TWI772535B - 工件的研削方法以及研削裝置 - Google Patents
工件的研削方法以及研削裝置 Download PDFInfo
- Publication number
- TWI772535B TWI772535B TW107136178A TW107136178A TWI772535B TW I772535 B TWI772535 B TW I772535B TW 107136178 A TW107136178 A TW 107136178A TW 107136178 A TW107136178 A TW 107136178A TW I772535 B TWI772535 B TW I772535B
- Authority
- TW
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- Prior art keywords
- workpiece
- thickness
- grinding
- chuck table
- protection member
- Prior art date
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017201728A JP7015139B2 (ja) | 2017-10-18 | 2017-10-18 | 被加工物の研削方法及び研削装置 |
JP2017-201728 | 2017-10-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201916976A TW201916976A (zh) | 2019-05-01 |
TWI772535B true TWI772535B (zh) | 2022-08-01 |
Family
ID=66544331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107136178A TWI772535B (zh) | 2017-10-18 | 2018-10-15 | 工件的研削方法以及研削裝置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7015139B2 (ja) |
TW (1) | TWI772535B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7249218B2 (ja) * | 2019-07-02 | 2023-03-30 | 株式会社ディスコ | 研削装置 |
JP7412996B2 (ja) * | 2019-12-10 | 2024-01-15 | 株式会社ディスコ | 研削装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200807538A (en) * | 2006-06-12 | 2008-02-01 | Disco Corp | Wafer grinding apparatus |
TW200943405A (en) * | 2008-03-27 | 2009-10-16 | Tokyo Seimitsu Co Ltd | Wafer grinding method and wafer grinding machine |
US20150072507A1 (en) * | 2013-09-12 | 2015-03-12 | Disco Corporation | Device wafer processing method |
TW201632309A (zh) * | 2015-01-16 | 2016-09-16 | Disco Corp | 被加工物的磨削方法 |
TW201707861A (zh) * | 2015-08-26 | 2017-03-01 | Disco Corp | 磨削方法 |
US9716039B2 (en) * | 2015-05-19 | 2017-07-25 | Disco Corporation | Wafer processing method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4272757B2 (ja) * | 1999-07-14 | 2009-06-03 | 株式会社ディスコ | 研削装置 |
JP4299111B2 (ja) * | 2003-11-18 | 2009-07-22 | 株式会社ディスコ | 研削装置 |
JP2006021264A (ja) * | 2004-07-07 | 2006-01-26 | Disco Abrasive Syst Ltd | 研削装置 |
JP5025200B2 (ja) * | 2006-09-19 | 2012-09-12 | 株式会社ディスコ | 研削加工時の厚さ測定方法 |
JP4986568B2 (ja) * | 2006-10-11 | 2012-07-25 | 株式会社ディスコ | ウエーハの研削加工方法 |
JP2009043931A (ja) * | 2007-08-08 | 2009-02-26 | Disco Abrasive Syst Ltd | ウェーハの裏面研削方法 |
JP5685118B2 (ja) * | 2011-03-17 | 2015-03-18 | 日東電工株式会社 | 粘着テープ |
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2017
- 2017-10-18 JP JP2017201728A patent/JP7015139B2/ja active Active
-
2018
- 2018-10-15 TW TW107136178A patent/TWI772535B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200807538A (en) * | 2006-06-12 | 2008-02-01 | Disco Corp | Wafer grinding apparatus |
TW200943405A (en) * | 2008-03-27 | 2009-10-16 | Tokyo Seimitsu Co Ltd | Wafer grinding method and wafer grinding machine |
US20150072507A1 (en) * | 2013-09-12 | 2015-03-12 | Disco Corporation | Device wafer processing method |
TW201511114A (zh) * | 2013-09-12 | 2015-03-16 | Disco Corp | 裝置晶圓之加工方法 |
TW201632309A (zh) * | 2015-01-16 | 2016-09-16 | Disco Corp | 被加工物的磨削方法 |
US9716039B2 (en) * | 2015-05-19 | 2017-07-25 | Disco Corporation | Wafer processing method |
TW201707861A (zh) * | 2015-08-26 | 2017-03-01 | Disco Corp | 磨削方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201916976A (zh) | 2019-05-01 |
JP2019075494A (ja) | 2019-05-16 |
JP7015139B2 (ja) | 2022-02-02 |
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