TWI528872B - 金屬被覆積層板 - Google Patents

金屬被覆積層板 Download PDF

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Publication number
TWI528872B
TWI528872B TW101108417A TW101108417A TWI528872B TW I528872 B TWI528872 B TW I528872B TW 101108417 A TW101108417 A TW 101108417A TW 101108417 A TW101108417 A TW 101108417A TW I528872 B TWI528872 B TW I528872B
Authority
TW
Taiwan
Prior art keywords
layer
metal
protrusion
polyimine
ratio
Prior art date
Application number
TW101108417A
Other languages
English (en)
Chinese (zh)
Other versions
TW201251535A (en
Inventor
矢熊建太郎
近藤榮吾
Original Assignee
新日鐵住金化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=46995121&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI528872(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 新日鐵住金化學股份有限公司 filed Critical 新日鐵住金化學股份有限公司
Publication of TW201251535A publication Critical patent/TW201251535A/zh
Application granted granted Critical
Publication of TWI528872B publication Critical patent/TWI528872B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW101108417A 2011-03-31 2012-03-13 金屬被覆積層板 TWI528872B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011080333A JP5698585B2 (ja) 2011-03-31 2011-03-31 金属張積層板

Publications (2)

Publication Number Publication Date
TW201251535A TW201251535A (en) 2012-12-16
TWI528872B true TWI528872B (zh) 2016-04-01

Family

ID=46995121

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101108417A TWI528872B (zh) 2011-03-31 2012-03-13 金屬被覆積層板

Country Status (4)

Country Link
JP (1) JP5698585B2 (ko)
KR (1) KR101965174B1 (ko)
CN (1) CN102740613B (ko)
TW (1) TWI528872B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016215651A (ja) * 2016-07-19 2016-12-22 新日鉄住金化学株式会社 フレキシブル銅張積層板及びフレキシブル回路基板
CN111194362B (zh) * 2017-07-24 2022-03-11 古河电气工业株式会社 表面处理铜箔、以及使用其的覆铜板及印刷配线板
CN114007832B (zh) * 2019-06-17 2024-04-19 株式会社可乐丽 覆金属层叠体的制造方法
CN114953640B (zh) * 2022-05-27 2023-10-20 广州方邦电子股份有限公司 一种挠性覆金属板、电子装置及挠性覆金属板的制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650794B2 (ja) 1989-05-02 1994-06-29 日鉱グールド・フォイル株式会社 印刷回路用銅箔の処理方法
JPH0693537A (ja) 1992-09-07 1994-04-05 Kanebo Ltd 織機管理装置
JP2717910B2 (ja) 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JP2875186B2 (ja) 1995-06-08 1999-03-24 日鉱グールド・フォイル株式会社 印刷回路用銅箔の処理方法
TWI300744B (ko) 2001-04-19 2008-09-11 Nippon Steel Chemical Co
JP4615226B2 (ja) * 2004-02-06 2011-01-19 古河電気工業株式会社 基板用複合材及びそれを用いた回路基板
JP4692758B2 (ja) * 2006-02-24 2011-06-01 信越化学工業株式会社 フレキシブル積層板及びその製造方法
JP2007281361A (ja) * 2006-04-11 2007-10-25 Asahi Kasei Corp ポリイミド系プリント基板及びポリイミド系プリント配線板
WO2010010892A1 (ja) * 2008-07-22 2010-01-28 古河電気工業株式会社 フレキシブル銅張積層板
JP5180814B2 (ja) * 2008-12-26 2013-04-10 新日鉄住金化学株式会社 フレキシブル配線基板用積層体
WO2011010540A1 (ja) * 2009-07-24 2011-01-27 三菱瓦斯化学株式会社 樹脂複合電解銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
KR101965174B1 (ko) 2019-04-03
JP5698585B2 (ja) 2015-04-08
CN102740613A (zh) 2012-10-17
JP2012213902A (ja) 2012-11-08
CN102740613B (zh) 2016-09-14
KR20120112216A (ko) 2012-10-11
TW201251535A (en) 2012-12-16

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