TWI772535B - 工件的研削方法以及研削裝置 - Google Patents

工件的研削方法以及研削裝置 Download PDF

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Publication number
TWI772535B
TWI772535B TW107136178A TW107136178A TWI772535B TW I772535 B TWI772535 B TW I772535B TW 107136178 A TW107136178 A TW 107136178A TW 107136178 A TW107136178 A TW 107136178A TW I772535 B TWI772535 B TW I772535B
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TW
Taiwan
Prior art keywords
workpiece
thickness
grinding
chuck table
protection member
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TW107136178A
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English (en)
Chinese (zh)
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TW201916976A (zh
Inventor
山本敬祐
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日商迪思科股份有限公司
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  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW107136178A 2017-10-18 2018-10-15 工件的研削方法以及研削裝置 TWI772535B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017201728A JP7015139B2 (ja) 2017-10-18 2017-10-18 被加工物の研削方法及び研削装置
JP2017-201728 2017-10-18

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TW201916976A TW201916976A (zh) 2019-05-01
TWI772535B true TWI772535B (zh) 2022-08-01

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TW107136178A TWI772535B (zh) 2017-10-18 2018-10-15 工件的研削方法以及研削裝置

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JP (1) JP7015139B2 (ja)
TW (1) TWI772535B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7249218B2 (ja) * 2019-07-02 2023-03-30 株式会社ディスコ 研削装置
JP7412996B2 (ja) * 2019-12-10 2024-01-15 株式会社ディスコ 研削装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200807538A (en) * 2006-06-12 2008-02-01 Disco Corp Wafer grinding apparatus
TW200943405A (en) * 2008-03-27 2009-10-16 Tokyo Seimitsu Co Ltd Wafer grinding method and wafer grinding machine
US20150072507A1 (en) * 2013-09-12 2015-03-12 Disco Corporation Device wafer processing method
TW201632309A (zh) * 2015-01-16 2016-09-16 Disco Corp 被加工物的磨削方法
TW201707861A (zh) * 2015-08-26 2017-03-01 Disco Corp 磨削方法
US9716039B2 (en) * 2015-05-19 2017-07-25 Disco Corporation Wafer processing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4272757B2 (ja) * 1999-07-14 2009-06-03 株式会社ディスコ 研削装置
JP4299111B2 (ja) * 2003-11-18 2009-07-22 株式会社ディスコ 研削装置
JP2006021264A (ja) * 2004-07-07 2006-01-26 Disco Abrasive Syst Ltd 研削装置
JP5025200B2 (ja) * 2006-09-19 2012-09-12 株式会社ディスコ 研削加工時の厚さ測定方法
JP4986568B2 (ja) * 2006-10-11 2012-07-25 株式会社ディスコ ウエーハの研削加工方法
JP2009043931A (ja) * 2007-08-08 2009-02-26 Disco Abrasive Syst Ltd ウェーハの裏面研削方法
JP5685118B2 (ja) * 2011-03-17 2015-03-18 日東電工株式会社 粘着テープ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200807538A (en) * 2006-06-12 2008-02-01 Disco Corp Wafer grinding apparatus
TW200943405A (en) * 2008-03-27 2009-10-16 Tokyo Seimitsu Co Ltd Wafer grinding method and wafer grinding machine
US20150072507A1 (en) * 2013-09-12 2015-03-12 Disco Corporation Device wafer processing method
TW201511114A (zh) * 2013-09-12 2015-03-16 Disco Corp 裝置晶圓之加工方法
TW201632309A (zh) * 2015-01-16 2016-09-16 Disco Corp 被加工物的磨削方法
US9716039B2 (en) * 2015-05-19 2017-07-25 Disco Corporation Wafer processing method
TW201707861A (zh) * 2015-08-26 2017-03-01 Disco Corp 磨削方法

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TW201916976A (zh) 2019-05-01
JP2019075494A (ja) 2019-05-16
JP7015139B2 (ja) 2022-02-02

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