TWI569357B - Electronic parts transfer device, electronic parts inspection device and electronic parts pressing device - Google Patents
Electronic parts transfer device, electronic parts inspection device and electronic parts pressing device Download PDFInfo
- Publication number
- TWI569357B TWI569357B TW104139016A TW104139016A TWI569357B TW I569357 B TWI569357 B TW I569357B TW 104139016 A TW104139016 A TW 104139016A TW 104139016 A TW104139016 A TW 104139016A TW I569357 B TWI569357 B TW I569357B
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- TW
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- Prior art keywords
- heat
- electronic component
- heat transfer
- unit
- inspection
- Prior art date
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- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014240150A JP6507592B2 (ja) | 2014-11-27 | 2014-11-27 | 電子部品搬送装置、電子部品検査装置および電子部品押圧装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201620066A TW201620066A (zh) | 2016-06-01 |
TWI569357B true TWI569357B (zh) | 2017-02-01 |
Family
ID=56088030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104139016A TWI569357B (zh) | 2014-11-27 | 2015-11-24 | Electronic parts transfer device, electronic parts inspection device and electronic parts pressing device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6507592B2 (ja) |
TW (1) | TWI569357B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI665454B (zh) * | 2017-07-24 | 2019-07-11 | 南韓商Isc股份有限公司 | 用於測試的按壓裝置 |
TWI727540B (zh) * | 2018-12-19 | 2021-05-11 | 日商朝日科技股份有限公司 | 電子零件之安裝裝置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI649567B (zh) * | 2016-09-29 | 2019-02-01 | 日商精工愛普生股份有限公司 | 電子零件搬送裝置及電子零件檢查裝置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201425638A (zh) * | 2012-07-30 | 2014-07-01 | Hitachi Int Electric Inc | 基板處理裝置,半導體裝置之製造方法及記錄媒體 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6220340U (ja) * | 1985-07-22 | 1987-02-06 | ||
JP2826499B2 (ja) * | 1996-01-17 | 1998-11-18 | 九州日本電気株式会社 | Ic測定方法およびその装置 |
JP2006147305A (ja) * | 2004-11-18 | 2006-06-08 | Mitsumi Electric Co Ltd | フローティングコネクタ |
JP5040538B2 (ja) * | 2007-09-05 | 2012-10-03 | セイコーエプソン株式会社 | 電子部品の温度制御装置、電子部品の温度制御方法及びicハンドラ |
US8359906B2 (en) * | 2008-07-22 | 2013-01-29 | Espec Corp. | Environment testing apparatus capable of controlling condensation amount, and control method therefor |
JP5279026B2 (ja) * | 2009-04-24 | 2013-09-04 | 株式会社チノー | 温度センサ |
JP2014190708A (ja) * | 2013-03-26 | 2014-10-06 | Seiko Epson Corp | 電子部品押圧装置、電子部品の温度制御方法、ハンドラーおよび検査装置 |
-
2014
- 2014-11-27 JP JP2014240150A patent/JP6507592B2/ja not_active Expired - Fee Related
-
2015
- 2015-11-24 TW TW104139016A patent/TWI569357B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201425638A (zh) * | 2012-07-30 | 2014-07-01 | Hitachi Int Electric Inc | 基板處理裝置,半導體裝置之製造方法及記錄媒體 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI665454B (zh) * | 2017-07-24 | 2019-07-11 | 南韓商Isc股份有限公司 | 用於測試的按壓裝置 |
TWI727540B (zh) * | 2018-12-19 | 2021-05-11 | 日商朝日科技股份有限公司 | 電子零件之安裝裝置 |
Also Published As
Publication number | Publication date |
---|---|
JP6507592B2 (ja) | 2019-05-08 |
TW201620066A (zh) | 2016-06-01 |
JP2016102688A (ja) | 2016-06-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |