JP3979391B2 - 回路形成基板の製造方法および回路形成基板の製造用材料 - Google Patents
回路形成基板の製造方法および回路形成基板の製造用材料 Download PDFInfo
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- JP3979391B2 JP3979391B2 JP2004016795A JP2004016795A JP3979391B2 JP 3979391 B2 JP3979391 B2 JP 3979391B2 JP 2004016795 A JP2004016795 A JP 2004016795A JP 2004016795 A JP2004016795 A JP 2004016795A JP 3979391 B2 JP3979391 B2 JP 3979391B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Description
前記圧力吸収手段は、基板材料に面する側の反対側の金属箔の表面に形成されている粗化構造のものであることを特徴とする回路形成基板の製造方法としたものであり、熱プレス工程での層間接続手段の変形等を防止する等の効果を有する。
図1(a)〜(d)は本発明の第1の実施の形態における回路形成基板の製造方法および回路形成基板の製造用材料を示す工程断面図である。
図3に示す回路形成基板の製造用材料は片面を粗化した処理銅箔1の光沢面(シャイニィ面)側に圧力吸収手段としての変形層6を形成したものである。
1a 圧力吸収手段
2 基板材料
3 導電性ペースト
4 金属板
5 回路
6 変形層
10 回路形成基板
Claims (7)
- 層間接続手段を配設した基板材料と金属箔もしくは層間接続手段を配設した基板材料とコア回路形成基板と圧力吸収手段を備えた金属箔を重ね合わせて積層物とする積層工程と、前記積層物を一体化する熱プレス工程とを備え、
前記圧力吸収手段は、基板材料に面する側の反対側の金属箔の表面に形成されている粗化構造のものであることを特徴とする回路形成基板の製造方法。 - 基板材料に面する側の表面粗さは、粗化構造の粗さより大であることを特徴とする請求項1に記載の回路形成基板の製造方法。
- 熱プレス工程の後に金属箔に配設した圧力吸収手段を除去する工程を備えたことを特徴とする請求項1に記載の回路形成基板の製造方法。
- 層間接続手段は、基板材料に設けられたビア穴に導電性ペーストを充填して構成されたものであることを特徴とする請求項1に記載の回路形成基板の製造方法。
- 請求項1に記載の回路形成基板の製造方法を用いて製造しかつ回路を有する回路形成基板を準備する工程と、
前記回路形成基板の上下に層間接続手段を配設した基板材料と金属箔とを重ね合わせて積層物を形成する工程と、
前記積層物を一体化する熱プレス工程とを備えたことを特徴とする回路形成基板の製造方法。 - 基板材料と金属箔を積層し熱プレス工程で一体化して構成される回路形成基板に用いる金属箔を主体とする材料であって、前記金属箔に圧力吸収手段を備え、
前記圧力吸収手段は、基板材料に面する側の反対側の金属箔の表面に形成されている粗化構造のものであることを特徴とする回路形成基板の製造用材料。 - 基板材料に面する側の表面粗さは、粗化構造の粗さより大であることを特徴とする請求項6に記載の回路形成基板の製造用材料。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004016795A JP3979391B2 (ja) | 2004-01-26 | 2004-01-26 | 回路形成基板の製造方法および回路形成基板の製造用材料 |
TW094101542A TW200527995A (en) | 2004-01-26 | 2005-01-19 | Method for producing circuit-forming board and material for producing circuit-forming board |
CNB2005800002557A CN100539813C (zh) | 2004-01-26 | 2005-01-21 | 电路成形基板制造方法和用于制造电路成形基板的材料 |
US10/546,730 US7624502B2 (en) | 2004-01-26 | 2005-01-21 | Method for producing circuit-forming board and material for producing circuit-forming board |
EP05703984A EP1599079B1 (en) | 2004-01-26 | 2005-01-21 | Method for producing a circuit board and material for producing a circuit board |
PCT/JP2005/000763 WO2005072037A1 (ja) | 2004-01-26 | 2005-01-21 | 回路形成基板の製造方法および回路形成基板の製造用材料 |
KR1020057017222A KR100736518B1 (ko) | 2004-01-26 | 2005-01-21 | 회로 형성 기판의 제조 방법 및 회로 형성 기판의 제조용재료 |
US11/882,396 US7572500B2 (en) | 2004-01-26 | 2007-08-01 | Method of manufacturing circuit-forming board and material of circuit-forming board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004016795A JP3979391B2 (ja) | 2004-01-26 | 2004-01-26 | 回路形成基板の製造方法および回路形成基板の製造用材料 |
Publications (2)
Publication Number | Publication Date |
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JP2005209993A JP2005209993A (ja) | 2005-08-04 |
JP3979391B2 true JP3979391B2 (ja) | 2007-09-19 |
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JP2004016795A Expired - Fee Related JP3979391B2 (ja) | 2004-01-26 | 2004-01-26 | 回路形成基板の製造方法および回路形成基板の製造用材料 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7624502B2 (ja) |
EP (1) | EP1599079B1 (ja) |
JP (1) | JP3979391B2 (ja) |
KR (1) | KR100736518B1 (ja) |
CN (1) | CN100539813C (ja) |
TW (1) | TW200527995A (ja) |
WO (1) | WO2005072037A1 (ja) |
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WO2007086568A1 (ja) * | 2006-01-30 | 2007-08-02 | Kyocera Corporation | 樹脂フィルム、接着シート、配線基板および電子装置 |
KR100905566B1 (ko) * | 2007-04-30 | 2009-07-02 | 삼성전기주식회사 | 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법 |
CN101562952B (zh) * | 2008-04-18 | 2012-04-11 | 富葵精密组件(深圳)有限公司 | 线路基板、线路基板的制作方法及电路板的制作方法 |
KR100999918B1 (ko) | 2008-09-08 | 2010-12-13 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
KR100982791B1 (ko) * | 2010-07-08 | 2010-09-16 | 윤병철 | 금속 스테이플을 이용한 Non-PCB 복합재료 플레이트의 절연층의 상하면 통전 방법 |
KR100982790B1 (ko) * | 2010-07-08 | 2010-09-16 | 윤병철 | 금속섬유를 이용한 Non-PCB 복합재료 플레이트의 절연층의 상하면 통전 방법 |
GB2529346A (en) * | 2011-03-31 | 2016-02-17 | Plasyl Ltd | Improvements for electrical circuits |
TW201340807A (zh) * | 2011-12-28 | 2013-10-01 | Panasonic Corp | 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板 |
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JPH11251703A (ja) | 1998-02-27 | 1999-09-17 | Matsushita Electric Ind Co Ltd | 回路基板、両面回路基板、多層回路基板及び回路基板の製造方法 |
US6139777A (en) * | 1998-05-08 | 2000-10-31 | Matsushita Electric Industrial Co., Ltd. | Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same |
JP4486196B2 (ja) * | 1999-12-08 | 2010-06-23 | イビデン株式会社 | 多層プリント配線板用片面回路基板およびその製造方法 |
US6504705B2 (en) * | 2000-10-12 | 2003-01-07 | Matsushita Electric Industrial Co., Ltd. | Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same |
US6713688B2 (en) * | 2000-12-27 | 2004-03-30 | Matsushita Electric Industrial Co., Ltd. | Circuit board and its manufacture method |
JP2002217510A (ja) | 2001-01-15 | 2002-08-02 | Matsushita Electric Ind Co Ltd | 基板の接続構造とその製造方法 |
JP2002368043A (ja) | 2001-06-12 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 導電性ペーストとそれを用いた導電性バンプおよびその形成方法、導電性バンプの接続方法、並びに回路基板とその製造方法 |
JP2003023250A (ja) * | 2001-07-06 | 2003-01-24 | Denso Corp | 多層基板のおよびその製造方法 |
JP4062907B2 (ja) * | 2001-11-12 | 2008-03-19 | 松下電器産業株式会社 | 回路基板およびその製造方法 |
JP2003209355A (ja) | 2002-01-15 | 2003-07-25 | Sony Corp | 配線基板の製造方法および配線基板 |
US6946205B2 (en) * | 2002-04-25 | 2005-09-20 | Matsushita Electric Industrial Co., Ltd. | Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same |
JP4029759B2 (ja) * | 2003-04-04 | 2008-01-09 | 株式会社デンソー | 多層回路基板およびその製造方法 |
-
2004
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2005
- 2005-01-19 TW TW094101542A patent/TW200527995A/zh not_active IP Right Cessation
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- 2005-01-21 CN CNB2005800002557A patent/CN100539813C/zh not_active Expired - Fee Related
- 2005-01-21 KR KR1020057017222A patent/KR100736518B1/ko not_active IP Right Cessation
- 2005-01-21 EP EP05703984A patent/EP1599079B1/en not_active Expired - Fee Related
- 2005-01-21 WO PCT/JP2005/000763 patent/WO2005072037A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
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TW200527995A (en) | 2005-08-16 |
EP1599079B1 (en) | 2012-05-09 |
EP1599079A1 (en) | 2005-11-23 |
TWI350718B (ja) | 2011-10-11 |
KR20050110001A (ko) | 2005-11-22 |
JP2005209993A (ja) | 2005-08-04 |
US7624502B2 (en) | 2009-12-01 |
US20080017403A1 (en) | 2008-01-24 |
CN100539813C (zh) | 2009-09-09 |
CN1771773A (zh) | 2006-05-10 |
KR100736518B1 (ko) | 2007-07-06 |
US7572500B2 (en) | 2009-08-11 |
WO2005072037A1 (ja) | 2005-08-04 |
US20060242827A1 (en) | 2006-11-02 |
EP1599079A4 (en) | 2008-05-21 |
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