JP7251446B2 - 伝熱部材付基板及び伝熱部材付基板の製造方法 - Google Patents
伝熱部材付基板及び伝熱部材付基板の製造方法 Download PDFInfo
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Description
最初に本開示の実施態様を列記して説明する。
本開示の伝熱部材付基板及び伝熱部材付基板の製造方法の具体例を、以下に図面を参照しつつ説明する。なお、本開示はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
以下、実施形態に係る伝熱部材付基板及び伝熱部材付基板の製造方法について説明する。図1は伝熱部材付基板10を示す斜視図である。図2は図1におけるII-II線断面図である。
このため、断面積(上記接触面積)が大きくなれば熱抵抗が小さくなること、熱伝導率が大きくなれば熱抵抗が小さくなることがわかる。
伝熱部材30における第1伝熱部32の表面に無電解ニッケル下地フラッシュ金めっき処理を施した実施例と、表面に無電解ニッケル下地フラッシュ金めっき処理が施されない伝熱部材130に係る例について、発熱部品40をはんだ付けしてみた。
20 基板
21h 貫通孔
22 絶縁板
23 導電層
25 導電層
28 熱硬化性接着剤
30 伝熱部材
32 第1伝熱部
33 ニッケル下地めっき層
34 金めっき層
36 第2伝熱部
37 アルマイト皮膜
40 発熱部品
48 部品
50 はんだ部
50a はんだペースト
60 放熱部材
62 板部
63 凹部
64 放熱構造部
68 絶縁スペーサ
69 熱伝導性材料
100 ボイド
130 伝熱部材
Claims (6)
- 貫通孔が形成された基板と、
前記貫通孔内に配設された伝熱部材と、
前記基板の一方主面側に実装された発熱部品と、
前記発熱部品を前記伝熱部材の一方端面にはんだ付けするはんだ部と、
を備え、
前記伝熱部材のうち少なくとも前記一方端面にニッケル下地めっき層が形成され、
前記ニッケル下地めっき層の酸化を抑制する金めっき層が、前記はんだ部に混じって、前記はんだ部が前記ニッケル下地めっき層に接合された状態となっており、
前記伝熱部材は、前記一方端面が形成された第1伝熱部と、前記第1伝熱部に対して前記一方端面とは反対側に直接接して接合された第2伝熱部とを備え、
前記第1伝熱部は銅又は銅合金によって形成され、
前記第2伝熱部はアルミニウム又はアルミニウム合金によって形成され、
前記第2伝熱部の表面の少なくとも一部にアルマイト皮膜が形成されており、
前記第2伝熱部は、前記第1伝熱部の周囲に突出する板状に形成されている、伝熱部材付基板。 - 請求項1に記載の伝熱部材付基板であって、
前記第2伝熱部のうち前記第1伝熱部の周囲に突出しかつ前記第1伝熱部側を向く面を、前記基板の他方主面に接着する、熱硬化性接着剤をさらに備える、伝熱部材付基板。 - 請求項1又は請求項2に記載の伝熱部材付基板であって、
前記基板の他方主面側に配設された放熱部材をさらに備え、
前記伝熱部材の他端部が前記基板の他方主面から突出しており、
前記放熱部材に、前記伝熱部材の前記他端部が収容される凹部が形成され、
前記凹部と前記伝熱部材の前記他端部との間に熱伝導性材料が設けられている、伝熱部材付基板。 - (a)一方端面が形成された第1伝熱部と、前記第1伝熱部に対して前記一方端面とは反対側に直接接して接合された第2伝熱部とを備え、前記第1伝熱部は銅又は銅合金によって形成され、前記第2伝熱部はアルミニウム又はアルミニウム合金によって形成され、少なくとも前記一方端面にニッケル下地めっき層が形成されると共に、前記ニッケル下地めっき層の表面に前記ニッケル下地めっき層の酸化を抑制する金めっき層が形成され、前記第2伝熱部の表面の少なくとも一部にアルマイト皮膜が形成されており、前記第2伝熱部は、前記第1伝熱部の周囲に突出する板状に形成されている、伝熱部材を準備するステップと、
(b)前記伝熱部材を基板における貫通孔に挿入するステップと、
(c)発熱部品を前記伝熱部材の前記一方端面にはんだ付けするステップと、
を備える伝熱部材付基板の製造方法。 - 請求項4に記載の伝熱部材付基板の製造方法であって、
前記ステップ(a)において、前記金めっき層を、0.01μm以上0.03μm以下の厚みに形成する、伝熱部材付基板の製造方法。 - 請求項4又は請求項5に記載の伝熱部材付基板の製造方法であって、
前記伝熱部材は、前記一方端面とは反対側の端部でつば状に突出するつば状部を含み、
前記ステップ(b)の後、前記ステップ(c)の前に、前記つば状部を前記基板の他方主面に、熱硬化性接着剤によって接着する、伝熱部材付基板の製造方法。
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JP2019195337A JP7251446B2 (ja) | 2019-10-28 | 2019-10-28 | 伝熱部材付基板及び伝熱部材付基板の製造方法 |
CN202080073206.0A CN114631400B (zh) | 2019-10-28 | 2020-09-02 | 带传热构件的基板以及带传热构件的基板的制造方法 |
PCT/JP2020/033256 WO2021084897A1 (ja) | 2019-10-28 | 2020-09-02 | 伝熱部材付基板及び伝熱部材付基板の製造方法 |
US17/755,391 US20220408545A1 (en) | 2019-10-28 | 2020-09-02 | Heat transfer member-equipped substrate and method for manufacturing heat transfer member-equipped substate |
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