TWI540051B - Release film - Google Patents
Release film Download PDFInfo
- Publication number
- TWI540051B TWI540051B TW100108641A TW100108641A TWI540051B TW I540051 B TWI540051 B TW I540051B TW 100108641 A TW100108641 A TW 100108641A TW 100108641 A TW100108641 A TW 100108641A TW I540051 B TWI540051 B TW I540051B
- Authority
- TW
- Taiwan
- Prior art keywords
- release film
- film
- surface layer
- release
- item
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/704—Crystalline
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010056622 | 2010-03-12 | ||
JP2010056620 | 2010-03-12 | ||
JP2010056621 | 2010-03-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201144072A TW201144072A (en) | 2011-12-16 |
TWI540051B true TWI540051B (zh) | 2016-07-01 |
Family
ID=44563624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100108641A TWI540051B (zh) | 2010-03-12 | 2011-03-14 | Release film |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP5719290B2 (ko) |
KR (1) | KR101873071B1 (ko) |
CN (1) | CN102791480B (ko) |
TW (1) | TWI540051B (ko) |
WO (1) | WO2011111826A1 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI613956B (zh) * | 2012-11-19 | 2018-02-01 | Tatsuta Electric Wire & Cable Co Ltd | 層疊膜和遮罩印刷佈線板 |
JP6126446B2 (ja) * | 2013-04-24 | 2017-05-10 | 三井化学東セロ株式会社 | 離型フィルムおよびled素子封止体の製造方法 |
WO2014178151A1 (ja) * | 2013-04-30 | 2014-11-06 | 住友ベークライト株式会社 | 離型フィルムおよび離型フィルムの使用方法 |
JP6223913B2 (ja) * | 2013-08-05 | 2017-11-01 | 積水化学工業株式会社 | 離型フィルム |
JP2015077783A (ja) * | 2013-09-10 | 2015-04-23 | 東レ株式会社 | 離型用二軸配向ポリエステルフィルム |
MY192516A (en) * | 2014-03-07 | 2022-08-25 | Asahi Glass Co Ltd | Mold release film, process for its production and process for producing semiconductor package |
JP6572616B2 (ja) * | 2014-09-17 | 2019-09-11 | 東レ株式会社 | 白色ポリエステルフィルム |
JP6531555B2 (ja) * | 2014-10-31 | 2019-06-19 | 東レ株式会社 | 光学フィルム製造用ポリエステルフィルム |
JP2018167458A (ja) * | 2017-03-29 | 2018-11-01 | 日本メクトロン株式会社 | 離型フィルムおよびフレキシブルプリント基板の製造方法 |
KR20200135302A (ko) * | 2018-03-19 | 2020-12-02 | 세키스이가가쿠 고교가부시키가이샤 | 이형 필름 |
US11937365B2 (en) | 2018-07-06 | 2024-03-19 | Tatsuta Electric Wire & Cable Co., Ltd. | Affixation film for printed wiring board |
WO2021060151A1 (ja) * | 2019-09-25 | 2021-04-01 | 積水化学工業株式会社 | 離型フィルム |
CN111019148B (zh) * | 2019-12-10 | 2021-10-01 | 河南科技学院 | 一种改性泡沫铜材料及其制备方法和应用 |
KR102325676B1 (ko) | 2019-12-18 | 2021-11-11 | 황진상 | 반도체 패키지 몰드용 이형필름 및 그 제조방법 |
KR102304403B1 (ko) | 2019-12-18 | 2021-09-17 | 황진상 | 반도체 패키지 몰드용 이형필름 및 그 제조방법 |
TWI740515B (zh) | 2019-12-23 | 2021-09-21 | 長春人造樹脂廠股份有限公司 | 液晶高分子膜及包含其之積層板 |
JP7095780B1 (ja) * | 2021-06-09 | 2022-07-05 | 住友ベークライト株式会社 | 離型フィルムおよび成型品の製造方法 |
CN117858800A (zh) * | 2021-08-31 | 2024-04-09 | 东洋纺株式会社 | 树脂片成型用脱模薄膜 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03240658A (ja) * | 1990-02-01 | 1991-10-28 | Teijin Ltd | 蓋材 |
JPH05283862A (ja) | 1992-03-31 | 1993-10-29 | Sony Corp | 積層プリント基板の製造方法 |
JP4818541B2 (ja) * | 2001-08-07 | 2011-11-16 | 三菱樹脂株式会社 | ポリエステルフィルム |
JP2003192987A (ja) * | 2001-12-26 | 2003-07-09 | Toray Ind Inc | 無溶剤型ポリシロキサン系塗剤及び離型フィルム |
JP3791458B2 (ja) * | 2002-05-23 | 2006-06-28 | 旭硝子株式会社 | 離型フィルム |
JP4011086B2 (ja) * | 2003-09-30 | 2007-11-21 | 積水化学工業株式会社 | 多層シート |
JP2005212453A (ja) * | 2004-02-02 | 2005-08-11 | Sekisui Chem Co Ltd | 離型フィルム及び離型フィルムの製造方法 |
KR100879003B1 (ko) * | 2005-05-26 | 2009-01-15 | 주식회사 코오롱 | 이형필름 |
JP2007237497A (ja) * | 2006-03-07 | 2007-09-20 | Teijin Dupont Films Japan Ltd | 離型用フィルム |
JPWO2007116793A1 (ja) * | 2006-04-05 | 2009-08-20 | 旭硝子株式会社 | 離型フィルム、離型性クッション材およびプリント基板の製造方法 |
JP4332204B2 (ja) * | 2007-09-21 | 2009-09-16 | 積水化学工業株式会社 | 離型フィルム |
JP2009132806A (ja) | 2007-11-30 | 2009-06-18 | Sekisui Chem Co Ltd | 離型フィルム |
JP5587771B2 (ja) * | 2008-05-28 | 2014-09-10 | 株式会社クレハ | ポリフェニレンサルファイド樹脂製回路基板用離型フィルム及び積層体 |
JP5300372B2 (ja) * | 2008-08-25 | 2013-09-25 | ユニチカ株式会社 | 剥離性ポリエステルフィルム |
JP5492542B2 (ja) * | 2009-12-24 | 2014-05-14 | 積水化学工業株式会社 | 離型フィルムの製造方法 |
-
2011
- 2011-03-11 WO PCT/JP2011/055798 patent/WO2011111826A1/ja active Application Filing
- 2011-03-11 JP JP2011513562A patent/JP5719290B2/ja active Active
- 2011-03-11 KR KR1020127026625A patent/KR101873071B1/ko active IP Right Grant
- 2011-03-11 CN CN201180013457.0A patent/CN102791480B/zh active Active
- 2011-03-14 TW TW100108641A patent/TWI540051B/zh active
-
2014
- 2014-10-29 JP JP2014220657A patent/JP5837976B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TW201144072A (en) | 2011-12-16 |
JP2015083379A (ja) | 2015-04-30 |
JP5837976B2 (ja) | 2015-12-24 |
WO2011111826A1 (ja) | 2011-09-15 |
JP5719290B2 (ja) | 2015-05-13 |
JPWO2011111826A1 (ja) | 2013-06-27 |
CN102791480B (zh) | 2015-06-17 |
KR20130043623A (ko) | 2013-04-30 |
CN102791480A (zh) | 2012-11-21 |
KR101873071B1 (ko) | 2018-06-29 |
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