TWI569357B - Electronic parts transfer device, electronic parts inspection device and electronic parts pressing device - Google Patents

Electronic parts transfer device, electronic parts inspection device and electronic parts pressing device Download PDF

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Publication number
TWI569357B
TWI569357B TW104139016A TW104139016A TWI569357B TW I569357 B TWI569357 B TW I569357B TW 104139016 A TW104139016 A TW 104139016A TW 104139016 A TW104139016 A TW 104139016A TW I569357 B TWI569357 B TW I569357B
Authority
TW
Taiwan
Prior art keywords
heat
electronic component
heat transfer
unit
inspection
Prior art date
Application number
TW104139016A
Other languages
English (en)
Chinese (zh)
Other versions
TW201620066A (zh
Inventor
Satoshi Nakamura
Original Assignee
Seiko Epson Corp
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201620066A publication Critical patent/TW201620066A/zh
Application granted granted Critical
Publication of TWI569357B publication Critical patent/TWI569357B/zh

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TW104139016A 2014-11-27 2015-11-24 Electronic parts transfer device, electronic parts inspection device and electronic parts pressing device TWI569357B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014240150A JP6507592B2 (ja) 2014-11-27 2014-11-27 電子部品搬送装置、電子部品検査装置および電子部品押圧装置

Publications (2)

Publication Number Publication Date
TW201620066A TW201620066A (zh) 2016-06-01
TWI569357B true TWI569357B (zh) 2017-02-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW104139016A TWI569357B (zh) 2014-11-27 2015-11-24 Electronic parts transfer device, electronic parts inspection device and electronic parts pressing device

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JP (1) JP6507592B2 (ja)
TW (1) TWI569357B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665454B (zh) * 2017-07-24 2019-07-11 南韓商Ｉｓｃ股份有限公司 用於測試的按壓裝置
TWI727540B (zh) * 2018-12-19 2021-05-11 日商朝日科技股份有限公司 電子零件之安裝裝置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI649567B (zh) * 2016-09-29 2019-02-01 日商精工愛普生股份有限公司 電子零件搬送裝置及電子零件檢查裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201425638A (zh) * 2012-07-30 2014-07-01 Hitachi Int Electric Inc 基板處理裝置，半導體裝置之製造方法及記錄媒體

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6220340U (ja) * 1985-07-22 1987-02-06
JP2826499B2 (ja) * 1996-01-17 1998-11-18 九州日本電気株式会社 Ｉｃ測定方法およびその装置
JP2006147305A (ja) * 2004-11-18 2006-06-08 Mitsumi Electric Co Ltd フローティングコネクタ
JP5040538B2 (ja) * 2007-09-05 2012-10-03 セイコーエプソン株式会社 電子部品の温度制御装置、電子部品の温度制御方法及びｉｃハンドラ
US8359906B2 (en) * 2008-07-22 2013-01-29 Espec Corp. Environment testing apparatus capable of controlling condensation amount, and control method therefor
JP5279026B2 (ja) * 2009-04-24 2013-09-04 株式会社チノー 温度センサ
JP2014190708A (ja) * 2013-03-26 2014-10-06 Seiko Epson Corp 電子部品押圧装置、電子部品の温度制御方法、ハンドラーおよび検査装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201425638A (zh) * 2012-07-30 2014-07-01 Hitachi Int Electric Inc 基板處理裝置，半導體裝置之製造方法及記錄媒體

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI665454B (zh) * 2017-07-24 2019-07-11 南韓商Ｉｓｃ股份有限公司 用於測試的按壓裝置
TWI727540B (zh) * 2018-12-19 2021-05-11 日商朝日科技股份有限公司 電子零件之安裝裝置

Also Published As

Publication number Publication date
JP6507592B2 (ja) 2019-05-08
TW201620066A (zh) 2016-06-01
JP2016102688A (ja) 2016-06-02

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