2017-02-07 Advanced Semiconductor Engineering, Inc. Package carrier, semiconductor package, and process for fabricating same
US9196597B2 (en) 2010-01-13 2015-11-24 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US8884424B2 (en) 2010-01-13 2014-11-11 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US9349611B2 (en) 2010-03-22 2016-05-24 Advanced Semiconductor Engineering, Inc. Stackable semiconductor package and manufacturing method thereof

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DE60217023D1 (de) 2007-02-08
SG107602A1 (en) 2004-12-29
CN1247053C (zh) 2006-03-22
EP1280393A2 (en) 2003-01-29
EP1280393A3 (en) 2004-10-13
KR100502498B1 (ko) 2005-07-22
CN1396796A (zh) 2003-02-12
US7328505B2 (en) 2008-02-12
MXPA02006635A (es) 2003-02-10
US20040208933A1 (en) 2004-10-21
JP2003023250A (ja) 2003-01-24
EP1280393B1 (en) 2006-12-27
TW519863B (en) 2003-02-01
KR20030005054A (ko) 2003-01-15
US20030007330A1 (en) 2003-01-09

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