TWI382561B - 附有反射透鏡之功率發光二極體封裝及其製造方法 - Google Patents

附有反射透鏡之功率發光二極體封裝及其製造方法 Download PDF

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TWI382561B
TWI382561B TW094118053A TW94118053A TWI382561B TW I382561 B TWI382561 B TW I382561B TW 094118053 A TW094118053 A TW 094118053A TW 94118053 A TW94118053 A TW 94118053A TW I382561 B TWI382561 B TW I382561B
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lead frame
lens
light emitting
opening
molded body
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Ban P Loh
Gerald H Negley
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Cree Inc
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Description

附有反射透鏡之功率發光二極體封裝及其製造方法
本發明係廣泛關於半導體元件封裝領域，具體而言，係關於封裝發光二極體。
如發光二極體(LED)之發光元件通常被封裝在導線框封裝(leadframe package)內。導線框封裝典型包括一連接至多個薄金屬線之LED，該LED及大多數導線被完全囊封在一塑膠主體內。該塑膠主體之一部分界定一透鏡。連接至該LED之該等導線之一部分延伸至該塑膠主體外部。該導線框封裝的該等金屬線係當做將電力供應至該LED的導線管，而且同時可具有將熱度引出而離開該LED的作用。熱度是在將電力供應至該LED以發光時所產生。延伸至該塑膠主體外部的該等導線之該部分連接至該導線框封裝外部的電路。
該LED產生的部分熱度被該塑膠封裝主體予以消散；但是，大多數熱度係經由該封裝的金屬組件引出而離開該LED。該等金屬線通常非常薄且具有小交叉段。基於此原因，該等金屬線使熱度移離該LED的容量有限。這限制了可傳送至該LED的電量。進而，這限制了該LED可產生的光量。
為了增加LED封裝的散熱容量，在LED封裝設計中，在該封裝中導入一嵌入式散熱片(heat sink slug)。該嵌入式散熱片將熱度從LED晶片引出，因此增加LED封裝的散熱容量。然而，此項設計會在封裝的光學腔中引入未被佔用的空間，這需要在該封裝內填充一折射率匹配(refractive－index－matching)的透明封膠，藉以抽取來自LED晶片的光線。可惜，封膠的容積膨脹與收縮通常超過容納該封膠之空間的容積膨脹與收縮。因此，隨著溫度上升，封膠膨脹且透過透氣孔(vent hole)從腔溢出或滲出。另外，當封膠冷郤時會收縮，而在腔內形成一局部真空，且因此造成吸收空氣或濕氣。有時候，封膠內部形成空隙，或封膠從其接觸的各種組件剝離。這會對封裝的光輸出及可靠度造成不利影響。另外，此項設計通常包括一對脆弱的導線，通常會藉由熱鐵焊接此導線。此烙焊程序不相容於常用的SMT(Surface Mount Technology；表面黏著技術)電子電路板組裝程序。
在另一LED封裝設計中，導線框中的導線係以各種形狀及組態而製成不同厚度，並且延伸至LED封裝主體之緊接邊緣外。封裝主體係使用透明熱固性塑膠所模製，此透明熱固性塑膠通常係當做封裝的囊封材料。這些導線通常薄於先前設計之LED的導線。較厚的導線被利用作為散熱器，並且將LED晶片安裝在此導線上。這項安排方式允許使LED晶片所產生的熱度透過熱連接至外部散熱片的較厚導線予以消散。可惜，由於介於塑膠主體、封膠及導線框等材料之間的熱膨脹係數(CTE)差異大，導致此項設計原本就不可靠。因此，當歷經(假設)－40C至120C之溫度循環時，LED封裝的大多數或所有組件承受高溫應力，特別是在接觸點。這經常導致LED晶片爆裂、塑膠主體從導線剝離、黏合線(bond wire)斷裂或這些問題的組合。此外，延伸的導線還會增加LED封裝大小及佔用面積。增加的大小防礙在PCB(印刷電路板)上以密集群集安裝該等封裝，產生適用於某些應用(例如，用於汽車照明或一般照明)的亮度光線。
現行高功率導線框封裝設計的另一項缺點在於，厚導線材料無法被模壓至精細的電路中，以用於覆晶或安裝用於色彩控制之數個可個別定址之LED晶片。
結果，仍然需要一種克服或減輕先前技術封裝之一或多項缺點的改良型LED封裝。
本發明滿足這項需求。在本發明第一項具體實施例中，一種發光二極體封裝包括：一導線框、至少一發光元件(LED)、一模製主體及一透鏡。該導線框包括複數個導線，且具有一頂側及一底側。該導線框之一部分界定一安裝墊。該LED元件被安裝在該安裝墊上。該模製主體與該導線框之多個部位整合在一起，並且界定一在該導線框之該頂側上的開口，該開口環繞該安裝墊。該模製主體進一步包括在該導線框之該底側上的多個閂鎖件。該透鏡被耦合到該模製主體。
在本發明第二項具體實施例中，揭示一種製造發光二極體封裝之方法。製造一導線框條體(leadframe strip)。該導線框條體包括複數個導線，每個導線各具有一頂側及一底側。一第一導線之多個部分界定一安裝墊。一主體被模製且與該導線框條體的多個部分整合在一起。該模製主體界定一在該導線框之該頂側上的開口，並且該開口環繞該安裝墊。該模製主體進一步包括在該導線框之該底側上的多個閂鎖件。接著，至少一發光元件被安裝在該安裝墊上。
從參考附圖以舉例方式解說本發明原理的實施方式中，將可更明白本發明的其他態樣及優點。
現在將參考繪示本發明各項具體實施例之圖1A至4來說明本發明。在各圖式中，基於圖解目的，結構或部位的某些尺寸係相對於其它結構或部位的尺寸而誇大，且以此方式提供來圖解本發明的一般結構。另外，提及形成在其它結構、部位或兩者上的結構或部位，來描述本發明的各項態樣。熟習此項技術者應明白，提及形成在其它結構或部位之「上」或「上方」的結構，預計可***其它結構、部位或兩者。提及形成在其它結構或部位「上」的結構或部位且無任何介於中間的結構或部位，在本文中則描述為「直接」形成在該結構或部位上。
另外，本文中會使用諸如「上」或「上方」之相對用詞，來描述如圖所示之一結構或部位相對於其它結構或部位的關係。應明白，除圖中所描繪的方位之外，諸如「上」或「上方」之相對用詞還預定涵蓋元件的不同方位。例如，如果圖式中的元件翻轉，則描述為在其它結構或部位「上方」的結構或部位，現在其方位為在其它結構或部位「下方」。同樣地，如果圖式中的元件沿一軸旋轉，則描述為在其它結構或部位「上方」的結構或部位，現在其方位為在其它結構或部位「旁邊」或「左邊」。整份說明書中相似的數字代表相似的元件。
如圖解用之圖式所示，以一種發光二極體封裝來例示說明本發明具體實施例，該發光二極體封裝包括一導線框及與該導線框之多個部位整合在一起的模製主體。至少一發光元件(LED)(例如，一發光二極體)被安裝在該導線框上。該模製主體具有一環繞該LED之開口以及用於閂鎖一散熱片之閂鎖件。該LED被一實質上填充該開口之封膠所覆蓋。
該模製主體係由高溫塑膠所製成，用以提供對相對薄之導線框的結構支撐。該LED被安裝在該導線框的一主導線上，並且藉由黏合線而連接至用於額外電連接的其它導線。
一耦合至位於該開口上方之該模製主體的透鏡，為該LED產生的光線提供光學功能。如下文詳細說明所述，透鏡佔據該LED四周之開口的許多部分，因此減少該封裝內使用的封膠量。這減輕關聯於上文所述之封膠容積膨脹與收縮的熱應力問題，導致較低的失敗率及相對較高的可靠度。
使用閂鎖件將一散熱片耦合至該導線框，藉以進一步輔助散熱。閂鎖件設計考慮到較簡單且較小成本之二極體封裝製造。
裝置
圖1A繪示根據本發明一項具體實施例之發光二極體封裝10之透視圖。圖1B繪示圖解之發光二極體封裝10之俯視圖，但未繪示圖1A所示之透鏡及發光元件。圖1C繪示發光二極體封裝10之側視剖面圖。圖2A繪示發光二極體封裝10之透視分解圖。圖2B繪示發光二極體封裝10之側視分解圖。
請參考圖1A至圖2B，該發光二極體封裝10包括一具有複數個導線(統稱為導線22)之導線框20。在附圖中，為了避免凌亂，並非所有繪示的導線都已標示參考數字22。該導線框具有一頂側24及一底側26。該導線框20係以金屬或其它電導材料所製成，其具有預先決定厚度，可很大程度上視所要的特性及應用而有不同厚度。例如，該導線框20的厚度可能是大約數十或數百微米。
該導線框20之一部分(例如，一第一導線22a，通常位於中央)界定一安裝墊28，在安裝墊上安裝一發光元件(LED)組件50。該發光元件(LED)組件50包括至少一發光元件(LED)，例如，一發光二極體。
一模製主體40與該導線框20的多個部分整合，因為該模製主體40的一上部部分位於該導線框20上方，同時相同之該模製主體40的一下部部分位於該導線框20下方。在此圖解示範性具體實施例中，該模製主體40覆蓋該導線框20之一重要部份。該模製主體40的該上部部分界定一環繞該安裝墊28的開口42。該模製主體40的該下部部分包括多個閂鎖件44。藉由嚙合該等閂鎖件44，將一散熱片30附接至該導線框20。
當該散熱片30嚙合該導線框20時，引出該LED組件50被供給能量時所產生的熱度，並且輔助消散所產生的熱。為了避免電短路，該散熱片30係以介電材料所製成。或者，如果該散熱片30係使用電導材料所製成，則可藉由一介電層31來使該散熱片30分隔於該導線框。該介電層31可能是(例如)玻璃或已填入高熱傳導陶瓷的有機聚合物。
一透鏡70被耦合至該模製主體40的開口42且在該LED組件50上方。可使用高溫塑膠，將該模製主體40注模至該導線框20上及四周。適用於該模製主體40的材料為此項技術所熟知。可使用高溫塑膠，將該模製主體40注模至該導線框20上及四周。適用於該模製主體40的材料實例為已填入玻璃或碳纖維的LCP(Liquid Crystal Polymer；液晶聚合物)。
可藉由黏著劑或藉由機械構件，使該透鏡70緊緊地附接至該模製主體40的開口42且在該LED組件50上方。或者，可藉由軟性封膠將透鏡耦合至該模製主體40，促使該透鏡得以隨溫度上升及下降而在該模製主體40上浮動。
該散熱片30通常係以熱傳導材料所製成，例如，銅、鋁或陶瓷。
該發光二極體封裝10的尺寸很大程度上視所要的特性及應用而異。在此圖解具體實施例中，該發光二極體封裝10的尺寸可能是數毫米(mm)或數十毫米之級數。例如，該發光二極體封裝10可具有下列尺寸：厚度12為從約3mm至約50 mm範圍內；長度14為從約5 mm至約40 mm範圍內；以及寬度16為從約5 mm至約30 mm範圍內。
方法
可參考圖3A至3D來論述一種製造圖1A所示之發光二極體封裝10之方法。圖3A至3D繪示發光二極體封裝10之製造製程各階段的透視圖。為了製造圖1A所示之發光二極體封裝10，製造一導線框條體(leadframe strip)80。基於圖解之目的，在圖3A中，該導線框條體80被製造以用於製造兩個發光二極體封裝。實際上，一導線框條體可被製造用以同時製造多個發光二極體封裝。
請參考圖3A至圖3D，該導線框條體80包括複數個導線22及一環繞且支撐該等導線22的縱橫體(crossbar)82。該導線框條體80及該等導線22具有一頂側24(即，與圖1A至2B之導線框20的該頂側24相同的一端)以及一底側26(即，與圖1A至2B之導線框20的該底側26相同的一端)。再者，如圖1B所示，一第一導線22a之一部分界定該安裝墊28。該導線框條體80係藉由模壓一片電導材料所製造而成。該材料的厚度很大程度上視所要的應用而異，例如，厚度可為數十或數百微米之範圍。或者，可使用化學蝕刻或銑切製程來製造該導線框條體80。
該模製主體40被模製且與該導線框條體80及該散熱片30的多個部分整合在一起。該模製主體40界定一環繞該安裝墊28的開口42。另外，該模製主體40包括在該導線框20之該底側26上的該等閂鎖件44。
在模製之前，將該模製主體40與該導線框條體80整合在一起，可使介電黏著膜將該散熱片30附著於該導線框條體80，如上文所述且如圖3B所示。當該模製塑膠主體40模製至該導線框條體80上時，使用該等閂鎖件44來鎖定該散熱片30，例如，如圖1A所示。
接著，也如圖2A及2B所示，包括至少一發光元件的該LED組件50被安裝在該安裝墊28上。接著，藉由封膠(例如，軟聚矽氧或任何低硬度之兼具黏著性與伸縮性的聚合物)來囊封該LED組件50。接著，該透鏡70被耦合至該模製主體40的開口42上方，且藉此界定(例如)圖1C及2B所示之一密封光學腔45。
圖1C及2B所示之該光學腔45實質上被填充封膠。視所要的結果而定，該光學腔45可被完成填充或局部填充，同時在該透鏡的反射鏡後方或下方留下一膨脹空間或未佔用空間，該膨脹空間無封膠存在。接著，該導線框條體80的該縱橫體82部分被分隔，而留下該導線框二極體封裝10與伸出至該模製主體40外的導線22之外部部分。最後，該等導線22之該等外部部分被彎曲為鷗翼形，如(例如)圖1A及1C所示。
透鏡
該透鏡70繪示於圖1A、1C、2A、2B、3D及4中。具體而言，圖2A、3D及4繪示該透鏡70的透視圖；以及圖1C及2B繪示該透鏡70的側視剖面圖。請參閱該透鏡70的各圖，尤其請參閱圖2B及4，在此圖解具體實施例中，該透鏡70包括兩部分：一上部部分75及一下部部分77。該上部部分75包括一影響該二極體封裝10之光學效能的光學表面76。
該下部部分77包括一凹底部表面72，其置放在該LED組件50上方，經調適以接收來自該LED組件50的光線。另外，該下部部分77界定位於其中央部位中的凹腔78，用以提供該LED組件50的空間。該凹腔78與該導線框20結合，而形成如上文所述之該密封光學腔45。
該透鏡70的該凹底部表面72可被塗佈光學材料，其預定用以在LED晶片所發射的光線離開該二極體封裝10之前，先影響或變更該光線的性質。光學材料類型的實例為發光轉換磷光體、染料、螢光聚合物或吸收部分不同波長的晶片發射之光線及重發射之光線的其它材料。其它光學材料之實例為光擴散劑(例如，氧化鈦)或散發或散射光線之空隙。這些材料中任何個別材料或組合皆可被塗佈在該透鏡上，藉以獲得某光譜及發生效能。
該下部部分77中還包括一已塗佈反射材料之外反射表面74。該外反射表面74被調適成收集及反射來自該LED組件50的接收之光線。該外反射表面74被塗佈反射材料，例如，銀、金或鋁。反射之光線透過該光學表面76而離開該透鏡70。藉由使用厚膜技術來化學沉積、印刷及固化金屬膏，就可以反射材料塗佈至該外反射表面74。
可以用大於於臨界角71之角度來置放該反射表面74，藉以提供該LED組件50所發射的光線之至少一部分的全內反射(TIR)。另外，該反射表面74可被製造成具有一預定的光學表面光潔度，其被採用來散射該光線，以便混合置放在該光學腔內之不同彩色LED晶片所發射的光線。對於將該透鏡70置放在該發光二極體封裝10的其餘部分上，該透鏡70可包括一突出部73。
該透鏡70的該下部部分77佔據該LED組件50之該開口42的許多部分(或許甚至超過50%)。結果，在先前技術設計中將被填充封膠的該開口42之空間容積會被減小。該開口42之減小空間容積可減少用於填充該容積的封膠量。減少封膠量減輕相關聯於上文所述之封膠容積膨脹與收縮的差異熱應力問題。結果，本發明的封裝10具有較低的失敗率及相對較高的可靠度。
可用數種方式將該透鏡70附接至該模製主體40。例如，該透鏡70被附接至該封膠，促使在溫度循環期間，該透鏡70坐落於且浮動於該封膠上。或者，該透鏡70的該突出部73可被固定至該模製主體40。數百微米的小間隙(膨脹空間)存在於該透鏡70的最低點與該導線22的該頂側24之間。在溫度循環期間，此間隙允許該封膠透過此間隙呼吸(膨脹與收縮)，促使該二極體封裝10的其它部分承受微小的(若有的話)高熱應力。此減少因剝離、爆裂或相關於熱相關應力的其它原因而失敗。
該光學表面76是該複合光學透鏡70之外表面的一部分。來自該LED組件50的光線(反射光線及非反射光線)透過該外反射表面76而離開該複合光學透鏡70。該透鏡70係以光學塑膠、玻璃或兩者所製成，其通常為透明，以允許來自該LED組件50的大多數光線通過該透鏡70。
從前文可得知，本發明屬新穎技術且提供優於現行技術的優點。雖然前面已描述及圖解說明本發明之特定具體實施例，但是本發明不限定於所描述及圖解說明的特定形式或部件排列方式。例如，可使用不同組態、尺寸或材料來實踐本發明。本發明由下申請專利範圍予以限制。
10．．．發光二極體封裝
12．．．發光二極體封裝厚度
14．．．發光二極體封裝長度
16．．．發光二極體封裝寬度
20．．．導線框
22．．．導線
22a．．．第一導線
24．．．導線框頂側
26．．．導線框底側
28．．．安裝墊
30．．．散熱片
31．．．介電層
40．．．模製主體
42．．．開口
44．．．閂鎖件
45．．．光學腔
50．．．發光元件(LED)組件
70．．．透鏡
72．．．凹底部表面
73．．．突出部
74．．．外反射表面
75．．．上部部分
76．．．光學表面
77．．．下部部分
78．．．凹腔
80．．．導線框條體
82．．．縱橫體
圖1A繪示根據本發明一項具體實施例之發光二極體封裝之透視圖；圖1B繪示圖1所示之發光二極體封裝之俯視圖，但未繪示圖1A所示之透鏡；圖1C繪示圖1所示之發光二極體封裝之側視剖面圖；圖2A繪示圖1所示之發光二極體封裝之透視分解圖；圖2B繪示圖1所示之發光二極體封裝之側視剖面分解圖；圖3A至3D繪示發光二極體封裝之製造製程各階段的透視圖；以及圖4繪示根據本發明具體實施例之透鏡的透視圖。
20．．．導線框
22．．．導線
22a．．．第一導線
30．．．散熱片
31．．．介電層
40．．．模製主體
42．．．開口
44．．．閂鎖件
45．．．光學腔
50．．．發光元件(LED)組件
70．．．透鏡

Claims (22)

  1. 一種發光二極體封裝，包括：一導線框，其包括複數個導線，該導線框具有一頂側及一底側，並且該導線框之一部分界定一安裝墊；至少一發光元件，其被安裝在該安裝墊上；一模製主體，其與該導線框之多個部位整合在一起，界定一在該導線框之該頂側上的開口，該開口環繞該安裝墊；該模製主體包括在該導線框之該底側上的多個閂鎖件；以及一透鏡，其被耦合到該模製主體，該透鏡在該開口中朝向該導線框向下延伸，使得該透鏡之一部分與該發光元件齊平或在其頂面之下。
  2. 如請求項1之發光二極體封裝，其中該模製主體包括模製塑膠。
  3. 如請求項1之發光二極體封裝，進一步包括一散熱片，其經由一介電黏著膜而耦合至該導線框，散熱片藉由該等閂鎖件而被閂鎖至該導線框。
  4. 如請求項1之發光二極體封裝，其中該透鏡是一複合光學透鏡。
  5. 一種製造發光二極體封裝之方法，該方法包括：製造一導線框條體，該導線框條體包括複數個導線，每個導線及該導線框條體各具有一頂側及一底側，一第一導線之多個部分界定一安裝墊； 模製一主體，其與該導線框之多個部位整合在一起，該模製主體界定一在該導線框條體之該頂側上的開口，該開口環繞該安裝墊；該模製主體包括在該導線框條體之該底側上的多個閂鎖件；在該安裝墊上安裝至少一發光元件；及將一透鏡結合在該開口之上，藉此，界定一光學腔，該透鏡在該開口中朝該導線框向下延伸，使得該透鏡之一部分與該發光元件齊平或在其頂面之下。
  6. 如請求項5之方法，其中該導線框條體包含薄金屬。
  7. 如請求項5之方法，其中該導線框條體80係從一金屬片模壓而成。
  8. 如請求項5之方法，其中該模製主體包括高溫塑膠。
  9. 如請求項5之方法，進一步包括藉由使用該等閂鎖件嚙合一散熱片而將該散熱片耦合至該導線框。
  10. 如請求項5之方法，進一步包括使用一封膠來囊封該發光元件。
  11. 如請求項5之方法，其中該透鏡是一複合光學透鏡，其包括一反射表面及一置放在該安裝墊上的凹曲底部表面。
  12. 如請求項5之方法，其中該透鏡具有一被塗佈光學材料之凹曲底部表面，其經調適以處置該光線。
  13. 如請求項5之方法，進一步包括使用封膠實質上填充該光學腔，同時留下一無該封膠之膨脹空間，藉此允許該封膠膨脹與收縮。
  14. 如請求項5之方法，進一步包括移除該導線框的縱橫體部分，留下該發光二極體封裝與該等導線之外部部分；以及使該等導線之該等外部部分彎曲。
  15. 如請求項3之發光二極體封裝，其中該散熱片包括一種由銅、鋁及陶瓷材料所構成之群組選出之熱傳導材料。
  16. 如請求項1之發光二極體封裝，其中該透鏡具有一大致上為半球形之上部及一截錐形下部，該上部在其突出部處漸縮配合在該模製主體之一水平面上，使得該截錐下部延伸通過該開口而圍繞該發光元件。
  17. 如請求項1之發光二極體封裝，其中該透鏡具有一上部及與該模製主體內之開口配合之一內凹下部，以圍繞在導線框之安裝墊上之該發光元件，並在位於該透鏡與該導線框頂面之間之該內凹下部形成一光學腔；及一封膠，其充填該光學腔之至少一部分以囊封該發光元件。
  18. 如請求項17之發光二極體封裝，其中未具有封膠之一間隙形成在該透鏡之內部下部之最低點與該導線頂面之間，以允許封膠擴張及收縮。
  19. 如請求項1之發光二極體封裝，其中該開口包括一第一部分，其斜邊導向至與該安裝墊相鄰之一第二圓柱形部分，且該透鏡包括一上部，其在該模製主體上方延伸，並包括一下部，其延伸入相鄰該開口第一部分並延伸入該開口第二圓柱形部分。
  20. 如請求項19之發光二極體封裝，其中該透鏡下部包括一截錐下部，其大致上平行於該模製主體內之開口的第一部分的斜邊，且大致上以相對於該模製主體內之開口的第二圓柱部分成一角度的方式延伸，以在該截錐下部之外表面與該模製主體內之開口的第二圓柱部分之間產生一間隙。
  21. 如請求項20之發光二極體封裝，其中該截錐形狀下部之外表面包括一反射外表面。
  22. 如請求項1之發光二極體封裝，其中該透鏡之至少一部分佔據界定於該模製主體內之開口之一相當大之部分。
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