CN102740613B - 覆金属层叠板 - Google Patents
覆金属层叠板 Download PDFInfo
- Publication number
- CN102740613B CN102740613B CN201210093700.0A CN201210093700A CN102740613B CN 102740613 B CN102740613 B CN 102740613B CN 201210093700 A CN201210093700 A CN 201210093700A CN 102740613 B CN102740613 B CN 102740613B
- Authority
- CN
- China
- Prior art keywords
- shape
- lugs
- metal
- polyimide layer
- ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-080333 | 2011-03-31 | ||
JP2011080333A JP5698585B2 (ja) | 2011-03-31 | 2011-03-31 | 金属張積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102740613A CN102740613A (zh) | 2012-10-17 |
CN102740613B true CN102740613B (zh) | 2016-09-14 |
Family
ID=46995121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210093700.0A Active CN102740613B (zh) | 2011-03-31 | 2012-03-31 | 覆金属层叠板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5698585B2 (zh) |
KR (1) | KR101965174B1 (zh) |
CN (1) | CN102740613B (zh) |
TW (1) | TWI528872B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016215651A (ja) * | 2016-07-19 | 2016-12-22 | 新日鉄住金化学株式会社 | フレキシブル銅張積層板及びフレキシブル回路基板 |
CN111194362B (zh) * | 2017-07-24 | 2022-03-11 | 古河电气工业株式会社 | 表面处理铜箔、以及使用其的覆铜板及印刷配线板 |
CN114007832B (zh) * | 2019-06-17 | 2024-04-19 | 株式会社可乐丽 | 覆金属层叠体的制造方法 |
CN114953640B (zh) * | 2022-05-27 | 2023-10-20 | 广州方邦电子股份有限公司 | 一种挠性覆金属板、电子装置及挠性覆金属板的制作方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0650794B2 (ja) | 1989-05-02 | 1994-06-29 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔の処理方法 |
JPH0693537A (ja) | 1992-09-07 | 1994-04-05 | Kanebo Ltd | 織機管理装置 |
JP2717910B2 (ja) | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
JP2875186B2 (ja) | 1995-06-08 | 1999-03-24 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔の処理方法 |
TWI300744B (zh) | 2001-04-19 | 2008-09-11 | Nippon Steel Chemical Co | |
JP4615226B2 (ja) * | 2004-02-06 | 2011-01-19 | 古河電気工業株式会社 | 基板用複合材及びそれを用いた回路基板 |
JP4692758B2 (ja) * | 2006-02-24 | 2011-06-01 | 信越化学工業株式会社 | フレキシブル積層板及びその製造方法 |
JP2007281361A (ja) * | 2006-04-11 | 2007-10-25 | Asahi Kasei Corp | ポリイミド系プリント基板及びポリイミド系プリント配線板 |
WO2010010892A1 (ja) * | 2008-07-22 | 2010-01-28 | 古河電気工業株式会社 | フレキシブル銅張積層板 |
JP5180814B2 (ja) * | 2008-12-26 | 2013-04-10 | 新日鉄住金化学株式会社 | フレキシブル配線基板用積層体 |
WO2011010540A1 (ja) * | 2009-07-24 | 2011-01-27 | 三菱瓦斯化学株式会社 | 樹脂複合電解銅箔、銅張積層板及びプリント配線板 |
-
2011
- 2011-03-31 JP JP2011080333A patent/JP5698585B2/ja active Active
-
2012
- 2012-03-13 TW TW101108417A patent/TWI528872B/zh active
- 2012-03-30 KR KR1020120033001A patent/KR101965174B1/ko active IP Right Grant
- 2012-03-31 CN CN201210093700.0A patent/CN102740613B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR101965174B1 (ko) | 2019-04-03 |
JP5698585B2 (ja) | 2015-04-08 |
CN102740613A (zh) | 2012-10-17 |
JP2012213902A (ja) | 2012-11-08 |
KR20120112216A (ko) | 2012-10-11 |
TWI528872B (zh) | 2016-04-01 |
TW201251535A (en) | 2012-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan, Japan Applicant after: Nippon Steel Chemical Co. Address before: Tokyo, Japan, Japan Applicant before: Nippon Seel Chemical Co., Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: NIPPON SEEL CHEMICAL CO., LTD. TO: NIPPON STEEL + SUMITOMO METAL CORPORATION |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191212 Address after: No.13-1, No.1, No.1, No Patentee after: Nippon Iron Chemical Materials Co., Ltd. Address before: Tokyo, Japan Patentee before: Nippon Steel Chemical Co. |
|
TR01 | Transfer of patent right |